AVAGO ASMC-QAB2-TAC0E Envisium 0.5w power plcc-4 surface mount led indicator Datasheet

ASMC-QxB2-Txxxx
Envisium 0.5W Power PLCC-4 Surface Mount LED Indicator
Data Sheet
Envisium
Features
Envisium is the premier class of mid-Power LEDs from
Avago and Philips Lumileds utilizing the very best solidstate lighting technologies from these two industry
leaders. Envisium LEDs offer unparalleled performance,
engineering and design flexibility.
• Industry Standard PLCC 4 platform (3.2 x 2.8 x 1.9mm)
• High reliability LED package
• Mid-Power intensity brightness with optimum flux
performance using Philips Lumileds TS AllnGaP chip
technologies
• Available in Red Orange and Amber colors
• High optical efficiency
• Available in 8mm carrier tape and 7 inch reel
• Low Thermal Resistance
Description
The Envisium 0.5W Power PLCC-4 SMT LED is an extension
of Envisium Power PLCC-4 SMT LEDs. The package can be
driven at high current due to its superior package design.
The product is able to dissipate the heat more efficiently compared to the Envisium Power PLCC-4 SMT LEDs.
These LEDs produce higher light output with better flux
performance compared to the Envisium Power PLCC-4
SMT LED.
The Envisium 0.5W Power PLCC-4 SMT LEDs are designed
for higher reliability, better performance, and operate
under a wide range of environmental conditions. The
performance characteristics of these new mid-power
LEDs make them uniquely suitable for use in harsh conditions such as in automotive applications, and in electronics signs and signals.
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel is
shipped in single intensity and color bin (except for red),
to provide close uniformity. These LEDs are compatible
with the IR solder reflow process. Due to the high reliability feature of these products, they also can be mounted
using through-the-wave soldering process.
Envisium 0.5W Power PLCC-4 SMT LED is available in red
orange & amber colors.
• Super wide viewing angle at 120°
• Longer life time with minimum degradation due to
enhanced silicone resin material
• JEDEC MSL 2a
Applications
1. Exterior automotive
- Turn signals
- Side repeaters
- CHSML
- Rear combination lamp
- Side markers
- Truck clearance lamp
2. Electronic signs and signals
- Channel lettering
- Contour lighting
- Indoor variable message sign
3. Office automation, home appliances, industrial
equipment
- Front panel backlighting
- Push button backlighting
- Display backlighting
Component Dimensions
2.2±0.2
1.9±0.2
0.8±0.1
A
0.15 (TYP.)
Ø 2.40
1.15±0.05
0.8±0.3
C
C
0.7±0.1
CATHODE
MARKING
0.56 (TYP.)
3.2±0.2
3.6±0.2
A
0.41 (TYP.)
2.8±0.2
2.30±0.05
Note:
1. All Dimensions in millimeters.
2. Lead Polarity as shown in Figure 12.
Figure 1. Package Drawing
Table 1. Device Selection Guide
Luminous Flux, fV [1] (lm)
Color
Part Number
Min. Flux (lm)
Typ. Flux (lm)
Max. Flux (lm)
Test Current (mA)
Dice Technology
Amber
ASMC-QAB2-TAC0E
4.30
6.60
9.00
150
AlInGaP
Red Orange
ASMC-QHB2-TCD0E
7.00
9.30
11.50
150
AlInGaP
Notes:
1. fV is the total luminous flux output as measured with an integrating sphere at mono pulse conditions.
2. Tolerance = ±12%
Part Numbering System
A S M C - Q X1 B 2 - T X2 X3 X4 X5
Packaging Option
Color Bin Selection
Max. Flux Bin
Min. Flux Bin
LED Chip Color
Table 2. Absolute Maximum Ratings (TA = 25 °C)
Parameters
ASMC-QxB2-Txxxx
DC Forward Current [1]
150 mA
Peak Forward Current [2]
300 mA
Power Dissipation
470 mW
Reverse Voltage
5V
Junction Temperature
125 °C
Operating Temperature
-40 °C to +100 °C
Storage Temperature
-40 °C to +100 °C
Notes:
1. Derate Linearly as shown in Figure 6.
2. Duty Factor = 10%, Frequency = 1kHz
Table 3. Optical Characteristics (TA = 25 °C)
Dominant Wavelength
lD [1] (nm)
Viewing Angle
2q½ [2]
(Degrees)
Luminous
Efficacy
hV [3] (lm/W)
Luminous
Efficiency
he (lm/W)
Luminous
Intensity
/ Total Flux [4, 5]
IV (cd) / fV (lm)
Typ.
Typ.
Typ.
Typ.
Typ.
Color
Part
Number
Dice
Technology
Amber
ASMC-QAB2-Txxxx
AlInGaP
593.5
120
470
17
0.15
Red Orange
ASMC-QHB2-Txxxx
AlInGaP
619.3
120
240
24
0.20
Notes:
1. The dominant wavelength, lD, is derived from the CIE Chromaticity diagram and represents the color of the device.
2. q½ is the off-axis angle where the luminous intensity is ½ the peak intensity.
3. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = IV / hV, where IV is the luminous intensity in candelas and hV is
the luminous efficacy in lumens / watt.
4. fV is the total luminous flux output as measured with an integrating sphere after the device has stabilized.
5. Flux tested at mono pulse conditions.
Table 4. Electrical Characteristics (TA = 25 °C)
Forward Voltage
VF (Volts) @ IF = 150 mA
Reverse Voltage
VR @ 100mA
Part Number
Typ.
Max.
Min.
Thermal Resistance
RqJ-P (°C/W)
ASMC-QxB2-Txxxx
2.64
3.10
5
60
1.0
0.9
AlInGaP Red Orange
RELATIVE INTENSITY
0.8
AlInGaP Amber
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380
430
480
530
580
630
680
730
780
WAVELENGTH - nm
Figure 2. Relative Intensity Vs. Wavelength
1.2
350
250
RELATIVE LUMINOUS INTENSITY
(NORMALIZATION AT 150 mA)
FORWARD CURRENT - mA
300
AlInGaP Red Orange
200
150
100
AlInGaP Amber
0.6
0.4
0
0
1
2
3
4
5
FORWARD VOLTAGE - V
Figure 3. Forward Current Vs. Forward Voltage
RELATIVE LUMINOUS INTENSITY
(NORMALIZATION AT 25°C)
1.4
1.2
1
0.8
0.6
0.4
0.2
-50
-25
0
0
25
50
75
JUNCTION TEMPERATURE - °C
Figure 5. Relative Intensity Vs. Temperature
0
20
40
60
80
100
100
125
120
DC FORWARD CURRENT - mA
Figure 4. Relative Intensity Vs. Forward Current
1.6
0.8
0.2
50
0
1.0
140
160
160
160
Rθ JA = 100°C/W
140
Rθ�JA = 110°C/W
120
MAXIMUM FORWARD CURRENT - mA
MAXIMUM FORWARD CURRENT - mA
140
Rθ JA = 130°C/W
100
80
60
40
100
80
60
40
20
0
Rθ JP = 60°C/W
120
20
0
20
40
60
80
AMBIENT TEMPERATURE (°C)
100
0
120
0
20
40
60
80
SOLDER POINT TEMPERATURE (°C)
100
120
Figure 6b. Maximum Forward Current Vs. Solder Point Temperature.
Derated Based on TJMAX = 125°C, RqJP = 60°C/W
Figure 6a. Maximum Forward Current Vs. Ambient Temperature.
Derated Based on TJMAX = 125°C, RqJ-A=130 °C/W, 110°C/W and 100°C/W
630
RED ORANGE
DOMINANT WAVELENGTH - nm
620
610
600
AMBER
590
580
570
1
2
5
10
20
CURRENT - mA
50
100
150
Figure 7. Dominant Wavelength Vs. Forward Current - AlInGaP Devices
1
0.9
0.1
0.8
0.05
0
-50
-25
0
25
50
-0.05
-0.1
-0.15
T J - JUNCTION TEMPERATURE - ˚C
Figure 8. Forward Voltage Shift Vs. Temperature
75
100
NORMALIZED INTENSITY
FORWARD VOLTAGE SHIFT - V
0.15
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT - DEGREES
Figure 9. Radiation Pattern
60
90
D
Note: Diameter "D" should be smaller than 2.2mm
Figure 10. Recommended Pick and Place Nozzle Size
Figure 11. Recommended Pb-free Reflow Soldering Profile
Note: For detail information on reflow soldering of Avago surface mount
LEDs, do refer to Avago Application Note AN 1060 Surface Mounting
SMT LED Indicator Components
²
Figure 12. Recommended Soldering Pad Pattern
Figure 13. Tape Leader and Trailer Dimensions
Figure 14. Tape Dimensions
Figure 15. Reeling Orientation
Device Color (X1)
Color Bin Select (X4)
A
Amber
H
Red Orange
Individual reel will contain parts from one full bin only.
X4
Flux Bin Select (X2X3)
0
Full Distribution
A
1 and 2 only
Individual reel will contain parts from one bin only
B
2 and 3 only
Min Flux Bin
C
3 and 4 only
Max Flux Bin
D
4 and 5 only
E
5 and 6 only
G
1, 2 and 3 only
H
2, 3 and 4 only
J
3, 4 and 5 only
K
4, 5 and 6 only
M
1, 2, 3 and 4 only
N
2, 3, 4 and 5 only
P
3, 4, 5 and 6 only
R
1, 2, 3, 4 and 5 only
S
2, 3, 4, 5 and 6 only
Z
Special Color Bin
X2
X3
Flux Bin Limits
Bin ID
Min. (lm)
Max. (lm)
A
4.30
5.50
B
5.50
7.00
C
7.00
9.00
D
9.00
11.50
E
11.50
15.00
F
15.00
19.50
G
19.50
25.50
H
25.50
33.00
I
33.00
43.00
J
43.00
56.00
K
56.00
73.00
Tolerance of each bin limit = ± 12%
Color Bin Limits
Amber/Yellow
Min. (nm)
Max. (nm)
2
583.0
586.0
3
586.0
589.0
4
589.0
592.0
5
592.0
595.0
6
595.0
598.0
Red Orange
Min. (nm)
Max. (nm)
1
611.0
616.0
2
616.0
620.0
3
620.0
625.0
Tolerance of each bin limit = ±1nm
Packaging Option (X5)
Moisture Sensitivity
Option
Test Current
Package Type
Reel Size
E
150mA
Top Mount
7 Inch
VF Binning
This product is qualified as Moisture Sensitive Level 2a
per Jedec J-STD-020. Precautions when handling this
moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note
AN5305 Handling of Moisture Sensitive Surface Mount
Devices for details.
Bin
Min.
Max.
A. Storage before use
2D
2.35
2.50
2E
2.50
2.65
2F
2.65
2.80
2G
2.80
2.95
2H
2.95
3.10
2J
3.10
3.25
- Unopen moisture barrier bag (MBB) can be stored at
<40°C/90%RH for 12 months. If the actual shelf life has
exceeded 12 months and the HIC indicates that baking
is not required, then it is safe to reflow the LEDs per the
original MSL rating.
- It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
Tolerance of each bin = ±0.1V
Handling Precaution
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone is a
soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage the
product and cause premature failure. During assembly
of handling, the unit should b e held on the body only.
Please refer to Avago Application Note AN 5288 for detail
information.
B. Control after opening the MBB
- The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
- The LEDs must be kept at <30°C / 60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours.
C. Control for unfinished reel
- For any unuse LEDs, they need to be stored in sealed
MBB with desiccant or desiccator at <5%RH.
D. Control of assembled boards
- If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB need to
be stored in sealed MBB with desiccant or desiccator
at <5%RH to ensure no LEDs have exceeded their floor
life of 672 hours.
E. Baking is required if:
- “10%” or “15%” HIC indicator turns pink.
- The LEDs are exposed to condition of >30°C / 60% RH
at any time.
- The LEDs floor life exceeded 672 hours.
Recommended baking condition: 60±5°C for 20 hours.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited, in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies, Limited. All rights reserved.
AV02-0397EN - July 3, 2007
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