IXYS IXFT60N20 Hiperfet power mosfet Datasheet

ADVANCE TECHNICAL INFORMATION
HiPerFETTM
Power MOSFETs
VDSS = 200 V
= 60 A
ID25
Ω
RDS(on) = 33 mΩ
IXFH 60N20
IXFT 60N20
N-Channel Enhancement Mode
Avalanche Rated, High dv/dt
Symbol
Test Conditions
VDSS
TJ = 25°C to 150°C
VDGR
VGS
trr ≤ 250 ns
Maximum Ratings
200
V
TJ = 25°C to 150°C; RGS = 1 MΩ
200
V
Continuous
±20
V
VGSM
Transient
±30
V
ID25
TC = 25°C
60
A
IDM
TC = 25°C, pulse width limited by TJM
240
A
IAR
TC = 25°C
60
A
EAR
TC = 25°C
50
mJ
EAS
dv/dt
IS ≤ IDM, di/dt ≤ 100 A/µs, VDD ≤ VDSS,
TJ ≤ 150°C, RG = 2 Ω
PD
TC = 25°C
2.5
J
5
V/ns
300
W
-55 to +150
°C
150
°C
Tstg
-55 to +150
°C
300
°C
TJ
1.6 mm (0.063 in) from case for 10 s
Md
Mounting torque
Weight
TO-247
TO-268
(TAB)
TO-268 ( IXFT) Case Style
G
S
TJM
TL
TO-247 AD (IXFH)
G = Gate
D
= Drain
S = Source TAB = Drain
1.13/10 Nm/lb.in.
6
4
g
g
Features
l
l
l
l
Symbol
Test Conditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min.
typ.
max.
VDSS
VGS = 0 V, ID = 250µA
200
VGS(th)
VDS = VGS, ID = 4 mA
2.0
IGSS
VGS = ±20 VDC, VDS = 0
IDSS
VDS = VDSS
VGS = 0 V
RDS(on)
International standard packages
Low RDS (on)
Rated for unclamped Inductive load
switching (UIS)
Molding epoxies meet UL 94 V-0
flammability classification
Advantages
V
l
4.0
V
l
±100
nA
TJ = 25°C
TJ = 125°C
25
1
µA
mA
VGS = 10 V, ID = 0.5 ID25
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
33
mΩ
© 2001 IXYS All rights reserved
(TAB)
l
Easy to mount
Space savings
High power density
98845 (6/01)
IXFH 60N20
IXFT 60N20
Symbol
Test Conditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
gfs
VDS = 10 V; ID = 0.5 • ID25, pulse test
30
40
S
5200
pF
880
pF
Crss
260
pF
td(on)
38
ns
Ciss
Coss
VGS = 0 V, VDS = 25 V, f = 1 MHz
tr
VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
63
ns
td(off)
RG = 2.5 Ω (External),
85
ns
26
ns
155
nC
38
nC
55
nC
tf
Qg(on)
Qgs
VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
RthJC
RthCK
0.42
(TO-247)
Source-Drain Diode
0.25
K/W
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
Symbol
Test Conditions
IS
VGS = 0 V
ISM
Repetitive; pulse width limited by TJM
VSD
IF = IS, VGS = 0 V,
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
trr
QRM
IRM
K/W
IF = 25A, -di/dt = 100 A/µs, VR = 50 V
60
A
240
A
1.5
V
250
ns
µC
A
0.7
8
TO-247 AD (IXFH) Outline
1
2
3
Terminals:
1 - Gate
2 - Drain
3 - Source
Tab - Drain
Dim.
Millimeter
Min.
Max.
Inches
Min.
Max.
A
A1
A2
4.7
2.2
2.2
5.3
2.54
2.6
.185
.087
.059
.209
.102
.098
b
b1
b2
1.0
1.65
2.87
1.4
2.13
3.12
.040
.065
.113
.055
.084
.123
C
D
E
.4
20.80
15.75
.8
21.46
16.26
.016
.819
.610
.031
.845
.640
e
L
L1
5.20
19.81
5.72
20.32
4.50
0.205
.780
0.225
.800
.177
∅P
Q
3.55
5.89
3.65
6.40
.140
0.232
.144
0.252
R
S
4.32
6.15
5.49
BSC
.170
242
.216
BSC
TO-268 Outline
Terminals: 1 - Gate
3 - Source
2 - Drain
Tab - Drain
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents:
4,835,592
4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,486,715
5,381,025
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