Rohm BD2056AFJ 2ch small current output usb high side switch ic Datasheet

Power Management Switch IC Series for PCs and Digital Consumer Product
2ch Small Current Output
USB High Side Switch ICs
BD2046AFJ, BD2056AFJ
No.09029JAT05
Description
High side switch for USB is a high side switch having over current protection used in power supply line of universal serial bus
(USB). Its switch unit has two channels of N-channel power MOSFET. And, over current detection circuit, thermal shutdown
circuit, under voltage lockout and soft start circuit are built in.
Features
1) Dual N-MOS high side switch
2) Continuous current load 0.25A
3) Control input logic
Active-Low : BD2046AFJ
Active-High : BD2056AFJ
4) Soft start circuit
5) Over current detection
6) Thermal shutdown
7) Under voltage lockout
8) Open drain error flag output
9) Reverse-current protection when switch off
10) Flag output delay filter built in
Applications
USB hub in consumer appliances, Car accessory, PC, PC peripheral equipment, and so forth
Lineup
Parameter
Continuous current load (A)
Over current detection (A)
Control input logic
Absolute Maximum Ratings
Parameter
Supply voltage
Enable voltage
/OC voltage
/OC current
OUT voltage
Storage temperature
Power dissipation
*1
*
BD2046AFJ
0.25
0.5
Low
Symbol
VIN
VEN, V/EN
V/OC
IS/OC
VOUT
TSTG
Pd
BD2056AFJ
0.25
0.5
High
Limits
-0.3 to 6.0
-0.3 to 6.0
-0.3 to 6.0
10
-0.3 to 6.0
-55 to 150
560*1
Unit
V
V
V
mA
V
°C
mW
Limits
2.7 to 5.5
-40 to 85
0 to 250
Unit
V
°C
mA
In the case of exceeding Ta = 25°C, 4.48mW should be reduced per 1°C.
This chip is not designed to protect itself against radioactive rays.
Operating conditions
Parameter
Operating voltage
Operating temperature
Continuous output current
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Symbol
VIN
TOPR
ILO
1/13
2009.05 - Rev.A
Technical Note
BD2046AFJ, BD2056AFJ
Electrical characteristics
○BD2046AFJ (Unless otherwise specified, VIN = 5.0V, Ta = 25°C)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Operating Current
IDD
Standby Current
ISTB
Unit
-
110
140
μA
Condition
V/EN = 0V, OUT = OPEN
-
0.01
1
μA
V/EN = 5V, OUT = OPEN
2.0
-
-
V
High input
-
-
0.8
V
Low input
-
-
0.4
V
Low input 2.7V≤ VIN ≤4.5V
I/EN
-1.0
0.01
1.0
μA
V/EN = 0V or V/EN = 5V
/OC output LOW voltage
V/OC
-
-
0.5
V
I/OC = 5mA
/OC output leak current
IL/OC
-
0.01
1
μA
V/OC = 5V
ON resistance
RON
-
100
130
mΩ
Output current at short
ISC
0.3
0.5
0.7
A
IOUT = 250mA
VIN = 5V, VOUT = 0V,
CL = 100μF (RMS)
TON1
-
1.8
10
ms
/EN input voltage
V/EN
/EN input current
Output rise time
Output turn on time
TON2
-
2.1
20
ms
Output fall time
TOFF1
-
1
20
μs
Output turn off time
UVLO threshold
RL = 20Ω , CL = OPEN
TOFF2
-
3
40
μs
VTUVH
2.1
2.3
2.5
V
Increasing VIN
VTUVL
2.0
2.2
2.4
V
Decreasing VIN
(Unless otherwise specified, VIN = 5.0V, Ta = 25°C)
Limits
Parameter
Symbol
Min.
Typ.
Max.
○BD2056AFJ
Operating Current
IDD
Standby Current
ISTB
Unit
Condition
VEN = 5V , OUT = OPEN
-
110
140
μA
-
0.01
1
μA
VEN = 0V , OUT = OPEN
2.0
-
-
V
High input
-
-
0.8
V
Low input
-
-
0.4
V
Low input 2.7V≤ VIN ≤4.5V
IEN
-1.0
0.01
1.0
μA
VEN = 0V or VEN = 5V
/OC output LOW voltage
V/OC
-
-
0.5
V
I/OC = 5mA
/OC output leak current
IL/OC
-
0.01
1
μA
V/OC = 5V
ON resistance
RON
-
100
130
mΩ
Output current at short
ISC
0.3
0.5
0.7
A
IOUT = 250mA
VIN = 5V , VOUT = 0V,
CL = 100μF (RMS)
TON1
-
1.8
10
ms
/EN input voltage
VEN
/EN input current
Output rise time
Output turn on time
TON2
-
2.1
20
ms
Output fall time
TOFF1
-
1
20
μs
Output turn off time
UVLO threshold
RL = 20Ω , CL = OPEN
TOFF2
-
3
40
μs
VTUVH
2.1
2.3
2.5
V
Increasing VIN
VTUVL
2.0
2.2
2.4
V
Decreasing VIN
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2/13
2009.05 - Rev.A
Technical Note
BD2046AFJ, BD2056AFJ
Measurement circuit
VDD
VDD
1µF
1µF
A
GND
GND
/OC1
IN
OUT1
V EN
EN1
OUT2
V EN
EN2
/OC2
/OC1
IN
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
RL
RL
Operating current
VDD
GND
VDD
10k
VDD
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
GND
IOUT
IOUT
/OC1
IN
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
ON resistance, Over current detection
IOUT
IOUT
1µF
/OC1
IN
CL
EN, /EN input voltage, Output rise, fall time
10k
1µF
CL
OC output LOW voltage
Fig.1 Measurement circuit
Timing diagram
○BD2046AFJ
○BD2056AFJ
TOFF1
TOFF1
TON1
TON1
90%
90%
VOUT
10%
10%
TON2
VEN
50%
10%
TON2
VCTRL
50%
Fig.2 Timing diagram
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90%
10%
TOFF2
© 2009 ROHM Co., Ltd. All rights reserved.
90%
VOUT
50%
TOFF2
50%
Fig.3 Timing diagram
3/13
2009.05 - Rev.A
Technical Note
BD2046AFJ, BD2056AFJ
Reference data
140
140
Ta=25°C
100
100
80
60
40
20
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
80
60
40
20
0
-50
0
6
1.0
0.2
2
0.8
0.6
0.4
0.2
VIN=5.0V
1.5
1.5
Low to High
High to Low
1.0
High to Low
0.5
0.0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
6
Fig.9 EN,/EN input voltage
Fig.8 EN,/EN input voltage
Fig.7 Operating current
EN,/EN Disable
0.5
0.5
0.3
0.2
0.1
Ta=25°C
0.4
ON RESISTANCE :
R ON[mΩ]
0.4
200
VIN=5.0V
/OC OUTPUT LOW VOLTAGE :
V/OC[V]
Ta=25°C
0.3
0.2
0.1
150
100
0.0
0.0
3
4
5
SUPPLY VOLTAGE : VDD [V]
-50
6
Fig.10 /OC output LOW voltage
2
Fig.11 /OC output LOW voltage
SHORT CIRCUIT CURRENT :
ISC[A]
Ta=25°C
1.0
50
0.5
Fig.13 ON resistance
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VIN=5.0V
1.5
1.0
0.5
0.0
0.0
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
6
2.0
1.5
100
3
4
5
SUPPLY VOLTAGE : VDD [V]
Fig. ON resistance
2.0
VIN=5.0V
150
50
0
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
SHORT CIRCUIT CURRENT :
ISC[A]
200
0
-50
Low to High
1.0
0.5
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
6
2.0
0.0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
Fig.6 Operating current
EN,/EN Disable
ENABLE INPUT VOLTAGE :
VEN, V/EN[V]
ENABLE INPUT VOLTAGE :
VEN, V /EN[V] 0
OPERATING CURRENT :
ISTB [uA]
0.4
0.0
Ta=25°C
0.0
/OC OUTPUT LOW VOLTAGE :
V/OC[V]
0.6
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
2.0
VIN=5.0V
-50
0.8
Fig.5 Operating current
EN,/EN Enable
Fig.4 Operating current
EN,/EN Enable
ON RESISTANCE :
R ON [mΩ]
Ta=25°C
OPERATING CURRENT :
ISTB [uA]
120
OPERATING CURRENT :
IDD [uA]
OPERATING CURRENT :
IDD [uA]
120
1.0
VIN=5.0V
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
Fig.14 Output current at shortcircuit
4/13
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.15 Output current at short circuit
2009.05 - Rev.A
Technical Note
BD2046AFJ, BD2056AFJ
5.0
4.0
RISE TIME :
T ON1 [ms]
3.0
2.0
TURN ON TIME :
TON2 [ms]
4.0
1.0
3.0
2.0
1.0
0.0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
0.0
-50
2.0
0.0
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
2
Fig.17 Output rise time
5.0
2.0
VIN=5.0V
4.0
4.0
3.0
3.0
FALL TIME :
T OFF1[us]
FALL TIME :
T OFF1[us]
3.0
2.0
0.0
-50
0.0
0.0
0
50
2
100
3
4
5
SUPPLY VOLTAGE : VIN [V]
AMBIENT TEMPERATURE : Ta[℃]
Fig.19 Output turn on time
-50
6
Fig.20 Output fall time
2.5
UVLO THRESHOLD VOLTAGE :
VUVLOH , VUVLOL [V]
VIN=5.0V
Ta=25°C
TURN OFF TIME :
TOFF2 [us]
4.0
4.0
3.0
2.0
3.0
2.0
1.0
1.0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
Fig.22 Output turn off time
2.4
VUVLOH
2.3
VUVLOL
2.2
2.1
2.0
0.0
0.0
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.21 Output fall time
5.0
6.0
5.0
2.0
1.0
1.0
1.0
6
5.0
Ta=25°C
4.0
3
4
5
SUPPLY VOLTAGE : VIN [V]
Fig.18 Output turn on time
5.0
VIN=5.0V
TURN ON TIME :
TON2 [ms]
3.0
1.0
Fig.16 Output rise time
TURN OFF TIME :
TOFF2 [us]
Ta=25°C
VIN=5.0V
4.0
RISE TIME :
T ON1 [ms]
5.0
5.0
Ta=25°C
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.23 Output turn off time
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.24 UVLO threshold voltage
UVLO HYSTERESIS VOLTAGE :
VHYS[V]
1.0
0.8
0.6
0.4
0.2
0.0
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.25 UVLO hysteresis voltage
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5/13
2009.05 - Rev.A
Technical Note
BD2046AFJ, BD2056AFJ
Waveform data
V/EN
(5V/div.)
V/EN
(1V/div.)
V/EN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
V/OC
(1V/div.)
VIN=5V
RL=20Ω
VOUT
(5V/div.)
VOUT
(5V/div.)
VIN=5V
RL=10Ω
CL=100uF
IOUT
(0.5A/div.)
CL=200µF
VIN=5V
RL=10Ω
CL=100uF
IOUT
(0.5A/div.)
CL=147µF
IOUT
(0.1A/div.)
CL=100µ
CL=47µF
TIME(1ms/div.)
TIME(1ms/div.)
TIME(500us/div.)
Fig.26 Output rise characteristic
(BD2056AFJ)
Fig.27 Output fall characteristic
(BD2056AFJ)
Fig.28 Inrush current response
(BD2056AFJ)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VIN=5V
VIN=5V
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
TIME(20ms/div.)
TIME(2ms/div.)
Fig.29 Over current response
Ramped load
(BD2056AFJ)
Fig.30 Over current response
Ramped load
(BD2056AFJ)
V/EN
(5V/div.)
VIN=2.5V
CL=100uF
V/OC
(1V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(1V/div.)
VIN=5V
CL=100uF
VIN=5V
CL=100uF
Thermal Shutdown
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
TIME (2ms/div.)
TIME (1ms/div.)
TIME (500ms/div.)
Fig.31 Over current response
Enable to short circuit
(BD2056AFJ)
Fig.32 Over current response
Enable to short circuit
(BD2056AFJ)
Fig.33 Over current response
Enable to short circuit
(BD2056AFJ)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
V/OC
(5V/div.)
RL=20Ω
CL=100uF
V/OC
(5V/div.)
RL=20Ω
CL=100uF
TIME (1s/div.)
TIME (1s/div.)
Fig.34 UVLO response
Increasing VIN
(BD2056AFJ)
Fig.35 UVLO response
Decreasing VIN
(BD2056AFJ)
Regarding the output rise/fall and over current detection characteristics of BD2046AFJ, refer to the characteristic of BD2056AFJ.
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6/13
2009.05 - Rev.A
Technical Note
BD2046AFJ, BD2056AFJ
Block diagram
TSD1
/EN1
EN1
/OC1
Gate
Logic1
Delay
Charge
Pump1
OCD1
IN
OUT1
UVLO
GND 1
OUT2
/EN2
EN2
IN 2
Charge
Pump2
OCD2
/EN1 3
(EN1)
/EN2 4
(EN2)
/OC2
Gate
Logic2
8 /OC1
Delay
GND
7 OUT1
Top View
6 OUT2
5 /OC2
TSD2
Fig.36 Block diagram
Pin description
○BD2046AFJ
Pin No.
Fig.37 Pin Configuration
Symbol
I/O
1
GND
I
2
IN
I
3, 4
/EN
I
5, 8
/OC
O
6, 7
OUT
O
Symbol
I/O
1
GND
I
Ground.
2
IN
I
Power supply input.
Input terminal to the switch and power supply input terminal of the internal circuit.
3, 4
EN
I
Enable input. Switch on at High level.
High level input > 2.0V, Low level input < 0.8V
5, 8
/OC
O
Error flag output. Low at over current, thermal shutdown.
Open drain output.
6, 7
OUT
O
Switch output.
○BD2056AFJ
Pin No.
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Pin function
Ground.
Power supply input.
Input terminal to the switch and power supply input terminal of the internal circuit.
Enable input.
Switch on at Low level.
High level input > 2.0V, Low level input < 0.8V.
Error flag output. Low at over current, thermal shutdown.
Open drain output.
Switch output.
Pin function
7/13
2009.05 - Rev.A
Technical Note
BD2046AFJ, BD2056AFJ
I/O circuit
Symbol
EN1(/EN1)
EN2(/EN2)
Pin No
Equivalent circuit
/EN1(EN1)
/EN2(EN2)
3, 4
/OC1
/OC2
/OC1
/OC2
OUT1
OUT2
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5, 8
OUT1
OUT2
6, 7
8/13
2009.05 - Rev.A
Technical Note
BD2046AFJ, BD2056AFJ
Functional description
1. Switch operation
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. And the IN
terminal is used also as power source input to internal control circuit.
When the switch is turned on from EN/EN control input, IN terminal and OUT terminal are connected by a 100mΩ switch.
In on status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of IN terminal,
current flows from OUT terminal to IN terminal.
Since a parasitic diode between the drain and the source of switch MOSFET is canceled, in the off status, it is possible to
prevent current from flowing reversely from OUT to IN.
2. Thermal shutdown circuit (TSD)
Thermal shut down circuit have dual thermal shutdown threshold. Since thermal shutdown works at a lower junction
temperature when an overcurrent occurs, only the switch of an overcurrent state become off and error flag is output.
Thermal shut down action has hysteresis. Therefore, when the junction temperature goes down, switch on and error flag
output automatically recover. However, until cause of junction temperature increase such as output shortcircuit is removed
or the switch is turned off, thermal shut down detection and recovery are repeated. The thermal shut down circuit works
when the switch of either OUT1 or OUT2 is on (EN,/EN signal is active).
3. Over current detection (OCD)
The over current detection circuit limits current (ISC) and outputs error flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. There are three types of response against over current. The over current detection
circuit works when the switch is on (EN,/EN signal is active).
3-1. When the switch is turned on while the output is in shortcircuit status
When the switch is turned on while the output is in shortcircuit status or so, the switch gets in current limit status soon.
3-2. When the output shortcircuits while the switch is on
When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the
over current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out.
3-3. When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the over
current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under voltage lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.) while
the switch turns on, then UVLO shuts off the switch. UVLO has hysteresis of a 100mV(Typ).
Under voltage lockout circuit works when the switch of either OUT1 or OUT2 is on (EN,/EN signal is active).
5. Error flag (/OC) output
Error flag output is N-MOS open drain output. At detection of over current, thermal shutdown, low level is output.
Over current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at
switch on, hot plug from being informed to outside.
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2009.05 - Rev.A
Technical Note
BD2046AFJ, BD2056AFJ
V/EN
Output shortcircuit
VOUT
Thermal shut down
IOUT
V/OC
delay
Fig.38 Over current detection, thermal shutdown timing
(BD2046AFJ)
VEN
Output shortcircuit
VOUT
Thermal shut down
IOUT
V/OC
delay
Fig.39 Over current detection, thermal shutdown timing
(BD2056AFJ)
Typical application circuit
5V(Typ)
10k~100k
10k~100k
VBUS
IN
OUT
ON/OFF
GND
Ferrite
Beads
/OC1
D+
CL
OC
CIN
DRegulator
GND
OC
ON/OFF
IN
/EN1
(EN1)
/EN2
(EN2)
OUT1
OUT2
Data
/OC2
CL
BD2046AFJ/56AFJ
Data
USB Controller
Data
Fig.40 Typical application circuit
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10/13
2009.05 - Rev.A
Technical Note
BD2046AFJ, BD2056AFJ
Application information
When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC, and
may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor by IN terminal and GND
terminal of IC. 1uF or higher is recommended.
Pull up /OC output by resistance 10kΩ ~ 100kΩ.
Set up value which satisfies the application as CL and Ferrite Beads.
This system connection diagram doesn’t guarantee operating as the application.
The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account
external parts or dispersion of IC including not only static characteristics but also transient characteristics.
This system connection diagram doesn’t guarantee operating as the application.
The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account
external parts or dispersion of IC including not only static characteristics but also transient characteristics.
Power dissipation character
(SOP-J8)
600
POWER DISSIPATION: Pd[mW]
500
400
300
200
100
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE: Ta [℃]
Fig.41 Power dissipation curve (Pd-Ta Curve)
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11/13
2009.05 - Rev.A
Technical Note
BD2046AFJ, BD2056AFJ
Notes for use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due
to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the
same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used
present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig.
After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition,
for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the
transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a
voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to
the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a
switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible,
is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit
operating or use the LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use.
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© 2009 ROHM Co., Ltd. All rights reserved.
12/13
2009.05 - Rev.A
Technical Note
BD2046AFJ, BD2056AFJ
Ordering part number
B
D
2
Part No.
0
4
6
A
F
Part No.
2046A
2056A
J
Package
FJ: SOP-J8
-
E
2
Packaging and forming specification
E2: Embossed tape and reel
(SOP-J8)
SOP-J8
<Tape and Reel information>
4.9±0.2
(MAX 5.25 include BURR)
+6°
4° −4°
6
5
0.45MIN
7
3.9±0.2
6.0±0.3
8
1
2
3
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.545
0.2±0.1
0.175
1.375±0.1
S
1.27
0.42±0.1
0.1 S
1pin
(Unit : mm)
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© 2009 ROHM Co., Ltd. All rights reserved.
Reel
13/13
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2009.05 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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© 2009 ROHM Co., Ltd. All rights reserved.
R0039A
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