Mitsubishi FU-48SDF-Y37M98F 1.3 um dfb-ld module with singlemode fiber pigtail Datasheet

JAN06 (1/5)
MITSUBISHI (OPTICAL DEVICES)
FU-48SDF-x37M9yF
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
DESCRIPTION
Module type FU-48SDF-x37M9yF is a cooled butterfly
packaged 1.3μm DFB-LD module with single-mode
optical fiber.
This module is suitable for a light source of analog
applications such repeater systems.
FEATURES
• High liniality multi quantum wells (MQW) DFB-LD
• Emission wavelength is in 1.3μm band
• Built-in optical isolator
• Thermo electric cooler for laser temperature control
• With photodiode for optical output monitor
• RoHS (2002/95/EC) compliant
APPLICATION
Repeater systems
Radio on fiber
Analog transmission systems
ABSOLUTE MAXIMUM RATINGS (Tld=25°C)
Parameter
Laser diode
Optical output power from fiber end
Symbol
Pf
Conditions
Rating
Unit
CW
-37M92
10
mW
-37M96
20
-37M98
Forward current
If
CW
150
mA
Reverse voltage
Vrl
2
V
Photodiode
Reverse voltage
Vrd
20
V
Forward current
Ifd
2
mA
Cooler
Voltage
Vpem
2.4
V
(Note)
Current
Ipem
1.2
A
Operating case temperature
Tc
-20 to 65
°C
Storage temperature
Tstg
-40 to 70
°C
Note. Even if the thermo-electric cooler (TEC) is operated within the rated conditions, uncontrolled current loading or
operation without heat sink may easily damage the module by exceeding the storage temperature range. Thermistor
resistance should be properly monitored by the feedback circuit during TEC operation to avoid the catastrophic
damage.
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
MITSUBISHI CONFIDENTIAL
JAN06 (2/5)
MITSUBISHI (OPTICAL DEVICES)
FU-48SDF-x37M9yF
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
(Tld=25°C,Tc=25°C, unless otherwise noted)
Condition
Limits
Min.
Typ.
CW
-37M92
10
-37M96
-37M98
15
CW
-37M92
40
-37M96
43
-37M98
54
Imod = Iop-Ith
-37M92
30
-37M96
33
-37M98
39
CW, If = Iop (Note1)
1.3
CW, If = Iop
-37M92
4
-37M96
8
-37M98
12
CW, If = Iop
1290
1310
CW, If = Iop
30
35
ELECTRICAL/OPTICAL CHARACTERISTICS
Parameter
Symbol
Threshold Current
Ith
Operating Current
Iop
Modulation Current
Imod
Operating Voltage
Output Power from Fiber
End
Vop
Pf
Central Wavelength
Side Mode Suppression
Ratio
Cut-off Frequency
λc
Sr
Frequency response ripple
rd
3 order distortion
fc(-1.5dB)
fc(-3dB)
ΔS21
D3
RIN (Note 3)
Tracking Error(Note 4)
Differential Efficiency
Nr
Er
η
If = Iop
If = Iop
If = Iop, f = 1900~2100MHz
2-tone test
(Note 2) , f1,f2 =
2000±3MHz, m = 21%/carrier,
If(average) = Iop
CW, If = Iop, f = 2000MHz (Note 2)
Tc = -20~65°C, APC, ATC
If(average) = Iop
-37M92
-37M96
-37M98
CW, If = Iop, Vrd = 5V
Vrd = 5V
Vrd = 5V, f = 1MHz
Tc = 0 to 65°C
Units
Max.
20
25
55
70
85
40
50
60
1.8
1330
-
mA
mA
mA
V
mW
nm
dB
2
3
-0.5
-
3
4
-75
0.5
-65
GHz
0.1
0.16
0.2
0.1
25
-160
0.3
0.13
0.24
0.31
0.1
10
37
-155
0.5
0.4
0.4
0.45
3
1
20
-
dB/Hz
dB
mW/m
A
Limits
Typ.
10
3950
Max.
10.5
-
KΩ
K
0.6
1.2
1
2
K
A
V
dB
dBc
Monitor Current
Imon
mA
Dark current( PD )
Id
mA
Capacitance ( PD )
Ct
pF
Isolation
Iso
dB
Note 1. If : LD forward current
Note 2. Optical return loss of the connectors should be greater than 40dB in order to get the specified performance.
Note 3. Relative intensity noise does not include shot noise of receiver.
Note 4. Er = MAX |10* log (Pf/Pf(25°C))|
THERMAL CHARACTERISTICS (Tld=25°C,Tc=-20~+65°C)
Parameter
Symbol
Conditions
Thermistor resistance
B constant of thermistor
resistance
Cooling capacity
Cooler current
Cooler voltage
Rth
B
Tld=25°C
-
Min.
9.5
-
ΔT
Ipe
Vpe
Tc=65°C
ΔT=40K
ΔT=40K
40
-
Units
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
MITSUBISHI CONFIDENTIAL
JAN06 (3/5)
MITSUBISHI (OPTICAL DEVICES)
FU-48SDF-x37M9yF
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
OPTICAL FIBER SPECIFICATION
Parameter
Type
Mode filed diameter
Cladding diameter
Jacket diameter
Connector type
Limits
SM
9.5±1
125±2
900±100
Pigtail without connector(or with SC/PC for test)
(FU-48SDF-37M92/96/98)
SC/PC
(FU-48SDF-W37M92/96/98)
FC/PC
(FU-48SDF-V37M92/96/98)
Lfiber = 1100±100
(Lfiber is defined in the outline drawing.)
>45
Fiber pintail length
Optical return loss of the
connector
Unit
μm
μm
μm
-
mm
dB
FC/APC CONNECTOR SPECIFICATION
(1) FC/APC CONNECTOR PARTS
Part
FC connector
Ferrule
Maker
SEIKOH
GIKEN
Part No.
PF11A
FF3A
(2) FERRULE ENDFACE GEOMETRY
Reference
EB
EO
rEP
EQ
Dimensions
8°
50μmMAX
5~12mm
±0.1μm
ORDERING INFORMATION
FU - 48SDF – _ 37M9 _ F
2
6
8
W
L
Y
Output Power Range
4mW
8mW
12mW
Connector
SC/PC
SC/APC
FC/APC
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
MITSUBISHI CONFIDENTIAL
JAN06 (4/5)
MITSUBISHI (OPTICAL DEVICES)
FU-48SDF-x37M9yF
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
OUTLINE DIAGRAM
Unless otherwise noted +/-0.5mm
(Unit : mm)
FU-48SDF-x37M9yF
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
MITSUBISHI CONFIDENTIAL
JAN06 (5/5)
MITSUBISHI (OPTICAL DEVICES)
FU-48SDF-x37M9yF
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
Safety Cautions for Use of Optoelectronic Devices
General:
Although the manufacturer is always striving to improve the reliability of its product, problems and errors may occur with
semiconductor products. Therefore, the user's products are required to be designed with full safety regard to prevent any accidents that
results in injury, death, fire or environmental damage even when semiconductor products happen to error. Especially it is recommended
to take in consideration about redundancy, fire prevention, error prevention safeguards. And the following requirements must be strictly
observed.
Warning!
1. Eye safety : Seminductor laser radiates laser light during operation. Laser light is very dangerous when shot directly into human
eyes. Don't look at laser light directly, or through optics such as a lens. The laser light should be observed using the ITV camera, IRviewer, or other appropriate instruments.
2. Product handling : The product contains GaAs (gallium arsenide). It is safe for regular use, but harmful to the human body if
made into powder or steam. Be sure to avoid dangerous process like smashing, burning, chemical etching. Never put this product in
one's mouth or swallow it.
3. Product disposal : This product must be disposed of as special industrial waste. It is necessary to separate it from general
industrial waste and general garbage.
Handling Cautions for Optoelectronic Devices
1. General:
(1) The products described in this specification are designed and manufactured for use in general communication systems or
electronic devices, unless their applications or reliability are otherwise specified. Therefore, they are not designed or manufactured for
installation in devices or systems that may affect human life or that are used in social infrastructure requiring high reliability.
(2) When the customer is considering to use the products in special applications, such as transportation systems (automobiles, trains,
vessels), medical equipments, aerospace, nuclear power control, and submarine repeaters or systems, please contact Mitsubishi
Electric or an authorized distributor.
2. Shipping Conditions:
(1) During shipment, place the packing boxes in the correct direction, and fix them firmly to keep them immovable. Placing the boxes
upside down, tilting, or applying abnormal pressure onto them may cause deformation in the electrode terminals, breaking of optical
fiber, or other problems.
(2) Never throw or drop the packing boxes. Hard impact on the boxes may cause break of the devices.
(3) Take strict precautions to keep the devices dry when shipping under rain or snow.
3. Storage Conditions:
When storing the products, it is recommended to store them following the conditions described below without opening the packing. Not
taking enough care in storing may result in defects in electrical characteristics, soldering quality, visual appearance, and so on. The
main points are described below (if special storage conditions are given to the product in the specification sheet, they have priority over
the following general cautions):
(1) Appropriate temperature and humidity conditions, i.e., temperature range between 5~30°C, and humidity between 40~60 percent
RH, should be maintained in storage locations. Controlling the temperature and humidity within this range is particularly important in
case of long-term storage for six months or more.
(2) The atmosphere should be particularly free from toxic gases and dust.
(3) Do not apply any load on the product.
(4) Do not cut or bend the leads of the devices which are to be stored. This is to prevent corrosion in the cut or bent part of the lead
causing soldering problems in the customer’s assembling process.
(5) Sudden change in temperature may cause condensation in the product or packing, therefore, such locations should be avoided for
storing. Temperature in storage locations should be stable.
(6) When storing ceramic package products for extended periods of time, the leads may turn reddish due to reaction with sulfur in the
atmosphere.
(7) Storage conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products
require stricter controls than package sealed products.
4. Design Conditions and Environment under Use:
(1) Avoid use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the
generation of corrosive gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will not only significantly
lower the reliability, but also may lead to serious accidents.
(2) Operation in excess of the absolute maximum ratings can cause permanent damage to the device. The customers are requested
to design not to exceed those ratings even for a short time.
5. ESD Safety Cautions:
The optoelectronic devices are sensitive to static electricity (ESD, electro-static discharge). The product can be broken by ESD. When
handling this product, please observe the following countermeasures:
<Countermeasures against Static Electricity and Surge>
To prevent break of devices by static electricity or surge, please adopt the following countermeasures in the assembly line:
(1) Ground all equipments, machinery jigs, and tools in the process line with earth wires installed in them. Take particular care with hot
plates, solder irons and other items for which the commercial power supplies are prone to leakage.
(2) Workers should always use earth bands. Use of antistatic clothing, electric conductive shoes, and other safety equipment while at
work is highly recommended.
(3) Use conductive materials for this product’s container, etc.
(4) It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in work
area, etc.
(5) When mounting this product in parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.),
pay close attention to the static electricity in those parts. ESD may damage the product.
(6) Humidity in working environment should be controlled to be 40 percent RH or higher.
These countermeasures are most general, and there is a need to carefully confirm the line before starting mass production using this
product (in the trial production, etc.). It is extremely important to prevent surge, eliminate it rapidly, and prevent it from spreading.
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
MITSUBISHI CONFIDENTIAL
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