ON MRA4005T3G Surface mount standard recovery power rectifier Datasheet

MRA4003T3G Series,
NRVA4003T3G Series
Surface Mount Standard
Recovery Power Rectifier
SMA Power Surface Mount Package
Features construction with glass passivation. Ideally suited for
surface mounted automotive applications.
Features
• Compact Package with J−Bend Leads Ideal for Automated Handling
• Stable, High Temperature, Glass Passivated Junction
• NRVA Prefix for Automotive and Other Applications Requiring
•
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STANDARD RECOVERY
RECTIFIERS
1.0 AMPERES
300−1000 VOLTS
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant*
Mechanical Characteristics
CASE 403D
SMA
• Case: Molded Epoxy
Epoxy meets UL 94 V−0 @ 0.125 in
• Weight: 70 mg (Approximately)
• Finish: All External Surfaces are Corrosion Resistant and Terminal
•
•
•
•
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 seconds in Solder Bath
Polarity: Band in Plastic Body Indicates Cathode Lead
Marking: MRA4003T3G = R13
MRA4004T3G = R14
MRA4005T1G = R15
MRA4005T3G = R15
MRA4006T3G = R16
MRA4007T3G = R17
NRVA4003T3G = R13
NRVA4004T3G = R14
NRVA4005T3G = R15
NRVA4006T3G = R16
NRVA4007T3G = R17
ESD Rating:
♦ Human Body Model 3A
♦ Machine Model C
MARKING DIAGRAM
R1x
FAYWWG
R1x = Specific Device Code
F
= Wafer Source
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the ordering
information section on page 4 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2016
November, 2016 − Rev. 11
1
Publication Order Number:
MRA4003T3/D
MRA4003T3G Series, NRVA4003T3G Series
MAXIMUM RATINGS
Value
Rating
Symbol
MRA4003
MRA4004/
NRVA4004
VRRM
VRWM
VR
300
400
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Avg. Rectified Forward Current
(At Rated VR, TL = 150°C)
MRA4005/
NRVA4005
MRA4006/
NRVA4006
MRA4007/
NRVA4007
Unit
600
800
1000
Volts
IO
Amp
1
Peak Repetitive Forward Current
(At Rated VR, Square Wave,
20 kHz, TL = 150°C)
IFRM
Non−Repetitive Peak Surge Current
(Surge applied at rated load
conditions, halfwave, single phase,
60 Hz)
IFSM
Amps
2
Amps
30
Junction Operating Temperature Range
TJ
−55 to 150
°C
Storage Temperature Range
Tstg
−55 to 175
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
RθJL
RθJA
16.2
88.3
°C/W
Thermal Resistance, Junction−to−Lead (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 2)
ELECTRICAL CHARACTERISTICS
Value
Characteristic
Symbol
Maximum Instantaneous Forward Voltage (Note 3)
(IF = 1 A)
(IF = 2 A)
VF
Maximum Instantaneous Reverse Current (at rated DC voltage)
IR
TJ = 25°C
TJ = 100°C
1.1
1.18
1.04
1.12
10
50
Unit
Volts
mA
100E−6
10
TJ = 150°C
1.0
−40°C
0.1
100°C
25°C
IR , REVERSE CURRENT (AMPS)
IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
1. Minimum Pad Size
2. 1 inch Pad Size
3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2%.
TJ = 150°C
10E−6
1.0E−6
100°C
100E−9
0.01
25°C
10E−9
1.0E−9
0
0.4
0.6
0.8
1.0
1.2
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
50
100
150
200
250 300
350
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Typical Reverse Current
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2
400
IF(AV), AVERAGE FORWARD CURRENT (A)
MRA4003T3G Series, NRVA4003T3G Series
PFO , AVERAGE POWER DISSIPATION (WATTS)
2.0
DC
1.5
Square Wave
1.0
0.5
0
50
60
70
80
90
100 110 120 130 140 150
1.8
dc
1.6
1.4
Square Wave
1.2
Ipk/IO = p
1.0
5
0.8
10
0.6
20
0.4
0.2
0
0
0.5
1.0
1.5
IO, AVERAGE FORWARD CURRENT (AMPS)
TL, LEAD TEMPERATURE (°C)
Figure 3. Current Derating
2.0
Figure 4. Forward Power Dissipation per Leg
C, CAPACITANCE (pF)
100
TJ = 25°C
10
1
0
20
40 60 80 100 120 140 160
VR, REVERSE VOLTAGE (VOLTS)
180 200
r(t), TRANSIENT THERMAL RESISTANCE
(NORMALIZED)
Figure 5. Capacitance
1.0
RqJL (Min Pad Board)
RqJA (1 inch Pad Board)
0.1
RqJL(t) = RqJL * r(t)
0.01
0.001
10E−6
100E−6
1E−3
10E−3
100E−3
1E+0
t, TIME (s)
Figure 6. Thermal Response
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3
10E+0
100E+0
1E+3
10E+3
MRA4003T3G Series, NRVA4003T3G Series
ORDERING INFORMATION
Device
Package
Shipping†
MRA4003T3G
5,000 / Tape & Reel
MRA4004T3G
MRA4005T1G
1,500 / Tape & Reel
MRA4005T3G
MRA4006T3G
MRA4007T3G
5,000 / Tape & Reel
SMA
(Pb−Free)
NRVA4003T3G*
NRVA4004T3G*
NRVA4005T3G*
5,000 / Tape & Reel
NRVA4006T3G*
NRVA4007T3G*
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NRVA Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable.
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4
MRA4003T3G Series, NRVA4003T3G Series
PACKAGE DIMENSIONS
SMA
CASE 403D−02
ISSUE G
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L.
E
b
DIM
A
A1
b
c
D
E
HE
L
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
MIN
1.97
0.05
1.27
0.15
2.29
4.06
4.83
0.76
MILLIMETERS
NOM
MAX
2.10
2.20
0.10
0.20
1.45
1.63
0.28
0.41
2.60
2.92
4.32
4.57
5.21
5.59
1.14
1.52
MIN
0.078
0.002
0.050
0.006
0.090
0.160
0.190
0.030
INCHES
NOM
0.083
0.004
0.057
0.011
0.103
0.170
0.205
0.045
MAX
0.087
0.008
0.064
0.016
0.115
0.180
0.220
0.060
A
L
A1
c
SOLDERING FOOTPRINT*
4.0
0.157
2.0
0.0787
2.0
0.0787
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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MRA4003T3/D
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