OKI MSM9836-XXX Voice synthesis ic with built-in mask rom Datasheet

E2D0082-29-93
¡ Semiconductor
MSM9836-xxx
¡ Semiconductor
This version:
Sep. 1999
MSM9836-xxx
Previous version: May. 1997
Voice Synthesis IC with Built-in Mask ROM
GENERAL DESCRIPTION
The MSM9836 is a PCM voice synthesis IC with built-in 3-Mbit mask ROM, D/A converter, and
low-pass filter (LPF).
The MSM9836 is specifically designed for applications that use a microcontroller.
For this reason, functional support for standalone mode and RC oscillation has been omitted
from the MSM9805, and the ROM capacity and the number of phrases have been increased.
By using Oki's Sound Analysis and Editing Tool, ROM data such as Phrase Control Table can be
easily set, created, edited, and evaluated.
The following table lists the functional differences between the MSM9836 and the MSM9805.
MSM9836
ROM Capacity
Interface
Oscillation
Maximum Number of
Phrases
Status Signal
MSM9805
3 Mbits
2 Mbits
Microcontroller
Microcontroller/Standalone
Ceramic
Ceramic/RC
127
63
NAR/BUSY simultaneous output
Only NAR output when operating
in microcontroller interface mode
FEATURES
• 8-bit OKI nonlinear PCM method/8-bit Straight PCM method
• Sampling frequency
: 4.0 kHz/5.3 kHz/6.4 kHz/8.0 kHz/10.6 kHz/12.8 kHz/
(Can be set for each phrase)
16.0 kHz
• ROM capacity
: 3 Mbits
• Maximum playback time
: 97.7 sec (fSAM = 4.0 kHz)
73.7 sec (fSAM = 5.3 kHz)
61.0 sec (fSAM = 6.4 kHz)
48.8 sec (fSAM = 8.0 kHz)
• Master clock frequency
: 4.096 MHz
(Ceramic oscillation/external
clock input)
• Edit ROM function
• Maximum number of phrases
: 127
• Built-in current mode 10-bit D/A converter
• Built-in low-pass filter
• Power supply voltage
: +2.0 to +5.5 V
• Package :
24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name: MSM9836-xxxGS-K)
xxx indicates code number.
Chip
1/23
7
3-Mbit ROM
(Including 17 Kbits of
Edit ROM & Address ROM)
19-Bit Multiplexer
¡ Semiconductor
Address
Controller
BLOCK DIAGRAM
I6
I5
I4
I3
I2
I1
I0
8
DATA
Controller
TEST
ST
19-Bit
Address Counter
I/O
Interface
PCM
Synthesizer
NAR
BUSY
10
10-Bit
DAC
&
LPF
XT
XT
Crystal
Circuit
RESET
VDD
GND
VREF
AOUT
MSM9836-xxx
2/23
EXTCK
Timing Controller
¡ Semiconductor
MSM9836-xxx
PIN CONFIGURATION (TOP VIEW)
VDD
1
24 AOUT
XT
2
23 VREF
XT
3
22 GND
NC
4
21 NC
TEST
5
20 NAR
BUSY
6
19 NC
EXTCK
7
18 I6
ST
8
17 RESET
NC
9
16 NC
I0 10
15 I5
I1 11
14 I4
I2 12
13 I3
NC : No connection
24-Pin Plastic SOP
3/23
¡ Semiconductor
MSM9836-xxx
PIN DESCRIPTIONS
Pin
Symbol
Description
Type
The IC enters the standby state if this pin is set to "L" level. At this time, oscillation
17
RESET
I
stops and AOUT output becomes GND level, then the IC returns to the initial state.
Apply a "L" pulse upon power-on.
This pin has an internal pull-up resistor.
Signal output pin that indicates whether the 7-bit LATCH (see Block Diagram) is idle.
20
NAR
O
7
EXTCK
I
NAR at "H" level indicates that the LATCH is empty and ST input is enabled.
Ceramic oscillator input/external clock input switching pin. Set to "H" level if ceramic
oscillation is used. Set to "L" level if external clock is used.
Volume setting pin. If this pin is set to GND level, the maximum current is forced in,
23
VREF
I
and if set to VDD level, the minimum current is forced in.
An approx. 10 kW pull-down resistor is internally connected to this pin during operation.
Voice output pin.
24
AOUT
O
The voice signals are output as current changes. A "L" level signal is output through
22
GND
—
Ground pin.
1
VDD
—
2
XT
I
3
XT
O
this pin in standby state.
Power supply pin. Insert a bypass capacitor of 0.1 mF or more between this pin and
the GND pin.
Ceramic oscillator connection pin when ceramic oscillation is selected.
Input from this pin if external clock is used.
Ceramic oscillator connection pin when ceramic oscillation is selected.
Leave this pin open if external clock is used.
A "L" level signal is output through this pin in standby state.
5
TEST
I
Normally leave this pin open. This pin is used only for testing the internal circuit.
Voice synthesis starts at fall of ST, and addresses I0 to I6 are fetched at rise of ST.
8
ST
I
Input ST when NAR, the status signal, is at "H" level.
This pin has internal pull-up resistor.
10-15, 18
I0 - I6
I
6
BUSY
O
Phrase input pins corresponding to playback sound.
This pin is at "H" level after reset is input. A "L" level signal is output through this pin
for the time during which voice is being played.
4/23
¡ Semiconductor
MSM9836-xxx
ABSOLUTE MAXIMUM RATINGS
(GND=0V)
Parameter
Power Supply Voltage
Symbol
Condition
VDD
Input Voltage
VIN
Storage Temperature
TSTG
Ta=25°C
Rating
Unit
–0.3 to +7.0
V
–0.3 to VDD + 0.3
V
–55 to +150
°C
—
RECOMMENDED OPERATING CONDITIONS
(GND=0 V)
Symbol
Condition
Range
Unit
Power Supply Voltage
Parameter
VDD
—
2.0 to 5.5
V
Operating Temperature
Top
—
Original Oscillation Frequency
fOSC
When crystal is selected
–40 to +85
°C
Min.
Typ.
Max.
3.5
4.096
4.5
MHz
ELECTRICAL CHARACTERISTICS
DC Characteristics (1)
(VDD=5.0 V, GND=0 V, Ta=–40 to +85°C, unless otherwise specified)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
"H" Input Voltage
VIH
—
4.2
—
—
V
"L" Input Voltage
VIL
—
—
—
0.8
V
"H" Output Voltage
VOH
IOH=–1 mA
4.6
—
—
V
"L" Output Voltage
VOL
IOL=2 mA
—
—
0.4
V
"H" Input Current 1
IIH1
VIH=VDD
—
—
10
µA
"H" Input Current 2
IIH2
—
—
15
µA
Applies to XT pin only.
VIH=VDD
"L" Input Current 1
IIL1
VIL=GND
–10
—
—
µA
"L" Input Current 2 (*1)
IIL2
Internal pull-up resistor
–200
–90
–30
µA
Dynamic Supply Current 1 (*2)
IDD1
VREF=VDD, AOUT voltage=0V
—
0.4
1
mA
—
—
16
mA
Ta=–40 to +70°C
—
—
10
µA
Ta=–40 to +85°C
—
—
50
µA
6
9.5
15
mA
7
10
13
kW
Dynamic Supply Current 2 (*3)
IDD2
Standby Current
IDS
AOUT Output Current
IAOUT
VREF Pin Pull-Down Resistance
RVREF
At maximum output current
VREF=GND, AOUT voltage=0V
At maximum output current
VREF=VDD, AOUT voltage=0V
—
*1 Applicable to RESET, ST
*2 Dynamic supply current excluding DAC output current
*3 Dynamic supply current at maximum output current
5/23
¡ Semiconductor
MSM9836-xxx
DC Characteristics (2)
(VDD=3.1 V, GND=0 V, Ta=–40 to +85°C, unless otherwise specified)
Symbol
Condition
Min.
Typ.
Max.
Unit
"H" Input Voltage
VIH
—
2.7
—
—
V
"L" Input Voltage
VIL
—
—
—
0.5
V
Parameter
"H" Output Voltage
VOH
IOH=–1 mA
2.6
—
—
V
"L" Output Voltage
VOL
IOL=2 mA
—
—
0.4
V
"H" Input Current 1
IIH1
VIH=VDD
—
—
10
µA
—
—
15
µA
VIL=GND
–10
—
—
µA
"H" Input Current 2
IIH2
"L" Input Current 1
IIL1
Applies to XT pin only.
VIH=VDD
"L" Input Current 2 (*1)
IIL2
Internal pull-up resistor
–100
–30
–10
µA
Dynamic Supply Current 1 (*2)
IDD1
VREF=VDD, AOUT voltage=0V
—
0.15
0.5
mA
Dynamic Supply Current 2 (*3)
IDD2
—
—
5.5
mA
Standby Current
IDS
Ta=–40 to +70°C
—
—
5
µA
Ta=–40 to +85°C
—
—
20
µA
1.4
3.2
5
mA
7
10
13
kW
AOUT Output Current
IAOUT
VREF Pin Pull-Down Resistance
RVREF
At maximum output current
VREF=GND, AOUT voltage=0V
At maximum output current
VREF=VDD, AOUT voltage=0V
—
*1 Applicable to RESET, ST
*2 Dynamic supply current excluding DAC output current
*3 Dynamic supply current at maximum output current
6/23
¡ Semiconductor
MSM9836-xxx
AC Characteristics
(VDD=5.0 V, GND=0 V, fOSC=4.096 MHz, Ta=–40 to +85°C)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Master Clock Duty Cycle
fduty
—
40
50
60
%
RESET Input Pulse Width
tw(RST)
—
10
—
—
µs
RESET Input Time After Power-on
tD(RST)
—
0
—
—
µs
ST Signal Setup Time
tSTP
At power-on
1
—
—
µs
ST Input Pulse Width
t(ST)
—
0.35
—
2000
µs
The ST-ST Pulse Interval
tSS
Upon entering the stop code (*4)
40
—
—
µs
Data Setup Time
tDW
—
1
—
—
µs
Data Hold Time
tWD
—
1
—
—
µs
NAR Output Time 1
tSNS
fSAM=8 kHz
—
—
10
µs
NAR Output Time 2
tNAA
fSAM=8 kHz
(*4)
350
375
400
µs
NAR Output Time 3
tNAB
fSAM=8 kHz
(*4)
315
440
500
µs
NAR Output Time 4
tNAC
fSAM=8 kHz
(*4)
350
375
500
µs
BUSY Output Time 1
tSBS
fSAM=8 kHz
—
—
10
µs
BUSY Output Time 2
tBSYA
fSAM=8 kHz
(*4)
350
375
400
µs
tDAR, tDAF
—
(*4)
60
64
68
ms
200
250
300
ms
350
375
500
µs
D/A Converter Change Time
Standby Transition Time
(at end of voice output)
Silence Time Between Phrases
tSTB
—
tBLN
fSAM=8 kHz
(*4)
(*4)
*4 Proportional to master the periods of oscillation frequency fOSC1 and fOSC2.
The rated values show values when the standard master oscillation frequency is used.
7/23
¡ Semiconductor
MSM9836-xxx
TIMING DIAGRAMS
,
,,,
,
1. AC Characteristics at Power-On
VDDMin
VDD
tD(RST)
RESET (I)
tW(RST)
tSTP
ST (I)
NAR (O)
BUSY (O)
2. AC Characteristics in Standby Status and when the IC is Activated
I6 to I0 (I)
t(ST)
ST ( I )
tDW
tWD
NAR (O)
tSNS
BUSY (O)
tSBS
AOUT (O)
tBSYA
tNAA
tDAR
Oscillation start
Voice playback
tSTB
Standby transtion time
tDAF
D/A converter change time
8/23
1st phrase address
2nd phrase address
3rd phrase address
¡ Semiconductor
3. Playback Timing
I6 to I0 (I)
ST ( I )
tNAC
NAR (O)
BUSY (O)
AOUT (O)
tBSYA
tNAB
tDAR
1st phrase
playback
2nd phrase
playback
3rd phrase
playback
tBLN
Oscillation start
The pins I6 to I0 are used to enter the address of a phrase
subject to voice synthesis. Voice synthesis starts by entering
the ST signal during addressing.
MSM9836-xxx
9/23
¡ Semiconductor
MSM9836-xxx
4. Stop Code Input Timing
I6 to I0 (I)
"0000000"
User phrase
tSS
ST ( I )
NAR (O)
BUSY (O)
AOUT (O)
Voice stop
When I6-I0 are set to "0000000" during voice playback (during the output of "L" level at the BUSY
pin), and a ST signal is input, playback stops regardless of whether NAR is at "H" or "L" level and
AOUT becomes 1/2 IAOUT. Stop code becomes valid at the falling edge of ST.
The stop code does not initialize internal units but only stops playback. To initialize an internal
register, use the RESET pin.
10/23
¡ Semiconductor
MSM9836-xxx
1. Sampling Frequency
As shown in Table 1.1, 7 sampling frequencies are available.
A sampling frequency can be selected and assigned to each phrase in ROM data.
Table 1.1 Sampling Frequency
Sampling Frequency
At standard
Frequency diving ratio
oscillation frequency
4.0 kHz
fOSC1/1024
5.3 kHz
fOSC1/768
6.4 kHz
fOSC1/640
8.0 kHz
fOSC1/512
10.6 kHz
fOSC1/384
12.8 kHz
fOSC1/320
16.0 kHz
fOSC1/256
2. Recording/Playback Time
Figure 2.1 below shows memory allocation of the on-chip Mask ROM. About 17 Kbits of data area
is allocated for the Phrase Control Table, Phrase Data Control and Test Data.
Therefore, actual data area for storing sound data equals the total Mask ROM capacity minus 17
Kbits.
Phrase Control Table Area
8K bit
Pharase Data Control Area
8K bit
Test Data Area
1K bit
On-chip Mask ROM Capacity
3072K bit
User's Area
3055K bit
Figure 2.1 Memory Allocation of On-chip Mask ROM
11/23
¡ Semiconductor
MSM9836-xxx
The playback time is obtained by dividing the memory capacity by the bit rate.
The playback time for 8-bit PCM algorithm is obrained by using the following equation.
Memory capacity [bit]
Playback time [sec] =
Bit rate [bps]
Memory capacity [bit]
=
Sampling frequency [Hz] ¥ 8 [bit]
For example, if all phrases are stored in the MSM9836 at 8 kHz sampling frequency, the
maximum playback time is as follows.
Playback time =
(3072–17) ¥ 1024 [bit]
8000 [Hz] ¥ 8 [bit]
= 48.8 [sec]
Table 2.1 Maximum playback time
Model
MSM9836
ROM capacity
User's area
3M bit
3055K bit
Maximum playback time (sec)
fSAM=4.0kHz fSAM=6.4kHz fSAM=8.0kHz fSAM=16.0kHz
97.7
61.0
48.8
24.4
3. Playback Method
This IC provides two kinds of playback methods, non-linear PCM algorithm and straight PCM
algorithm. When the 8-bit non-linear PCM algorithm is selected, sound quality can be improved
because a resolution equivalent to 10-bit straight PCM is available around the waveform center.
You can select either non-linear PCM algorithm or straight PCM algorithm for each phrase. Table
3.1 shows the relationship between playback methods and applicable sounds. It is recommended to evaluate the sound quality before actual use.
Table 3.1 Relationship between playback methods and applicable sounds
Playback method
Applicable sound
8-bit non-linear PCM algorithm Human voice
8-bit straight PCM algorithm
BEEP tone, sound effects
12/23
¡ Semiconductor
MSM9836-xxx
4. Phrase Control Table
Because the LSI contains the Phrase Control Table, it is possible to play back multiple phrases in
succession by a single easy control operation like controlling a single regular phrase playback.
Up to 8 combined phrases including a silence can be registered in a single address in the Phrase
Control Table.
Further, you can use the maximum memory space for data storage because it is not required to
have the same phrase data.
To show an example, let's assume that your application needs to speak two similar sentences, "It
is fine today" and "It is rainy today." The two sentences have the common words "it", "is" and
"today". What you have to do is to prepare these common sound data, not in sentences but in
words, and to store each combined phrase data in Phrase Control Table as shown in Table 4.1 and
Figure 4.1
Multiple phrases can be played continuously merely by specifying a desired phrase using an X
address. For an example from Table 4.1, when address "01" is specified, "It is fine today" is played,
and when address"02" is specified, "It is rainy" is played.
Phrase Control Table, a silence can be inserted without using the User's Area.
Minimum time for silence
Maximum time for silence
Time unit for setting up silence
32 ms
4064 ms
32 ms
Table 4.1 Matrix of the Phrase Control Table
No.
X-Address
Y-Address
(HEX)
(Up to 8 phrases)
Sound Data
It is (silence) fine today.
2
02
[01] [02] Silence [12] [03]
It is (silence) rainy today.
3
03
[01] [02] [10] [21] [11] [12] [22] [03] It is fine becoming cloudy, rainy in some areas today.
126
7E
127
7F
···
[01] [02] Silence [10] [03]
···
01
···
1
13/23
¡ Semiconductor
MSM9836-xxx
Figure 4.1 Phrase Combination Matrix for Phrase Control Table
Phrase Control Table Area
No. X-Address
Phrase Data Registration Area
Phrase Addigned
No. Y-Address
Phrase
1
01
1
[01]
it
1
01
2
02
2
[02]
is
2
02
is
3
03
3
Silence (64ms)
3
03
today
4
04
4
[12]
rainy
5
05
5
[03]
today
16
10
fine
6
06
6
—
17
11
cloudy
7
07
7
—
18
12
rainy
8
08
8
—
19
13
snowy
9
09
Silence time setting
32
20
occasionally
(32ms ¥ n)
33
21
becoming
34
22
in some areas
127
7F
—
127
7F
0
Silence time
1
32 ms
2
64 ms
127
4064 ms
it
14/23
¡ Semiconductor
MSM9836-xxx
5. Oscillation and Clock Input
5. 1 Ceramic oscillation
Figure 2 shows an external circuit using a ceramic oscillator.
Pull this pin to "H" level
EXTCK
XT
XT
C1
C2
Figure 2 External Circuit Using a Ceramic Oscillator
For example, the following table shows the optimum load capacitances, power supply voltage
ranges, and operating temperature ranges when ceramic oscillators made by Murata MFG Co.,
Ltd., and TDK Co., Ltd. are used.
Ceramic oscillator
(MHz)
C1 (pF)
C2 (pF)
(V)
Murata MFG.
Type
supply voltage range
CSA4.09MGU
4.09
30
30
2.0 to 5.5
CST4.09MGWU
4.09
Built in
Built in
2.0 to 5.5
TDK
Maker
Optimal load capacity
Frequency
CCR4.00MC3
4.0
Built in
Built in
2.4 to 5.5
(Note)
Operating
temperature range
(°C)
–40 to +85
–40 to +85
When a 4 MHz ceramic oscillator is used, the playback speed of MSM9802/03/05 is
slower by 2 percent than that of an analysis tool or a demonstration board.
15/23
¡ Semiconductor
MSM9836-xxx
5. 2 External clock input
Figure 3 shows a circuit for external clock input.
EXTCK
Pull this pin to "L" level
XT
XT
Open
External oscillation circuit
Figure 3 Circuit for External Clock Input
16/23
¡ Semiconductor
MSM9836-xxx
6. Low-Pass Filter
In this IC, all voice outputs are through the built-in low-pass filter (LPF). Figure 4 and Table 4
show the LPF frequency characteristics and LPF cutoff frequency respectively.
Only the voice output through LPF is enabled in this IC.
[dB] 20
10
0
–10
–20
–30
–40
–50
–60
–70
–80
100
10
1k
10k
[Hz]
Figure 4 LPF Frequency Characteristics (fSAM=8 kHz)
Table 4 LPF Cutoff Frequency
Sampling Frequency (kHz)
Cutoff Frequency (kHz)
(fSAM)
(fCUT)
4.0
5.3
1.2
1.6
6.4
2.0
8.0
2.5
10.6
3.2
12.8
4.0
16.0
5.0
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¡ Semiconductor
MSM9836-xxx
7. Standby Transition
When playback of a phrase is finished, if playback of the next phrase does not start up within
tSTB (0.25 sec. typ.), the IC enters standby status and the entire operation stops.
I5-I0
ST
NAR
BUSY
AOUT
Figure 5 Voice Playback Timing during D/A Converter Change Time
If playback is attempted during D/A converter change time as shown in Figure 5, the IC exits
from standby status and the output from the D/A converter begins going to the 1/2 IAOUT level.
When the output reaches 1/2 IAOUT, voice playback starts.
18/23
¡ Semiconductor
MSM9836-xxx
8. Voice Output Unit Equivalent Circuit (AOUT, FREF Pins)
Current-Sourcing Type
D/A Converter
VDD
VREF
10kW
(TYP)
PCM Value
AOUT
IAOUT
Standby Signal
(The above switch positions show those when the circuit is active.)
Figure 8.1 Voice Output Unit Equivalent Circuit
19/23
¡ Semiconductor
MSM9836-xxx
D/A CONVERTER OUTPUT CURRENT CHARACTERISTICS
AOUT Output Current [mA]
Power Supply Voltage vs. Output Current Characteristics (Ta=25°C, VAOUT=0V)
14
12
10
8
6
4
2
0
0
1
2
3
4
5
6
Power Supply Voltage [V]
AOUT Output Current [mA]
Temperature vs. Output Current Characteristics (VDD=5V, VAOUT=0V)
14
12
10
8
6
4
2
0
–50
–25
0
25
50
75
100
Ambient Temperature Ta [°C]
VREF Voltage vs. Output Current Characteristics (Ta=25°C, VDD=5V, VAOUT=0V)
AOUT Output Current [mA]
10
8
6
4
2
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VREF [V]
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¡ Semiconductor
MSM9836-xxx
APPLICATION CIRCUIT
MSM9836-xxx
MSC1157
(Speaker drive amplifier)
VDD
MCU
I6
I5
I4
I3
I2
I1
I0
ST
RESET
BUSY
NAR
VREF
VCC
AOUT
+
-
AIN
SP
SP
TEST
EXTCK
XT
GND
XT
STBY
GND
VR
SEL
+
-
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¡ Semiconductor
MSM9836-xxx
PAD CONFIGURATION
Pad Layout
Chip size
Chip thickness
Pad size
Substrate potential
X=7.65mm Y=3.32mm
350mm±30mm
110mm¥110mm
GND
Chip and pad number
Y-axis
16
(NC)
17
15
14
MSM9836
13
18
12
19
11
X-axis
1
2
10
3
8
9
4
5
6
7
Pad coordinates (Chip center is located at X=0 and Y=0)
(Unit: mm)
PAD No.
PAD Name
X-axis
Y-axis
PAD No.
PAD Name
X-axis
Y-axis
1
VDD
–3620
–452
11
I3
3673
415
2
XT
–3623
–742
12
I4
3673
816
3
XT
–3623
–1349
13
I5
3673
1460
4
TEST
–1932
–1460
14
RESET
1778
1460
5
BUSY
–1044
–1455
15
I6
1260
1458
6
EXTCK
1163
–1453
16
NAR
–2443
1460
7
ST
2234
–1455
17
GND
–3665
1460
8
I0
3673
–1432
18
VREF
–3623
1136
19
AOUT
–3623
585
9
I1
3673
–754
10
I2
3673
–312
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¡ Semiconductor
MSM9836-xxx
PACKAGE DIMENSIONS
(Unit : mm)
SOP24-P-430-1.27-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.58 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
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E2Y0002-29-62
NOTICE
1.
The information contained herein can change without notice owing to product and/or
technical improvements. Before using the product, please make sure that the information
being referred to is up-to-date.
2.
The outline of action and examples for application circuits described herein have been
chosen as an explanation for the standard action and performance of the product. When
planning to use the product, please ensure that the external conditions are reflected in the
actual circuit, assembly, and program designs.
3.
When designing your product, please use our product below the specified maximum
ratings and within the specified operating ranges including, but not limited to, operating
voltage, power dissipation, and operating temperature.
4.
Oki assumes no responsibility or liability whatsoever for any failure or unusual or
unexpected operation resulting from misuse, neglect, improper installation, repair, alteration
or accident, improper handling, or unusual physical or electrical stress including, but not
limited to, exposure to parameters beyond the specified maximum ratings or operation
outside the specified operating range.
5.
Neither indemnity against nor license of a third party’s industrial and intellectual property
right, etc. is granted by us in connection with the use of the product and/or the information
and drawings contained herein. No responsibility is assumed by us for any infringement
of a third party’s right which may result from the use thereof.
6.
The products listed in this document are intended for use in general electronics equipment
for commercial applications (e.g., office automation, communication equipment,
measurement equipment, consumer electronics, etc.). These products are not authorized
for use in any system or application that requires special or enhanced quality and reliability
characteristics nor in any system or application where the failure of such system or
application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety
devices, aerospace equipment, nuclear power control, medical equipment, and life-support
systems.
7.
Certain products in this document may need government approval before they can be
exported to particular countries. The purchaser assumes the responsibility of determining
the legality of export of these products and will take appropriate and necessary steps at their
own expense for these.
8.
No part of the contents contained herein may be reprinted or reproduced without our prior
permission.
9.
MS-DOS is a registered trademark of Microsoft Corporation.
Copyright 1999 Oki Electric Industry Co., Ltd.
Printed in Japan
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