NL17SZ08 Single 2-Input AND Gate The NL17SZ08 is a single 2−input AND Gate in three tiny footprint packages. The device performs much as LCX multi−gate products in speed and drive. They should be used wherever the need for higher speed and drive are needed. www.onsemi.com Features • • • • • • • • Tiny SOT−353, SOT−553 and SOT−953 Packages 2.7 ns TPD at 5.0 V (typ) Source/Sink 24 mA at 3.0 V Overvoltage Tolerant Inputs Pin For Pin with NC7SZ08P5X, TC7SZ08FU and TC7SZ08AFE Chip Complexity: FETs = 20 Designed for 1.65 V to 5.5 V VCC Operation These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant IN B 1 VCC A VCC 5 1 5 GND IN A OUT Y GND 4 3 1 SC−88A (SC−70−5/SOT−353) DF SUFFIX CASE 419A L2 MG G 5 1 SOT−553 XV5 SUFFIX CASE 463B L2 M G L2 MG G = Specific Device Marking = Date Code* = Pb−Free Package (Note: Microdot may be in either location) 2 2 MARKING DIAGRAMS 5 B Y 3 4 *Date Code orientation and/or position may vary depending upon manufacturing location. SOT−953 CASE 527AE YM 1 SOT−953 SOT−353/SC70−5/ SC−88A/SOT−553 Y M = Specific Device Code = Month Code Figure 1. Pinout (Top View) ORDERING INFORMATION IN A & IN B See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. OUT Y Figure 2. Logic Symbol © Semiconductor Components Industries, LLC, 2015 November, 2015 − Rev. 20 1 Publication Order Number: NL17SZ08/D NL17SZ08 PIN ASSIGNMENT PIN ASSIGNMENT (SOT−953) (SOT−353/SC70−5/SC−88A/SOT−553) FUNCTION TABLE Pin Function Pin Function 1 IN A 1 IN B 2 GND A B Y 2 IN A 3 IN B L L L 3 GND 4 OUT Y L H L 4 OUT Y 5 VCC H L L 5 VCC H H H Output Input Y = AB MAXIMUM RATINGS Symbol Parameter Value Units VCC DC Supply Voltage −0.5 to +7.0 V VIN DC Input Voltage −0.5 to +7.0 V VOUT DC Output Voltage (SOT−353/SC70−5/SC−88A/SOT−553 Packages) −0.5 to +7.0 V VOUT DC Output Voltage (SOT−953 Package) −0.5 to VCC + 0.5 V −50 mA IIK DC Input Diode Current IOK DC Output Diode Current (SOT−953 Package) VOUT < GND, VOUT > VCC ±50 mA IOK DC Output Diode Current (SOT−353/SC70−5/SC−88A/SOT−553 Packages) VOUT < GND −50 mA IOUT DC Output Sink Current ±50 mA ICC DC Supply Current per Supply Pin TSTG Storage Temperature Range ±100 mA −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias +150 °C qJA Thermal Resistance SOT−353 (Note 1) SOT−553 350 496 °C/W PD Power Dissipation in Still Air at 85°C SOT−353 SOT−553 186 135 mW MSL Moisture Sensitivity FR Flammability Rating ESD ESD Classification ILATCHUP Level 1 Oxygen Index: 28 to 34 Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Latchup Performance Above VCC and Below GND at 125°C (Note 5) UL 94 V−0 @ 0.125 in 2000 200 N/A V ±100 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B. 3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. www.onsemi.com 2 NL17SZ08 RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Units 1.65 5.5 V VCC DC Supply Voltage VIN DC Input Voltage 0 5.5 V VOUT DC Output Voltage (SOT−353/SC70−5/SC−88A/SOT−553 Packages) 0 5.5 V VOUT DC Output Voltage (SOT−953 Package) 0 VCC V −55 +125 °C 0 0 100 20 ns/V TA Operating Temperature Range tr, tf Input Rise and Fall Time VCC = 3.0 V ±0.3 V VCC = 5.0 V ±0.5 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. DC ELECTRICAL CHARACTERISTICS Min 0.75 VCC 0.7 VCC Symbol Parameter VIH High−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VIL Low−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VOH High−Level Output Voltage VIN = VIL or VIH VOL Low−Level Output Voltage VIN = VIH or VOH Condition −555C 3 TA 3 1255C TA = 255C VCC (V) IOH = −100 mA IOH = −3 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 IOL = 100 mA IOL = 3 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 Typ Max Min 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 Max VCC 1.52 2.1 2.4 2.7 2.5 4.0 0.08 0.20 0.22 0.28 0.38 0.42 Units V 0.25 VCC 0.3 VCC VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 V V 0.1 0.24 0.3 0.4 0.4 0.55 0.55 0.1 0.24 0.3 0.4 0.4 0.55 0.55 V IIN Input Leakage Current VIN = 5.5 V or GND 0 to 5.5 ±0.1 ±1.0 mA ICC Quiescent Supply Current VIN = 5.5 V or GND 5.5 1 10 mA IOFF Power Off Leakage Current (SOT−353/SC70−5/ SC−88A/SOT−553 Packages) VIN = 5.5 V or VOUT = 5.5 V 0 1 10 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 3 NL17SZ08 AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns tPLH tPHL Condition (V) Min Typ Max Min Max Units RL = 1 MW, CL = 15 pF 1.65 2.0 6.3 12 2.0 12.7 ns RL = 1 MW, CL = 15 pF 1.8 2.0 6.2 10 2.0 10.5 RL = 1 MW, CL = 15 pF 2.5 ± 0.2 0.8 3.4 7.0 0.8 7.5 RL = 1 MW, CL = 15 pF 3.3 ± 0.3 0.5 2.6 4.7 0.5 5.0 1.5 3.3 5.2 1.5 5.5 0.5 2.2 4.1 0.5 4.4 0.8 2.7 4.5 0.8 4.8 Parameter Symbol Propagation Delay (Figure 3 and 4) −555C 3 TA 3 1255C TA = 255C VCC RL = 500 W, CL = 50 pF RL = 1 MW, CL = 15 pF 5.0 ± 0.5 RL = 500 W, CL = 50 pF CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Units u4.0 pF 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 30 CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC CPD Power Dissipation Capacitance (Note 6) 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. tf = 3 ns tf = 3 ns 90% INPUT A and B 50% VCC 90% VCC 50% 10% 10% GND OUTPUT INPUT RL tPHL 50% CL tPLH 50% A 1−MHz square input wave is recommended for propagation delay tests. VOH OUTPUT Y VOL Figure 3. Switching Waveform Figure 4. Test Circuit DEVICE ORDERING INFORMATION Package Type Tape and Reel Size† NL17SZ08DFT2G SC−88A/SC−70−5/SOT−353 (Pb−Free) 3000 / Tape & Reel NL17SZ08XV5T2G SOT−553 (Pb−Free) 4000 / Tape & Reel NL17SZ08P5T5G SOT−953 (Pb−Free) 8000 / Tape & Reel Device Order Number †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 4 NL17SZ08 PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) M B M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 J C K H SOLDER FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 5 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NL17SZ08 PACKAGE DIMENSIONS SOT−553, 5 LEAD XV5 SUFFIX CASE 463B ISSUE C D −X− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A L 4 1 2 E −Y− 3 b e HE c 5 PL 0.08 (0.003) DIM A b c D E e L HE M X Y MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.65 1.20 1.25 0.50 BSC 0.10 0.20 0.30 1.55 1.60 1.65 MIN 0.50 0.17 0.08 1.55 1.15 RECOMMENDED SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6 INCHES NOM 0.022 0.009 0.005 0.063 0.047 0.020 BSC 0.004 0.008 0.061 0.063 MIN 0.020 0.007 0.003 0.061 0.045 MAX 0.024 0.011 0.007 0.065 0.049 0.012 0.065 NL17SZ08 PACKAGE DIMENSIONS SOT−953 CASE 527AE ISSUE E X D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A Y 5 4 PIN ONE INDICATOR HE E 1 2 3 DIM A b C D E e HE L L2 L3 C TOP VIEW SIDE VIEW e L 5X 5X L3 MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.10 0.15 0.20 0.07 0.12 0.17 0.95 1.00 1.05 0.75 0.80 0.85 0.35 BSC 0.95 1.00 1.05 0.175 REF 0.05 0.10 0.15 −−− −−− 0.15 SOLDERING FOOTPRINT* 5X 0.35 5X 0.20 5X L2 5X BOTTOM VIEW b PACKAGE OUTLINE 0.08 X Y 1.20 1 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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