Intersil ISL43L122IR Ultra low on-resistance, single supply, dual spst analog switch Datasheet

ISL43L120, ISL43L121, ISL43L122
®
Data Sheet
June 23, 2006
Ultra Low ON-Resistance, Single Supply,
Dual SPST Analog Switches
The Intersil ISL43L120, ISL43L121, ISL43L122 devices are
low ON-resistance, low voltage, bidirectional, precision, dual
single-pole/single-throw (SPST) analog switches designed
to operate from a single +1.65V to +3.6V supply. Targeted
applications include battery powered equipment that benefit
from low RON (0.16Ω), low power consumption (0.12µW)
and fast switching speeds (tON = 13ns, tOFF = 13ns).
Cell phones, for example, often face ASIC functionality
limitations. The number of analog input or GPIO pins may be
limited and digital geometries are not well suited to analog
switch performance. This family of parts may be used to
switch in additional functionality while reducing ASIC design
risk. The ISL43L12X are offered in an 8 Ld MSOP package,
alleviating board space limitations.
The ISL43L120, ISL43L121, ISL43L122 are dual singlepole/single-throw (SPST) devices. The ISL43L120 has two
normally open (NO) switches; the ISL43L121 has two
normally closed (NC) switches; the ISL43L122 has one
normally open (NO) and one normally closed (NC) switch
and can be used as an SPDT.
Table 1 summarizes the performance of this family.
TABLE 1. FEATURES AT A GLANCE
ISL43L120
ISL43L121
ISL43L122
NUMBER OF
SWITCHES
2
2
2
SW 1/SW 2
NO/NO
NC/NC
NO/NC
1.8V RON
0.26Ω
0.26Ω
0.26Ω
1.8V tON/tOFF
30ns/25ns
30ns/25ns
30ns/25ns
3V RON
0.16Ω
0.16Ω
0.16Ω
3V tON/tOFF
13ns/13ns
13ns/13ns
13ns/13ns
PACKAGES
FN6091.2
Features
• Low ON Resistance (RON)
- V+ = 3.0V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.16Ω
- V+ = 1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.26Ω
• RON Matching Between Channels . . . . . . . . . . . . 0.005Ω
• RON Flatness Over Signal Range . . . . . . . . . . . . . . 0.008Ω
• Single Supply Operation. . . . . . . . . . . . . . . . +1.65V to +3.6V
• Low Power Consumption (PD) . . . . . . . . . . . . . . . . . <0.12µW
• Fast Switching Action (V+ = 3.0V)
- tON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13ns
- tOFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13ns
• ESD HBM Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >8kV
• 1.8V Logic Compatible (+3V Supply)
• Available in 8-Ld thin DFN and 8-Ld MSOP Packages
• Pb-Free Plus Anneal Available (RoHS Compliant)
Applications
• Battery Powered, Handheld, and Portable Equipment
- Cellular/Mobile Phones
- Pagers
- Laptops, Notebooks, Palmtops
• Portable Test and Measurement
• Medical Equipment
• Audio and Video Switching
8Ld 3x3 TDFN, 8Ld MSOP
Related Literature
Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”.
Application Note AN557 “Recommended Test Procedures
for Analog Switches”.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2004, 2006. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL43L120, ISL43L121, ISL43L122
Pinouts
(Note 1)
ISL43L120 (MSOP, TDFN)
TOP VIEW
V+
ISL43L122 (MSOP, TDFN)
TOP VIEW
8 COM1
1
NO1 2
8 COM1
IN2
NO1 2
IN1 3
7 IN
2
6 COM2
NC1 2
6 COM2
5 GND
NC2 4
5 GND
NO2 4
V+
1
7
IN1 3
V+
ISL43L121 (MSOP, TDFN)
TOP VIEW
NC2 4
8 COM1
1
7
IN1 3
IN2
6 COM2
5
GND
NOTE:
1. Switches Shown for Logic “0” Input.
Ordering Information
Truth Table
PART
MARKING
TEMP.
RANGE
(°C)
ISL43L120IU
L120
-40 to 85 8 Ld MSOP
ISL43L120IR
L10
-40 to 85 8 Ld 3x3 TDFN L8.3x3A
ISL43L121IU
L121
-40 to 85 8 Ld MSOP
ISL43L121IR
L11
-40 to 85 8 Ld 3x3 TDFN L8.3x3A
ISL43L122IU
L122
-40 to 85 8 Ld MSOP
ISL43L122IR
L12
-40 to 85 8 Ld 3x3 TDFN L8.3x3A
PIN
ISL43L120IUZ L120Z
(Note)
-40 to 85 8 Ld MSOP
(Pb-free)
V+
ISL43L120IRZ L10Z
(Note)
-40 to 85 8 Ld 3x3 TDFN L8.3x3A
(Pb-free)
ISL43L121IUZ L121Z
(Note)
-40 to 85 8 Ld MSOP
(Pb-free)
ISL43L121IRZ L11Z
(Note)
-40 to 85 8 Ld 3x3 TDFN L8.3x3A
(Pb-free)
ISL43L122IUZ L122Z
(Note)
-40 to 85 8 Ld MSOP
(Pb-free)
ISL43L122IRZ L12Z
(Note)
-40 to 85 8 Ld 3x3 TDFN L8.3x3A
(Pb-free)
PART
NUMBER*
PACKAGE
PKG.
DWG. #
M8.118
M8.118
M8.118
M8.118
M8.118
ISL43L120
ISL43L121
LOGIC
SW 1, 2
SW 1, 2
SW 1
SW 2
0
OFF
ON
OFF
ON
1
ON
OFF
ON
OFF
NOTE:
ISL43L122
Logic “0” ≤ 0.5V. Logic “1” ≥ 1.4V with a 3V Supply.
Pin Descriptions
FUNCTION
System Power Supply Input (+1.65V to +3.6V)
GND
Ground Connection
IN
Digital Control Input
COM
Analog Switch Common Pin
NO
Analog Switch Normally Open Pin
NC
Analog Switch Normally Closed Pin
M8.118
*Add “-T” suffix for tape and reel
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
2
FN6091.2
June 23, 2006
ISL43L120, ISL43L121, ISL43L122
Absolute Maximum Ratings
Thermal Information
V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 4.7V
Input Voltages
IN (Note 2). . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V)
NO, NC (Note 2) . . . . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V)
Output Voltages
COM (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V)
Continuous Current (Any Terminal) . . . . . . . . . . . . . . . . . . . . 300mA
Peak Current, IN, NO, NC, or COM
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . 500mA
ESD Rating (Per MIL-STD-883 Method 3015). . . . . . . . . . . . . .>8kV
Thermal Resistance (Typical, Note 3)
θJA (°C/W)
8 Ld 3x3 TDFN Package . . . . . . . . . . . . . . . . . . . . .
110
8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . .
190
Maximum Junction Temperature (Plastic Package). . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
(Lead Tips Only)
Operating Conditions
Temperature Range
ISL43L12XIU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2. Signals on NC, NO, COM, or IN exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum current ratings.
3. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications - 3V Supply
PARAMETER
Test Conditions: V+ = +2.7V to +3.3V, GND = 0V, VINH = 1.4V, VINL = 0.5V (Note 4, 6),
Unless Otherwise Specified
TEST CONDITIONS
TEMP
(°C)
MIN
(NOTE 5)
TYP
MAX
(NOTE 5) UNITS
Full
0
-
V+
V
25
-
0.17
0.25
Ω
Full
-
-
0.3
Ω
25
-
0.005
0.02
Ω
Full
-
-
0.04
Ω
25
-
0.008
0.06
Ω
Full
-
-
0.07
Ω
25
-3
-
3
nA
Full
-60
-
60
nA
25
-3
-
3
nA
Full
-80
-
80
nA
25
-
15
25
ns
Full
-
-
30
ns
25
-
15
25
ns
Full
-
-
30
ns
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
ON Resistance, RON
V+ = 2.7V, ICOM = 100mA, VNO or VNC = 0V to V+
See Figure 4
RON Matching Between Channels,
∆RON
V+ = 2.7V, ICOM = 100mA, VNO or VNC = Voltage at
Max RON, Note 8
RON Flatness, RFlat(ON)
V+ = 2.7V, ICOM = 100mA, VNO or VNC = 0V to V+,
Note 9
NO or NC OFF Leakage Current,
INO(OFF) or INC(OFF)
V+ = 3.3V, VCOM = 0.3, 3V, VNO or VNC = 3V, 0.3V
COM ON Leakage Current,
ICOM(ON)
V+ = 3.3V, VCOM = 0.3V, 3V, or VNO or VNC = 0.3V, 3V
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
V+ = 2.7V, VNO or VNC = 1.5V, RL = 50Ω, CL = 35pF,
VIN = 0 to 2.7V, See Figure 1, Note 7
V+ = 2.7V, VNO or VNC = 1.5V, RL = 50Ω, CL = 35pF,
VIN = 0 to 2.7V, See Figure 1, Note 7
Turn-OFF Time, tOFF
Charge Injection, Q
CL = 1.0nF, VG = 0V, RG = 0Ω, See Figure 2
25
-
-125
-
pC
OFF Isolation
RL = 50Ω, CL = 5pF, f = 100kHz, VCOM = 1 VRMS, See
Figure 3
25
-
62
-
dB
Crosstalk (Channel-to-Channel)
RL = 50Ω, CL = 5pF, f = 100kHz, VCOM = 1 VRMS, See
Figure 5
25
-
-94
-
dB
25
-
182
-
pF
NO or NC OFF Capacitance, COFF f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 6
3
FN6091.2
June 23, 2006
ISL43L120, ISL43L121, ISL43L122
Electrical Specifications - 3V Supply
PARAMETER
Test Conditions: V+ = +2.7V to +3.3V, GND = 0V, VINH = 1.4V, VINL = 0.5V (Note 4, 6),
Unless Otherwise Specified (Continued)
TEST CONDITIONS
TEMP
(°C)
MIN
(NOTE 5)
TYP
MAX
(NOTE 5) UNITS
COM OFF Capacitance,
CCOM(OFF)
f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 6
25
-
182
-
pF
COM ON Capacitance, CCOM(ON)
f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 6
25
-
290
-
pF
Full
1.65
-
3.6
V
25
-
-
30
nA
Full
-
-
750
nA
Input Voltage Low, VINL
Full
-
-
0.5
V
Input Voltage High, VINH
Full
1.4
-
-
V
Full
-0.5
-
0.5
µA
POWER SUPPLY CHARACTERISTICS
Power Supply Range
Positive Supply Current, I+
V+ = 1.65V to 3.6V, VIN = 0V or V+, all channels on or
off
DIGITAL INPUT CHARACTERISTICS
Input Current, IINH, IINL
V+ = 3.3V, VIN = 0V or V+ (Note 7)
NOTES:
4. VIN = input voltage to perform proper function.
5. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.
6. Parts are 100% tested at +25°C. Limits across the full temperature range are guaranteed by design and correlation.
7. Guaranteed but not tested.
8. RON matching between channels is calculated by subtracting the channel with the highest max Ron value from the channel with lowest max Ron
value.
9. Flatness is defined as the difference between maximum and minimum value of on-resistance over the specified analog signal range.
Electrical Specifications - 1.8V Supply
PARAMETER
Test Conditions: V+ = +1.65V to +2.0V, GND = 0V, VINH = 1.0V, VINL = 0.4V (Note 4, 6),
Unless Otherwise Specified
TEST CONDITIONS
TEMP
(°C)
MIN
(NOTE 5)
TYP
MAX
(NOTE 5) UNITS
Full
0
-
V+
V
25
-
0.26
0.35
Ω
Full
-
-
0.4
Ω
25
-
0.005
-
Ω
Full
-
0.005
-
Ω
25
-
0.074
-
Ω
Full
-
0.082
-
Ω
25
-3
-
3
nA
Full
-60
-
60
nA
25
-3
-
3
nA
Full
-80
-
80
nA
25
-
30
40
ns
Full
-
-
45
ns
25
-
25
35
ns
Full
-
-
40
ns
25
-
-80
-
pC
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
ON Resistance, RON
V+ = 1.8V, ICOM = 100mA, VNO or VNC = 0V to V+, See
Figure 4, Note 7
RON Matching Between Channels,
∆RON
V+ = 1.8V, ICOM = 100mA, VNO or VNC = Voltage at
Max RON, Note 8
RON Flatness, RFLAT(ON)
V+ = 1.8V, ICOM = 100mA, VNO or VNC = 0V to V+,
Note 9
NO or NC OFF Leakage Current,
INO(OFF) or INC(OFF)
V+ = 2.0V, VCOM = 0.3V, 1.8V, VNO or VNC = 1.8V, 0.3V
COM ON Leakage Current,
ICOM(ON)
V+ = 2.0V, VCOM = 0.3V, 1.8V, or VNO or VNC = 0.3V,
1.8V
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
V+ = 1.65V, VNO or VNC = 1.0V, RL =50Ω, CL = 35pF,
VIN = 0 to 1.65V, See Figure 1, Note 7
V+ = 1.65V, VNO or VNC = 1.0V, RL =50Ω, CL = 35pF,
VIN = 0 to 1.65V, See Figure 1, Note 7
Turn-OFF Time, tOFF
CL = 1.0nF, VG = 0V, RG = 0Ω, See Figure 2
Charge Injection, Q
4
FN6091.2
June 23, 2006
ISL43L120, ISL43L121, ISL43L122
Electrical Specifications - 1.8V Supply
Test Conditions: V+ = +1.65V to +2.0V, GND = 0V, VINH = 1.0V, VINL = 0.4V (Note 4, 6),
Unless Otherwise Specified (Continued)
TEMP
(°C)
MIN
(NOTE 5)
TYP
25
-
62
-
dB
25
-
-94
-
dB
NO or NC OFF Capacitance, COFF f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 6
25
-
182
-
pF
COM OFF Capacitance,
CCOM(OFF)
f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 6
25
-
182
-
pF
COM ON Capacitance, CCOM(ON)
f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 6
25
-
290
-
pF
25
-
-
30
nA
Full
-
-
750
nA
Input Voltage Low, VINL
Full
-
-
0.4
V
Input Voltage High, VINH
Full
1.0
-
-
V
Full
-0.5
-
0.5
µA
PARAMETER
TEST CONDITIONS
OFF Isolation
RL = 50Ω, CL = 5pF, f = 100kHz, VCOM = 1 VRMS, See
Figure 3 and Figure 5
Crosstalk (Channel-to-Channel)
MAX
(NOTE 5) UNITS
POWER SUPPLY CHARACTERISTICS
Positive Supply Current, I+
V+ = 1.65V to 3.6V, VIN = 0V or V+, all channels on or
off
DIGITAL INPUT CHARACTERISTICS
Input Current, IINH, IINL
V+ = 2.0V, VIN = 0V or V+ (Note 7)
Test Circuits and Waveforms
V+
LOGIC
INPUT
V+
tr < 5ns
tf < 5ns
50%
0V
tOFF
SWITCH
V
INPUT NO
SWITCH
INPUT
VOUT
VOUT
NO or NC
COM
IN
90%
SWITCH
OUTPUT
C
90%
LOGIC
INPUT
0V
CL
35pF
RL
50Ω
GND
tON
Logic input waveform is inverted for switches that have the opposite
logic sense.
Repeat test for all switches. CL includes fixture and stray
capacitance.
RL
-----------------------------V OUT = V
(NO or NC) R + R
L
( ON )
FIGURE 1B. TEST CIRCUIT
FIGURE 1A. MEASUREMENT POINTS
FIGURE 1. SWITCHING TIMES
V+
SWITCH
OUTPUT
VOUT
∆VOUT
RG
NO or NC
C
VOUT
COM
V+
LOGIC
INPUT
ON
ON
OFF
0V
VG
GND
IN
CL
LOGIC
INPUT
Q = ∆VOUT x CL
FIGURE 2A. MEASUREMENT POINTS
FIGURE 2B. TEST CIRCUIT
FIGURE 2. CHARGE INJECTION
5
FN6091.2
June 23, 2006
ISL43L120, ISL43L121, ISL43L122
Test Circuits and Waveforms (Continued)
V+
V+
C
C
RON = V1/100mA
SIGNAL
GENERATOR
NO or NC
NO or NC
VNX
INX
1mA
0V or V+
0V or V+
COM
COM
ANALYZER
IN
V1
GND
GND
RL
FIGURE 3. OFF ISOLATION TEST CIRCUIT
FIGURE 4. RON TEST CIRCUIT
V+
C
V+
C
SIGNAL
GENERATOR
NO1 or NC1
COM1
50Ω
NO or NC
IN1
0V or V+
COM2
ANALYZER
INX
IN2 0V or V+
NO2 or NC2
GND
RL
0V or V+
IMPEDANCE
ANALYZER
NC
FIGURE 5. CROSSTALK TEST CIRCUIT
COM
GND
FIGURE 6. CAPACITANCE TEST CIRCUIT
Detailed Description
Supply Sequencing and Overvoltage Protection
The ISL43L12X family of devices are bidirectional, single
pole/single throw (SPST) analog switches that offer precise
switching capability from a single 1.65V to 3.6V supply with
low on-resistance (0.16Ω) and high speed operation
(tON = 13ns, tOFF = 13ns). The device is especially well
suited for portable battery powered equipment due to its low
operating supply voltage (1.65V), low power consumption
(2.7µW max), low leakage currents (80nA max), and the tiny
TDFN and MSOP packaging. The ultra low on-resistance and
RON flatness provide very low insertion loss and distortion to
application that require signal reproduction.
With any CMOS device, proper power supply sequencing is
required to protect the device from excessive input currents
which might permanently damage the IC. All I/O pins contain
ESD protection diodes from the pin to V+ and to GND (see
Figure 7). To prevent forward biasing these diodes, V+ must
be applied before any input signals, and the input signal
voltages must remain between V+ and GND. If these
conditions cannot be guaranteed, then one of the following
two protection methods should be employed.
6
Logic inputs can easily be protected by adding a 1kΩ
resistor in series with the input (see Figure 7). The resistor
limits the input current below the threshold that produces
permanent damage, and the sub-microamp input current
produces an insignificant voltage drop during normal
operation.
FN6091.2
June 23, 2006
ISL43L120, ISL43L121, ISL43L122
This method is not acceptable for the signal path inputs.
Adding a series resistor to the switch input defeats the
purpose of using a low RON switch, so two small signal
diodes can be added in series with the supply pins to provide
overvoltage protection for all pins (see Figure 7). These
additional diodes limit the analog signal from 1V below V+ to
1V above GND. The low leakage current performance is
unaffected by this approach, but the switch signal range is
reduced and the resistance may increase, especially at low
supply voltages.
Logic-Level Thresholds
This switch family is 1.8V CMOS compatible (0.5V and 1.4V)
over a supply range of 2V to 3.6V (see Figure 14). At 3.6V
the VIH level is about 1.27V. This is still below the 1.8V
CMOS guaranteed high output minimum level of 1.4V, but
noise margin is reduced.
The digital input stages draw supply current whenever the
digital input voltage is not at one of the supply rails. Driving
the digital input signals from GND to V+ with a fast transition
time minimizes power dissipation.
High-Frequency Performance
OPTIONAL PROTECTION
DIODE
V+
OPTIONAL
PROTECTION
RESISTOR
INX
VNO or NC
VCOM
GND
OPTIONAL PROTECTION
DIODE
FIGURE 7. OVERVOLTAGE PROTECTION
Power-Supply Considerations
The ISL43L12x construction is typical of most single supply
CMOS analog switches, in that they have two supply pins:
V+ and GND. V+ and GND drive the internal CMOS
switches and set their analog voltage limits. Unlike switches
with a 4V maximum supply voltage, the ISL43L12X 4.7V
maximum supply voltage provides plenty of room for the
10% tolerance of 3.6V supplies, as well as room for
overshoot and noise spikes.
The minimum recommended supply voltage is 1.65V but the
part will operate with a supply below 1.5V. It is important to
note that the input signal range, switching times, and onresistance degrade at lower supply voltages. Refer to the
electrical specification tables and Typical Performance
curves for details.
V+ and GND also power the internal logic and level shifters.
The level shifters convert the input logic levels to switched
V+ and GND signals to drive the analog switch gate
terminals.
In 50Ω systems, signal response is reasonably flat even past
20MHz with a -3dB bandwidth of 175MHz (see Figure 15).
The frequency response is very consistent over a wide V+
range, and for varying analog signal levels.
An OFF switch acts like a capacitor and passes higher
frequencies with less attenuation, resulting in signal
feedthrough from a switch’s input to its output. Off Isolation is
the resistance to this feedthrough, while Crosstalk indicates
the amount of feedthrough from one switch to another.
Figure 16 details the high Off Isolation and Crosstalk
rejection provided by this family. At 100kHz, Off Isolation is
about 62dB in 50Ω systems, decreasing approximately 20dB
per decade as frequency increases. Higher load
impedances decrease Off Isolation and Crosstalk rejection
due to the voltage divider action of the switch OFF
impedance and the load impedance.
Leakage Considerations
Reverse ESD protection diodes are internally connected
between each analog-signal pin and both V+ and GND. One of
these diodes conducts if any analog signal exceeds V+ or
GND.
Virtually all the analog leakage current comes from the ESD
diodes to V+ or GND. Although the ESD diodes on a given
signal pin are identical and therefore fairly well balanced,
they are reverse biased differently. Each is biased by either
V+ or GND and the analog signal. This means their leakages
will vary as the signal varies. The difference in the two diode
leakages to the V+ and GND pins constitutes the analogsignal-path leakage current. All analog leakage current flows
between each pin and one of the supply terminals, not to the
other switch terminal. This is why both sides of a given
switch can show leakage currents of the same or opposite
polarity. There is no connection between the analog signal
paths and V+ or GND.
This family of switches cannot be operated with bipolar
supplies, because the input switching point becomes
negative in this configuration.
7
FN6091.2
June 23, 2006
ISL43L120, ISL43L121, ISL43L122
Typical Performance Curves TA = 25°C, Unless Otherwise Specified
0.26
0.19
V+ = 3V
ICOM = 100mA
ICOM = 100mA
0.18
0.24
V+ = 1.8V
0.17
0.22
85°C
RON (Ω)
RON (Ω)
0.16
0.2
0.18
0.15
25°C
0.14
0.16
V+ = 2.7V
0.13
V+ = 3V
0.14
0.12
-40°C
V+ = 3.6V
0.11
0.12
0
1
2
3
0
4
0.5
1
1.5
2
2.5
3
VCOM (V)
VCOM (V)
FIGURE 9. ON RESISTANCE vs SWITCH VOLTAGE
FIGURE 8. ON RESISTANCE vs SUPPLY VOLTAGE vs
SWITCH VOLTAGE
50
0.3
V+ = 1.8V
ICOM = 100mA
0
V+ = 3V
85°C
0.25
Q (pC)
RON (Ω)
-50
0.2
V+ = 1.8V
-150
25°C
-40°C
-100
0.15
-200
-250
0.1
0
0.5
1
1.5
0
2
0.5
1
1.5
2
2.5
3
VCOM (V)
VCOM (V)
FIGURE 10. ON RESISTANCE vs SWITCH VOLTAGE
FIGURE 11. CHARGE INJECTION vs SWITCH VOLTAGE
80
50
70
40
60
85°C
40
85°C
tOFF (ns)
tON (ns)
50
25°C
30
30
-40°C
25°C
20
-40°C
20
10
10
0
1
1.5
2
2.5
3
V+ (V)
3.5
4
FIGURE 12. TURN - ON TIME vs SUPPLY VOLTAGE
8
4.5
0
1
1.5
2
2.5
3
3.5
4
4.5
V+ (V)
FIGURE 13. TURN - OFF TIME vs SUPPLY VOLTAGE
FN6091.2
June 23, 2006
ISL43L120, ISL43L121, ISL43L122
Typical Performance Curves TA = 25°C, Unless Otherwise Specified (Continued)
NORMALIZED GAIN (dB)
1.8
1.6
V+ = 3V
0
GAIN
-20
1.2
VINH
1
PHASE
0
20
VINL
40
0.8
60
0.6
80
0.4
RL = 50Ω
VIN = 0.2VP-P to 2VP-P
0.2
1
1.5
2
2.5
3
3.5
4
4.5
V+ (V)
1M
FIGURE 14. DIGITAL SWITCHING POINT vs SUPPLY VOLTAGE
-10
100
600M
FIGURE 15. FREQUENCY RESPONSE
10
V+ = 3V
-20
20
Die Characteristics
-30
30
SUBSTRATE POTENTIAL (POWERED UP):
-40
40
-50
50
-60
60
ISOLATION
-70
70
-80
80
GND
OFF ISOLATION (dB)
CROSSTALK (dB)
10M
100M
FREQUENCY (Hz)
PHASE (DEGREES)
VINH AND VINL (V)
1.4
TRANSISTOR COUNT:
114
PROCESS:
Submicron CMOS
CROSSTALK
-90
90
-100
100
-110
1k
10k
100k
1M
10M
110
100M 500M
FREQUENCY (Hz)
FIGURE 16. CROSSTALK AND OFF ISOLATION
9
FN6091.2
June 23, 2006
ISL43L120, ISL43L121, ISL43L122
Thin Dual Flat No-Lead Plastic Package (TDFN)
L8.3x3A
2X
0.15 C A
A
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
D
MILLIMETERS
2X
0.15 C B
E
SYMBOL
MIN
A
0.70
A1
-
A3
6
INDEX
AREA
b
TOP VIEW
B
0.10 C
//
C
SEATING
PLANE
SIDE VIEW
D2
(DATUM B)
6
INDEX
AREA
0.08 C
A3
7
-
0.30
0.35
5, 8
2.40
7, 8, 9
1.60
7, 8, 9
-
2.30
-
1.50
-
0.65 BSC
-
k
0.25
-
-
-
L
0.20
0.30
0.40
8
N
8
Nd
4
2
3
Rev. 3 11/04
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2
2. N is the number of terminals.
3. Nd refers to the number of terminals on D.
NX k
4. All dimensions are in millimeters. Angles are in degrees.
(DATUM A)
E2
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
E2/2
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
NX L
N
N-1
NX b
e
8
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
5
(Nd-1)Xe
REF.
0.10 M C A B
BOTTOM VIEW
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
9. Compliant to JEDEC MO-WEEC-2 except for the “L” min
dimension.
CL
NX (b)
-
8
D2/2
1
0.80
0.05
3.00 BSC
1.40
e
A
0.02
NOTES
3.00 BSC
2.20
E
E2
0.75
MAX
0.20 REF
0.25
D
D2
NOMINAL
(A1)
L1
5
10 L
e
SECTION "C-C"
TERMINAL TIP
FOR EVEN TERMINAL/SIDE
10
FN6091.2
June 23, 2006
ISL43L120, ISL43L121, ISL43L122
Mini Small Outline Plastic Packages (MSOP)
M8.118 (JEDEC MO-187AA)
N
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
E1
INCHES
E
-B-
INDEX
AREA
0.20 (0.008)
1 2
A B C
TOP VIEW
4X θ
0.25
(0.010)
R1
R
GAUGE
PLANE
SEATING
PLANE -CA
4X θ
A2
A1
b
-H-
0.10 (0.004)
L
SEATING
PLANE
C
MIN
MAX
MIN
MAX
NOTES
A
0.037
0.043
0.94
1.10
-
A1
0.002
0.006
0.05
0.15
-
A2
0.030
0.037
0.75
0.95
-
b
0.010
0.014
0.25
0.36
9
c
0.004
0.008
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.116
0.120
2.95
3.05
4
0.026 BSC
0.20 (0.008)
C
C
a
SIDE VIEW
CL
E1
0.20 (0.008)
C D
-
0.187
0.199
4.75
5.05
-
L
0.016
0.028
0.40
0.70
6
0.037 REF
N
-A-
0.65 BSC
E
L1
e
D
SYMBOL
e
L1
MILLIMETERS
0.95 REF
8
R
0.003
R1
0
α
-
8
-
0.07
0.003
-
5o
15o
0o
6o
7
-
-
0.07
-
-
5o
15o
-
0o
6o
-B-
Rev. 2 01/03
END VIEW
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane. - H - Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (0.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums -A -H- .
and - B - to be determined at Datum plane
11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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11
FN6091.2
June 23, 2006
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