TI1 DS10BR150 1.0 gbps lvds buffer / repeater Datasheet

DS10BR150
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SNLS252C – APRIL 2007 – REVISED MAY 2011
DS10BR150 1.0 Gbps LVDS Buffer / Repeater
Check for Samples: DS10BR150
FEATURES
DESCRIPTION
•
The DS10BR150 is a single channel 1.0 Gbps LVDS
buffer optimized for high-speed signal transmission
over lossy FR-4 printed circuit board backplanes and
balanced cables. Fully differential signal paths ensure
exceptional signal integrity and noise immunity.
1
2
•
•
•
DC - 1.0 Gbps Low Jitter, High Noise
Immunity, Low Power Operation
On-chip 100Ω Input and Output Termination
Minimizes Insertion and Return Losses,
Reduces Component Count and Minimizes
Board Space
7 kV ESD on LVDS I/O Pins Protects Adjoining
Components
Small 3 mm x 3 mm 8-WSON Space Saving
Package
APPLICATIONS
•
•
•
Clock and Data Buffering
OC-12 / STM-4
FireWire 800
Wide input common mode range allows the receiver
to accept signals with LVDS, CML and LVPECL
levels; the output levels are LVDS. A very small
package footprint requires a minimal space on the
board while the flow-through pinout allows easy board
layout. The differential inputs and outputs are
internally terminated with a 100Ω resistor to lower
device input and output return losses, reduce
component count and further minimize board space.
Typical Application
CML
ASIC / FPGA
LVDS
LVPECL
BR150
LVDS
ASIC / FPGA
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2011, Texas Instruments Incorporated
DS10BR150
SNLS252C – APRIL 2007 – REVISED MAY 2011
www.ti.com
Block Diagram
IN+
OUT+
IN-
OUT-
Pin Diagram
NC
1
IN+
2
IN-
3
NC
4
8
VCC
DAP
7
OUT+
GND
6
OUT-
5
NC
DS10BR150
See Package Number NGQ0008A
PIN DESCRIPTIONS
Pin Name
Pin Name
Pin Type
Pin Description
NC
1
NA
"NO CONNECT" pin.
IN+
2
Input
Non-inverting LVDS input pin.
IN-
3
Input
Inverting LVDS input pin.
NC
4
NA
"NO CONNECT" pin.
NC
5
NA
"NO CONNECT" pin.
OUT-
6
Output
Inverting LVDS output pin.
OUT+
7
Output
Non-inverting LVDS Output pin.
VCC
8
Power
Power supply pin.
GND
DAP
Power
Ground pad (DAP - die attach pad)
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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DS10BR150
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SNLS252C – APRIL 2007 – REVISED MAY 2011
Absolute Maximum Ratings
(1) (2)
Supply Voltage (VCC)
−0.3V to +4V
LVDS Input Voltage (IN+, IN−)
−0.3V to +4V
Differential Input Voltage |VID|
1V
−0.3V to (VCC +0.3V)
LVDS Output Voltage (OUT+, OUT−)
LVDS Differential Output Voltage ((OUT+) - (OUT−))
0V to 1V
LVDS Output Short Circuit Current Duration
5 ms
Junction Temperature
+150°C
−65°C to +150°C
Storage Temperature Range
Lead Temperature Range
Soldering (4 sec.)
+260°C
Maximum Package Power Dissipation at 25°C
NGQ Package
2.08W
Derate NGQ Package
16.7 mW/°C above +25°C
Package Thermal Resistance
θJA
+60.0°C/W
θJC
+12.3°C/W
ESD Susceptibility
HBM (3)
≥7 kV
MM (4)
≥250V
CDM (5)
(1)
(2)
(3)
(4)
(5)
≥1250V
“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Human Body Model, applicable std. JESD22-A114C
Machine Model, applicable std. JESD22-A115-A
Field Induced Charge Device Model, applicable std. JESD22-C101-C
Recommended Operating Conditions
Supply Voltage (VCC)
Receiver Differential Input Voltage (VID)
Min
Typ
Max
Units
3.0
3.3
3.6
V
0
−40
Operating Free Air Temperature (TA)
+25
1
V
+85
°C
DC Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
(1) (2) (3)
Min
Typ
Max
Units
250
350
450
mV
35
mV
1.375
V
35
mV
LVDS OUTPUT DC SPECIFICATIONS (OUT+, OUT-)
VOD
Differential Output Voltage
ΔVOD
Change in Magnitude of VOD for Complimentary
Output States
VOS
Offset Voltage
ΔVOS
(1)
(2)
(3)
RL = 100Ω
-35
1.05
Change in Magnitude of VOS for Complimentary
Output States
RL = 100Ω
-35
1.2
The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not guaranteed.
Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
except VOD and ΔVOD.
Typical values represent most likely parametric norms for VCC = +3.3V and TA = +25°C, and at the Recommended Operation Conditions
at the time of product characterization and are not guaranteed.
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DS10BR150
SNLS252C – APRIL 2007 – REVISED MAY 2011
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DC Electrical Characteristics (continued)
Over recommended operating supply and temperature ranges unless otherwise specified. (1)(2)(3)
Symbol
IOS
Parameter
Output Short Circuit Current
Conditions
(4)
Min
Typ
Max
Units
OUT to GND
-30
-50
mA
OUT to VCC
7.5
50
mA
COUT
Output Capacitance
Any LVDS Output Pin to GND
1.2
pF
ROUT
Output Termination Resistor
Between OUT+ and OUT- Pins
100
Ω
LVDS INPUT DC SPECIFICATIONS (IN+, IN-)
VID
Input Differential Voltage
VTH
Differential Input High Threshold
0
VTL
Differential Input Low Threshold
VCMR
Common Mode Voltage Range
VID = 100 mV
IIN
Input Current
VIN = 3.6V or 0V
VCC = 3.6V or 0V
±1
CIN
Input Capacitance
1.7
pF
RIN
Input Termination Resistor
Between IN+ and IN- Pins
100
Ω
VCM = +0.05V or VCC-0.05V
0
−100
1
V
+100
mV
0
0.05
mV
VCC 0.05
V
±10
μA
SUPPLY CURRENT
ICCD
(4)
Total Supply Current
16
21
mA
Typ
Max
Units
380
600
ps
410
600
ps
30
150
ps
45
160
ps
165
400
ps
155
400
ps
Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only.
AC Electrical Characteristics
(1)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
(2) (3)
Min
LVDS OUTPUT AC SPECIFICATIONS (OUT+, OUT-)
tPHLD2
Differential Propagation Delay High to Low
tPLHD2
Differential Propagation Delay Low to High
tSKD1
Pulse Skew |tPLHD − tPHLD|
tSKD2
Part to Part Skew
tLHT
Rise Time
tHLT
Fall Time
RL = 100Ω
(4)
(5)
RL = 100Ω
JITTER PERFORMANCE Figure 5
tDJ
tRJ
tTJ
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
4
Deterministic Jitter (Peak-to-Peak Value ) (See
(6)
)
Random Jitter (RMS Value)
(7)
Total Jitter (Peak to Peak Value)
(8)
VID = 350 mV
VCM = 1.2V
K28.5 (NRZ)
622 Mbps
12
39
ps
1.06 Gbps
15
42
ps
VID = 350 mV
VCM = 1.2V
Clock (NRZ)
311 MHz
0.6
1.3
ps
503 MHz
0.6
1.1
ps
VID = 350 mV
VCM = 1.2V
PRBS-23 (NRZ)
622 Mbps
0.02
0.04
UIP-P
1.06 Gbps
0.02
0.05
UIP-P
Specification is guaranteed by characterization and is not tested in production.
The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not guaranteed.
Typical values represent most likely parametric norms for VCC = +3.3V and TA = +25°C, and at the Recommended Operation Conditions
at the time of product characterization and are not guaranteed.
tSKD1, |tPLHD − tPHLD|, is the magnitude difference in differential propagation delay time between the positive going edge and the negative
going edge of the same channel.
tSKD2, Part to Part Skew, is defined as the difference between the minimum and maximum specified differential propagation delays. This
specification applies to devices at the same VCC and within 5°C of each other within the operating temperature range.
Tested with a combination of the 1100000101 (K28.5+ character) and 0011111010 (K28.5- character) patterns. Input stimulus jitter is
subtracted algebraically.
Measured on a clock edge with a histogram and an acummulation of 1500 histogram hits. Input stimulus jitter is subtracted
geometrically.
Measured on an eye diagram with a histogram and an acummulation of 3500 histogram hits. Input stimulus jitter is subtracted.
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Copyright © 2007–2011, Texas Instruments Incorporated
Product Folder Links: DS10BR150
DS10BR150
www.ti.com
SNLS252C – APRIL 2007 – REVISED MAY 2011
DC Test Circuits
DS10BR150
Power Supply
VOH
OUT+
IN+
R
D
RL
Power Supply
IN-
OUTVOL
Figure 1. Differential Driver DC Test Circuit
AC Test Circuits and Timing Diagrams
DS10BR150
OUT+
IN+
R
Signal Generator
D
IN-
RL
OUT-
Figure 2. Differential Driver AC Test Circuit
Figure 3. Propagation Delay Timing Diagram
Figure 4. LVDS Output Transition Times
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Product Folder Links: DS10BR150
5
DS10BR150
SNLS252C – APRIL 2007 – REVISED MAY 2011
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CHARACTERIZATION
BOARD
50:
Microstrip
50:
Microstrip
DS10BR150
L=4"
L=4"
PATTERN
GENERATOR
OSCILLOSCOPE
L=4"
L=4"
50:
Microstrip
50:
Microstrip
Figure 5. Jitter Measurements Test Circuit
DEVICE OPERATION
INPUT INTERFACING
The DS10BR150 accepts differential signals and allows simple AC or DC coupling. With a wide common mode
range, the DS10BR150 can be DC-coupled with all common differential drivers (i.e. LVPECL, LVDS, CML). The
following three figures illustrate typical DC-coupled interface to common differential drivers. Note that the
DS10BR150 inputs are internally terminated with a 100Ω resistor.
100: Differential T-Line
IN+
OUT+
LVDS
DS10BR150
OUT-
IN-
Figure 6. Typical LVDS Driver DC-Coupled Interface to DS10BR150 Input
CML3.3V or CML2.5V
VCC
50:
100: Differential T-Line
50:
IN+
OUT+
DS10BR150
OUT-
IN-
Figure 7. Typical CML Driver DC-Coupled Interface to DS10BR150 Input
6
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DS10BR150
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SNLS252C – APRIL 2007 – REVISED MAY 2011
LVPECL
Driver
100: Differential T-Line
OUT+
LVDS
Receiver
IN+
100:
OUT-
IN-
150-250:
150-250:
Figure 8. Typical LVPECL Driver DC-Coupled Interface to DS10BR150 Input
OUTPUT INTERFACING
The DS10BR150 outputs signals are compliant to the LVDS standard. It can be DC-coupled to most common
differential receivers. The following figure illustrates typical DC-coupled interface to common differential receivers
and assumes that the receivers have high impedance inputs. While most differential receivers have a common
mode input range that can accomodate LVDS compliant signals, it is recommended to check respective
receiver's data sheet prior to implementing the suggested interface implementation.
100: Differential T-Line
OUT+
DS10BR150
IN+
CML or
LVPECL or
LVDS
100:
IN-
OUT-
Figure 9. Typical DS10BR150 Output DC-Coupled Interface to an LVDS, CML or LVPECL Receiver
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Product Folder Links: DS10BR150
7
DS10BR150
SNLS252C – APRIL 2007 – REVISED MAY 2011
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Typical Performance
Figure 10. A 622 Mbps NRZ PRBS-7 Output Eye Diagram
V:100 mV / DIV, H:200 ps / DIV
Figure 11. A 1062.5 Mbps NRZ PRBS-7 Output Eye Diagram
V:100 mV / DIV, H:150 ps / DIV
90
90
75
60
VICM = 1.0V
45
30
VICM = 2.4V
15
0
0.25
8
VCC = 3.3V
TA = 25°C
NRZ PRBS-7
622 Mbps
TOTAL RESIDUAL JITTER (ps)
TOTAL RESIDUAL JITTER (ps)
VCC = 3.3V
0.40
0.55
0.70
0.85
1.00
75
TA = 25°C
NRZ PRBS-7
1062.5 Mbps
60
45
VICM = 1.0V
30
VICM = 2.4V
15
0
0.25
0.40
0.55
0.70
0.85
1.00
DIFFERENTIAL INPUT VOLTAGE (V)
DIFFERENTIAL INPUT VOLTAGE (V)
Figure 12. Total Jitter as a Function of Input Amplitude
Figure 13. Total Jitter as a Function of Input Amplitude
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
DS10BR150TSD/NOPB
ACTIVE
WSON
NGQ
8
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
1R150
DS10BR150TSDX/NOPB
ACTIVE
WSON
NGQ
8
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
1R150
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DS10BR150TSD/NOPB
WSON
NGQ
8
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
DS10BR150TSDX/NOPB
WSON
NGQ
8
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS10BR150TSD/NOPB
WSON
NGQ
8
1000
213.0
191.0
55.0
DS10BR150TSDX/NOPB
WSON
NGQ
8
4500
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
NGQ0008A
SDA08A (Rev A)
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