Skyworks CX65100 700 - 1000 mhz linear power amplifier Datasheet

DATA SHEET
CX65100: 700 – 1000 MHz Linear Power Amplifier
Applications
Description
• AMPS/CDMA/TDMA/GSM
Skyworks CX65100 Power Amplifier (PA) is a fully matched, 8-pin
Leadless Chip Carrier (LCC) surface mount module, developed for
cellular, Wireless Local Loop (WLL), and Industrial, Scientific,
Medical (ISM) applications. This small, power-efficient PA has a
full 700 to 1000 MHz bandwidth coverage packed into a single
compact package.
• Repeaters
• WLL and ISM bands
• Mobile radio
• Paging
All active circuitry in the module is contained in a single Gallium
Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC).
The CX65100 is manufactured with Skyworks Aluminum (Al) GaAs
Heterojunction Bipolar Transistor (HBT) process, which allows for
single supply operation while maintaining high efficiency and
good linearity.
• Telematics
Features
• Typical POUT of 30 dBm
• High linearity
Figure 1 shows a functional block diagram for the CX65100. The
device package and pinout for the 8-pin Leadless Chip Carrier
(LCC) are shown in Figure 2. Signal pin assignments and
functional pin descriptions are provided in Table 1.
• Low power consumption
• Single +3.4 V supply
• LCC 8-pin, 8 x 8 mm package
VREF
VCC1
VCC2
3
8
4
CX65100
Driver Stage
Bias
RFIN
2
Input Match
Power Stage
Bias
PA
Interstage Match
PA
Output Match
6
RFOUT
MMIC
GND
1, 5, 7
C1220
Figure 1. CX65100 Functional Block Diagram
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VCC1
DATA SHEET • CX65100
8
GND
1
7
GND
RFIN
2
6
RFOUT
VREF
3
5
GND
VCC2
4
S384
Figure 2. CX65100 Pinout– 8-Pin LCC Package
(Top View)
Table 1. CX65100 Signal Descriptions
Pin #
Name
Description
Pin #
Name
Description
1
GND
Ground
5
GND
Ground
2
RFIN
RF input
6
RFOUT
RF output
3
VREF
Reference voltage
7
GND
Ground
4
VCC2
Supply voltage
8
VCC1
Supply voltage
Technical Description
The CX65100 is comprised of two amplifier stages. The matching
circuits for the input stage, inter-stage, and output stage are
contained within the device. The bias circuits for both input and
output stages are included within the device for optimum
temperature tracking performance.
The CX65100 is internally matched for optimum linearity and
efficiency. The input and output stages are independently
supplied using the VCC1 and VCC2 supply lines, pins 8 and 4
respectively. The bias reference voltage is supplied using a
common VREF (pin 3) line.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 5 °C per second. Maximum temperature
should not exceed 225 °C and the time spent at a temperature
that exceeds 210 °C should be limited to less than 10 seconds. If
the part is manually attached, precaution should be taken to
ensure that the part is not subjected to a temperature that
exceeds 300 °C for more than 10 seconds.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the Skyworks
Application Note, Tape and Reel, document number 101568.
Electrical and Mechanical Specifications
The absolute maximum ratings of the CX65100 are provided in
Table 2. The recommended operating conditions are specified in
Table 3 and electrical specifications are provided in Table 4.
Typical performance characteristics over temperature of the
CX65100 are illustrated in Figures 3 through 8. Figure 9 shows
the package dimensions for the 8-pin CX65100 LCC and
Figure 10 provides the tape and reel dimensions.
Electrostatic Discharge (ESD) Sensitivity
The CX65100 is a static-sensitive electronic device. Do not
operate or store near strong electrostatic fields. Take proper ESD
precautions.
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DATA SHEET • CX65100
Table 2. CX65100 Absolute Maximum Ratings
Parameter
Symbol
Min
Typical
Max
Units
2
dBm
RF input power
PIN
Supply voltage
VCC
4.5
V
Reference voltage
VREF
3.3
V
Case operating temperature
TC
–40
+85
°C
Storage temperature
TST
–55
+125
°C
Note:
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal values.
Table 3. CX65100 Recommended Operating Conditions
Parameter
Supply voltage
Symbol
Min
Typical
VCC
Reference voltage
VREF
Operating frequency
FO
Max
Units
3.4
V
3.2
700
V
900
1000
MHz
Table 4. CX65100 Electrical Characteristics
(VCC = 3.4 V, VREF = 3.2 V, Frequency = 900 MHz, TC = 25 °C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min
Typical
Max
Units
900
1000
MHz
110
140
mA
Analog Inputs
Frequency range
700
Quiescent current
IQ
Small signal gain
G
PIN = –15 dBm
28
30
dB
Output power
POUT
PIN = 1 dBm
28
30
dBm
Efficiency
PAE
PIN = 1 dBm
40
45
%
32.5
39.0
Noise Figure (NF)
NF
Output IP3
OIP3
Note:
4
Two tones with 100 kHz
spacing, PIN = –10 dBm
per tone
6
dB
dBm
The above specifications apply only to the 900 MHz operating frequency.
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DATA SHEET • CX65100
33
60
32
50
40
PAE (%)
Gain (dB)
31
30
29
30
–40 oC
–40 oC
27
25 oC
20
25 oC
28
10
85 oC
85 oC
0
26
–15
–13
–11
–9
–7
–5
–3
–1
1
–15
3
–13
–11
–9
–7
PIN (dBm)
–3
–1
1
3
PIN (dBm)
Figure 3. Typical Gain vs PIN Over Temperature
(Frequency = 900 MHz)
Small Signal Gain (dB)
–5
Figure 4. Typical PAE vs PIN Over Temperature
(Frequency = 900 MHz)
35
6
30
5
25
4
NF (dB)
20
15
25 oC
10
3
25 oC
2
–30 oC
5
85 oC
0
0
750
–30 oC
1
85 oC
800
850
900
950
750
1000
800
Freq (MHz)
850
900
950
1000
Freq (MHz)
Figure 5. Typical Small Signal Gain vs Frequency Over
Temperature
Figure 6. Typical Noise Figure vs Frequency Over Temperature
50
35
30
40
25
Pout (dBm)
OIP3 (dBm)
30
20
25 oC
–30 oC
10
20
15
25 oC
10
–30 oC
85 oC
5
85 oC
0
0
750
800
850
900
950
1000
Freq (MHz)
Figure 7. Typical OIP3 vs Frequency Over Temperature
750
800
850
900
950
Freq (MHz)
Figure 8. Typical POUT vs Frequency Over Temperature
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1000
DATA SHEET • CX65100
1.955 ± 0.155
1.45 ± 0.10
Pin 8
Pin 1
Pin 7
Pin 2
Pin 6
Pin 3
Pin 5
8.385 ± 0.125
7.875 ± 0.075
Pin 4
0.51 ± 0.05
8.385 ± 0.125
7.875 ± 0.075
3.30 (2X)
DETAIL A
1.65 (2X)
Note: pin 1 connects to ground
0.81 (12X)
3.30 (2X)
R.20 (8X)
R 2.54
3.99
3.94
Pin 9
1.91 (2X)
1.91 (2X)
SEE DETAIL A
0.61 (12X)
3.94
1.65 (2X)
3.99
COPPER BOTTOM
SOLDER MASK BOTTOM
The bottom solder mask thickness = 0.063 maximum
C1201
All measurements are in millimeters
Figure 9. CX65100 8-Pin LCC Package Dimensions
12.00 ± 0.10
4.00 ± 0.10
1.50± 0.10
2.00 ± 0.10
1.75 ± 0.10
B
Pin #1
A
A
7.50 ± 0.10
16.00 +0.30/-0.10
B
1.50 ± 0.25
5o Max
8o Max
0.318 ± 0.013
Notes:
1. Carrier tape: black conductive polycarbonate
or polystyrene.
2. Cover tape material: transparent conductive PSA.
3. All measurements are in millimeters.
8.89 ± 0.10
8.88 ± 0.10
A
B
2.14 ± 0.10
C1221
Figure 10. CX65100 8-Pin LCC Tape and Reel Dimensions
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DATA SHEET • CX65100
Evaluation Board Description
5. At the RF input (pin 2), a DC blocking capacitor is required.
Skyworks CX65100 Evaluation Board is used to test the
performance of the CX65100 PA. The Evaluation Board schematic
diagram is shown in Figure 11. The schematic shows the basic
design of the board for the 700 to 1000 MHz range. Figure 12
provides the Evaluation Board assembly diagram. Figure 13
provides the Evaluation Board layer detail.
6. The RF output includes an onboard internal DC blocking
capacitor. All impedance matching is provided internally.
Therefore, the application only needs to provide a good 50 Ω
load.
Circuit Design Considerations
The following design considerations are general in nature and
must be followed regardless of final use or configuration
1. Paths to ground should be made as short as possible.
2. The ground pad of the CX65100 PA has special electrical and
thermal grounding requirements. This pad is the main thermal
conduit for heat dissipation. Since the circuit board acts as the
heat sink, it must shunt as much heat as possible from the
amplifier. As such, design the connection to the ground pad to
dissipate the maximum wattage produced to the circuit board.
Multiple vias to the grounding layer are required.
3. Three external output bypass capacitors (150 pF, 0.01 µF, and
4.7 µF) are required on the VCC1 (pin 8) supply input. The
same three capacitors are also required on the VCC2 (pin 4)
supply input. All three capacitors should be placed in parallel
between the supply line and ground. Also, 0.01 µF and 4.7 µF
bypass capacitors are required on the VREF input (pin 3). See
Figure 11 for a detailed diagram.
Testing Procedure
Use the following procedure to set up the CX65100 Evaluation
Board for testing. Refer to Figure 14 for guidance:
1. Connect a +3.4 V supply voltage to VCC1 and VCC2, and
+3.2 V supply voltage to VREF. If available, enable the current
limiting function of the power supplies to 1.0 A for the +3.4 V
supply current and 30 mA for the +3.2 V supply current.
2. Connect a signal generator to the RF signal input port. Set it to
the desired RF frequency at a power level of 2 dBm or less to
the Evaluation Board but do NOT enable the RF signal.
3. Connect a spectrum analyzer to the RF signal output port.
4. Enable the power supply.
5. Enable the RF signal.
6. Take measurements.
Caution: If the input signal exceeds the rated power, the
CX65100 Evaluation Board can be permanently
damaged.
4. VCC1 (pin 8) and VCC2 (pin 4) may be connected together at
the supply.
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DATA SHEET • CX65100
+3.4 V
C1
4.7 mF
C3
150 pF
C2
0.01 mF
VCC1
8
T2
50 W
microstrip
T1
1
7
2
6
3
5
RF in
C9
22 pF
RFIN
VREF
C7
0.01 mF
T3
50 W
microstrip
RF out
RFOUT
4
C8
4.7 mF
Pin 9
Package Base
VCC2
C4
150 pF
+3.2 V
C5
0.01 mF
Notes:
1) Pin 9 provides both a thermal and electrical ground.
This ground path is critical and must be as short
as possible.
2) Transmission line lengths T1 and T2 should be
minimized.
C6
4.7 mF
+3.4 V
C1237a
Figure 11. Evaluation Board Schematic, 700 MHz to 1000 MHz
8x8 PA EVALUATION BD.
C1
C2
C9
J1 (RF In)
C7
J2 (RF Out)
C5
C8 C4
C3
GND
GND
VREF
VCC 2
GND
VCC 1
C6
J3
C1257
Figure 12. Evaluation Board Assembly Diagram
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DATA SHEET • CX65100
Layer 1: Top - Metal
Layer 2: Inner Traces
Layer 3: Solid Ground Plane
C1253a
Figure 13. Evaluation Board Layer Detail
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DATA SHEET • CX65100
Power Supply
Signal Generator
Input
CX65100
Evaluation Board
Output
Power Meter
or
Spectrum Analyzer
C1240a
Figure 14. CX65100 Evaluation Board Testing Configuration
Ordering Information
Model Name
CX65100 700-1000 MHz Linear Power Amplifier
Manufacturing Part Number
CX65100-11
Evaluation Kit Part Number
TW10-D802
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specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts,
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Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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