TI LM50BIM3X Lm50/lm50-q1 sot-23 single-supply centigrade temperature sensor Datasheet

LM50, LM50-Q1
SNIS118E – JULY 1999 – REVISED SEPTEMBER 2013
LM50/LM50-Q1 SOT-23 Single-Supply Centigrade Temperature Sensor
Check for Samples: LM50, LM50-Q1
FEATURES
DESCRIPTION
•
The LM50/LM50-Q1 is a precision integrated-circuit
temperature sensor that can sense a −40°C to
+125°C temperature range using a single positive
supply. The LM50/LM50-Q1's output voltage is
linearly proportional to Celsius (Centigrade)
temperature (+10 mV/°C) and has a DC offset of
+500 mV. The offset allows reading negative
temperatures without the need for a negative supply.
The ideal output voltage of the LM50/LM50-Q1
ranges from +100 mV to +1.75V for a −40°C to
+125°C temperature range. The LM50/LM50-Q1 does
not require any external calibration or trimming to
provide accuracies of ±3°C at room temperature and
±4°C over the full −40°C to +125°C temperature
range. Trimming and calibration of the LM50/LM50Q1 at the wafer level assure low cost and high
accuracy. The LM50/LM50-Q1's linear output, +500
mV offset, and factory calibration simplify circuitry
required in a single supply environment where
reading negative temperatures is required. Because
the LM50/LM50-Q1's quiescent current is less than
130 μA, self-heating is limited to a very low 0.2°C in
still air.
1
2
•
•
•
•
•
•
•
•
•
•
•
Calibrated Directly in Degree Celsius
(Centigrade)
Linear + 10.0 mV/°C Scale Factor
±2°C Accuracy Specified at +25°C
Specified for Full −40° to +125°C range
Suitable for Remote Applications
Low Cost Due to Wafer-level Trimming
Operates from 4.5V to 10V
Less than 130 μA Current Drain
Low Self-heating, Less than 0.2°C in Still Air
Nonlinearity Less than 0.8°C Over Temp
LM50Q is AEC-Q100 Grade 1 qualified and is
manufactured on an Automotive Grade flow.
UL Recognized Component
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
Automotive
Computers
Disk Drives
Battery Management
Automotive
FAX Machines
Printers
Portable Medical Instruments
HVAC
Power Supply Modules
Figure 1. SOT-23 Pin Out
Top View
See Package Number DBZ0003A
Figure 2. Full-Range Centigrade Temperature
Sensor Application (−40°C to +125°C)
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard
warranty. Production processing does not necessarily include testing of all parameters.
LM50, LM50-Q1
SNIS118E – JULY 1999 – REVISED SEPTEMBER 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
(1)
ABSOLUTE MAXIMUM RATINGS
Supply Voltage
+12V to −0.2V
Output Voltage
(+VS + 0.6V) to −1.0V
Output Current
10 mA
−65°C to +150°C
Storage Temperature
TJMAX, Maximum Junction Temperature
150°C
(2)
ESD Susceptibility :
Human Body Model
Machine Model (Does not apply for LM50-Q1)
Charged Device Model
(1)
(2)
2000V
250V
750V
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its rated operating conditions.
Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine model, 200 pF discharged directly into each pin.
OPERATING RATINGS
(1)
Specified Temperature Range:
TMIN to TMAX
LM50C/LM50-Q1
−40°C to +125°C
LM50B
−25°C to +100°C
−40°C to +150°C
Operating Temperature Range
θJA (2)
450°C/W
Supply Voltage Range (+VS)
+4.5V to +10V
Soldering process must comply with Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging. (3)
(1)
(2)
(3)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its rated operating conditions.
Thermal resistance of the SOT-23 package is specified without a heat sink, junction to ambient.
Reflow temperature profiles are different for lead-free and non-lead-free packages.
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, these specifications apply for VS = +5 VDC and ILOAD = +0.5 μA, in the circuit of Figure 2. Boldface
limits apply for the specified TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25°C, unless otherwise noted.
Parameter
Conditions
LM50B
Typical
Accuracy
(2)
Nonlinearity
(3)
(4)
2
Limit
(1)
Units
(Limit)
±2.0
±3.0
°C (max)
±3.0
±4.0
°C (max)
TA = TMIN
+3.0, −3.5
±4.0
°C (max)
Output Resistance
(1)
(2)
Typical
TA = TMAX
Sensor Gain(Average Slope)
(4)
(1)
TA = +25°C
(3)
Line Regulation
LM50C/LM50-Q1
Limit
2000
+4.5V ≤ VS ≤ +10V
±0.8
±0.8
°C (max)
+9.7
+9.7
mV/°C (min)
+10.3
+10.3
mV/°C (max)
4000
Ω (max)
±0.8
±0.8
mV/V (max)
±1.2
±1.2
mV/V (max)
4000
2000
Limits are specified to TI's AOQL (Average Outgoing Quality Level).
Accuracy is defined as the error between the output voltage and 10mv/°C times the device's case temperature plus 500 mV, at specified
conditions of voltage, current, and temperature (expressed in °C).
Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's
rated temperature range.
Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
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ELECTRICAL CHARACTERISTICS (continued)
Unless otherwise noted, these specifications apply for VS = +5 VDC and ILOAD = +0.5 μA, in the circuit of Figure 2. Boldface
limits apply for the specified TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25°C, unless otherwise noted.
Parameter
Conditions
LM50B
Typical
Quiescent Current
(5)
+4.5V ≤ VS ≤ +10V
+4.5V ≤ VS ≤ +10V
Change of Quiescent Current
Temperature Coefficient of Quiescent
Current
Long Term Stability
(5)
(6)
(6)
TJ = 125°C, for 1000
hours
LM50C/LM50-Q1
Limit
(1)
Typical
Limit
(1)
Units
(Limit)
130
130
μA (max)
180
180
μA (max)
2.0
2.0
μA (max)
+1.0
+2.0
μA/°C
±0.08
±0.08
°C
Quiescent current is defined in the circuit of Figure 2.
For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature
cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered;
allow time for stress relaxation to occur. The majority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after
1000 hours will not continue at the first 1000 hour rate.
TYPICAL CHARACTERISTICS
To generate these curves the LM50/LM50-Q1 was mounted to a printed circuit board as shown in Figure 14.
Thermal Resistance
Junction to Air
Thermal Time Constant
Figure 3.
Figure 4.
Thermal Response in Still Air
with Heat Sink (Figure 14)
Thermal Response in Stirred Oil Bath
with Heat Sink
Figure 5.
Figure 6.
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SNIS118E – JULY 1999 – REVISED SEPTEMBER 2013
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TYPICAL CHARACTERISTICS (continued)
To generate these curves the LM50/LM50-Q1 was mounted to a printed circuit board as shown in Figure 14.
4
Start-Up Voltage vs Temperature
Thermal Response in Still
Air without a Heat Sink
Figure 7.
Figure 8.
Quiescent Current vs Temperature (Figure 2)
Accuracy vs Temperature
Figure 9.
Figure 10.
Noise Voltage
Supply Voltage vs Supply Current
Figure 11.
Figure 12.
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SNIS118E – JULY 1999 – REVISED SEPTEMBER 2013
TYPICAL CHARACTERISTICS (continued)
To generate these curves the LM50/LM50-Q1 was mounted to a printed circuit board as shown in Figure 14.
Start-Up Response
Figure 13.
PRINTED CIRCUIT BOARD
A.
½″ Square Printed Circuit Board with 2 oz. Foil or Similar
Figure 14. Printed Circuit Board Used
for Heat Sink to Generate All Curves
Mounting
The LM50/LM50-Q1 can be applied easily in the same way as other integrated-circuit temperature sensors. It
can be glued or cemented to a surface and its temperature will be within about 0.2°C of the surface temperature.
This presumes that the ambient air temperature is almost the same as the surface temperature; if the air
temperature were much higher or lower than the surface temperature, the actual temperature of the LM50/LM50Q1 die would be at an intermediate temperature between the surface temperature and the air temperature.
To ensure good thermal conductivity the backside of the LM50/LM50-Q1 die is directly attached to the GND pin.
The lands and traces to the LM50/LM50-Q1 will, of course, be part of the printed circuit board, which is the object
whose temperature is being measured. These printed circuit board lands and traces will not cause the
LM50/LM50-Q1s temperature to deviate from the desired temperature.
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SNIS118E – JULY 1999 – REVISED SEPTEMBER 2013
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Alternatively, the LM50/LM50-Q1 can be mounted inside a sealed-end metal tube, and can then be dipped into a
bath or screwed into a threaded hole in a tank. As with any IC, the LM50/LM50-Q1 and accompanying wiring and
circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may
operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as
Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM50/LM50-Q1 or
its connections.
Table 1. Temperature Rise of LM50/LM50-Q1 Due to Self-Heating
(Thermal Resistance, θJA)
Still air
SOT-23
SOT-23
no heat sink (1)
small heat fin (2)
450°C/W
260°C/W
Moving air
(1)
(2)
180°C/W
Part soldered to 30 gauge wire.
Heat sink used is ½″ square printed circuit board with 2 oz. foil with part attached as shown in Figure 14.
Capacitive Loads
Figure 15. LM50/LM50-Q1 No Decoupling Required
for Capacitive Load
Figure 16. LM50C/LM50-Q1 with Filter for Noisy Environment
The LM50/LM50-Q1 handles capacitive loading very well. Without any special precautions, the LM50/LM50-Q1
can drive any capacitive load. The LM50/LM50-Q1 has a nominal 2 kΩ output impedance (as can be seen in
Figure 17). The temperature coefficient of the output resistors is around 1300 ppm/°C. Taking into account this
temperature coefficient and the initial tolerance of the resistors the output impedance of the LM50/LM50-Q1 will
not exceed 4 kΩ. In an extremely noisy environment it may be necessary to add some filtering to minimize noise
pickup. It is recommended that 0.1 μF be added from VIN to GND to bypass the power supply voltage, as shown
in Figure 16. In a noisy environment it may be necessary to add a capacitor from the output to ground. A 1 μF
output capacitor with the 4 kΩ output impedance will form a 40 Hz lowpass filter. Since the thermal time constant
of the LM50/LM50-Q1 is much slower than the 25 ms time constant formed by the RC, the overall response time
of the LM50/LM50-Q1 will not be significantly affected. For much larger capacitors this additional time lag will
increase the overall response time of the LM50/LM50-Q1.
6
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SNIS118E – JULY 1999 – REVISED SEPTEMBER 2013
*R2 ≈ 2k with a typical 1300 ppm/°C drift.
Figure 17. Block Diagram
TYPICAL APPLICATIONS
Figure 18. Centigrade Thermostat/Fan Controller
Figure 19. Temperature To Digital Converter (Serial Output) (+125°C Full Scale)
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SNIS118E – JULY 1999 – REVISED SEPTEMBER 2013
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Figure 20. Temperature To Digital Converter (Parallel TRI-STATE Outputs for
Standard Data Bus to μP Interface) (125°C Full Scale)
Figure 21. LM50/LM50-Q1 With Voltage-To-Frequency Converter And Isolated Output
(−40°C to +125°C; 100 Hz to 1750 Hz)
8
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Product Folder Links: LM50 LM50-Q1
LM50, LM50-Q1
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SNIS118E – JULY 1999 – REVISED SEPTEMBER 2013
REVISION HISTORY
Changes from Revision C (February 2013) to Revision E
Page
•
Added LM50-Q1 option throughout document ...................................................................................................................... 1
•
Added Charged Device Model ESD for LM50B and LM50C ................................................................................................ 2
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PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM50BIM3
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-25 to 100
T5B
LM50BIM3/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-25 to 100
T5B
LM50BIM3X
NRND
SOT-23
DBZ
3
3000
TBD
Call TI
Call TI
-25 to 100
T5B
LM50BIM3X/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-25 to 100
T5B
LM50CIM3
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 125
T5C
LM50CIM3/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
T5C
LM50CIM3X
NRND
SOT-23
DBZ
3
3000
TBD
Call TI
Call TI
-40 to 125
T5C
LM50CIM3X/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
T5C
LM50QIM3/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-25 to 100
T5Q
LM50QIM3X/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-25 to 100
T5Q
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(4)
1-Nov-2013
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM50, LM50-Q1 :
• Catalog: LM50
• Automotive: LM50-Q1
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LM50BIM3
SOT-23
DBZ
3
1000
178.0
8.4
LM50BIM3X
SOT-23
DBZ
3
3000
178.0
LM50CIM3
SOT-23
DBZ
3
1000
178.0
LM50CIM3X
SOT-23
DBZ
3
3000
LM50QIM3/NOPB
SOT-23
DBZ
3
LM50QIM3X/NOPB
SOT-23
DBZ
3
3.3
2.9
1.22
4.0
8.0
Q3
8.4
3.3
2.9
1.22
4.0
8.0
Q3
8.4
3.3
2.9
1.22
4.0
8.0
Q3
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Oct-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM50BIM3
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM50BIM3X
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM50CIM3
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM50CIM3X
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM50QIM3/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM50QIM3X/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
Pack Materials-Page 2
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www.ti.com/omap
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e2e.ti.com
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www.ti.com/wirelessconnectivity
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