Infineon ESD5V3U2U Ultra-low capacitance esd diode array Datasheet

ESD5V3U2U...
Ultra-Low Capacitance ESD Diode Array
• ESD / transient protection of high-speed
data lines exceeding
IEC61000-4-2 (ESD): 20 kV (air / contact)
IEC61000-4-4 (EFT): 40 A (5/50 ns)
IEC61000-4-5 (surge): 3 A (8/20 µs)
• Max. working voltage: 5.3 V
• Extremely low capacitance: down to 0.2 pF
• Very low clamping voltage: 12 V typ.
• Extremely low forward clamping voltage: 4 V typ.
• Very low reverse current: < 1 nA typ.
• Pb-free (RoHS compliant) package
• Qualified according AEC Q101
Applications
• USB 2.0, 10/100/1000 Ethernet, FireWire, DVI
HDMI, S-ATA
• Mobile communication
• Consumer products (STB, MP3; DVD, DSC...)
• LCD displays, camera
• Notebooks and destop computers, peripherals
ESD5V3U2U-03F
ESD5V3U2U-03LRH
1
2
3
Type
ESD5V3U2U-03F
ESD5V3U2U-03LRH
Package
TSFP-3
TSLP-3-7
Configuration
2 lines, uni-directional*
2 lines, uni-directional*
Marking
Z1
Z1
* or 1 line, bi-directional between pins 1 and 2, if pin 3 is not connected
1
2008-09-04
ESD5V3U2U...
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter
Symbol
Value
Unit
ESD contact/ air discharge1)
VESD
20
kV
Peak pulse current (tp = 8 / 20 µs)2)
I pp
3
A
Operating temperature range
T op
-40...125
°C
Storage temperature
T stg
-65...150
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
Characteristics -
Reverse working voltage
VRWM
-
-
5.3
Breakdown voltage
V(BR)
6
-
-
IR
-
<1
50
V
I(BR) = 1 mA, from pin 1 to 3
Reverse current
nA
VR = 5.3 V, from pin 1 to 3
Clamping voltage
V
VCL
IPP = 1 A, tp = 8/20µs2), from 1/2 to 3
-
10
13
IPP = 3 A, tp = 8/20µs2), from 1/2 to 3
-
12
15
IPP = 1 A, tp = 8/20µs2), from 3 to 1/2
-
2
4
IPP = 3 A, tp = 8/20µs2), from 3 to 1/2
-
4
6
Forward clamping voltage
VFC
Line capacitance, VR = 0 V, f = 1 MHz
pF
CT
from pin 1/2 to 33)
-
0.4
0.6
from pin 1 to 2, pin 3 not connected
-
0.2
0.4
1V
ESD according to IEC61000-4-2
2I
pp according to IEC61000-4-5
3Total
capacitance line to ground
2
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ESD5V3U2U...
Clamping voltage, V cl = ƒ(Ipp)
tp = 8 / 20 µs, from pin 1/2 to 3
Forward clamping voltage V FC = ƒ(IPP)
tp = 8 / 20 µs, from pin 3 to 1/2
13
6
V
V
11
V cl
V FC
4
10
3
9
2
8
1
7
6
0
1
A
2
0
0
4
1
2
3
A
Ipp
5
Ipp
Reverse current IR = ƒ (TA)
Diode capacitance CT = ƒ (VR)
f = 1MHz, from pin 1/2 to 3
VR = Parameter, from pin 1/2 to 3
10 -6
0.6
A
pF
CT
IR
10 -7
10 -8
0.4
0.3
10 -9
0.2
10 -10
0.1
10 -11
25
50
75
100
°C
0
0
150
TA
1
2
3
V
5
VR
3
2008-09-04
ESD5V3U2U...
Line capacitance CT = ƒ (f)
Line capacitance CT = ƒ(TA)
VR = parameter, from pin 1/2 to 3
VR = 0 V, f = 1 MHz
0.7
0.6
pF
0.5
VR=0V
0.4
5.3 V
CT
CT
pF
0.4
VR=5.3V
0V
0.3
0.3
0.2
0.2
0.1
0
0
0.1
500
1000
1500
2000
MHz
0
-50
3000
-25
0
25
50
°C
100
TA
f
4
2008-09-04
ESD5V3U2U...
Connector
Application example ESD5V3U2U...
2 lines, uni-directional
2 protected high-speed I/O data lines
I/O
I/O
2
1
ESD sensitive
device
The protection diode should be
placed very close to the location
where the ESD or other transients
can occur to keep loops and
inductances as small as possible.
Pin 3 should be connected directly to
a ground plane on the board.
0.4 pF typ.
3
Connector
Application example ESD5V3U2U...
1 line, bi-directional
1 protected high-speed I/O data lines
I/O
I/O
2
1
ESD sensitive
device
The protection diode should be
placed very close to the location
where the ESD or other transients
can occur to keep loops and
inductances as small as possible.
Pin 3 should not be connected on
the board.
0.2 pF typ.
3
5
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Package TSFP-3
ESD5V3U2U...
Package Outline
0.2 ±0.05
0.55 ±0.04
1
1.2 ±0.05
0.2 ±0.05
3
2
0.2 ±0.05
10˚ MAX.
0.8 ±0.05
1.2 ±0.05
0.15 ±0.05
0.4 ±0.05
0.4 ±0.05
Foot Print
1.05
0.45
0.4
0.4
0.4
Marking Layout (Example)
Manufacturer
BCR847BF
Type code
Pin 1
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
4
0.2
1.2
1.5
8
0.3
Pin 1
0.7
1.35
6
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Package TSLP-3-7
ESD5V3U2U...
Package Outline
Bottom view
0.39 +0.01
-0.03
0.6 ±0.05
0.5 ±0.035
3
0.65 ±0.05
3
2
2
1
0.35 ±0.05
Pin 1
marking
2 x 0.15 ±0.035
2 x 0.25 ±0.035
1
1)
1 ±0.05
0.05 MAX.
1)
Cathode 2)
marking
0.25 ±0.035
1)
Top view
1)
1) Dimension applies to plated terminal
2) Only for diodes, cathode marking on pin 3
Foot Print
0.275
0.6
R0.1
0.2
0.225
0.2
0.225
0.315
0.35
1
0.3
0.945
0.35
0.45
0.355
For board assembly information please refer to Infineon website "Packages"
0.17
0.15
Copper
Solder mask
Stencil apertures
Marking Layout
Type code
Type code
Pin 1 marking
Cathode marking
Standard
Only for diodes, cathode marking on pin 3
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
Pin 1
marking
0.76
Cathode
marking
7
0.5
8
1.16
1.16
Only for diodes, cathode marking on pin 3
4
8
Standard
4
0.76
2008-09-04
ESD5V3U2U...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office ( www.infineon.com ).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
8
2008-09-04
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