Rohm BA3474F-E2 High speed with high voltage operational amplifier Datasheet

Datasheet
Operational Amplifiers / Comparators
High Speed with High Voltage
Operational Amplifiers
BA3472, BA3472R, BA3474, BA3474R
●Key Specifications
 Wide Operating Supply Voltage:
Single supply
+3.0[V] to +36.0[V]
Dual supply
±1.5[V] to ±18.0[V]
●General Description
General-purpose
BA3472,BA3472R,BA3474,BA3474R
integrate two/four Independent Op-amps and phase
compensation capacitors on a single chip and have some
features of high-gain, and wide operating voltage range of
+3[V] to +36[V](single power supply). Especially,
characteristics are high slew rate (10[V/μs]) and high
Maximum frequency (4[MHz]).
 Wide Temperature Range:
BA3474F
BA3472F
BA3472FVM
●Features
 Operable with a single power supply
 Wide operating supply voltage
 Standard Op-Amp. Pin-assignments
 Internal phase compensation
 High open loop voltage gain
 Internal ESD protection
 Operable low input voltage around GND level
 Wide output voltage range
BA3472FV
BA3474FV
BA3472RFVM
BA3474RFV
-40[°C] to +85[°C]
-40[°C] to +105[°C]
 Low Input Offset Current:
6[nA] (Typ.)
 Low Input Bias Current:
100[nA] (Typ.)
 Wide Output Voltage Range:
VEE+0.3[V]-VCC-1.0[V](Typ.)
with VCC-VEE=30[V]
 High Slew Rate:
10[V/µs]
 Maximum Frequency:
4[MHz]
 Human Body Model (HBM):
±5000[V] (Typ.)
(Typ.)
(Typ.)
(Max.)
2.90mm x 4.00mm x 0.90mm
3.00mm x 6.40mm x 1.35mm
5.00mm x 6.40mm x 1.35mm
5.00mm x 6.20mm x 1.71mm
8.70mm x 6.20mm x 1.71mm
●Packages
MSOP8
SSOP-B8
SSOP-B14
SOP8
SOP14
-40[°C] to +75[°C]
●Selection Guide
Operation guaranteed
High Speed
+75[°C]
Output Current
Source/Sink
Slew Rate
Dual
30[mA]/ 30[mA]
10[V/µs]
Quad
30[mA]/ 30[mA]
10[V/µs]
○Product structure:Silicon monolithic integrated circuit
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
BA3474F
+85[°C]
+105[°C]
BA3472F
BA3472FV
BA3472FVM
BA3472RFVM
BA3474FV
BA3474RFV
○This product is not designed protection against radioactive rays.
1/39
TSZ02201-0RAR0G200100-1-2
27.FEB.2012 Rev.001
Datasheet
BA3472, BA3472R, BA3474, BA3474R
●Pin Configuration(TOP VIEW)
OUT1 1
14 OUT4
-IN1 2
OUT1 1
-IN1
2
+IN1
3
VEE
4
8 VCC
VCC 4
11 VEE
BA3472FV
5
- +
CH2
+ CH3
OUT2 7
MSOP8
SSOP-B8
13 -IN4
12 +IN4
-IN2 6
5 +IN2
CH4
+ -
+IN1 3
+IN2
6 -IN2
CH2
+ -
SOP8
BA3472F
7 OUT2
CH1
- +
CH1
- +
SOP14
BA3474F
BA3472FVM
BA3472RFVM
10 +IN3
9
-IN3
8
OUT3
SSOP-B14
BA3474FV
BA3474RFV
●Ordering Information
B
A
3
4
7
Part Number
x
F
x
x
-
Package
F
: SOP8
SOP14
FV : SSOP-B8
SSOP-B14
FVM : MSOP8
xx
Packaging and forming specification
E2: Embossed tape and reel
(SOP8/SOP14/SSOP-B8/SSOP-B14)
TR: Embossed tape and reel
(MSOP8)
●Lineup
Topr
-40°C to +75°C
-40°C to +85°C
-40°C to +105°C
Supply
Current
(Typ.)
8.0mA
Slew Rate
(Typ.)
4.0mA
Orderable
Part Number
Package
SOP14
Reel of 2500
BA3474F-E2
SOP8
Reel of 2500
BA3472F-E2
SSOP-B8
Reel of 2500
BA3472FV-E2
MSOP8
Reel of 3000
BA3472FVM-TR
8.0mA
SSOP-B14
Reel of 2500
BA3474FV-E2
4.0mA
MSOP8
Reel of 3000
BA3472RFVM-TR
8.0mA
SSOP-B14
Reel of 2500
BA3474RFV-E2
10.0V/µs
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Datasheet
BA3472, BA3472R, BA3474, BA3474R
●Absolute Maximum Ratings (Ta=25[℃])
Ratings
Parameter
Supply Voltage
Symbol
BA3472
BA3474
Unit
BA3472R
BA3474R
VCC-VEE
+36
V
Vid
36
V
Vicm
(VEE - 0.3) to VEE + 36
V
Differential Input Voltage (*1)
Input Common-mode
Voltage Range
Operating Temperature Range
Topr
Storage Temperature Range
Maximum Junction Temperature
-40 to +85(SOP14:+75)
-40 to +105
℃
Tstg
-55 to +150
℃
Tjmax
+150
℃
Note: Absolute maximum rating item indicates the condition which must not be exceeded.
Application if voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause
deterioration of characteristics.
(*1) The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VEE.
●Electrical Characteristics
○BA3472 (Unless otherwise specified
Parameter
Input Offset Voltage (*2)
Symbol
Vio
VCC=+15[V], VEE=-15[V], Ta=25[℃])
Limits
Temperature
range
BA3472F/FV/FVM
Min.
Typ.
Max.
-
1
10
25℃
Unit
Vicm=0[V],VOUT=0[V]
mV
-
1.5
10
Condition
VCC=5[V],VEE=0[V],Vicm=0[V],
VOUT=VCC/2
Input Offset Current (*2)
Iio
25℃
-
6
75
nA
Vicm=0[V],VOUT=0[V]
Input Bias Current (*2)
Ib
25℃
-
100
500
nA
Vicm=0[V],VOUT=0[V]
ICC
25℃
-
4
5.5
mA
RL=∞
3.7
4
-
13.7
14
-
Supply Current
High Level Output Voltage
Low Level Output Voltage
Large Signal Voltage Gain
VOH
VOL
25℃
25℃
13.5
-
-
-
0.1
0.3
-
-14.7
-14.3
-
-
-13.5
VCC=5[V],RL=2[kΩ]
V
RL=10[kΩ]
RL=2[kΩ]
VCC=5[V],RL=2[kΩ]
V
RL=10[kΩ]
RL=2[kΩ]
AV
25℃
80
100
-
dB
RL≧2[kΩ],VOUT=±10 [V]
Vicm
25℃
0
-
VCC-2.0
V
VCC=5[V],VEE=0[V],
VOUT=VCC/2
Common-mode Rejection Ratio
CMRR
25℃
60
97
-
dB
Vicm=0[V],VOUT=0[V]
Power Supply Rejection Ratio
PSRR
25℃
60
97
-
dB
Vicm=0[V],VOUT=0[V]
Output Source Current (*3)
IOH
25℃
10
30
-
mA
Output Sink Current (*3)
IOL
25℃
20
30
-
mA
ft
25℃
-
4
-
MHz
Slew Rate
SR
25℃
-
10
-
V/μs
Channel Separation
CS
25℃
-
120
-
dB
Input Common-mode
Voltage Range
Maximum Frequency
(*2)
(*3)
VCC=5[V],VIN+=1[V],
VIN-=0[V],VOUT=0[V]
Only 1ch is short circuit
VCC=5[V],VIN+=0[V],
VIN-=1[V],VOUT=5[V],
Only 1ch is short circuit
Av=1,Vin=-10 to +10[V],
RL=2[kΩ]
-
Absolute value
Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
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TSZ02201-0RAR0G200100-1-2
27.FEB.2012 Rev.001
Datasheet
BA3472, BA3472R, BA3474, BA3474R
○BA3472R (Unless otherwise specified VCC=+15[V], VEE=-15[V], Ta=25[℃])
Limits
Parameter
Input Offset Voltage (*4)
Symbol
Vio
Temperature
range
BA3472RFVM
Unit
Min.
Typ.
Max.
-
1
10
25℃
Vicm=0[V],VOUT=0[V]
mV
-
1.5
10
Condition
VCC=5[V],VEE=0[V],Vicm=0[V],
VOUT=VCC/2
Input Offset Current (*4)
Iio
25℃
-
6
75
nA
Vicm=0[V],VOUT=0[V]
Input Bias Current (*4)
Ib
25℃
-
100
500
nA
Vicm=0[V],VOUT=0[V]
Supply Current
ICC
25℃
-
4
5.5
mA
RL=∞
3.7
4
-
High Level Output Voltage
VOH
25℃
13.7
14
-
13.5
-
-
Low Level Output Voltage
Large Signal Voltage Gain
VOL
25℃
-
0.1
0.3
-
-14.7
-14.3
-
-
-13.5
VCC=5[V],RL=2[kΩ]
V
RL=10[kΩ]
RL=2[kΩ]
VCC=5[V],RL=2[kΩ]
V
RL=10[kΩ]
RL=2[kΩ]
AV
25℃
80
100
-
dB
RL≧2[kΩ],VOUT=±10 [V]
Vicm
25℃
0
-
VCC-2.0
V
VCC=5[V],VEE=0[V],
VOUT=VCC/2
Common-mode Rejection Ratio
CMRR
25℃
60
97
-
dB
Vicm=0[V],VOUT=0[V]
Power Supply Rejection Ratio
PSRR
25℃
60
97
-
dB
Vicm=0[V],VOUT=0[V]
Output Source Current (*5)
IOH
25℃
10
30
-
mA
Output Sink Current (*5)
IOL
25℃
20
30
-
mA
ft
25℃
-
4
-
MHz
Slew Rate
SR
25℃
-
10
-
V/μs
Channel Separation
CS
25℃
-
120
-
dB
Input Common-mode
Voltage Range
Maximum Frequency
(*4)
(*5)
VCC=5[V],VIN+=1[V],
VIN-=0[V], VOUT=0[V]
Only 1ch is short circuit
VCC=5[V],VIN+=0[V],
VIN-=1[V], VOUT=5[V]
Only 1ch is short circuit
Av=1,Vin=-10 to +10[V],
RL=2[kΩ]
-
Absolute value
Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
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4/39
TSZ02201-0RAR0G200100-1-2
27.FEB.2012 Rev.001
Datasheet
BA3472, BA3472R, BA3474, BA3474R
○BA3474 (Unless otherwise specified VCC=+15[V], VEE=-15[V], Ta=25[℃])
Limits
Parameter
Input Offset Voltage (*6)
Symbol
Vio
Temperature
range
BA3474F/FV
Unit
Min.
Typ.
Max.
-
1
10
25℃
Vicm=0[V],VOUT=0[V]
mV
-
1.5
10
Condition
VCC=5[V],VEE=0[V], Vicm=0[V]
VOUT=VCC/2
Input Offset Current (*6)
Iio
25℃
-
6
75
nA
Vicm=0[V],VOUT=0[V]
Input Bias Current (*6)
Ib
25℃
-
100
500
nA
Vicm=0[V],VOUT=0[V]
Supply Current
ICC
25℃
-
8
11
mA
RL=∞
3.7
4
-
High Level Output Voltage
VOH
25℃
13.7
14
-
13.5
-
-
Low Level Output Voltage
Large Signal Voltage Gain
VOL
25℃
-
0.1
0.3
-
-14.7
-14.3
-
-
-13.5
VCC=5[V],RL=2[kΩ]
V
RL=10[kΩ]
RL=2[kΩ]
VCC=5[V],RL=2[kΩ]
V
RL=10[kΩ]
RL=2[kΩ]
AV
25℃
80
100
-
dB
RL≧2[kΩ], VOUT=±10 [V]
Vicm
25℃
0
-
VCC-2.0
V
VCC=5[V],VEE=0[V],
VOUT=VCC/2
Common-mode Rejection Ratio
CMRR
25℃
60
97
-
dB
Vicm=0[V],VOUT=0[V]
Power Supply Rejection Ratio
PSRR
25℃
60
97
-
dB
Vicm=0[V],VOUT=0[V]
Output Source Current (*7)
IOH
25℃
10
30
-
mA
Output Sink Current (*7)
IOL
25℃
20
30
-
mA
ft
25℃
-
4
-
MHz
Slew Rate
SR
25℃
-
10
-
V/μs
Channel Separation
CS
25℃
-
120
-
dB
Input Common-mode Voltage
Range
Maximum Frequency
(*6)
(*7)
VCC=5[V],VIN+=1[V],
VIN-=0[V], VOUT=0[V]
Only 1ch is short circuit
VCC=5[V],VIN+=0[V],
VIN-=1[V], VOUT=5[V]
Only 1ch is short circuit
Av=1,Vin=-10 to +10[V],
RL=2[kΩ]
-
Absolute value
Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
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5/39
TSZ02201-0RAR0G200100-1-2
27.FEB.2012 Rev.001
Datasheet
BA3472, BA3472R, BA3474, BA3474R
○BA3474R (Unless otherwise specified VCC=+15[V], VEE=-15[V], Ta=25[℃])
Limits
Parameter
Input Offset Voltage (*8)
Symbol
Vio
Temperature
range
25℃
BA3474RFV
Unit
Min.
Typ.
Max.
-
1
10
Vicm=0[V],VOUT=0[V]
mV
-
1.5
10
Condition
VCC=5[V],VEE=0[V],Vicm=0[V],
VOUT=VCC/2
Input Offset Current (*8)
Iio
25℃
-
6
75
nA
Vicm=0[V],VOUT=0[V]
Input Bias Current (*8)
Ib
25℃
-
100
500
nA
Vicm=0[V],VOUT=0[V]
Supply Current
ICC
25℃
-
8
11
mA
RL=∞
High Level Output Voltage
VOH
Low Level Output Voltage
Large Signal Voltage Gain
VOL
25℃
25℃
3.7
4
-
13.7
14
-
13.5
-
-
-
0.1
0.3
-
-14.7
-14.3
-
-
-13.5
VCC=5[V],RL=2[kΩ]
V
RL=10[kΩ]
RL=2[kΩ]
VCC=5[V],RL=2[kΩ]
V
RL=10[kΩ]
RL=2[kΩ]
AV
25℃
80
100
-
dB
RL≧2[kΩ],VOUT=±10 [V]
Vicm
25℃
0
-
VCC-2.0
V
VCC=5[V],VEE=0[V],
VOUT=VCC/2
Common-mode Rejection Ratio
CMRR
25℃
60
97
-
dB
Vicm=0[V],VOUT=0[V]
Power Supply Rejection Ratio
PSRR
25℃
60
97
-
dB
Vicm=0[V],VOUT=0[V]
Output Source Current (*9)
IOH
25℃
10
30
-
mA
Output Sink Current (*9)
IOL
25℃
20
30
-
mA
ft
25℃
-
4
-
MHz
Slew Rate
SR
25℃
-
10
-
V/μs Av=1,Vin=-10 to +10[V],RL=2[kΩ]
Channel Separation
CS
25℃
-
120
-
Input Common-mode Voltage
Range
Maximum Frequency
(*8)
(*9)
VCC=5[V],VIN+=1[V],
VIN-=0[V],VOUT=0[V],
Only 1ch is short circuit
VCC=5[V],VIN+=0[V],
VIN-=1[V],VOUT=5[V],
Only 1ch is short circuit
-
-
dB
Absolute value
Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
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TSZ02201-0RAR0G200100-1-2
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Datasheet
BA3472, BA3472R, BA3474, BA3474R
Description of Electrical Characteristics
Described below are descriptions of the relevant electrical terms
Please note that item names, symbols and their meanings may differ from those on another manufacturer’s documents.
1. Absolute maximum ratings
The absolute maximum ratings are values that should never be exceeded, since doing so may result in deterioration of
electrical characteristics or damage to the part itself as well as peripheral components.
1.1 Power supply voltage (VCC-VEE)
Expresses the maximum voltage that can be supplied between the positive and negative supply terminals without
causing deterioration of the electrical characteristics or destruction of the internal circuitry.
1.2 Differential input voltage (Vid)
Indicates the maximum voltage that can be supplied between the non-inverting and inverting terminals without
damaging the IC.
1.3 Input common-mode voltage range (Vicm)
Signifies the maximum voltage that can be supplied to non-inverting and inverting terminals without causing
deterioration of the characteristics or damage to the IC itself. Normal operation is not guaranteed within the
common-mode voltage range of the maximum ratings – use within the input common-mode voltage range of the
electric characteristics instead.
1.4 Power dissipation (Pd)
Indicates the power that can be consumed by a particular mounted board at ambient temperature (25℃). For
packaged products, Pd is determined by the maximum junction temperature and the thermal resistance.
2. Electrical characteristics
2.1 Input offset voltage (Vio)
Signifies the voltage difference between the non-inverting and inverting terminals. It can be thought of as the input
voltage difference required for setting the output voltage to 0 V.
2.2 Input offset current (Iio)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
2.3 Input bias current (Ib)
Denotes the current that flows into or out of the input terminal, it is defined by the average of the input bias current at
the non-inverting terminal and the input bias current at the inverting terminal.
2.4 Circuit current (ICC)
Indicates the current of the IC itself that flows under specified conditions and during no-load steady state.
2.5 maximum output voltage (VOM)
Indicates the voltage range that can be output by the IC under specified load condition. It is typically divided into
high-level output voltage and low-level output voltage.
2.6 Large signal voltage gain (AV)
The amplifying rate (gain) of the output voltage against the voltage difference between non-inverting and inverting
terminals, it is (normally) the amplifying rate (gain) with respect to DC voltage.
AV = (output voltage fluctuation) / (input offset fluctuation)
2.7 Input common-mode voltage range (Vicm)
Indicates the input voltage range under which the IC operates normally.
2.8 Common-mode rejection ratio (CMRR)
Signifies the ratio of fluctuation of the input offset voltage when the in-phase input voltage is changed (DC fluctuation).
CMRR = (change in input common-mode voltage) / (input offset fluctuation)
2.9 Power supply rejection ratio (PSRR)
Denotes the ratio of fluctuation of the input offset voltage when supply voltage is changed (DC fluctuation).
SVR = (change in power supply voltage) / (input offset fluctuation)
2.10 Channel separation (CS)
Expresses the amount of fluctuation of the input offset voltage or output voltage with respect to the change in the
output voltage of a driven channel.
2.11 Slew rate (SR)
Indicates the time fluctuation ratio of the output voltage when an input step signal is supplied.
2.12 Maximum frequency (ft)
Indicates a frequency where the voltage gain of Op-Amp is 1.
2.13 Total harmonic distortion + Noise (THD+N)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
2.14 Input referred noise voltage (Vn)
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in
series with input terminal.
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TSZ02201-0RAR0G200100-1-2
27.FEB.2012 Rev.001
Datasheet
BA3472, BA3472R, BA3474, BA3474R
●Circuit Diagram
VCC
VIN-
VOUT
VIN+
VEE
Fig.1 Schematic diagram (one channel only)
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TSZ02201-0RAR0G200100-1-2
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Datasheet
BA3472, BA3472R, BA3474, BA3474R
●Typical Performance Curves
BA3472
Fig.2
Derating Curve
Fig.3
Supply Current - Supply Voltage
Fig.4
Supply Current - Ambient Temperature
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TSZ22111・15・001
Fig.5
High level Output Voltage - Supply Voltage
(RL=10[kΩ])
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TSZ02201-0RAR0G200100-1-2
27.FEB.2012 Rev.001
Datasheet
BA3472, BA3472R, BA3474, BA3474R
Fig.7
Low level Output Voltage
- Supply Voltage
(RL=10[kΩ])
Fig.6
High level Output Voltage
- Ambient Temperature
(RL=10[kΩ])
Fig.8
Low level Output Voltage
- Ambient Temperature
(RL=10[kΩ])
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TSZ22111・15・001
Fig.9
Output Source Current - (VCC-VOUT)
(VCC/VEE=5[V]/0[V])
10/39
TSZ02201-0RAR0G200100-1-2
27.FEB.2012 Rev.001
Datasheet
BA3472, BA3472R, BA3474, BA3474R
Fig.11
Input Offset Voltage
- Common Model Input Voltage
(VCC/VEE=15[V]/-15[V])
Fig.10
Output Source Current - (VOUT-VEE)
(VCC/VEE=5[V]/0[V])
Fig.13
Input Offset Voltage - Ambient Temperature
Fig.12
Input Offset Voltage - Supply voltage
(*)The data above is ability value of sample, it is not guaranteed
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Datasheet
BA3472, BA3472R, BA3474, BA3474R
Fig.14
Input Bias Current - Supply voltage
Fig.15
Input Bias Current - Ambient Temperature
Fig.16
Large Signal Voltage Gain
-Supply Voltage
Fig.17
Large Signal Voltage Gain
-Ambient Temperature
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Fig.18
Common Mode Rejection Ratio
-Supply Voltage
Fig.19
Common Mode Rejection Ratio
-Ambient Temperature
Fig.20
Slew Rate L-H - Supply Voltage
(RL=10[kΩ])
Fig.21
Slew Rate L-H - Ambient Temperature
(RL=10[kΩ])
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Fig.23
Input / Output Voltage - Time
(VCC/VEE=15[V]/-15[V], Av=0[dB],
RL=2[kΩ],CL=100[pF],Ta=25[℃])
Fig.22
Voltage Gain - Frequency
(VCC=7.5[V]/-7.5[V], Av=40[dB],
RL=2[kΩ],CL=100[pF],Ta=25[℃])
Fig.24
Input / Output Voltage - Time
(VCC/VEE=15[V]/-15[V], Av=0[dB],
RL=2[kΩ], CL=100[pF], Ta=25[℃])
(*)The data above is ability value of sample, it is not guaranteed
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BA3474
Fig.25
Derating Curve
Fig.26
Supply Current - Supply Voltage
Fig.27
Supply Current - Ambient Temperature
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TSZ22111・15・001
Fig.28
High level Output Voltage
- Supply Voltage
(RL=10[kΩ])
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Fig.29
High level Output Voltage
- Ambient Temperature
(RL=10[kΩ])
Fig.30
Low level Output Voltage
- Supply Voltage
(RL=10[kΩ])
Fig.31
Low level Output Voltage
- Ambient Temperature
(RL=10[kΩ])
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Fig.32
Output Source Current - (VCC-VOUT)
(VCC/VEE=5[V]/0[V])
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Fig.34
Input Offset Voltage
- Common Model Input Voltage
(VCC/VEE=15[V]/-15[V])
Fig.33
Output Source Current - (VOUT-VEE)
(VCC/VEE=5[V]/0[V])
Fig.35
Input Offset Voltage - Supply voltage
Fig.36
Input Offset Voltage -Ambient Temperature
(*)The data above is ability value of sample, it is not guaranteed
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Fig.37
Input Bias Current - Supply voltage
Fig.38
Input Bias Current - Ambient Temperature
Fig.39
Large Signal Voltage Gain
-Supply Voltage
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Fig.40
Large Signal Voltage Gain
-Ambient Temperature
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Fig.42
Common Mode Rejection Ratio
-Ambient Temperature
Fig.41
Common Mode Rejection Ratio
-Supply Voltage
Fig.43
Slew Rate L-H - Supply Voltage
(RL=10[kΩ])
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Fig.44
Slew Rate L-H - Ambient Temperature
(RL=10[kΩ])
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Fig.45
Voltage Gain - Frequency
(VCC=7.5[V]/-7.5[V], Av=40[dB],
RL=2[kΩ],CL=100[pF],Ta=25[℃])
Fig.46
Input / Output Voltage - Time
(VCC/VEE=15[V]/-15[V], Av=0[dB],
RL=2[kΩ],CL=100[pF],Ta=25[℃])
Fig.47
Input / Output Voltage - Time
(VCC/VEE=15[V]/-15[V], Av=0[dB],
RL=2[kΩ],CL=100[pF],Ta=25[℃])
(*)The data above is ability value of sample, it is not guaranteed.
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BA3472R
Fig.48
Derating Curve
Fig.49
Supply Current - Supply Voltage
Fig.50
Supply Current - Ambient
Temperature
Fig.51
High level Output Voltage
- Supply Voltage
(RL=10[kΩ])
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Fig.52
High level Output Voltage
- Ambient Temperature
(RL=10[kΩ])
Fig.53
Low level Output Voltage
- Supply Voltage
(RL=10[kΩ])
Fig.54
Low level Output Voltage
- Ambient Temperature
(RL=10[kΩ])
Fig.55
Output Source Current - (VCC-VOUT)
(VCC/VEE=5[V]/0[V])
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Fig.56
Output Source Current (VOUT-VEE)
(VCC/VEE=5[V]/0[V])
Fig.57
Input Offset Voltage
- Common Model Input Voltage
(VCC/VEE=15[V]/-15[V])
Fig.58
Input Offset Voltage - Supply voltage
Fig.59
Input Offset Voltage - Ambient
Temperature
(*)The data above is ability value of sample, it is not guaranteed.
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Fig.60
Input Bias Current - Supply
voltage
Fig.61
Input Bias Current - Ambient
Temperature
Fig.62
Large Signal Voltage Gain
-Supply Voltage
Fig.63
Large Signal Voltage Gain
-Ambient Temperature
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Fig.65
Common Mode Rejection Ratio
-Ambient Temperature
Fig.64
Common Mode Rejection Ratio
-Supply Voltage
Fig.67
Slew Rate L-H - Ambient Temperature
(RL=10[kΩ])
Fig.66
Slew Rate L-H - Supply Voltage
(RL=10[kΩ])
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Fig.68
Voltage Gain - Frequency
(VCC=7.5[V]/-7.5[V], Av=40[dB],
RL=2[kΩ],CL=100[pF],Ta=25[℃])
Fig.69
Input / Output Voltage - Time
(VCC/VEE=15[V]/-15[V], Av=0[dB],
RL=2[kΩ],CL=100[pF],Ta=25[℃])
Fig.70
Input / Output Voltage - Time
(VCC/VEE=15[V]/-15[V], Av=0[dB],
RL=2[kΩ],CL=100[pF],Ta=25[℃])
(*) The data above is ability value of sample, it is not guaranteed.
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BA3474R
Fig.71
Derating Curve
Fig.72
Supply Current - Supply Voltage
Fig.73
Supply Current - Ambient Temperature
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Fig.74
High level Output Voltage
- Supply Voltage
(RL=10[kΩ])
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Fig.76
Low level Output Voltage
- Supply Voltage
(RL=10[kΩ])
Fig.75
High level Output Voltage
- Ambient Temperature
(RL=10[kΩ])
Fig.77
Low level Output Voltage
- Ambient Temperature
(RL=10[kΩ])
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Fig.78
Output Source Current - (VCC-VOUT)
(VCC/VEE=5[V]/0[V])
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Fig.79
Output Source Current - (VOUT-VEE)
(VCC/VEE=5[V]/0[V])
Fig.80
Input Offset Voltage
- Common Model Input Voltage
(VCC/VEE=15[V]/-15[V])
Fig.81
Input Offset Voltage - Supply voltage
Fig.82
Input Offset Voltage -Ambient Temperature
(*)The data above is ability value of sample, it is not guaranteed
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Fig.83
Input Bias Current - Supply voltage
Fig.84
Input Bias Current - Ambient Temperature
Fig.85
Large Signal Voltage Gain
-Supply Voltage
Fig.86
Large Signal Voltage Gain
-Ambient Temperature
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Fig.88
Common Mode Rejection Ratio
-Ambient Temperature
Fig.87
Common Mode Rejection Ratio
-Supply Voltage
Fig.89
Slew Rate L-H - Supply Voltage
(RL=10[kΩ])
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Fig.90
Slew Rate L-H - Ambient Temperature
(RL=10[kΩ])
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Fig.92
Input / Output Voltage - Time
(VCC/VEE=15[V]/-15[V], Av=0[dB],
RL=2[kΩ],CL=100[pF],Ta=25[℃])
Fig.91
Voltage Gain - Frequency
(VCC=7.5[V]/-7.5[V], Av=40[dB],
RL=2[kΩ],CL=100[pF],Ta=25[℃])
Fig.93
Input / Output Voltage - Time
(VCC/VEE=15[V]/-15[V], Av=0[dB],
RL=2[kΩ],CL=100[pF],Ta=25[℃])
(*)The data above is ability value of sample, it is not guaranteed
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Datasheet
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●Application Information
Test circuit 1 NULL method
VCC, VEE, EK, Vicm Unit : [V]
Parameter
VF
S1
S2
S3
VCC
VEE
EK
Vicm Calculation
Input Offset Voltage
VF1
ON
ON
OFF
15
-15
0
0
1
Input Offset Current
VF2
OFF
OFF
OFF
15
-15
0
0
2
VF3
OFF
ON
VF4
ON
OFF
OFF
15
-15
0
0
3
ON
ON
ON
15
-15
+10
0
15
-15
-10
0
ON
ON
OFF
15
-15
0
-15
15
-15
0
13
ON
ON
OFF
Input Bias Current
VF5
Large Signal Voltage Gain
VF6
Common-mode Rejection Ratio
(Input Common-mode Voltage Range)
VF7
VF8
VF9
Power Supply Rejection Ratio
VF10
2
-2
0
0
18
-18
0
0
4
5
6
-Calculation-
1. Input Offset Voltage (Vio)
Vio =
| VF1 |
1 + Rf / Rs
[V]
C2
0.1[µF]
2. Input Offset Current (Iio)
Iio =
| VF2-VF1 |
[A]
Rf
50[kΩ]
Ri ×(1 + Rf / Rs)
S1
3. Input Bias Current (Ib)
Ib =
| VF4-VF3 |
Rs
[A]
2×Ri× (1 + Rf / Rs)
50[Ω] 10[kΩ]
Av = 20×Log
Rs
ΔEK×(1+Rf /Rs)
[dB]
|VF5-VF6|
0.1[µF]
+15[V]
RK 500[kΩ]
DUT
NULL
S3
Ri
S2
Vicm
EK
C1
RK
500[kΩ]
Ri
50[Ω] 10[kΩ]
4. Large Signal Voltage Gain (Av)
VCC
VEE
C3
1000[pF]
RL
-15[V]
V VF
5. Common-mode Rejection Ratio (CMRR)
CMRR = 20×Log
ΔVicm×(1+Rf /Rs)
|VF8-VF7|
[dB]
Fig.94 Test circuit 1 (one channel only)
6. Power Supply Rejection Ratio (PSRR)
PSRR = 20×Log
ΔVcc×(1+Rf /Rs)
|VF10-VF9|
[dB]
Test circuit2 switch condition
SW No.
SW
1
SW
2
SW
3
SW
4
SW
5
SW
6
SW
7
SW
8
SW
9
SW
10
SW
11
SW
12
SW
13
SW
14
Supply Current
OFF OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF OFF
High Level Output Voltage
OFF OFF ON OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF
Low Level Output Voltage
OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF ON OFF
Output Source Current
OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON
Output Sink Current
OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON
Slew Rate
OFF OFF OFF ON OFF OFF OFF ON
ON
ON OFF OFF OFF OFF
Gain Bandwidth Product
OFF ON OFF OFF ON
ON OFF OFF ON
ON OFF OFF OFF OFF
Equivalent Input Noise Voltage
ON OFF OFF OFF ON
ON OFF OFF OFF OFF ON OFF OFF OFF
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Voltage
SW4
VH
R2
SW5
VL
VCC
A
Input Voltage Waveform
-
SW1
RS
SW2
SW3
Voltage
電圧
+
SW6
R1
SW7
SW8
time
VH
SW9
SW10
SW11
SW12
SW13
ΔV
SW14
VEE
~
VIN-
VIN+
A
RL
~
CL
V
~
VL
V
VOUT
Δt
Output Voltage Waveform
出力電圧波形
Fig.95 Test circuit 2 (one channel only)
time
時間
Fig.96 Slew rate input output wave
Test circuit 3 Channel separation
VCC
VCC
R1//R2
R1//R2
OTHER
CH
VEE
VEE
R1
VIN
R2
R1
V
VOUT2
R2
V
VOUT1
=0.5[Vrms]
CS=20 × log
100 × VOUT1
VOUT2
Fig.97 Test circuit 3
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Derating curves
Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature). IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal
resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θja[℃/W].The temperature of IC inside the package can be estimated by this
thermal resistance. Fig.98 (a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient
temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below:
θja = (Tj-Ta) / Pd
[℃/W]
・・・・・ (Ⅰ)
Derating curve in Fig.98 (b) indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient iis determined by thermal
resistance θja. Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package
condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value
measured at a specified condition. Fig.99(c) ~ (f) shows a derating curve for an example of BA3472, BA3474, BA3472R,
BA3474R.
LSIの 消 費
力 [W]
Power dissipation
of 電
LSI
Pd (max)
θja = ( Tj ー Ta ) / Pd [℃/W]
P2
Ambient temperature
θja2 < θja1
周囲温度 Ta [℃]
θ' ja2
P1
θ ja2
Tj ' (max) Tj (max)
θ' ja1
Chip surface temperature
θ ja1
チップ 表面温度 Tj [℃]
Power dissipation Pd [W]
0
消費電力 P [W]
25
50
75
100
125
150
Ambient temperature
周 囲 温 度 Ta [℃ ]
(b) Derating curve
(a) Thermal resistance
Fig. 98 Thermal resistance and derating curve
1000
1000
BA3472F
許容損失
POWER
DISSIPATION
Pd [mW]
Pd [mW]
許容損失
Pd [mW]
POWER
DISSIPATION
Pd [mW]
870mW(*13)
800 780mW(*10)
690mW(*11)
BA3472FV
590mW(*12)
600
400
BA3472FVM
200
0
0
25
50
75 85 100
BA3474FV
800
610mW(*14)
600
400
BA3474F
200
0
125
0
Ta [℃] Ta [℃]
Ambient
Temperature:
周囲温度
(c)BA3472
1000
50
75
85
100
125
(d)BA3474
1800
937mW(*17)
BA3472RFVM
1689mW(*19)
1600
800
POWER
DISSIPATION
Pd [mW]
許容損失
Pd [mW]
許容損失
POWER
DISSIPATION
Pd [mW]
Pd [mW]
25
Ambient
Temperature:
Ta [℃] Ta [℃]
周囲温度
713mW(*16)
625mW(*15)
600
590mW(*12)
400
200
BA3474RFV
1400
1187mW(*18)
1200
1000
870mW(*13)
800
600
400
200
105
0
105
0
0
25
50
75
100
[℃] Ta [℃]
Ambient周囲温度
Temperature:
125
0
25
50
75
100
125
Ta [℃] Ta [℃]
Ambient
Temperature:
周囲温度
(e)BA3472R
(f)BA3474R
(*10)
(*11)
(*12)
(*13)
(*14)
(*15)
(*16)
(*17)
(*18)
(*19)
Unit
6.2
5.5
4.7
7.0
4.9
5.0
5.7
7.5
9.5
13.5
[mW/℃]
When using the unit above Ta=25[℃], subtract the value above per degree[℃].
(*10) (*11) (*12) (*13) (*14) Mounted on a glass epoxy 1 layers PCB 70[mm]×70[mm]×1.6[mm] (occupied copper area:below 3[%]).
(*15) Mounted on a glass epoxy 2 layers PCB 70[mm]×70[mm]×1.6[mm] (occupied copper area:15mm×15mm).
(*16) (*18) Mounted on a glass epoxy 2 layers PCB 70[mm]×70[mm]×1.6[mm] (occupied copper area:70mm×70mm).
(*17) (*19) Mounted on a glass epoxy 4 layers PCB 70[mm]×70[mm]×1.6[mm] (occupied copper area:70mm×70mm).
Fig. 99 Derating curve
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BA3472, BA3472R, BA3474, BA3474R
●Operational Notes
1) Unused circuits
When there are unused circuits it is recommended that they are connected
as in Fig.100, setting the non-inverting input terminal to a potential within
input common-mode voltage range (Vicm).
2) Input terminal voltage
Applying GND + 36V to the input terminal is possible without causing
deterioration of the electrical characteristics or destruction, irrespective of
the supply voltage. However, this does not ensure normal circuit operation.
Please note that the circuit operates normally only when the input voltage is
within the common mode input voltage range of the electric characteristics.
3) Power supply (single / dual)
The op-amp operates when the specified voltage supplied is between VCC
and VEE. Therefore, the single supply op-amp can be used as dual supply
op-amp as well.
VCC
Please keep this
potential in Vicm
+
VEE
Fig.100 Unused circuit example
4) Power dissipation Pd
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in
chip temperature, including reduced current capability. Therefore, please take into consideration the power dissipation
(Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating
curves for more information.
5) Short-circuit between pins and erroneous mounting
Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output and
the power supply, or the output and GND may result in IC destruction.
6) Operation in a strong electromagnetic field
Operation in a strong electromagnetic field may cause malfunctions.
7) Radiation
This IC is not designed to withstand radiation.
8) IC handing
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical
characteristics due to piezoelectric (piezo) effects.
9) Board inspection
Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every
process is recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the
power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the assembly
process as well as during transportation and storage.
10) Output capacitor
Discharge of the external output capacitor to VCC is possible via internal parasitic elements when VCC is shorted to VEE,
causing damage to the internal circuitry due to thermal stress. Therefore, when using this IC in circuits where oscillation
due to output capacitive load does not occur, such as in voltage comparators, use an output capacitor with a capacitance
less than 0.1µF.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
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TSZ02201-0RAR0G200100-1-2
27.FEB.2012 Rev.001
Datasheet
BA3472, BA3472R, BA3474, BA3474R
●Physical Dimensions Tape and Reel Information
SOP8
<Tape and Reel information>
7
6
5
6.2±0.3
4.4±0.2
0.3MIN
8
+6°
4° −4°
1 2
3
0.9±0.15
5.0±0.2
(MAX 5.35 include BURR)
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.595
1.5±0.1
+0.1
0.17 -0.05
S
S
0.11
0.1
1.27
1pin
0.42±0.1
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
SOP14
<Tape and Reel information>
8.7 ± 0.2
(MAX 9.05 include BURR)
8
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
0.3MIN
4.4±0.2
6.2±0.3
14
1
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
7
1.5±0.1
0.15 ± 0.1
0.11
1.27
0.4 ± 0.1
0.1
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
SSOP-B8
<Tape and Reel information>
3.0±0.2
(MAX 3.35 include BURR)
0.3MIN
4.4 ± 0.2
6.4 ± 0.3
876 5
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1.15 ± 0.1
1 23 4
0.15±0.1
0.1
S
0.1
0.22±0.10
(0.52)
0.08
M
0.65
1pin
Reel
(Unit : mm)
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
37/39
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
TSZ02201-0RAR0G200100-1-2
27.FEB.2012 Rev.001
Datasheet
BA3472, BA3472R, BA3474, BA3474R
SSOP-B14
<Tape and Reel information>
5.0 ± 0.2
8
1
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
0.3Min.
4.4 ± 0.2
6.4 ± 0.3
14
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
7
0.10
1.15 ± 0.1
0.15 ± 0.1
0.1
0.65
0.22 ± 0.1
Direction of feed
1pin
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
MSOP8
<Tape and Reel information>
2.8±0.1
4.0±0.2
8 7 6 5
0.6±0.2
+6°
4° −4°
0.29±0.15
2.9±0.1
(MAX 3.25 include BURR)
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1 2 3 4
1PIN MARK
1pin
+0.05
0.145 −0.03
0.475
0.08±0.05
0.75±0.05
0.9MAX
S
+0.05
0.22 −0.04
0.08 S
Direction of feed
0.65
Reel
(Unit : mm)
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
38/39
∗ Order quantity needs to be multiple of the minimum quantity.
TSZ02201-0RAR0G200100-1-2
27.FEB.2012 Rev.001
Datasheet
BA3472, BA3472R, BA3474, BA3474R
●Marking Diagrams
SOP8(TOP VIEW)
SOP14(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
SSOP-B8(TOP VIEW)
SSOP-B14(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
MSOP8(TOP VIEW)
Part Number Marking
Product Name
LOT Number
BA3472
1PIN MARK
BA3474
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
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F
FV
FVM
RFVM
F
FV
RFV
Package Type
SOP8S
SSOP-B8
MSOP8
MSOP8
SOP14
SSOP-B14
SSOP-B14
Marking
3472
3472R
3474F
3474
3474R
TSZ02201-0RAR0G200100-1-2
27.FEB.2012 Rev.001
Datasheet
Notice
●Precaution for circuit design
1) The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA
equipment, telecommunication equipment, home appliances, amusement equipment, etc.). If the products are to be
used in devices requiring extremely high reliability (medical equipment, transport equipment, aircraft/spacecraft,
nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose
malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the
ROHM sales staff in advance. If product malfunctions may result in serious damage, including that to human life,
sufficient fail-safe measures must be taken, including the following:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits in the case of single-circuit failure
2)
The products are designed for use in a standard environment and not in any special environments. Application of the
products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of
product performance, prior to use, is recommended if used under the following conditions:
[a] Use in various types of liquid, including water, oils, chemicals, and organic solvents
[b] Use outdoors where the products are exposed to direct sunlight, or in dusty places
[c] Use in places where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2,
and NO2
[d] Use in places where the products are exposed to static electricity or electromagnetic waves
[e] Use in proximity to heat-producing components, plastic cords, or other flammable items
[f] Use involving sealing or coating the products with resin or other coating materials
[g] Use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering
[h] Use of the products in places subject to dew condensation
3)
The products are not radiation resistant.
4)
Verification and confirmation of performance characteristics of products, after on-board mounting, is advised.
5)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
6)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta).
When used in sealed area, confirm the actual ambient temperature.
7)
Confirm that operation temperature is within the specified range described in product specification.
8)
Failure induced under deviant condition from what defined in the product specification cannot be guaranteed.
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the remainder of flux may negatively affect
product performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
Company in advance.
Regarding Precaution for Mounting / Circuit board design, please specially refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics
of the products and external components, including transient characteristics, as well as static characteristics.
2)
The application examples, their constants, and other types of information contained herein are applicable only when
the products are used in accordance with standard methods. Therefore, if mass production is intended, sufficient
consideration to external conditions must be made.
Notice - Rev.001
Datasheet
●Precaution for Electrostatic
This product is Electrostatic sensitive product, which may be damaged due to Electrostatic discharge. Please take proper
caution during manufacturing and storing so that voltage exceeding Product maximum rating won't be applied to products.
Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from
charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the products are stored in the following places:
[a] Where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] Where the temperature or humidity exceeds those recommended by the Company
[c] Storage in direct sunshine or condensation
[d] Storage in high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using products of which storage time is
exceeding recommended storage time period .
3)
Store / transport cartons in the correct direction, which is indicated on a carton as a symbol. Otherwise bent leads may
occur due to excessive stress applied when dropping of a carton.
4)
Use products within the specified time after opening a dry bag.
●Precaution for product label
QR code printed on ROHM product label is only for internal use, and please do not use at customer site. It might contain a
internal part number that is inconsistent with an product part number.
●Precaution for disposition
When disposing products please dispose them properly with a industry waste company.
●Precaution for Foreign exchange and Foreign trade act
Since concerned goods might be fallen under controlled goods prescribed by Foreign exchange and Foreign trade act,
please consult with ROHM in case of export.
●Prohibitions Regarding Industrial Property
1) Information and data on products, including application examples, contained in these specifications are simply for
reference; the Company does not guarantee any industrial property rights, intellectual property rights, or any other
rights of a third party regarding this information or data. Accordingly, the Company does not bear any responsibility for:
[a] infringement of the intellectual property rights of a third party
[b] any problems incurred by the use of the products listed herein.
2)
The Company prohibits the purchaser of its products to exercise or use the intellectual property rights, industrial
property rights, or any other rights that either belong to or are controlled by the Company, other than the right to use,
sell, or dispose of the products.
Notice - Rev.001
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