MCNIX MX27C1000TI-12 1m-bit [128k x 8] cmos eprom Datasheet

INDEX
MX27C1000/1001
1M-BIT [128K x 8] CMOS EPROM
FEATURES
•
•
•
•
•
•
• Operating current: 30mA
• Standby current: 100uA
• Package type:
128K x 8 organization
Single +5V power supply
+12.5V programming voltage
Fast access time: 45/55/70/90/100/120/150 ns
Totally static operation
Completely TTL compatible
-
32 pin ceramic DIP, plastic DIP
32 pin SOP
32 pin PLCC
32 pin TSOP
GENERAL DESCRIPTION
EPROM programmers may be used. The MX27C1000/
1001 supports an intelligent fast programming algorithm
which can result in programming time of less than thirty
seconds.
The MX27C1000/1001 is a 5V only, 1M-bit, ultraviolet
Erasable Programmable Read Only Memory. It is organized as 128K words by 8 bits per word, operates from a
single + 5 volt supply, has a static standby mode, and
features fast single address location programming. All
programming signals are TTL levels, requiring a single
pulse. For programming outside from the system, existing
This EPROM is packaged in industry standard 32 pin
dual-in-line packages, 32 lead PLCC , 32 lead SOP , and
32 lead TSOP packages.
PIN CONFIGURATIONS
CDIP/PDIP/SOP
VPP
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
GND
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
MX27C1000
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
VPP
OE
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
GND
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
PGM
NC
A14
A13
A8
A9
A11
A16
A10
CE
Q7
Q6
Q5
Q4
Q3
TSOP(MX27C1000)
A7
32
NC
1
PGM
VCC
A16
4
VPP
5
A15
A12
PLCC
30
29
A13
A5
A8
A3
A9
9
MX27C1000
25
A11
A2
OE
A1
A10
CE
A0
21
20
Q5
Q4
Q3
Q2
GND
17
Q7
Q6
13
14
Q1
Q0
A11
A9
A8
A13
A14
NC
PGM
VCC
VPP
A16
A15
A12
A7
A6
A5
A4
A14
A6
A4
P/N: PM0234
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MX27C1001
CDIP/PDIP/SOP(MX27C1001)
VCC
PGM
NC
A14
A13
A8
A9
A11
OE
A10
CE
Q7
Q6
Q5
Q4
Q3
1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MX27C1000
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE
Q7
Q6
Q5
Q4
Q3
GND
Q2
Q1
Q0
A0
A1
A2
A3
REV. 5.3, MAY 07, 1998
INDEX
MX27C1000/1001
BLOCK DIAGRAM
CE
PGM
CONTROL
LOGIC
OE
.
.
A0~A16
ADDRESS
INPUTS
Y-DECODER
.
.
.
.
OUTPUT
BUFFERS
.
Q0~Q17
X-DECODER
.
.
.
.
SYMBOL
PIN NAME
A0~A16
Address Input
Q0~Q7
Data Input/Output
CE
Chip Enable Input
OE
Output Enable Input
PGM
Programmable Enable Input
VPP
Program Supply Voltage
NC
No Internal Connection
VCC
Power Supply Pin (+5V)
GND
Ground Pin
Y-SELECT
.
.
.
.
VCC
GND
PIN DESCRIPTION
1M BIT
CELL
MAXTRIX
.
VPP
For programming, the data to be programmed is applied
with 8 bits in parallel to the data pins.
FUNCTIONAL DESCRIPTION
THE ERASURE OF THE MX27C1000/1001
Vcc must be applied simultaneously or before Vpp, and
removed simultaneously or after Vpp.
When
programming an MXIC EPROM, a 01.uF capacitor is
required across Vpp and ground to suppress spurious
voltage transients which may damage the device.
The MX27C1000/1001 is erased by exposing the chip
to an ultraviolet light source. A dosage of 15 W seconds/
cm2 is required to completely erase a MX27C1000/1001
This dosage can be obtained by exposure to an ultraviolet
lamp - wavelength of 2537 Angstroms (A) - with intensity
of 12,000 uW/cm2 for 15 to 20 minutes. The MX27C1000/
1001 should be directly under and about one inch from
the source and all filters should be removed from the UV
light source prior to erasure.
FAST PROGRAMMING
The device is set up in the fast programming mode when
the programming voltage VPP = 12.75V is applied, with
VCC = 6.25 V and PGM = VIL(or OE = VIH) (Algorithm
is shown in Figure 1). The programming is achieved by
applying a single TTL low level 100us pulse to the PGM
input after addresses and data line are stable. If the data
is not verified, an additional pulse is applied for a
maximum of 25 pulses. This process is repeated while
sequencing through each address of the device. When
the programming mode is completed, the data in all
address is verified at VCC = VPP = 5V ± 10%.
It is important to note that the MX27C1000/1001, and
similar devices, will be cleared for all bits of their
programmed states with light sources having
wavelengths shorter than 4000 A Although erasure times
will be much longer than that with UV sources at 2537A
nevertheless the exposure to fluorescent light and
sunlight will eventually erase the MX27C1000/1001 and
exposure to them should be prevented to realize
maximum system reliability. If used in such an
environment, the package window should be covered by
an opaque label or substance.
THE PROGRAMMING OF THE MX27C1000/1001
When the MX27C1000/1001 is delivered, or it is erased,
the chip has all 1M bits in the "ONE" or HIGH state.
"ZEROs" are loaded into the MX27C1000 through the
procedure of programming.
P/N: PM0234
2
REV. 5.3, MAY 07, 1998
INDEX
MX27C1000/1001
PROGRAM INHIBIT MODE
data to the output pins, independent of device selection.
Assuming that addresses are stable, address access time
(tACC) is equal to the delay from CE to output (tCE). Data
is available at the outputs tQE after the falling edge of
OE, assuming that CE has been LOW and addresses
have been stable for at least tACC - tQE.
Programming of multiple MX27C1000/1001s in parallel
with different data is also easily accomplished by using
the Program Inhibit Mode. Except for CE and OE, all
like inputs of the parallel MX27C1000/1001 may be
common. A TTL low-level program pulse applied to an
MX27C1000/1001 CE input with VPP = 12.5 ± 0.5 V and
PGM LOW will program that MX27C1000/1001. A highlevel CE input inhibits the other MX27C1000/1001s from
being programmed.
STANDBY MODE
The MX27C1000/1001 has a CMOS standby mode which
reduces the maximum VCC current to 100 uA. It is placed
in CMOS standby when CE is at VCC ± 0.3 V. The
MX27C1000/1001 also has a TTL-standby mode which
reduces the maximum VCC current to 1.5 mA. It is placed
in TTL-standby when CE is at VIH. When in standby
mode, the outputs are in a high-impedance state,
independent of the OE input.
PROGRAM VERIFY MODE
Verification should be performed on the programmed bits
to determine that they were correctly programmed. The
verification should be performed with OE and CE at VIL,
PGM at VIH, and VPP at its programming voltage.
TWO-LINE OUTPUT CONTROL FUNCTION
AUTO IDENTIFY MODE
To accommodate multiple memory connections, a twoline control function is provided to allow for:
The auto identify mode allows the reading out of a binary
code from an EPROM that will identify its manufacturer
and device type. This mode is intended for use by
programming equipment for the purpose of automatically
matching the device to be programmed with its
corresponding programming algorithm. This mode is
functional in the 25°C ± 5°C ambient temperature range
that is required when programming the MX27C1000/
1001.
1. Low memory power dissipation,
2. Assurance that output bus contention will not occur.
It is recommended that CE be decoded and used as the
primary device-selecting function, while OE be made a
common connection to all devices in the array and
connected to the READ line from the system control bus.
This assures that all deselected memory devices are in
their low-power standby mode and that the output pins
are only active when data is desired from a particular
memory device.
To activate this mode, the programming equipment must
force 12.0 ± 0.5 V on address line A9 of the device. Two
identifier bytes may then be sequenced from the device
outputs by toggling address line A0 from VIL to VIH. All
other address lines must be held at VIL during auto
identify mode.
SYSTEM CONSIDERATIONS
During the switch between active and standby conditions,
transient current peaks are produced on the rising and
falling edges of Chip Enable. The magnitude of these
transient current peaks is dependent on the output
capacitance loading of the device. At a minimum, a 0.1
uF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between VCC
and GND to minimize transient effects. In addition, to
overcome the voltage drop caused by the inductive effects
of the printed circuit board traces on EPROM arrays, a
4.7 uF bulk electrolytic capacitor should be used between
VCC and GND for each eight devices. The location of
the capacitor should be close to where the power supply
is connected to the array.
Byte 0 ( A0 = VIL) represents the manufacturer code,
and byte 1 (A0 = VIH), the device identifier code. For
the MX27C1000/1001, these two identifier bytes are
given in the Mode Select Table. All identifiers for
manufacturer and device codes will possess odd parity,
with the MSB (DQ7) defined as the parity bit.
READ MODE
The MX27C1000/1001 has two control functions, both
of which must be logically satisfied in order to obtain data
at the outputs. Chip Enable (CE) is the power control
and should be used for device selection. Output Enable
(OE) is the output control and should be used to gate
P/N: PM0234
3
REV. 5.3, MAY 07, 1998
INDEX
MX27C1000/1001
MODE SELECT TABLE
PINS
MODE
CE
OE
PGM
A0
A9
VPP
OUTPUTS
Read
VIL
VIL
X
X
X
VCC
DOUT
Output Disable
VIL
VIH
X
X
X
VCC
High Z
Standby (TTL)
VIH
X
X
X
X
VCC
High Z
Standby (CMOS)
VCC±0.3V
X
X
X
X
VCC
High Z
Program
VIL
VIH
VIL
X
X
VPP
DIN
Program Verify
VIL
VIL
VIH
X
X
VPP
DOUT
Program Inhibit
VIH
X
X
X
X
VPP
High Z
Manufacturer Code(3)
VIL
VIL
X
VIL
VH
VCC
C2H
Device Code(27C1000)(3) VIL
VIL
X
VIH
VH
VCC
0EH
Device Code(27C1001)(3) VIL
VIL
X
VIH
VH
VCC
0FH
NOTES: 1. VH = 12.0 V ± 0.5 V
2. X = Either VIH or VIL
P/N: PM0234
3. A1 - A8 = A10 - A16 = VIL(For auto select)
4. See DC Programming Characteristics for VPP voltage during
programming.
4
REV. 5.3, MAY 07, 1998
INDEX
MX27C1000/1001
FIGURE 1. FAST PROGRAMMING FLOW CHART
START
ADDRESS = FIRST LOCATION
VCC = 6.25V
VPP = 12.75V
X=0
PROGRAM ONE 100us PULSE
INCREMENT X
INTERACTIVE
SECTION
YES
X = 25?
NO
FAIL
VERIFY BYTE
?
PASS
NO
LAST ADDRESS
INCREMENT ADDRESS
FAIL
YES
VCC = VPP = 5.25V
VERIFY SECTION
VERIFY ALL BYTES
?
FAIL
DEVICE FAILED
PASS
DEVICE PASSED
P/N: PM0234
5
REV. 5.3, MAY 07, 1998
INDEX
MX27C1000/1001
SWITCHING TEST CIRCUITS
DEVICE
UNDER
TEST
1.8K ohm
+5V
DIODES = IN3064
OR EQUIVALENT
CL
6.2K ohm
CL = 100 pF including jig capacitance(30pF for 45/44/70 ns parts)
SWITCHING TEST WAVEFORMS
2.0V
2.0V
TEST POINTS
AC driving levels
0.8V
0.8V
OUTPUT
INPUT
AC TESTING: AC driving levels are 2.4V/0.4V for commercial grade, 3.0V/0V for industrial grade.
Input pulse rise and fall times are < 10ns.
1.5V
AC driving levels
1.5V
TEST POINTS
OUTPUT
INPUT
AC TESTING: (1) AC driving levels are 3.0V/0V for both commercial grade and industrial grade.
Input pulse rise and fall times are < 10ns.
(2) For MX27C1000-45, MX27C1000/1001-55, MX27C1000/1001-70.
P/N: PM0234
6
REV. 5.3, MAY 07, 1998
INDEX
MX27C1000/1001
ABSOLUTE MAXIMUM RATINGS
RATING
VALUE
Ambient Operating Temperature
-40oC to 85oC
Storage Temperature
-65oC to 125oC
Applied Input Voltage
-0.5V to 7.0V
Applied Output Voltage
-0.5V to VCC + 0.5V
VCC to Ground Potential
-0.5V to 7.0V
A9 & Vpp
-0.5V to 13.5V
NOTICE:
Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other
conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating
conditions for extended period may affect reliability.
NOTICE:
Specifications contained within the following tables are subject to
change.
DC/AC Operating Conditions for Read Operation
MX27C1000/1001
-45*
Operating
Commercial 0°C to 70°C
Temperature
Industrial
Vcc Power Supply
-55
-70
-90
-10
-12
-15
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
-40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C
5V ± 5%
5V ± 10%
5V ± 10%
5V ±10%
5V ± 10%
5V ± 10%
5V ± 10%
*Note:45ns for MX27C1000 only
DC CHARACTERISTICS
SYMBOL
PARAMETER
MIN.
VOH
Output High Voltage
2.4
VOL
Output Low Voltage
VIH
Input High Voltage
VIL
MAX.
UNIT
CONDITIONS
V
IOH = -0.4mA
0.4
V
IOL = 2.1mA
2.0
VCC + 0.5
V
Input Low Voltage
-0.2
0.8
V
ILI
Input Leakage Current
-10
10
uA
VIN = 0 to 5.5V
ILO
Output Leakage Current
-10
10
uA
VOUT = 0 to 5.5V
ICC3
VCC Power-Down Current
100
uA
CE = VCC ± 0.3V
ICC2
VCC Standby Current
1.5
mA
CE = VIH
ICC1
VCC Active Current
30
mA
CE = VIL, f=5MHz, Iout = 0mA
IPP
VPP Supply Current Read
10
uA
CE = VIL, VPP = 5.5V
CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only)
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
CONDITIONS
CIN
Input Capacitance
8
12
pF
VIN = 0V
COUT
Output Capacitance
8
12
pF
VOUT = 0V
Vpp
VPP Capacitance
18
25
pF
VPP = 0V
P/N: PM0234
7
REV. 5.3, MAY 07, 1998
INDEX
MX27C1000/1001
AC CHARACTERISTICS
27C1000
27C1000/1001
27C1000/1001
-45
-55
-70
SYMBOL
PARAMETER
MIN.
MAX.
tACC
Address to Output Delay
45
tCE
Chip Enable to Output Delay
45
tOE
tDF
Output Enable to Output Delay
OE High to Output Float,
tOH
or CE High to Output Float
Output Hold from Address,
0
CE or OE which ever occurred first
25
17
0
MIN.
MAX.
MAX.
UNIT
CONDITIONS
55
70
ns
CE = OE = VIL
55
70
ns
OE = VIL
35
20
ns
ns
CE = VIL
30
20
0
0
-90
ns
27C1000/1001 27C1000/1001
-10
MAX.
PARAMETER
tACC
Address to Output Delay
90
100
tCE
Chip Enable to Output Delay
90
100
tOE
tDF
Output Enable to Output Delay
OE High to Output Float,
tOH
or CE High to Output Float
Output Hold from Address,
0
CE or OE which ever occurred first
40
25
MIN.
-12
SYMBOL
0
0
0
27C1000/1001 27C1000/1001
MIN.
MIN.
MAX.
45
30
0
0
MIN.
MAX.
MAX.
UNIT
CONDITIONS
120
150
ns
CE = OE = VIL
120
150
ns
OE = VIL
65
50
ns
ns
CE = VIL
50
35
0
-15
0
MIN.
0
0
ns
DC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C
SYMBOL
PARAMETER
MIN.
VOH
Output High Voltage
2.4
VOL
Output Low Voltage
VIH
Input High Voltage
VIL
MAX.
UNIT
CONDITIONS
V
IOH = -0.40mA
0.4
V
IOL = 2.1mA
2.0
VCC + 0.5
V
Input Low Voltage
-0.3
0.8
V
ILI
Input Leakage Current
-10
10
uA
VH
A9 Auto Select Voltage
11.5
12.5
V
ICC3
VCC Supply Current (Program & Verify)
50
mA
IPP2
VPP Supply Current(Program)
30
mA
VIN = 0 to 5.5V
CE = PGM = VIL,
OE = VIH
VCC1
Fast Programming Supply Voltage
6.00
6.50
V
VPP1
Fast Programming Voltage
12.5
13.0
V
P/N: PM0234
8
REV. 5.3, MAY 07, 1998
INDEX
MX27C1000/1001
AC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C
SYMBOL
PARAMETER
MIN.
MAX.
tAS
Address Setup Time
2.0
us
tOES
OE Setup Time
2.0
us
tDS
Data Setup Time
2.0
us
tAH
Address Hold Time
0
us
tDH
Data Hold Time
2.0
us
tDFP
Output Enable to Output Float Delay
0
tVPS
VPP Setup Time
2.0
tPW
PGM Program Pulse Width
95
tVCS
VCC Setup Time
2.0
us
tCES
CE Setup Time
2.0
us
tOE
Data valid from OE
130
UNIT
CONDITIONS
ns
us
105
150
us
ns
WAVEFORMS
READ CYCLE
ADDRESS
INPUTS
DATA ADDRESS
tACC
CE
tCE
OE
tDF
DATA
OUT
VALID DATA
tOE
P/N: PM0234
tOH
9
REV. 5.3, MAY 07, 1998
INDEX
MX27C1000/1001
FAST PROGRAMMING ALGORITHM WAVEFORMS
PROGRAM
PROGRAM VERIFY
VIH
Addresses
VIL
DATA
tAH
Hi-z
tAS
DATA OUT VALID
DATA IN STABLE
tDS
tDFP
tDH
VPP1
VPP
VCC
tVPS
VCC1
VCC
tVCS
VCC
VIH
CE
VIL
tCES
VIH
PGM
VIL
tPW
tOES
tOE
Max
VIH
OE
P/N: PM0234
VIL
10
REV. 5.3, MAY 07, 1998
INDEX
MX27C1000/1001
ORDERING INFORMATION
CERAMIC PACKAGE
PART NO.
ACCESS TIME(ns)
OPERATING
STANDBY
OPERATING
CURRENT MAX.(mA)
CURRENT MAX.(uA)
TEMPERATURE
PACKAGE
MX27C1000DC-45
45
30
100
0°C t0 70°C
32 Pin DIP
MX27C1000DC-55
55
30
100
0°C t0 70°C
32 Pin DIP
MX27C1001DC-55
55
30
100
0°C t0 70°C
32 Pin DIP
MX27C1001DC-70
70
30
100
0°C t0 70°C
32 Pin DIP
MX27C1001DC-90
90
30
100
0°C t0 70°C
32 Pin DIP
MX27C1001DC-10
100
30
100
0°C t0 70°C
32 Pin DIP
MX27C1001DC-12
120
30
100
0°C t0 70°C
32 Pin DIP
MX27C1001DC-15
150
30
100
-40°C to 85°C
32 PIn DIP
P/N: PM0234
11
REV. 5.3, MAY 07, 1998
INDEX
MX27C1000/1001
PLASTIC PACKAGE
PART NO.
ACCESS TIME(ns)
OPERATING
STANDBY
OPERATING
CURRENT MAX.(mA)
CURRENT MAX.(uA)
TEMPERATURE
PACKAGE
MX27C1000PC-45
45
30
100
0°C t0 70°C
32 PIN DIP
MX27C1000MC-45
45
30
100
0°C t0 70°C
32 Pin SOP
MX27C1000QC-45
45
30
100
0°C t0 70°C
32 Pin PLCC
MX27C1000TC-45
45
30
100
0°C t0 70°C
32 Pin TSOP
MX27C1000PC-55
55
30
100
0°C t0 70°C
32 Pin DIP
MX27C1000MC-55
55
30
100
0°C t0 70°C
32 Pin SOP
MX27C1000QC-55
55
30
100
0°C t0 70°C
32 Pin PLCC
MX27C1000TC-55
55
30
100
0°C t0 70°C
32 Pin TSOP
MX27C1001MC-55
55
30
100
0°C t0 70°C
32 Pin SOP
MX27C1001PC-55
55
30
100
0°C t0 70°C
32 Pin DIP
MX27C1000PC-70
70
30
100
0°C t0 70°C
32 Pin DIP
MX27C1000MC-70
70
30
100
0°C t0 70°C
32 Pin SOP
MX27C1000QC-70
70
30
100
0°C t0 70°C
32 Pin PLCC
MX27C1000TC-70
70
30
100
0°C t0 70°C
32 Pin TSOP
MX27C1001MC-70
70
30
100
0°C t0 70°C
32 Pin SOP
MX27C1001PC-70
70
30
100
0°C t0 70°C
32 Pin DIP
MX27C1000PC-90
90
30
100
0°C t0 70°C
32 Pin DIP
MX27C1000MC-90
90
30
100
0°C t0 70°C
32 Pin SOP
MX27C1000QC-90
90
30
100
0°C t0 70°C
32 Pin PLCC
MX27C1000TC-90
90
30
100
0°C t0 70°C
32 Pin TSOP
MX27C1001MC-90
90
30
100
0°C t0 70°C
32 Pin SOP
MX27C1001PC-90
90
30
100
0°C t0 70°C
32 Pin DIP
MX27C1000PC-10
100
30
100
0°C t0 70°C
32 Pin DIP
MX27C1000MC-10
100
30
100
0°C t0 70°C
32 Pin SOP
MX27C1000QC-10
100
30
100
0°C t0 70°C
32 Pin PLCC
MX27C1000TC-10
100
30
100
0°C t0 70°C
32 Pin TSOP
MX27C1001MC-10
100
30
100
0°C t0 70°C
32 Pin SOP
MX27C1001PC-10
100
30
100
0°C t0 70°C
32 Pin DIP
MX27C1000PC-12
120
30
100
0°C t0 70°C
32 Pin DIP
MX27C1000MC-12
120
30
100
0°C t0 70°C
32 Pin SOP
MX27C1000QC-12
120
30
100
0°C t0 70°C
32 Pin PLCC
MX27C1000TC-12
120
30
100
0°C t0 70°C
32 Pin TSOP
MX27C1001MC-12
120
30
100
0°C t0 70°C
32 Pin SOP
MX27C1001PC-12
120
30
100
0°C t0 70°C
32 Pin DIP
MX27C1000PC-15
150
30
100
0°C t0 70°C
32 Pin DIP
MX27C1000MC-15
150
30
100
0°C t0 70°C
32 Pin SOP
MX27C1000QC-15
150
30
100
0°C t0 70°C
32 Pin PLCC
MX27C1000TC-15
150
30
100
0°C t0 70°C
32 Pin TSOP
MX27C1001MC-15
150
30
100
0°C t0 70°C
32 Pin SOP
MX27C1001PC-15
150
30
100
0°C t0 70°C
32 Pin DIP
P/N: PM0234
12
REV. 5.3, MAY 07, 1998
INDEX
MX27C1000/1001
ORDER INFORMATION(CONTINUED)
PLASTIC PACKAGE
PART NO.
ACCESS TIME(ns)
OPERATING
STANDBY
OPERATING
CURRENT MAX.(mA)
CURRENT MAX.(uA)
TEMPERATURE
PACKAG
MX27C1000PI-70
70
30
100
-40°C t0 85°C
32 Pin DIP
MX27C1000MI-70
70
30
100
-40°C t0 85°C
32 Pin SOP
MX27C1000QI-70
70
30
100
-40°C t0 85°C
32 Pin PLCC
MX27C1000TI-70
70
30
100
-40°C t0 85°C
32 Pin TSOP
MX27C1000PI-90
90
30
100
-40°C t0 85°C
32 Pin DIP
MX27C1000MI-90
90
30
100
-40°C t0 85°C
32 Pin SOP
MX27C1000QI-90
90
30
100
-40°C t0 85°C
32 Pin PLCC
MX27C1000TI-90
90
30
100
-40°C t0 85°C
32 Pin TSOP
MX27C1000PI-12
120
30
100
-40°C t0 85°C
32 Pin DIP
MX27C1000MI-12
120
30
100
-40°C t0 85°C
32 Pin SOP
MX27C1000QI-12
120
30
100
-40°C t0 85°C
32 Pin PLCC
MX27C1000TI-12
120
30
100
-40°C t0 85°C
32 Pin TSOP
MX27C1000PI-15
150
30
100
-40°C t0 85°C
32 Pin SOP
MX27C1000MI-12
120
30
100
-40°C t0 85°C
32 Pin SOP
MX27C1000QI-15
150
30
100
-40°C t0 85°C
32 Pin PLCC
MX27C1000TI-15
150
30
100
-40°C t0 85°C
32 Pin TSOP
P/N: PM0234
13
REV. 5.3, MAY 07, 1998
INDEX
MX27C1000/1001
PACKAGE INFORMATION
32-PIN CERDIP(MSI) WITH WINDOW (600mil)
ITEM
MILLIMETERS
INCHES
A
42.26 max.
1.665 max.
B
1.90 ± .38
.075 ± .015
C
2.54 [TP]
.100 [TP]
D
.46 [REF]
.018 [REF]
E
38.07
1.500
F
1.42 [REF]
.056 [REF]
G
3.43 ± .38
.135 ± .015
H
.96 ± .43
.038 ± .017
I
4.06
.160
J
5.00
.203
K
15.58 ± .13
.614 ± .005
L
13.20 ± .38
.520 ± .015
M
.25 [REF]
.010 [REF]
N
ø8.12
ø.320
NOTE:
32
17
N
1
16
K
L
A
I
J
H G
F
D
C
B
M
0.15¡
E
Each lead centerline is located within .25
mm[.01 inch] of its true position [TP] at
maximum material condition.
32-PIN PLASTIC DIP(600 mil)
ITEM
MILLIMETERS
INCHES
A
42.13 max.
1.660 max.
B
1.90 [REF]
.075 [REF]
C
2.54 [TP]
.100 [TP]
D
.46 [Typ.]
.018 [Typ.]
E
38.07
1.500
F
1.27 [Typ.]
.050 [Typ.]
G
3.30 ± .25
.130 ± .010
H
.51 [REF]
.020 [REF]
I
3.94 ± .25
.155 ± .010
J
5.33 max.
.210 max.
K
15.22 ± .25
.600 ± .010
L
13.97 ± .25
.550 ± .010
.25 [Typ.]
.010 [Typ.]
M
NOTE:
P/N: PM0234
32
17
1
16
A
F
D
Each lead centerline is located within .25
mm[.01 inch] of its true position [TP] at
maximum material condition.
K
L
C
B
I
J
H
G
M
0~15¡
E
14
REV. 5.3, MAY 07, 1998
INDEX
MX27C1000/1001
PACKAGE INFORMATION(Continued)
32-PIN PLASTIC SOP (450 mil)
ITEM
MILLIMETERS
INCHES
A
20.95 max.
.825 max.
B
1.00 [REF]
.039 [REF]
C
1.27 [TP]
.050 [TP]
D
.40 [Typ.]
.016 [Typ.]
E
.05 min.
.002 min.
F
3.05 max.
.120 max.
G
2.69 ± .13
.106 ± .005
H
14.12 ± .25
.556 ± .010
I
11.30 ± .13
.445 ± .005
J
1.42
.056
K
.20 [Typ.]
.008 [Typ.]
L
.79
.031
NOTE:
Each lead centerline is located within .25
mm[.01 inch] of its true position [TP] at
maximum material condition.
32
17
1
16
H
A
I
G
J
F
K
E
D
C
L
B
32-PIN PLASTIC LEADED CHIP CARRIER (PLCC)
A
ITEM
A
MILLIMETERS
12.44 ± .13
4
.490 ± .005
B
11.50 ± .13
.453 ± .005
C
14.04 ± .13
.553 ± .005
D
14.98 ± .13
.590 ± .005
E
1.93
.076
F
3.30 ± .25
.130 ± .010
G
2.03 ± .13
.080 ± .005
H
.51 ± .13
.020 ± .005
I
1.27 [Typ.]
.050 [Typ.]
J
.71[REF]
.028[REF]
K
L
.46 [REF]
10.40/12.94
(W) (L)
.018 [REF]
.410/.510
(W) (L)
M
.89 R
.035 R
N
.25 (TYP.)
.010 (TYP.)
NOTE:
B
1
INCHES
Each lead centerline is located within .25
mm[.01 inch] of its true position [TP] at
maximum material condition.
32
30
5
29
9
25
13
C
D
21
14
20
17
E
F
G
N
H
M
I
J
K
L
P/N: PM0234
15
REV. 5.3, MAY 07, 1998
INDEX
MX27C1000/1001
PACKAGE INFORMATION
32-PIN PLASTIC TSOP
ITEM
MILLIMETERS
A
20.0 ± .20
INCHES
.078 ± .006
A
B
18.40 ± .10
.724 ± .004
B
C
8.20 max.
.323 max.
D
0.15 [Typ.]
.006 [Typ.]
E
.80 [Typ.]
.031 [Typ.]
F
.20 ± .10
.008 ± .004
G
.30 ± .10
.012 ± .004
H
.50 [Typ.]
.020 [Typ.]
I
.45 max.
.018 max.
J
0 ~ .20
0 ~ .008
K
1.00 ± .10
.039 ± .004
L
1.27 max.
.050 max.
M
.50
.020
N
19.00
.748
O
0~5
.500
NOTE:
P/N: PM0234
C
O
N
M
K
L
D
E
F
G
H
I
J
Each lead centerline is located within .25
mm[.01 inch] of its true position [TP] at a
maximum material condition.
16
REV. 5.3, MAY 07, 1998
INDEX
MX27C1000/1001
Revision History
Revision No.
5.0
5.1
5.2
5.3
P/N: PM0234
Description
1) Reduce operating current change from 40mA to 30mA.
2) Eliminate Interactive Programming Mode.
3) Add 27C1001 pin configuration.
IPP 100uA --> 10uA
Change TSOP Orientation
27C1000CDIP 70/90/100/120/150ns speed grades deleted from ordering information.
17
Date
5/28/1997
8/08/1997
4/09/1998
5/07/1998
REV. 5.3, MAY 07, 1998
INDEX
MX27C1000/1001
MACRONIX INTERNATIONAL CO., LTD.
HEADQUARTERS:
TEL:+886-3-578-8888
FAX:+886-3-578-8887
EUROPE OFFICE:
TEL:+32-2-456-8020
FAX:+32-2-456-8021
JAPAN OFFICE:
TEL:+81-44-246-9100
FAX:+81-44-246-9105
SINGAPORE OFFICE:
TEL:+65-747-2309
FAX:+65-748-4090
TAIPEI OFFICE:
TEL:+886-3-509-3300
FAX:+886-3-509-2200
MACRONIX AMERICA, INC.
TEL:+1-408-453-8088
FAX:+1-408-453-8488
CHICAGO OFFICE:
TEL:+1-847-963-1900
FAX:+1-847-963-1909
http : //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the rignt to change product and specifications without notice.
18
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