Freescale Semiconductor Technical Data MPXV5004G Rev. 6, 10/2004 Integrated Silicon Pressure Sensor On- Chip Signal Conditioned, Temperature Compensated and Calibrated MPXV5004G SERIES INTEGRATED PRESSURE SENSOR 0 to 3.92 kPa (0 to 400 mm H2O) 1.0 to 4.9 V OUTPUT The MPXV5004G series piezoresistive transducer is a state--of--the--art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This sensor combines a highly sensitive implanted strain gauge with advanced micromachining techniques, thin--film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features SMALL OUTLINE PACKAGE SURFACE MOUNT • Temperature Compensated over 10° to 60°C SMALL OUTLINE PACKAGE THROUGH--HOLE • Available in Gauge Surface Mount (SMT) or Through-hole (DIP) Configurations • Durable Thermoplastic (PPS) Package Application Examples • Washing Machine Water Level • Ideally Suited for Microprocessor or Microcontroller-Based Systems MPXV5004G6U CASE 482 MPXV5004GC7U CASE 482C VS J MPXV5004GC6U CASE 482A THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 SENSING ELEMENT GND GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY PINS 1, 5, 6, 7, AND 8 ARE NO CONNECTS FOR SMALL OUTLINE PACKAGE DEVICE Vout MPXV5004G7U CASE 482B MPXV5004GP CASE 1369 Figure 1. Fully Integrated Pressure Sensor Schematic PIN NUMBER N/C 5 N/C 2 VS 6 N/C 3 Gnd 7 N/C 4 Vout 8 N/C 1 MPXV5004DP CASE 1351 NOTE: Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. MPXV5004GVP CASE 1368 © Freescale Semiconductor, Inc., 2004. All rights reserved. Sensor Device Data Freescale Semiconductor MPXV5004G SERIES 1 MAXIMUM RATINGS(NOTE) Symbol Value Unit Maximum Pressure (P1 > P2) Parametrics Pmax 16 kPa Storage Temperature Tstg --30 to +100 °C Operating Temperature TA 0 to +85 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications) Characteristic Symbol Min Typ Max Unit Pressure Range POP 0 — 3.92 400 kPa mm H2O Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current IS — — 10 mAdc Span at 306 mm H2O (3 kPa)(2) VFSS — 3.0 — V Offset(3)(5) Voff 0.75 1.00 1.25 V Sensitivity V/P — 1.0 9.8 — V/kPa mV/mm H2O — — — ±1.5 ±2.5 %VFSS %VFSS Accuracy(4)(5) 0 to 100 mm H2O 100 to 400 mm H2O (10 to 60°C) (10 to 60°C) NOTES: 1. Device is ratiometric within this specified excitation range. 2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • Offset Stability: Output deviation, after 1000 temperature cycles, −30 to 100°C, and 1.5 million pressure cycles, with minimum rated pressure applied. • TcSpan: Output deviation over the temperature range of 10 to 60°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV5004G, external mechanical stresses and mounting position can affect the zero pressure output reading. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device’s output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ± 5° C between autozero and measurement. MPXV5004G SERIES 2 Sensor Device Data Freescale Semiconductor ON--CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING test for dry air, and other media, are available from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the MPXV5004G to the A/D input of the microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over a temperature range of 10°C to 60°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. The performance over temperature is achieved by integrating the shear--stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the gauge configuration in the basic chip carrier (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV5004G series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long--term reliability. Internal reliability and qualification DIE FLUOROSILICONE GEL DIE COAT STAINLESS STEEL CAP +5 V P1 WIRE BOND Vout THERMOPLASTIC CASE OUTPUT Vs IPS LEAD FRAME 1.0 mF 0.01 mF GND 470 pF P2 DIE BOND DIFFERENTIAL SENSING ELEMENT Figure 2. Cross--Sectional Diagram (Not to Scale) Figure 3. Recommended power supply decoupling and output filtering. For additional output filtering, please refer to Application Note AN1646. 5.0 OUTPUT (V) TRANSFER FUNCTION: Vout = VS*[(0.2*P) + 0.2] ± 1.5% VFSS VS = 5.0 V ± 0.25 Vdc 4.0 TEMP = 10 to 60°C TYPICAL 3.0 MAX MIN 2.0 1.0 2 kPa 200 mm H2O 4 kPa 400 mm H2O DIFFERENTIAL PRESSURE Figure 4. Output versus Pressure Differential (See Note 5 in Operating Characteristics) MPXV5004G SERIES Sensor Device Data Freescale Semiconductor 3 PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale Semiconductor designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Part Number Freescale Semiconductor pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Case Type MPXV5004GC6U/T1 Pressure (P1) Side Identifier 482A MPXV5004G6U/T1 Side with Port Attached 482 Stainless Steel Cap MPXV5004GC7U 482C Side with Port Attached MPXV5004G7U 482B Stainless Steel Cap MPXV5004GP 1369 Side with Port Attached MPXV5004DP 1351 Side with Port Marking MPXV5004GVP 1368 Stainless Steel Cap ORDERING INFORMATION MPXV5004G series pressure sensors are available in the basic element package or with a pressure port. Two packing options are offered for the surface mount configuration. Device Type / Order No No. Case No No. Packing Options Device Marking MPXV5004G6U 482 Rails MPXV5004G MPXV5004G6T1 482 Tape and Reel MPXV5004G MPXV5004GC6U 482A Rails MPXV5004G MPXV5004GC6T1 482A Tape and Reel MPXV5004G MPXV5004GC7U 482C Rails MPXV5004G MPXV5004G7U 482B Rails MPXV5004G MPXV5004GP 1369 Trays MPXV5004G MPXV5004DP 1351 Trays MPXV5004G MPXV5004GVP 1368 Trays MPXV5004G INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct fottprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.100 TYP 8X 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 5. SOP Footprint (Case 482) MPXV5004G SERIES 4 Sensor Device Data Freescale Semiconductor NOTES MPXV5004G SERIES Sensor Device Data Freescale Semiconductor 5 NOTES MPXV5004G SERIES 6 Sensor Device Data Freescale Semiconductor SMALL OUTLINE PACKAGE DIMENSIONS --A-- D 8 PL 0.25 (0.010) 4 5 M T B S A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. S --B-G 8 1 S N H C J --T-SEATING PLANE PIN 1 IDENTIFIER M K DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 10.29 10.54 18.01 18.41 CASE 482--01 ISSUE O --A-- D 8 PL 0.25 (0.010) 4 5 M T B S A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. S N --B-G 8 1 S DIM A B C D G H J K M N S V W W V C H J INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 --T-K M PIN 1 IDENTIFIER SEATING PLANE CASE 482A--01 ISSUE A MPXV5004G SERIES Sensor Device Data Freescale Semiconductor 7 SMALL OUTLINE PACKAGE DIMENSIONS (CONTINUED) --A-NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. 4 5 --B-G 8 1 0.25 (0.010) M T B D 8 PL S A S DETAIL X S PIN 1 IDENTIFIER N C --T-K SEATING PLANE DIM A B C D G J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.210 0.220 0.026 0.034 0.100 BSC 0.009 0.011 0.100 0.120 0_ 15 _ 0.405 0.415 0.540 0.560 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.33 5.59 0.66 0.864 2.54 BSC 0.23 0.28 2.54 3.05 0_ 15 _ 10.29 10.54 13.72 14.22 M J DETAIL X CASE 482B--03 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. --A-4 5 N --B-G 8 0.25 (0.010) 1 M T B D 8 PL S A S DIM A B C D G J K M N S V W DETAIL X S W V PIN 1 IDENTIFIER C --T-K INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.026 0.034 0.100 BSC 0.009 0.011 0.100 0.120 0_ 15 _ 0.444 0.448 0.540 0.560 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.66 0.864 2.54 BSC 0.23 0.28 2.54 3.05 0_ 15 _ 11.28 11.38 13.72 14.22 6.22 6.48 2.92 3.17 SEATING PLANE M J DETAIL X CASE 482C--03 ISSUE B MPXV5004G SERIES 8 Sensor Device Data Freescale Semiconductor SMALL OUTLINE PACKAGE DIMENSIONS (CONTINUED) 2 PLACES 4 TIPS 0.008 (0.20) C A B E A GAGE PLANE e 5 4 e/2 .014 (0.35) D L A1 DETAIL G 8 1 b 0.004 (0.1) NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M--1994. 3. DIMENSIONS ”D” AND ”E1” DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION ”b” DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. 8X F M C A B E1 B N ∅T K A P θ 8X M 0.004 (0.1) DETAIL G C SEATING PLANE CASE 1369--01 ISSUE O DIM A A1 b D E E1 e F K L M N P T θ INCHES MIN MAX 0.300 0.330 0.002 0.010 0.038 0.042 0.465 0.485 0.717 BSC 0.465 0.485 0.100 BSC 0.245 0.255 0.120 0.130 0.061 0.071 0.270 0.290 0.080 0.090 0.009 0.011 0.115 0.125 ° 0 7° MILLIMETERS MIN MAX 7.11 7.62 0.05 0.25 0.96 1.07 11.81 12.32 18.21 BSC 11.81 12.32 2.54 BSC 6.22 6.47 3.05 3.30 1.55 1.80 6.86 7.36 2.03 2.28 0.23 0.28 2.92 3.17 ° 0 7° MPXV5004G SERIES Sensor Device Data Freescale Semiconductor 9 SMALL OUTLINE PACKAGE DIMENSIONS (CONTINUED) 2 PLACES 4 TIPS 0.006 (0.15) C A B E A GAGE PLANE e 5 4 e/2 .014 (0.35) D L A1 DETAIL G 8 1 b 0.004 (0.1) 8X F M C A B E1 B N STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. GND +Vout Vs --Vout N/C N/C N/C N/C ∅T M A P θ 8X 0.004 (0.1) DETAIL G C K SEATING PLANE STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. N/C Vs GND Vout N/C N/C N/C N/C NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M--1994. 3. DIMENSIONS ”D” AND ”E1” DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION ”b” DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T θ INCHES MIN MAX 0.370 0.390 0.002 0.010 0.038 0.042 0.465 0.485 0.680 0.700 0.465 0.485 0.100 BSC 0.240 0.260 0.115 0.135 0.040 0.060 0.270 0.290 0.160 0.180 0.009 0.011 0.110 0.130 0° 7° MILLIMETERS MIN MAX 9.39 9.91 0.05 0.25 0.96 1.07 11.81 12.32 17.27 17.78 11.81 12.32 2.54 BSC 6.10 6.60 2.92 3.43 1.02 1.52 6.86 7.37 4.06 4.57 0.23 0.28 2.79 3.30 0° 7° CASE 1351--01 ISSUE O MPXV5004G SERIES 10 Sensor Device Data Freescale Semiconductor SMALL OUTLINE PACKAGE DIMENSIONS (CONTINUED) 2 PLACES 4 TIPS 0.006 (0.15) C A B E A GAGE PLANE e 5 4 e/2 .014 (0.35) D L A1 DETAIL G 8 1 b 0.004 (0.1) 8X F M E1 B N GND +Vout Vs --Vout N/C N/C N/C N/C STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. K A 8X C A B STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. ∅R ∅T P θ 0.004 (0.1) M DETAIL G C SEATING PLANE CASE 1368--01 ISSUE O N/C Vs GND Vout N/C N/C N/C N/C NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M--1994. 3. DIMENSIONS ”D” AND ”E1” DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION ”b” DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T R θ INCHES MIN MAX 0.280 0.300 0.002 0.010 0.038 0.042 0.465 0.485 0.690 BSC 0.465 0.485 0.100 BSC 0.240 0.260 0.115 0.135 0.040 0.060 0.035 0.055 0.075 0.095 0.009 0.011 0.110 0.130 0.405 0.415 0° 7° MILLIMETERS MIN MAX 7.11 7.62 0.05 0.25 0.96 1.07 11.81 12.32 17.52 BSC 11.81 12.32 2.54 BSC 6.10 6.60 2.92 3.43 1.02 1.52 1.90 2.41 0.89 1.39 0.23 0.28 2.79 3.30 10.28 10.54 0° 7° MPXV5004G SERIES Sensor Device Data Freescale Semiconductor 11 How to Reach Us: Home Page: www.freescale.com E--mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. 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Freescalet and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2004. All rights reserved. MPXV5004G Rev. 6 10/2004 MPXV5004G SERIES 12 Sensor Device Data Freescale Semiconductor