Freescale Semiconductor, Inc. Technical Data MRFIC0970/D Rev. 0, 07/2002 MRFIC0970 3.2 V GSM GaAs Integrated Power Amplifier (Scale 2:1) Freescale Semiconductor, Inc... Package Information Plastic Package Case 1308 (QFN-20) Ordering Information Device Marking Package MRFIC0970 0970 QFN-20 The MRFIC0970 is a single supply, RF power amplifier designed for the 2.0 W GSM900 handheld radios. The device is packaged in the QFN-20 package, with exposed backside pad, which allows excellent electrical and thermal performance through a solderable contact. • Target 3.2 V Characteristics: RF Output Power: 34.5 dBm Typical Efficiency: 50% Typical • Single Positive Supply Solution • Available in Tape and Reel only. R2 Suffix = 2500 Units per 12 mm, 13 inch Reel Definitive Data: Motorola reserves the right to change the Production detail specifications as may be required to permit improvements in the design of its product. © Motorola, Inc., 2002. All rights reserved. For More Information On This Product, Go to: www.freescale.com Electrical Characteristics Freescale Semiconductor, Inc. D1 D2 RFin (G1) D3 VG1,2 ABC1,2 Freescale Semiconductor, Inc... VGG1,2 GND ABC3 ABC VG3 VGG3 Vref Figure 1. Functional Block Diagram 1 Electrical Characteristics Table 1. Maximum Ratings Rating Symbol Value Unit Supply Voltage VD1,2,3, Vabc Vref 8.0 5.0 V V RF Input Power Pin 15 dBm RF Output Power Pout 38 dBm Operating Case Temperature Range TC -40 to 85 °C Storage Temperature Range Tstg -40 to 85 °C TJ 150 °C Junction Temperature NOTES: 1. Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the limits in the Electrical Characteristics or Recommended Operating Conditions tables. 2 ESD (electrostatic discharge) immunity meets Human Body Model (HBM) ≤250 V and Machine Model (MM) ≤60 V. This device is rated Moisture Sensitivity Level (MSL) 1. Additional ESD data available upon request. Table 2. Recommended Operating Conditions Characteristic Supply Voltage Input Power 2 Symbol Min Typ Max Unit VD1,2,3 Vabc Vref 2.8 0 0.04 - 5.5 5.5 1.8 Vdc V V Pin 5.0 - 10 dBm MRFIC0970 Technical Data For More Information On This Product, Go to: www.freescale.com MOTOROLA Freescale Semiconductor, Inc. Electrical Characteristics Table 3. Electrical Specifications (VD1,2,3 = 3.2 V, Vabc = 2.6 V, Pin = 5.0 dBm, Peak measurement at 12.5% duty cycle, 4.6 ms period, TA = 25°C, unless otherwise noted.) Freescale Semiconductor, Inc... Characteristic Symbol Min Typ Max Unit Frequency Range BW 880 - 915 MHz Output Power Pout 34.5 - - dBm Power Added Efficiency PAE 50 - - % Minimum Output Power (Vref = 0.04, Vabc = 2.6 V) - - -17 dBm Power Control Slope (Vref = 0.1 to 1.8 V, ∆Vref = 0.01 V) - - 50:1 RFVrms Bleed thru Power (Pin(fo) ≤ -12dBm, Vref = 0.04, Vabc = 10 k load) - - -36 dBm RF Leakage Current (IDD1 + IDD2 +IDD3, Pin (fo) ≤5.0 dBm) (Vabc = 10 k load, Vref = 0.04 V) - - 35 mA Output Power Switching Speed (± step input of Vref RF Pout within 1.0 dB of final value) - - 1.0 µs - - 6.0 dB - - -73 -85 - - -30 Input Return Loss |S11| Noise Power in Rx band 925 to 935 MHz 935 to 960 MHz NP Stability-Spurious Output (Load VSWR 6:1 all phase angles, Adjust VD1, 2&3 for specified power) Load Mismatch Stress (Load VSWR = 10:1 all phase angles, 5 seconds, Adjust VD1, 2&3 for specified power) MOTOROLA /Vref Pspur dBm dBc No Degradation in Output Power Before & After Test MRFIC0970 Technical Data For More Information On This Product, Go to: www.freescale.com 3 Pin Connections Freescale Semiconductor, Inc. 2 Pin Connections D1 20 D2 1 15 VG1,2 N.C. 2 14 VGG1,2 N.C. 3 13 ABC N.C. 4 12 VGG3 N.C. 5 11 VG3 6 7 8 9 10 D3/ D3/ D3/ D3/ N.C. RF RF RF RF OUT OUT OUT OUT Figure 2. Pin Connections 3 Typical Performance Characteristics 35.6 Pout, OUTPUT POWER (dBm) Freescale Semiconductor, Inc... S1/ RFin N.C. GND N.C. (G1) 19 18 17 16 35.4 35.2 TA = -40°C 25°C 35 Pin = 5.0 dBm VDD = 3.2 V Vref = 1.8 V 34.8 34.6 85°C 34.4 34.2 880 885 890 895 900 905 f, FREQUENCY (MHz) 910 915 Figure 3. Output Power versus Frequency 4 MRFIC0970 Technical Data For More Information On This Product, Go to: www.freescale.com MOTOROLA Freescale Semiconductor, Inc. Typical Performance Characteristics 38 Pout, OUTPUT POWER (dBm) 37.5 VDD = 5.5 V 37 36.5 36 35.5 Pin = 5.0 dBm TA = 25°C Vref = 1.8 V 3.2 V 35 34.5 2.8 V 34 33.5 880 885 890 895 900 905 f, FREQUNCY (MHz) 910 915 Freescale Semiconductor, Inc... Figure 4. Output Power versus Frequency PAE, POWER ADDED EFFICIENCY (%) 65 60 TA = -40°C 25°C 55 50 45 880 85°C Pin = 5.0 dBm VDD = 3.2 V Vref = 1.8 V 885 890 895 900 905 f, FREQUENCY (MHz) 910 915 Figure 5. Power Added Efficiency versus Frequency PAE, POWER ADDED EFFICIENCY (%) 65 60 VDD = 2.8 V 55 3.2 V 50 45 Pin = 5.0 dBm TA = 25°C Vref = 1.8 V 40 35 880 5.5 V 885 890 895 900 905 f, FREQUENCY (MHz) 910 915 Figure 6. Power Added Efficiency versus Frequency MOTOROLA MRFIC0970 Technical Data For More Information On This Product, Go to: www.freescale.com 5 Application Schematic Freescale Semiconductor, Inc. 4 Application Schematic VDD1 RF In 470 1.0 µF Ferrite Bead 120 Ω 12 470 0.1 µF 100 pF 1.0 nF T2 T3 20 2.7 39 pF 4700 pF 0.01 µF 1.0 nF Freescale Semiconductor, Inc... VDD2 19 18 T1 16 1 15 1.0 nF 2 N.C. 14 1.0 nF 3 N.C. 13 1.0 nF 4 N.C. 12 1.0 nF 5 N.C. 11 0.1 µF 6 T1 = .100 in, Zo = 50 Ω T2 = .275 in, Zo = 50 Ω T3 = .166 in, Zo = 50 Ω T4 = .041 in, Zo = 50 Ω T5 = .420 in, Zo = 50 Ω 17 N.C. 7 T4 8 9 Vref 680 0.1 µF ABC 240 VG3 N.C. 10 12.55 nH Coilcraft 1601-10 27 pF T5 4700 pF VG1,2 6.8 pF VDD3 1.0 nF 0.1 µF 47 µF RF Out Figure 7. Application Schematic 6 MRFIC0970 Technical Data For More Information On This Product, Go to: www.freescale.com MOTOROLA Freescale Semiconductor, Inc. Packaging 5 Packaging PIN 1 INDEX AREA 0.1 C 2X 4 A M 0.1 C 0.1 C 2X G 1.0 0.8 4 1.00 0.75 0.05 C 5 (0.24) 0.05 0.00 (0.5) C SEATING PLANE DETAIL G VIEW ROTATED 90 CLOCKWISE M Freescale Semiconductor, Inc... B 0.1 C A B NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. THE COMPLETE JEDEC DESIGNATOR FOR THIS PACKAGE IS: HF-PQFP-N. 4. CORNER CHAMFER MAY NOT BE PRESENT. DIMENSIONS OF OPTIONAL FEATURES ARE FOR REFERENCE ONLY. 5. COPLANARITY APPLIES TO LEADS, CORNER LEADS, AND DIE ATTACH PAD. 7. FOR ANVIL SINGULATED QFN PACKAGES, MAXIMUM DRAFT ANGLE IS 12 . DETAIL M PIN 1 INDEX 2.25 1.95 16 EXPOSED DIE ATTACH PAD 20 15 1 2.25 1.95 0.1 C A B 5 11 0.5 16X N 10 20X 6 0.75 0.50 20X VIEW M-M 0.30 0.18 0.1 0.05 M C A B M C (45 ) (1.19) 20X 0.065 0.015 0.60 0.24 0.60 0.24 (0.27) DETAIL N DETAIL N CORNER CONFIGURATION OPTION PREFERRED CORNER CONFIGURATION 4 4 1.1 1.0 DETAIL T (90 ) BACKSIDE PIN 1 INDEX 0.475 0.425 2X 0.39 0.31 0.25 R 0.15 2X 0.1 0.0 DETAIL M DETAIL M DETAIL T PREFERRED BACKSIDE PIN 1 INDEX BACKSIDE PIN 1 INDEX OPTION PREFERRED BACKSIDE PIN 1 INDEX Figure 8. Outline Dimensions for QFN-20 (Case 1308-02, Issue C) MOTOROLA MRFIC0970 Technical Data For More Information On This Product, Go to: www.freescale.com 7 Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. HOW TO REACH US: Information in this document is provided solely to enable system and software implementers to use Motorola products. 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