CLARE CPC1979 Isoplusâ ¢-264 power relay Datasheet

CPC1979
ISOPLUS™-264 Power Relay
Description
Characteristics
Parameter
Blocking Voltage
Rating
Units
600
VP
Clare and IXYS have combined to bring OptoMOS®
technology, reliability and compact size to a new family
of high-power Solid State Relays.
Load Current, TA=25°C:
With 5°C/W Heat Sink
3.5
No Heat Sink
1.4
On-Resistance
0.75
Ω
RθJC
0.3
°C/W
As part of this family, the CPC1979 single-pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 3.5Arms continuous load current with a
5°C/W heat sink.
Arms
Features
•
•
•
•
•
•
•
•
•
•
3.5Arms Load Current with 5°C/W Heat Sink
Low 0.75Ω On-Resistance
600VP Blocking Voltage
2500Vrms Input/Output Isolation
Low Thermal Resistance (0.3 °C/W)
Electrically Non-conductive Thermal Pad for Heat
Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
•
•
•
•
Industrial Controls / Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Approvals
• UL 508 Recognized Component: File E69938
The CPC1979 employs optically coupled MOSFET
technology to provide 2500Vrms of input to output
isolation. The output, constructed with efficient
MOSFET switches and photovoltaic die, uses Clare’s
patented OptoMOS architecture while the input, a
highly efficient GaAlAs infrared LED, provides the
optically coupled control. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique ISOPLUS-264 package pioneered by
IXYS enables Solid State Relays to achieve the
highest load current and power ratings. This package
features a unique IXYS process in which the silicon
chips are soft soldered onto the Direct Copper Bond
(DCB) substrate instead of the traditional copper
leadframe. The DCB ceramic, the same substrate
used in high power modules, not only provides
2500Vrms isolation but also very low thermal
resistance (0.3 °C/W).
Ordering Information
Part
Description
CPC1979J
ISOPLUS-264 Package (25 per tube)
Switching Characteristics
Pin Configuration
Form-A
IF
90%
10%
ILOAD
ton
RoHS
2002/95/EC
DS-CPC1979 - R06
toff
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1
CPC1979
1 Specifications
1.1 Absolute Maximum Ratings @ 25°C
Symbol
Blocking Voltage
Ratings
Units
600
VP
Reverse Input Voltage
5
V
Input Control Current
100
mA
1
A
150
mW
Peak (10ms)
Input Power Dissipation
Isolation Voltage, Input to Output
2500
Vrms
Operational Temperature
-40 to +85
°C
Storage Temperature
-40 to +125
°C
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
1.2 Electrical Characteristics @ 25°C
Parameter
Conditions
Symbol
Minimum
Typical
Maximum
Units
20
AP
Output Characteristics
Load Current 1
Peak
Continuous
Continuous
Continuous
2
On-Resistance
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current 3
Input Dropout Current
Input Voltage Drop
Reverse Input Current
Input/Output Characteristics
Capacitance, Input-to-Output
t ≤ 10ms
No Heat Sink
TC=25°C
IL
TC=99°C
IL(99)
IF=10mA, IL=1A
RON
-
0.59
0.75
Ω
VL=600VP
ILEAK
-
-
1
μA
ton
-
8
25
toff
-
0.2
5
VL=25V, f=1MHz
Cout
-
700
-
pF
IL=1A
IF
-
-
10
mA
IF=5mA
IF
0.6
-
-
mA
VF
0.9
1.2
1.4
V
VR=5V
IR
-
-
10
μA
-
CI/O
-
1
-
pF
IF=20mA, VL=10V
-
-
1.4
14.5
Arms
1.7
ms
1
Higher load currents possible with proper heat sinking.
Measurement taken within 1 second of on-time.
3 For applications requiring high temperature operation (T > 60ºC) a LED drive current of 20mA is recommended.
C
2
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2
CPC1979
PRELIMINARY
2 Thermal Characteristics
Parameter
Thermal Resistance (Junction to Case)
Thermal Resistance (Junction to Ambient)
Junction Temperature (Operating)
Conditions
Symbol
Minimum
Typical
Maximum
Units
-
RθJC
-
-
0.3
°C/W
Free Air
RθJA
-
33
-
°C/W
-
TJ
-40
-
100
°C
2.1 Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal resistance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Heat Sink Rating
RθCA =
(TJ - TA) IL(99)2
IL2 • PD(99)
- RθJC
TJ = Junction Temperature (°C), TJ ≤ 100°C *
TA = Ambient Temperature (°C)
IL(99) = Load Current with Case Temperature @ 99°C (ADC)
IL = Desired Operating Load Current (ADC), IL ≤ IL(MAX)
RθJC = Thermal Resistance, Junction to Case (°C/W) = 0.3°C/W
RθCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
PD(99) = Maximum power dissipation with case temperature held at 99ºC = 3.33W
* Elevated junction temperature reduces semiconductor lifetime.
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CPC1979
3 Performance Data
25
Device Count (N)
30
Device Count (N)
Typical Turn-On Time
(N=35, IF=20mA, IL=1ADC, TA=25ºC)
25
20
15
10
Typical Turn-Off Time
(N=50, IF=20mA, IL=1ADC, TA=25ºC)
50
20
Device Count (N)
35
Typical LED Forward Voltage Drop
(N=50, IF=10mA, TA=25ºC)
15
10
5
40
30
20
10
5
0
0
1.31
1.32
1.33
0
7.3
1.34
7.8
8.3
Typical On-Resistance Distribution
(N=50, IF=10mA, IL=1ADC, TA=25ºC)
35
30
9.8
25
20
15
10
0.57
0.58
0.59
0.60
0.61
1.4
IF=50mA
IF=20mA
IF=10mA
1.2
1.0
0.8
100
20
15
10
642
0.62
650
658
0.270
Temperature (ºC)
60
80
0.260
0.255
0.250
0.240
0.235
0
21
100
0.265
0.245
5
10
15
20
25
30
35
40
45
50
0
2.5
5
7.5 10 12.5 15 17.5 20 22.5 25
LED Forward Current (mA)
LED Forward Current (mA)
Typical Turn-On vs. Temperature
(IL=1ADC)
Typical Turn-Off vs. Temperature
(IL=1ADC)
0.35
0.30
IF=10mA
15
IF=20mA
12
9
6
IF=20mA
0.25
0.20
IF=10mA
0.15
0.10
0.05
0
0
40
682
Typical Turn-Off
vs. LED Forward Current
(IL=1ADC, TA=25ºC)
0.280
3
20
674
0.275
18
0
666
Typical Turn-On
vs. LED Forward Current
(IL=1ADC, TA=25ºC)
22
20
18
16
14
12
10
8
6
4
2
0
120
Turn-On (ms)
LED Current (mA)
20
40
60
80
Temperature (ºC)
Typical IF for Switch Operation
vs. Temperature
(IL=1ADC)
-20
0.25
25
Turn-Off (ms)
1.6
Turn-On (ms)
LED Forward Voltage Drop (V)
1.8
-40
0.24
Blocking Voltage (VP)
Typical LED Forward Voltage Drop
vs. Temperature
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0.23
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
On-Resistance (Ω)
0
0.22
Turn-Off (ms)
0
0
-20
0.21
5
5
-40
0.20
30
Device Count (N)
Device Count (N)
9.3
Turn-On (ms)
LED Forward Voltage (V)
35
8.8
Turn-Off (ms)
1.30
-40
-20
0
20
40
60
80
100
-40
Temperature (ºC)
-20
0
20
40
60
80
100
Temperature (ºC)
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
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4
CPC1979
PRELIMINARY
Typical On-Resistance
vs. Temperature
(IF=20mA, IL=1A)
0.7
Load Current (A)
0.6
0.5
0.4
0.3
0.2
0.1
0
-20
0
20
40
60
80
100
9
7
6
5
5ºC/W
4
3
10ºC/W
2
Free Air
1
-1.0
0
-0.5
0.5
1.0
0
1.5
0
20
40
60
80
Load Voltage (V)
Temperature (ºC)
Typical Blocking Voltage
vs. Temperature
Typical Leakage vs. Temperature
Measured Across Pins 1&2
(VL=600VP)
Energy Rating Curve
Free Air, No Heat Sink
0.014
700
690
680
670
660
650
640
630
620
610
600
20
0.010
0.008
0.006
0.004
0.002
-20
0
20
40
60
Temperature (ºC)
80
100
0
-40
100
24
0.012
-40
1ºC/W
8
Temperature (ºC)
Leakage (μA)
Blocking Voltage (VP)
-40
2.5
2.0
1.5
1.0
0.5
0
-0.5
-1.0
-1.5
-2.0
-2.5
-1.5
Load Current (AP)
On-Resistance (Ω)
0.8
Maximum Load Current
vs. Temperature with Heat Sink
(IF=20mA)
Load Current (Arms)
0.9
Typical Load Current
vs. Load Voltage
(IF=10mA, TA=25ºC)
-20
0
20
40
60
80
100
16
12
8
4
0
10µs 110µs 1ms 10ms 100ms
Temperature (ºC)
1s
10s 100s
Time
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
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CPC1979
4 Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified
all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint
industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our
products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1979J
MSL 1
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
Device
Maximum Temperature x Time
CPC1979J
245°C for 30 seconds
4.4 Board Wash
Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is
acceptable. Since Clare employs the use of silicone coating as an optical waveguide in many of its optically isolated
products, the use of a short drying bake may be necessary if a wash is used after solder reflow processes.
Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic
energy should not be used.
RoHS
2002/95/EC
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6
CPC1979
PRELIMINARY
4.5 Mechanical Dimensions
5.029 ± 0.127
(0.198 ± 0.005)
1.181 ± 0.076
(0.047 ± 0.003)
19.914 ± 0.254
(0.784 ± 0.010)
26.162 ± 0.254
(1.030 ± 0.010)
20.396 ± 0.508
(0.803 ± 0.020)
20.600 ± 0.254
(0.811 ± 0.010)
2.362 ± 0.381
(0.093 ± 0.015)
DIMENSIONS
mm
(inches)
3.810 ± 0.254
(0.150 ± 0.010)
15.240 ± 0.508
(0.600 ± 0.020)
17.221 ± 0.254
(0.678 ± 0.010)
1.930 ± 0.381
(0.076 ± 0.015)
0.635 ± 0.076
(0.025 ± 0.003)
2.794 ± 0.127
(0.110 ± 0.005)
1.270 TYP
(0.050 TYP)
NOTE: Back-side heat sink meets 2500Vrms isolation to the pins.
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and
product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,
Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for
a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1979-R06
©Copyright 2011, Clare, Inc.
All rights reserved. Printed in USA.
1/7/2011
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