FUJITSU SEMICONDUCTOR DATA SHEET DS06-70105-3E Semicustom Bi-CMOS ASTRO-NT (for RF front-end LSI-Based on PLL, Analog Macro) MB15G000 Series ■ DESCRIPTION The ASTRO-NT* is a new technology to correspond to the demand of high performance RF LSI. The technology stands on a macro concept and create a custom LSI ideal for use in high frequency front-end circuit such as VCO, amplifier, mixer and I/Q modulator devices. The chip can be built by combining macros, in accordance with user’s demand function and characteristic. FUJITSU prepares standard RF macros. They are well finished in design and layout to fulfil good performance by function that a master slice method can not achive. It is possible to modify RF macro in response to user’s demand. This LSI series uses FUJITSU’s latest BiCMOS process technology for low current consumption. In addition, many types of packages are available that makes it possible to find a proper size package for different circuit integration levels. ASTRO-NT is ideal for applications with RF or IF signal, particularly mobile communication devices operating such as PDC, PHS, GSM, DCS, PCS and so on. *: Advanced Standard macro base Technology of PLL with RF system On LSI-New Technology ■ FEATURES • • • • • High operating frequency: to 3.0 GHz (max) Supply voltage: 2.5 to 5.5 V Standard RF macro Low power consumption Package line up –Many types of package are available. SSOP-16, SSOP-20, SSOP-24, SSOP-34, BCC-16, BCC-48, LQFP-48, LQFP-64, • Operating temperature: –40 to +85°C • Fujitsu’s latest BiCMOS process technology MB15G000 Series ■ PACKAGES 16-pin Plastic SSOP 20-pin Plastic SSOP 24-pin Plastic SSOP (FPT-16P-M05) (FPT-20P-M03) (FPT-24P-M03) 34-pin Plastic SSOP 48-pin Plastic LQFP 64-pin Plastic LQFP (FPT-34P-M03) (FPT-48P-M05) (FPT-64P-M03) 16-pad Plastic BCC (LCC-16P-M02) (LCC-16P-M03) (LCC-48P-M02) Number of pins and name of package Package Code Size (mm) 16-pin Plastic SSOP FPT-16P-M05 6.4 × 5.0 × 1.25 20-pin Plastic SSOP FPT-20P-M03 6.4 × 6.5 × 1.25 24-pin Plastic SSOP FPT-24P-M03 7.6 × 7.75 × 1.25 34-pin Plastic SSOP FPT-34P-M03 8.1 × 11.0 × 1.25 48-pin Plastic LQFP FPT-48P-M05 9.0 × 9.0 × 1.5 64-pin Plastic LQFP FPT-64P-M03 12.0 × 12.0 × 1.5 LCC-16P-M02 3.4 × 4.55 × 0.8 LCC-16P-M03 4.2 × 4.55 × 0.8 LCC-48P-M02 7.0 × 7.0 × 0.8 16-pad Plastic BCC 48-pad Plastic BCC 2 48-pad Plastic BCC MB15G000 Series ■ ABSOLUTE MAXIMUM RATINGS Parameter Symbol Rating Unit Min. Max. VCC *2 –0.5 4.0 V 3 VCC * –0.5 6.0 V Input voltage *1 VIN –0.5 VCC + 0.5 V Output current Iout –10 10 mA Storage temperature Tstg –55 +125 °C Power supply voltage *1 *1:Voltage values are based on GND = 0 V *2:Using 3V macro specifications *3:Using 5V macro specifications WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. ■ RECOMMENDED OPERATING CONDITIONS Parameter Symbol Value Unit Min. Typ. Max. VCC *2,*3 2.7 3.0 3.3 V VCC *2,*4 4.5 5.0 5.5 V GND — 0 — V Input voltage VIN GND — VCC V Operating temperature Ta –40 — +85 °C Power supply voltage *1 *1:Voltage values are based on GND = 0 V *2:The range of operating voltage should be defined depends on circuit configuration. For models not using standard 3V or 5V specifications, maximum ratings and recommended operating conditions are set according to circuit use. *3:Using 3V macro specifications *4:Using 5V macro specifications WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device’s electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their FUJITSU representatives beforehand. 3 MB15G000 Series ■ MACRO DESCRIPTIONS 1. Prescaler Divides the reference frequency by any given value and outputs the resulting frequency. Choice of two -modulus or fixed output mode. 2. PLL • Phase comparator The phase comparator has a phase detection range of –2π to +2π, and is designed to eliminate blind spots in phase comparison by output of a margin-of-error signal to the charge pump even when the phase difference is zero. Phase comparator characteristics can also be tuned to the polarity of VCO. • Counters The divide ratios of the comparator-side counter and reference-side counter can be either programmable or fixed. • Charge pump The “H” level output voltage from the charge pump is determined by power supply voltage. Charge pump characteristics for the sending and receiving systems can be optimized for each specific application. For example, when FM modulation is applied directly to the VCO signal, charge pump characteristic can be adjusted for lower speeds in order to reduce the sensitivity of the synthesizer loop so that output does not track the modulation. • High speed lock-up circuit This circuit is specially designed for faster lock-up speeds. • Intermittent operation control circuit This on-chip power-saving function reduces circuit current flow in standby status, enabling devices to operate with less power demand. A special circuit is built in to prevent excessive error signal from increasing lock-up delay during the transition from power-saving mode to operating mode. • List of standard macros Type VCC PLL1 PLL2 PLL3 PLL4 2.7 V Operating frequency Prescaler divide ratio (M) 1.5 mA 0.5 GHz 8/9, 16/17 2.0 mA 1.2 GHz 3.0 mA 2.0 GHz 3.5 mA 2.5 GHz ICC Crystal oscillator input frequency: Up to 32 MHz Standby mode current demand: 10 µA(Max.) Note: Refer to macro specification book. 4 32/33, 64/65 Comparator counter divide ratio (N) Swallow counter divide ratio (A) Reference counter divide ratio (R) 5 to 2047 0 to 255 5 to 16383 MB15G000 Series 3. RF Analog Macro List Circuit Function Voltage Current Application Example 900 MHz QMOD + AGC 29.6 mA PDC 1.9 GHz MOD + UpCONV (IF = 233 MHz) 27.0 mA PHS 0.9, 1.9 GHz Doubler + MOD UpCONV IF = 413 MHz 3.0 V 28.0 mA GSM/DCS, PCS QMOD/QDEM 130 MHz Shifter QMOD 7.7 mA CDMA 85 MHz Shifter + QDEM 7.8 mA CDMA Offset Mix + QMOD + AGC (900 MHz) 2nd Mixer Lim AMP/RSSI AGC AMP 39.0 mA PDC VCO + QMOD + AGC (200 MHz) 22.0 mA CDMA Lo = 250 MHz, IF = 10.8 MHz 2nd Mixer 3.5 mA PHS Lo = 130 MHz, IF = 450 kHz 2nd Mixer 3.0 mA PDC 400 MHz IF AMP + 2nd Mixer 5.0 mA GSM/DCS, PCS 800 MHz, 1.9 GHz UpCONV Buf AMP/VCO 2.9 V 3.0 V 10.2 mA CDMA 1.3-1.6 GHz Local Buffer AMP 3.0 mA GSM/DCS, PCS 400 MHz VCO + VCO Buffer 5.0 mA GSM/DCS, PCS 260 MHz VCO (Tx) 3.0 mA CDMA 170 MHz VCO (Rx) 1.6 mA CDMA 450 KHz LimAMP/RSSI 3.0 V 10.8 MHz LimAMP/RSSI 130 MHz AGC GP = 40 dB GP = 55 dB 850 MHz, 19 GHz AGC + Power driver 3.6 V 2.0 mA PDC 2.0 mA PHS 19.0 mA CDMA 4.9 mA 3.0 V 38.5 mA CDMA Note: Circuit format and other details can be adjusted to meet customer requirements. Refer to macro specification book. 5 MB15G000 Series ■ MACRO BROCHURE A macro brochure is available for the convenience of customers using standard FUJITSU macros in Astro-NT development. Astro-NT can be arranged in a variety of configurations using combinations of macros. Customer may select the macros that suit their particular requirements for specifications and characteristics. Also, standard macros may be modified to meet more detailed customer requirements. The macro brochure includes sample applications and electrical characteristics of macros. • Macro Brochure (Sample Macro Electrical Characteristics) RV001QMOD (900 MHz Doubler QMOD + AGC) (VCC = 3.0 V, Ta = −25 °C) Parameter Symbol Target Value Min. Typ. Max. Unit Comment/Condition Lo input frequency fMODLO 870 948 960 MHz Lo input level PMODLO −23 −20 −15 dBm I/Q input frequency fBB DC 0.5 MHz I/Q input amplitude VBB 0.5 1.0 1.2 Vpp I/Q offset voltage VOS 1.4 1.5 1.6 V I/Q offset current IOS 10 20 µA AGCcnt input voltage AGCcnt 0.7 2.5 V SSB maximum output level Pout1 −1.0 2.0 dBm AGCcnt = 2.5 V SSB minimum output level Pout2 −32 dBm AGCcnt = 1.1 V −32 dBm AGCcnt = 0.7 V Carrier leakage CL −30 dBc Image rejection IR −30 dBc Third order intermodulation distortion IM −35 dBc Vector error EVM 3.0 5 % Amplitude error Aerr % Phase error Perr 1.5 deg Adjacent cannel leakage power ACP TXout1-2 isolation Power supply current Single ended input External offset voltage value AGCcnt = 0.7 to 2.5V PMODLO = −20 dBm I/Q : PN9 −65 *1 −60 *1 dB −73 * dB ISOout 30 dB ICC 35 mA 2 −68 * 2 *1:50 kHz offset *2:100 kHz offset *:Macro brochures are available by contacting your Fujitsu marketing representative. 6 fMODLO = 948 MHz PMODLO = −20 dBm I/Q : sin, cos wave 5.25 kHz VBB = 1.0 V Single ended MB15G000 Series ■ DEVELOPMENT FLOW Products are developed through the following processes. The illustration below shows the development flow. (1) Customer Request (Phase 1) The customer selects an existing macro from the Fujitsu Macro Brochure, for the purpose of producing a system block in a specific design. If the desired macro does not exist, the customer may request Fujitsu to modify an existing macro. (2) Functional Study and Price Approximation (Phase 2) Based on the customer request, Fujitsu and the customer make an initial study of feasibility. An initial price estimate is also made. (3) Development Start (Phase 3) Based on the results of the primary study, and with the approval of the customer, Fujitsu starts the development process. Detailed investigation is made including circuit study and simulation of circuit characteristics, a layout is created, and provisional delivery characteristics (target specifications) are drawn up. The development schedule, development costs, and price estimate are prepared. (4) Prototyping and Mass Production Based on the provisional delivery specifications approved by the customer, the LSI is designed and prototyped. The standard time for ES prototyping is approximately nine weeks. Fujitsu and the customer jointly evaluate the ES based on the provisional specifications. If no problems are found, final delivery specifications are approved and development is completed. The next step, transition to mass production and delivery, requires a standard interval of approximately three months. 7 MB15G000 Series • Development Flow Fujitsu Customer Macro selection or modification of macro specifications New macro development Presented : Macro brochure Product specifications and estimate Primary Engineering and Price Study (Phase 1) Functional study, Price approximation No good Confirmation OK No good Confirmation Detailed Product Study (Phase 2) No good Price estimate OK Development start Detailed design (simulation, layout) Target specifications Confirmation Standard 9 Weeks (Phase 3) OK No good ES prototype Confirmation Standard 3 Months (Phase 4) Final specifications OK Mass production 8 ES evaluation MB15G000 Series ■ PACKAGE DIMENSIONS 16-pin Plastic SSOP (FPT-16P-M05) *:These dimensions do not include resin protrusion. +0.20 * 5.00±0.10(.197±.004) 1.25 –0.10 +.008 .049 –.004 (Mounting height) 0.10(.004) INDEX * 4.40±0.10 (.173±.004) 0.65±0.12 (.0256±.0047) 6.40±0.20 (.252±.008) 5.40(.213) NOM "A" +0.10 0.22 –0.05 +0.05 Details of "A" part 0.15 –0.02 +.004 +.002 .006 –.001 .009 –.002 0.10±0.10(.004±.004) (STAND OFF) 0 4.55(.179)REF C 10° 0.50±0.20 (.020±.008) Dimension in mm (inches) 1994 FUJITSU LIMITED F16013S-2C-4 20-pin Plastic SSOP (FPT-20P-M03) *:These dimensions do not include resin protrusion. +0.20 * 6.50±0.10(.256±.004) 1.25 –0.10 +.008 .049 –.004 (Mounting height) 0.10(.004) INDEX 0.65±0.12 (.0256±.0047) 5.85(.230)REF C 1994 FUJITSU LIMITED F20012S-2C-4 * 4.40±0.10 6.40±0.20 (.173±.004) (.252±.008) +0.10 "A" 5.40(.213) NOM +0.05 0.22 –0.05 0.15 –0.02 +.004 –.002 .006 –.001 .009 Details of "A" part +.002 0.10±0.10(.004±.004) (STAND OFF) 0 10° 0.50±0.20 (.020±.008) Dimension in mm (inches) 9 MB15G000 Series 24-pin Plastic SSOP (FPT-24P-M03) *:These dimensions do not include resin protrusion. +0.20 * 7.75±0.10(.305±.004) 1.25 –0.10 +.008 .049 –.004 (Mounting height) 0.10(.004) * 5.60±0.10 INDEX 0.65±0.12(.0256±.0047) (.220±.004) 7.60±0.20 (.299±.008) 6.60(.260) NOM "A" +0.10 +0.05 0.22 –0.05 0.15 –0.02 +.004 7.15(.281)REF C Details of "A" part +.002 .006 –.001 .009 –.002 0.10±0.10(.004±.004) (STAND OFF) 0 10° 1994 FUJITSU LIMITED F24018S-2C-2 0.50±0.20 (.020±.008) Dimension in mm (inches) 34-pin Plastic SSOP (FPT-34P-M03) *:These dimensions do not include resin protrusion. +0.20 * 11.00±0.10(.433±.004) 1.25 –0.10 (Mounting height) +.008 .049 –.004 0.10(.004) 6.10±0.10 (.240±.004) INDEX 8.10±0.20 (.319±.008) "A" +0.10 0.65(.0256)TYP 0.22 –0.05 .009 +.004 –.002 7.10(.280) NOM 0.10(.004) M +0.05 0.15 –0.02 +.002 .006 –.001 Details of "A" part 0.10±0.10(.004±.004) (STAND OFF) 10.40(.409)REF 0 C 10 1994 FUJITSU LIMITED F34003S-1C-2 10° 0.50±0.20 (.020±.008) Dimension in mm (inches) MB15G000 Series 48-pin Plastic LQFP (FPT-48P-M05) 9.00±0.20(.354±.008)SQ 7.00±0.10(.276±.004)SQ 36 25 37 24 0.08(.003) INDEX Details of "A" part +0.20 1.50 –0.10 48 13 (Mounting height) +.008 .059 –.004 "A" LEAD No. 1 12 +0.08 0.50±0.08 (.020±.003) 0.18 –0.03 .007 +.003 –.001 0.08(.003) M 0.145±0.055 (.006±.002) 0~8° 0.50±0.20 (.020±.008) 0.45/0.75 (.018/.030) C 0.10±0.10 (.004±.004) (Stand off) 0.25(.010) Dimension in mm (inches) 1998 FUJITSU LIMITED F48013S-3C-6 64-pin Plastic LQFP (FPT-64P-M03) 12.00±0.20(.472±.008)SQ 10.00±0.10(.394±.004)SQ 48 33 49 32 0.08(.003) Details of "A" part INDEX +0.20 1.50 –0.10 +.008 (Mounting height) .059 –.004 17 64 "A" LEAD No. 1 0.50±0.08 (.020±.003) 0~8° 16 0.18 .007 +0.08 –0.03 +.003 –.001 0.08(.003) M 0.145±0.055 (.006±.002) 0.50±0.20 (.020±.008) 0.45/0.75 (.018/.030) C 1998 FUJITSU LIMITED F64009S-3C-6 0.10±0.10 (.004±.004) (Stand off) 0.25(.010) Dimension in mm (inches) 11 MB15G000 Series 16-pads Plastic BCC (LCC-16P-M02) 4.55±0.10 (.179±.004) 14 9 0.80(.032)MAX (Mounting height) 3.40(.134)TYP 0.65(.026)TYP 9 14 0.40±0.10 (.016±.004) 3.40±0.10 (.1339±.0039) 2.45(.096) TYP "A" 45° 1.15(.045)TYP "B" 0.80(.032) TYP 1 E-MARK 6 0.40(.016) 0.325±0.10 (.013±.004) 6 0.085±0.04 (.003±.002) (STAND OFF) 1.725(.068) TYP Details of "A" part Details of "B" part 0.75±0.10 (.030±.004) 0.05(.002) 0.60±0.10 (.024±.004) 0.40±0.10 (.016±.004) C 1 0.60±0.10 (.024±.004) Dimension in mm (inches) 1996 FUJITSU LIMITED C16013S-1C-1 16-pads Plastic BCC (LCC-16P-M03) 4.55±0.10 (.179±.004) 14 9 0.80(.032)MAX (Mounting height) 3.40(.134)TYP 0.65(.026)TYP 9 14 0.40±0.10 (.016±.004) 4.20±0.10 (.165±.004) 3.25(.128) TYP 45° "A" 1.55(.061)TYP "B" 0.80(.032) TYP 1 E-MARK 6 0.40(.016) 0.325±0.10 (.013±.004) 6 0.085±0.040 (.003±.002) (STAND OFF) Details of "A" part 1.725(.068) TYP 1 Details of "B" part 0.75±0.10 (.030±.004) 0.60±0.10 (.024±.004) 0.05(.002) 0.40±0.10 (.016±.004) C 12 1996 FUJITSU LIMITED C16014S-1C-1 0.60±0.10 (.024±.004) Dimension in mm (inches) MB15G000 Series 48-pads Plastic BCC (LCC-48P-M02) 6.15(.242)TYP 5.00(.197)TYP 7.00±0.10(.276±.004) 37 (0.80(.031)MAX) (Total height) 25 0.50(.020) TYP 0.50±0.10 (.020±.004) "C" 25 37 0.085±0.040 (.003±.002) (Stand off) 7.00±0.10 (.276±.004) 0.50(.020) TYP 6.15(.242) TYP 5.00(.197) TYP 0.50±0.10 (.020±.004) 6.20(.244) TYP 48 48 13 1 13 Details of "A" part 0.05(.002) C0.2(.008) 0.45±0.10 (.018±.004) C 1998 FUJITSU LIMITED C48055SC-1-1 1 "B" 6.20(.244)TYP Details of "B" part 0.45±0.10 (.018±.004) 0.40±0.10 (.016±.004) 0.30±0.10 (.012±.004) "A" Details of "C" part 0.45±0.10 (.018±.004) 0.45±0.10 (.018±.004) Dimension in mm (inches) 13 MB15G000 Series ■ ASTRO-NT REQUEST SHEET (Example) Customer name : Application : Time :ES; Quantity : CS; Macro name (*1) Use current specifications RV001AMP × Modification requested (*2) RV002MIX × RV001QMOD × If Modification is Requested: Macro name : RV002MIX, RV001QMOD Function Parameter Block 14 RV002 MIX Gaim RV001 QMOD SSB maximum output level Symbol Target Value Min. Gv Pout1 −2 Typ. Max. Unit 30 dB 2 dBm Comment/Condition AGCcnt = 2.0 V MB15G000 Series Block diagram (Example) 0° φ Σ 1/2 90° φ φ Σ 15 MB15G000 Series ■ ASTRO-NT REQUEST SHEET Customer name : Application : Time :ES; Quantity : Macro name (*1) CS; Use current specifications MEMO *:Please fill in the macro name of the macro brochure. *:Please fill in the demand on an attached spec seat. 16 Modification requested (*2) MB15G000 Series Macro name: Function Block Parameter Symbol Target Value Min. Typ. Max. Unit Comment/Condition 17 MB15G000 Series Block diagram 18 MB15G000 Series FUJITSU LIMITED For further information please contact: Japan FUJITSU LIMITED Corporate Global Business Support Division Electronic Devices KAWASAKI PLANT, 4-1-1, Kamikodanaka Nakahara-ku, Kawasaki-shi Kanagawa 211-8588, Japan Tel: 81(44) 754-3763 Fax: 81(44) 754-3329 http://www.fujitsu.co.jp/ North and South America FUJITSU MICROELECTRONICS, INC. Semiconductor Division 3545 North First Street San Jose, CA 95134-1804, USA Tel: (408) 922-9000 Fax: (408) 922-9179 Customer Response Center Mon. - Fri.: 7 am - 5 pm (PST) Tel: (800) 866-8608 Fax: (408) 922-9179 http://www.fujitsumicro.com/ Europe FUJITSU MIKROELEKTRONIK GmbH Am Siebenstein 6-10 D-63303 Dreieich-Buchschlag Germany Tel: (06103) 690-0 Fax: (06103) 690-122 http://www.fujitsu-ede.com/ Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE LTD #05-08, 151 Lorong Chuan New Tech Park Singapore 556741 Tel: (65) 281-0770 Fax: (65) 281-0220 http://www.fmap.com.sg/ F9905 FUJITSU LIMITED Printed in Japan All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. The information and circuit diagrams in this document are presented as examples of semiconductor device applications, and are not intended to be incorporated in devices for actual use. Also, FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of this information or circuit diagrams. FUJITSU semiconductor devices are intended for use in standard applications (computers, office automation and other office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.). CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with FUJITSU sales representatives before such use. The company will not be responsible for damages arising from such use without prior approval. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be required for export of those products from Japan.