FUJITSU MB3802

FUJITSU SEMICONDUCTOR
DATA SHEET
DS04-27601-2E
ASSP For Power Supply Applications
Power Management Switch
MB3802
■ DESCRIPTION
The MB3802 is a power management switch incorporating two switch circuits with extremely low ON resistance.
NO diode is required because the switch block is configured with an N-ch MOS to prevent reverse current at
switch OFF.
The MB3802 starts at a very low voltage (typical VIN > 2.2V) and a stable ON resistance is obtained irrespective
of the switching voltage because the internal DC/DC converter applies the optimum voltage for the N-ch MOS
gate at switch ON.
Moreover, the load-side capacitor is discharged at switch OFF, and the power supply for various power supply
systems is switched efficiently.
■ FEATURES
• Extremely low ON resistance:
RON = 0.12 Ω (typical)
RON = 0.06 Ω (typical at parallel connection)
• Reverse current protection at load side at switch OFF
• Operation start at low input voltage: VIN > 2.2 V (typical)
• Low power consumption
At switch OFF: IIN (input voltage) = 0 µA, VIN = 0 V
At switch ON: IIN = 230 µA, VIN = 5 V
• Load discharge function
• External control of ON/OFF time
• Break-before-make operation
■ PACKAGE
16-pin plastic SOP
(FPT-16P-M04)
MB3802
■ PIN ASSIGNMENT
(TOP VIEW)
GNDA
1
16
VINA
DCGA
2
15
DLYA
SWINA
3
14
SWOUTA
SWINA
4
13
SWOUTA
MB3802
SWINB
5
12
SWOUTB
SWINB
6
11
SWOUTB
DCGB
7
10
DLYB
GNDB
8
9
VINB
(FPT-16P-M04)
■ PIN DESCRIPTION (SCSI Interface)
2
Pin No.
Pin symbol
16
VINA
9
VINB
3, 4
SWINA
5, 6
SWINB
13, 14
SWOUTA
11, 12
SWOUTB
2
DCGA
7
DCGB
15
DLYA
10
DLYB
1
GNDA
8
GNDB
Description
These pins switch ON at High level and OFF at Low level. They
serve as power-supply pins for the DC/DC converter to generate
the switch gate voltage.
Switch Input pins: Two common pins are assigned to SWINA and
SWINB. They serve as power-supply pins for the switch-OFF circuit
which starts at 1.5V min.
Switch output pins: Two common pins are assigned to SWOUTA
and SWOUTB. When DCGA and DCGB are High level, the loaddischarge circuit starts discharge via these pins.
SWOUTA/SWOUTB-side discharge control pins: These pins are
used to discharge from the load-side capacitor at switch OFF.
Connect them to GND when discharge is not required.
Switch-ON/OFF control pins: The ON/OFF time can be delayed
by connecting an external capacitor. Both times are delayed about
three fold by installing a 500-pF capacitor between these pins and
GND. Leave these pins open when they are not used. 10V may be
generated when these pins are open. To keep these pins at high
impedance, take care to mount the device so that no current leaks
(less than 0.1 µA).
Ground pins for input threshold reference voltage and load
discharge: When two switching circuits are used, ground both
GND pins.
MB3802
■ BLOCK DIAGRAM AND EXTERNAL CONNECTIONS
CD
Extemal capacitor
DLY
Power supply
SW IN
Switch-ON
circuit
DC/DC converter
Comp
V IN
SW OUT
Switch-OFF
circuit
(+)
Switch control
Load
Load discharge
circuit
DDG
GND
Note: The MB3802 incorporates two switch blocks as shown above. However, GND is common to both blocks.
■ BLOCK DESCRIPTION
The MB3802 is a one-way switching IC with the SWIN and SWOUT pins serving respectively for input and output.
When VIN exceeds 2.2 V, the Comp. starts driving the DC/DC converter to switch the N-ch MOS and applies the
optimum voltage for the switch gate.
The DC/DC converter boosts the VIN voltage.
When VIN is below 2.1 V, the Comp. stops the DC/DC converter, starts the switch-OFF circuit, and discharges
the voltage from the switch gate to GND. The switch-OFF circuit is powered from the SWIN and consumes 0.4µA
at 5 V.
Since the N-ch MOS back gate is connected to GND, switch-OFF reverse current is prevented irrespective of
the High level state between SWIN and SWOUT. Note, however, that turning the VIN pin on/off with 1.5 V or less
applied to the SWIN pin may cause reverse current to flow because the switch-off circuit does not work then.
For the method of compensating for the operation of the switch-off circuit, see section “■APPLICATIONS 7.Lowside Switch.”
The load discharge circuit installed between SWOUT and GND is powered by the DCG pin, and discharges the
load-side capacitor at switch OFF. When it is not necessary to discharge the load, connect the DCG pin to GND.
The DLY pins are for connection to an external capacitor to delay the switch-ON/OFF time. The surge current
at the load side is cut at power-on by controlling the switch-ON time. The switch-ON time depends on the boot
time of the DC/DC converter. Consequently, when the VIN level is high and the SWIN level is low, the switch-ON
time is small; when the SWIN level is high, the switch-OFF time is small.
3
MB3802
■ ABSOLUTE MAXIMUM RATING
Symbol
Condition
Ratings
(Ta = +25°C)
Unit
Input Voltage
VIN
—
–0.3 to 7.0
V
Switching voltage
VSW
At switch OFF
–0.3 to 7.0
At switch ON
–0.3 to 7.0
Switching current
ISW
At switch-ON peak
3.6
A
Permissible loss
PD
Ta ≤ + 75°C
290
mW
–55 to +125
°C
Parameter
Storage Temperature
TSTG
—
V
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
■ RECOMMENDED OPERATING CONDITIONS
Parameter
Input voltage
Switching level
Symbol
Conditions
VIN
—
VSWIN
Ratings
Unit
Min.
Typical
Max.
0
—
6.0
At switch ON
0
—
6.0
At switch OFF
0
—
6.0
At switch on
(for single switch)
—
—
1.2
A
V
V
Switching current
ISW
Gate-pin connection capacitance
CD
—
—
—
10
nF
Gate-pin mounting leak current
IDLY
—
–0.1
—
0.1
µA
Input voltage to load discharge circuit
VDCG
2.5
—
6.0
V
–40
—
+7.5
°C
Operating temperature
Top
VIN = 3V, 5V
—
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device's electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
4
MB3802
■ ELECTRICAL CHARACTERISTICS
1. DC Characteristics
(Ta = +25°C)
Parameter
Symbol
Input threshold voltage
Unit
Typ
Max
VIN = 0 V
—
0
—
µA
VIN = 3 V
—
100
200
µA
VIN = 5 V
—
230
460
µA
RON1
VIN = 3 V, ISW = 0.5 A,
VSWIN = 3 V
—
120
160
mΩ
RON2
VIN = 5 V, ISW = 0.5 A,
VSWIN = 3 V
—
130
175
mΩ
IL
VIN = 0 V, VSWIN = 6 V
—
0.5
2.0
µA
VTH1
At switch ON
2.0
2.2
2.4
V
VTH2
At switch OFF
1.9
2.1
2.3
V
50
100
—
mV
IIN2
Swiching resistance
Switch-OFF leak current
Ratings
Min
IIN1
Input current
Condition
Input hysteresis width
VHYS
Switch resistance
RON
VIN = 3 V, 5 V, ISW = 0.5 A
Ta = –40°C to +75°C
—
—
210
mΩ
RDCG1
VSWOUT = 3 V, VDCG = 3 V
—
750
1500
Ω
RDCG2
VSWOUT = 5 V, VDCG = 5 V
—
500
1000
Ω
VDCG = 5 V
—
0
2
µA
Switch charge resistance
Input voltage to switch charge
circuit
IDCG
—
2. AC Characteristics
(Ta = +25°C)
Parameter
Switch-ON time
Switch OFF time
Switch ON/OFF time lag
Symbol
Condition
tON1
Ratings
Unit
Min
Typ
Max
VIN = 0V → 3V, VSWIN = 3V
20
300
900
µs
tON2
VIN = 0V → 5V, VSWIN = 5V
20
150
450
µs
tOFF1
VIN = 3V → 0V, VSWIN = 3V
5
60
180
µs
tOFF2
VIN = 5V → 0V, VSWIN = 5V
5
30
150
µs
tHYS1
VIN = 3V / 0V, VSWIN = 3V
10
240
720
µs
tHYS2
VIN = 5V / 0V, VSWIN = 5V
10
120
300
µs
5
MB3802
■ AC CHARACTERISTIC TEST DIAGRAMS
1. Test Condition
Open
DLY
VIN
SWIN
1A
SWOUT
VS = 3 V/5 V
GND DCG
Load current = 1 A
R
R = 3 Ω/5 Ω
2. Switch-ON/OFF Timing Chart
tr
tf
90%
VIN
90%
50%
0V
50%
10%
10%
= SWIN
90%
SWOUT
0V
tON
SW OUT
10%
t OFF
Note: The rise/fall times (10%/90%) of VIN are both less than 1µs.
6
0V
MB3802
■ APPLICATIONS
1. Separate Use of Two Switching Circuits
DCGA
VINA
SWINA
SWOUTA
SWINB
VINB
SWOUTB
GND
VSB
DCGB
Load B
3 V to 5 V
VSA
Load A
3 V to 5 V
Notes:
1. The two power supplies VSA andVSB can be used separated by controlling the voltages VINA and VINB.
2. Connect the DCD pin to GND when it is not used.
2. Switching Two Power Supplies
VINA
SWINA
SWOUTA
SWINB
VINB
SWOUTB
GND
Load
VSB
VSA
3 V to 5 V
3 V to 5 V
Note: When using different power supplies for a single load, control them by connecting an external
capacitor so that both switches are not ON at the same time.
7
MB3802
3. Switching Two Loads
DCGA
VINA
SWINA
SWOUTA
SWINB
VINB
SWOUTB
GND
VS
DCGB
Load B
Load A
3 V to 5 V
Note: Make this connection to control two different loads separately for a single power supply.
4. Connecting Serial Switches
DCGA
VINA
SWINA
SWOUTA
SWINB
VINB
SWOUTB
GND
VS
DCGB
Load B
Load A
Note: Make this connection to supply power from VS to load B via load A.
8
3 V to 5 V
MB3802
5. Connecting Parallel Switches
DCGA
DLYA
VINA
SWINA
SWOUTA
SWINB
VINB
SWOUTB
GND
VS
DLYB
DCGB
3 V to 5 V
Load
Note: Connect the circuits A and B in parallel to produce a low ON resistance (RON = 0.06 Ω).
In this case, connect the DLYA and DLYB pins in common to give synchronous ON/OFF
between both switches.
6. 25% ON Resistance
DCGA
VINA
DLYA
SWINA
SWOUTA
SWINB
VINB
DLYB
SWOUTB
GND
DCGB
DCGA
VINA
VS
Load
3 V to 5 V
DLYA
SWINA
SWOUTA
SWINB
VINB
DLYB
SWOUTB
GND
DCGB
Notes:
1. Make this connection to produce an ON resistance that is much lower than the above connection.
Also, connect the DLY pins in common.
2. Consider the difference between the ON resistances and the switch-ON/OFF times between two
devices (MB3802) and insure that load control is not offset at one device.
9
MB3802
7. Low-side Switch
VINA
SWINA
Load A
SWOUTA
SWINB
VINB
Load B
SWOUTB
GND
VIN = 3 V,VS = 3 V
Switch-ON time
Switch-OFF time
80 µs
5.0 ms
DLYA
DLYB
RA
RB
VSB
3 V to 5 V
VSA
3 V to 5 V
VIN = 5 V,VS = 5 V
45 µs
3.5 ms
RA and RB = 10 MΩ
Notes:
1. Make this connection to control the switch ON/OFF at the lower load side.
2. To assist the switch-OFF circuit operation driven by the SWIN power supply, connect high
resistances (RA and RB = 5 to 10 MΩ) to the DLY pins without overloading the DC/DC converter.
3. At this connection, the switch-OFF time is longer than the switch-ON time.
10
MB3802
■ TYPICAL PERFORMANCE CHARACTERISTICS
ON Resistance (Load current dependence)
ON Resistance (Input-voltage dependence)
150
ISW = 1 A
VSWIN = 6 V
VSWIN = 5 V
VSWIN = 4 V
VSWIN = 3 V
VSWIN = 2 V
VSWIN = 1 V
VSWIN = 0 V
250
200
150
100
2.5
150
VSWIN = 5 V,VIN = 3 V
VSWIN = 5 V,VIN = 5 V
Switch-ONTime (µs)
ON resistance (mΩ)
300
100
VSWIN = 3 V,VIN = 3 V
VSWIN = 3 V,VIN = 5 V
50
3.0
3.5
4.0
4.5
5.0
5.5
6.0
0.2
0.4
0.6
0.8
ON Resistance
(Temperature dependence: SWIN = 5 V)
150
VSWIN = 5 V
ISW = 1 A
ON resistance (mΩ)
100
VVIN = 3 V
VVIN = 5 V
VIN = 3 V
VIN = 5 V
50
–25
0
25
Ta (°C)
50
75
0
25
50
VSWIN = 5 V
ISW = 1 A
400
Switch ONtime (µs)
400
300
200
Ta = –25°C
Ta = +25°C
100
300
Ta = –25°C
Ta = +25°C
200
100
Ta = +75°C
0
75
Switch-ON time
(Input voltage characteristic: SWIN = 5 V)
500
VSWIN = 3 V
ISW = 1 A
Switch-ON time (µs)
–25
Ta (°C)
Switch-ON time
(Input voltage characteristic: SWIN = 3 V)
500
1.2.
ON Resistance
(Temperature dependence: SWIN = 3 V)
100
50
1.0
Load current (A)
VSWIN = 3 V
ISW = 1 A
ON resistance (mΩ)
0
Input voltage (V)
3.0
3.5
4.0
4.5
5.0
Input voltage (V)
5.5
Ta = +75°C
6.0
0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Input voltage (V)
(Continued)
11
MB3802
Switch-OFF Time
(Input voltage characteristic: SWIN = 3 V)
Switch-OFF Time
(Input voltage characteristic: SWIN = 5 V)
100
100
VSWIN = 5 V
ISW = 1 A
90
Switch-OFF time (µs)
Switch-OFF time (µs)
VSWIN = 3 V
ISW = 1 A
Ta = –25°C
80
Ta = +25°C
70
Ta = +75°C
60
50
3.0
3.5
4.0
4.5
5.0
5.5
90
80
70
50
3.0
6.0
Input voltage (V)
4.0
4.5
100
VSWIN = 3 V
ISW = 1 A
10
1
10000
6.0
10
1
VIN = 3 V
VIN = 5 V
1000
0.1
100
10000
1000
10000
Capacitance (pF)
Capacitance (pF)
Switch-OFF Time
(DLY-pin connection capacitance: SWIN = 3 V)
Switch-OFF Time
(DLY-pin connection capacitance: SWIN = 5 V)
10000
VSWIN = 5 V
ISW = 1 A
OFF-time (ms)
VSWIN = 3 V
ISW = 1 A
OFF-time (ms)
5.5
VSWIN = 5 V
ISW = 1 A
VIN = 3 V
VIN = 5 V
0.1
100
5.0
Switch-ON Time
(DLY-pin connection capacitance: SWIN = 5 V)
ON-time (ms)
ON-time (ms)
3.5
Input voltage (V)
Switch-ON Time
(DLY-pin connection capacitance: SWIN = 3 V)
100
Ta = –25°C
Ta = +25°C
Ta = +75°C
60
1000
100
1000
100
VIN = 3 V
VIN = 5 V
VIN = 3 V
VIN = 5 V
10
100
1000
Capacitance (pF)
10000
10
100
1000
10000
Capacitance (pF)
(Continued)
12
MB3802
(Continued)
Discharge Resistance
(DCG voltage dependence: SWIN = 3 V)
Discharge Resistance
(DCG voltage dependence: SWIN = 5 V)
10
10
VSWIN = 5 V
ISW = 1 A
Discharge resistance (kΩ)
Discharge resistance (kΩ)
VSWIN = 3 V
ISW = 1 A
1
Ta = +75°C
Ta = +25°C
Ta = +75°C
Ta = +25°C
1
Ta = –25°C
Ta = –25°C
0.1
2
3
4
5
0.1
6
2
3
4
5
6
DCG voltage (V)
DCG voltage (V)
Input Current (Input voltage dependence)
Output Leak Current (at switch OFF)
1000
Input current (µA)
Leak current (nA)
300
100
Ta = +75°C
Ta = +25°C
Ta = –25°C
200
Ta = +75°C
Ta = +25°C
100
Ta = –25°C
VIN = 0 V
10
0
2
3
4
5
6
0
1.0
2.0
4.0
5.0
Switch-On resistance
(relationship between VIN and VS)
Surge Current and Output Voltage Boot
(DLY-pin connection capacitance dependence)
6
140 mΩ
130 mΩ
5
Open
510 pF Surge current
1000 pF
Output GND
120 mΩ
115 mΩ
Switch voltage (V)
Open
510 pF Output voltage
1000 pF
4
110 mΩ
3
105 mΩ
2
1
Input GND
(Surge current)
100 mΩ
ISW = 1A
0
Time
VIN = 0 → 5 V
SWIN = 5 V
Load capacitance = 47 µF
3.0
Input voltage (V)
SWIN voltage (V)
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VIN voltage (V)
V: 200 mA/div. (surge current)
V: 1.0 V/div. (output voltage)
H: 200 µs/div. (time axis)
13
MB3802
■ PACKAGE DIMENSIONS
16-pin plastic FTP
(FTP-16P-M04)
+0.25
+.010
10.15 –0.20 .400 –.008
2.10(.083)MAX
0(0)MIN
(STAND OFF)
INDEX
1.27(.050)TYP
3.90±0.30
(.154±.012)
0.45±0.10
(.018±.004)
+0.40
5.40 –0.20
+.016
.213 –.008
6.40±0.40
(.252±.016)
+0.05
Ø0.13(.005)
M
0.15 –0.02
+.002
.006 –.001
0.50±0.20
(.020±.008)
Details of "A" part
0.20(.008)
0.10(.004)
8.89(.350)REF
"A"
0.50(.020)
0.18(.007)MAX
0.68(.027)MAX
C
14
1994 FUJITSU LIMITED F16012S-4C-4
Dimensions in mm (inch)
MB3802
FUJITSU LIMITED
For further information please contact:
Japan
FUJITSU LIMITED
Corporate Global Business Support Division
Electronic Devices
KAWASAKI PLANT, 4-1-1, Kamikodanaka
Nakahara-ku, Kawasaki-shi
Kanagawa 211-8588, Japan
Tel: 81(44) 754-3763
Fax: 81(44) 754-3329
http://www.fujitsu.co.jp/
North and South America
FUJITSU MICROELECTRONICS, INC.
Semiconductor Division
3545 North First Street
San Jose, CA 95134-1804, USA
Tel: (408) 922-9000
Fax: (408) 922-9179
Customer Response Center
Mon. - Fri.: 7 am - 5 pm (PST)
Tel: (800) 866-8608
Fax: (408) 922-9179
http://www.fujitsumicro.com/
Europe
FUJITSU MIKROELEKTRONIK GmbH
Am Siebenstein 6-10
D-63303 Dreieich-Buchschlag
Germany
Tel: (06103) 690-0
Fax: (06103) 690-122
http://www.fujitsu-ede.com/
Asia Pacific
FUJITSU MICROELECTRONICS ASIA PTE LTD
#05-08, 151 Lorong Chuan
New Tech Park
Singapore 556741
Tel: (65) 281-0770
Fax: (65) 281-0220
http://www.fmap.com.sg/
F9902
 FUJITSU LIMITED Printed in Japan
All Rights Reserved.
The contents of this document are subject to change without
notice. Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information and circuit diagrams in this document are
presented as examples of semiconductor device applications,
and are not intended to be incorporated in devices for actual use.
Also, FUJITSU is unable to assume responsibility for
infringement of any patent rights or other rights of third parties
arising from the use of this information or circuit diagrams.
FUJITSU semiconductor devices are intended for use in
standard applications (computers, office automation and other
office equipment, industrial, communications, and measurement
equipment, personal or household devices, etc.).
CAUTION:
Customers considering the use of our products in special
applications where failure or abnormal operation may directly
affect human lives or cause physical injury or property damage,
or where extremely high levels of reliability are demanded (such
as aerospace systems, atomic energy controls, sea floor
repeaters, vehicle operating controls, medical devices for life
support, etc.) are requested to consult with FUJITSU sales
representatives before such use. The company will not be
responsible for damages arising from such use without prior
approval.
Any semiconductor devices have an inherent chance of
failure. You must protect against injury, damage or loss from
such failures by incorporating safety design measures into your
facility and equipment such as redundancy, fire protection, and
prevention of over-current levels and other abnormal operating
conditions.
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Law of Japan, the prior
authorization by Japanese government will be required for
export of those products from Japan.