FUJITSU SEMICONDUCTOR DATA SHEET ASSP DS04-27223-1E For Power Supply Applications Multi-Resonance AC/DC Converter IC MB3873 ■ DESCRIPTION The MB3873 is a pulse frequency modulation (PFM) type multi-resonance AC/DC converter IC providing soft switching functions in a more compact, higher-efficiency, low-noise package. Since this product allows reduced number of the components and reduced size of the transformer, it is also compatible with the miniaturization of AC adaptor. The product retains the multi-resonance for the non-load, over-load and load short-circuit over the wide range of input voltage, making it the appropriate IC for the small-sized AC adaptor. ■ FEATURES • • • • • • • Operating power supply voltage : 10V to 28V Operating current : 2.5mA typ. Low standby current : 400µA typ. Control frequency range : 10kHz to 800kHz Operating temperature range : −30°C to +105°C Soft start circuit on-chip Overvoltage detection circuit on-chip (Continued) ■ PACKAGE 16-pin plastic SOP (FPT-16P-M06) MB3873 (Continued) • Overload detection circuit on-chip • Over temperature detection circuit on-chip • Under voltage lockout protection circuit on-chip ■ PIN ASSIGNMENT (TOP VIEW) RT : 1 16 : −IN CT : 2 15 : +IN RD : 3 14 : OVP CD : 4 13 : OTP FB : 5 12 : ENB CS : 6 11 : VCC GND : 7 10 : VREF OUT : 8 9 : VCC (O) (FPT-16P-M06) 2 MB3873 ■ PIN DESCRIPTION Pin No. Symbol I/O Descriptions 1 RT — Triangular wave oscillator frequency setting resistor connection pin 2 CT — Triangular wave oscillator frequency setting capacitor connection pin 3 RD — Dead time setting resistor connection pin 4 CD — Delay interval setting capacitor connection pin 5 FB I 6 CS — Soft start capacitor connection pin 7 GND — Ground pin 8 OUT O Totem pole type output pin 9 VCC (O) — Output circuit power supply pin 10 VREF O Reference voltage output pin 11 VCC — Reference power and control circuit power supply pin 12 ENB — UVLO voltage setting resistor connection pin 13 OTP I Overtemperature detection comparator input pin 14 OVP I Overvoltage detection comparator 1 input pin 15 +IN I Overvoltage detection comparator 2 non-inverted input pin 16 –IN I Overvoltage detection comparator 2 inverted input pin Control frequency control pin 3 +IN 15 −IN 16 3.9 V − CD 4 + 10µA 2.5 V − + OVP 14 0.98 V − + OTP 13 − + 4 OVP Comp.2 OCP Comp. OVP Comp.1 OTP Comp. R2 25 kΩ R1 135 kΩ UVLO Comp.1 5V 2 CT RT 1 OSC “LO” output overload 5 6 Q CS FB OSC Control R S Latch 2.5 V/1.45 V + − 9.3 V/16 V − + ENB 12 RD 3 One-Shot DTC UVLO Comp.2 Power ON/OFF VCC 11 Ref Bias GND 7 Dead time Drive 8V VREF 10 8 OUT 9 VCC (O) MB3873 ■ BLOCK DIAGRAM MB3873 ■ ABSOLUTE MAXIMUM RAGINGS Parameter Power supply voltage Symbol VCC Conditions Rating Unit Min. Max. VCC, VCC (O) pin — 30 V Output current IO OUT pin — 20 mA Peak output current IO OUT pin, Duty ≤ 5 % — 300 mA Power dissipation PD Ta ≤ +25°C — 540* mW −55 +125 °C Storage temperature — Tstg * : The packages are mounted on the dual-sided epoxy board (10 cm × 10 cm). WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. ■ RECOMMENDED OPERATING CONDITIONS Parameter Power supply voltage Symbol Conditions VCC VCC (O) Reference voltage output current IOR Input voltage VIN Output current IO Value Unit Min. Typ. Max. — 10 18 28 V — 5 VREF 28 V –10 — 0 mA OTP, OVP pin 0 — VCC V +IN, –IN pin 0 — VREF V OUT pin –15 — 15 mA VCC (O) = VREF Triangular wave oscillator frequency fOSC FB = VREF, CS = OPEN 10 105 300 kHz Timing capacitor CT — 100 220 4700 pF Timing resistor RT — 15 33 47 kΩ Control frequency fOSC FB controlled 10 105 800 kHz OSC control current IFB FB pin –1 — — mA Soft start capacitor CS — — 0.1 1.0 µF Delay time capacitor CD — — 0.1 1.0 µF Dead time resistor RD — 36 120 250 kΩ Operating ambient temperature Ta — –30 25 105 °C WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device’s electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their FUJITSU representatives beforehand. 5 MB3873 ■ ELECTRICAL CHARACTERISTICS (Ta = +25°C, VCC = 18 V, VCC (O) = VREF) Parameter Reference voltage block [Ref] Overload detection block [OCP] Unit Min. Typ. Max. Ta = 25°C 7.6 8.0 8.4 V Ta = –30 to +85°C 7.44 8.0 8.56 V –30 — 30 mV — 25 50 mV 10 Input stability Line 10 VCC = 10 V to 28 V Load stability Load 10 VREF = 0 mA to –10 mA IOS 10 VREF = 4 V –35 –25 –15 mA VTLH 10 VCC = 15 16 17 V VTHL 10 VCC = 8.8 9.3 9.8 V VH 10 VH = VTLH – VTHL — 6.7 V fOSC1 8 CT = 220 pF, RT = 33 kΩ, FB = VREF, CS = OPEN 95 105 115 kHz fOSC2 8 CT = 220 pF, RT = 33 kΩ, FB = –1 mA, CS = OPEN 535 630 725 kHz ∆f/fdt 8 Ta = –30 to +85°C — 1.0* — % ICS1 6 CS = 0 V –35 –25 –15 µA ICS2 6 CS = 2 V –3.5 –2.5 –1.5 µA fCS1 8 CT = 220 pF, RT = 33 kΩ, FB = VREF, CS = 0 V 380 450 520 kHz fCS2 8 CT = 220 pF, RT = 33 kΩ, FB = VREF, CS = OPEN 95 105 115 kHz tDEAD 8 RD = 120 kΩ 400 500 600 ns Threshold current ITH 5 — –60 –40 –20 µA Threshold voltage VTH 4 — 3.7 3.9 4.1 V Charge current ICD 4 — –14 –10 –6 µA VTH 14 — 2.37 2.50 2.63 V IB 14 –400 –50 — nA Oscillator frequency Frequency temperature stability Charge current Dead time control block [DTC] Value VREF Under Threshold voltage voltage lockout circuit block Hysteresis width [UVLO] Soft start block [CS] Conditions Output voltage Short circuit output current Triangular wave oscillator block [OSC] Symbol Pin no Soft start frequency Dead time Overvoltage Threshold voltage detection comparator Input bias current block1 [OVP1] OVP = 0 V *: Standard design value. (Continued) 6 MB3873 (Continued) (Ta = +25°C, VCC = 18 V, VCC (O) = VREF) Parameter Overvoltage detection comparator block2 [OVP2] General Pin no Conditions Value Unit Min. Typ. Max. — — 10 mV 0 — VREF – 1.8 V Input offset voltage VIO 15, 16 CS = 1.5 V Common mode input voltage range VCM 15, 16 IB1 15 +IN = 0 V, –IN = 3 V –200 –25 — nA IB2 16 +IN = 3 V, –IN = 0 V –200 –25 — nA VTH 13 0.93 0.98 1.03 V IB 13 OTP = 0 V –400 –50 — nA Output source current ISOURCE 8 Duty ≤ 5 %, OUT = 5 V — –60 — mA Output sink current ISINK 8 Duty ≤ 5 %, OUT = 3 V — 100 — mA VOH 8 OUT = –15 mA 6.6 7.1 — V VOL 8 OUT = 15 mA — 0.9 1.4 V Rise time tr 8 CL = 100 pF — 25 — ns Fall time tf 8 CL = 100 pF — 20 — ns Standby current ICCS 11 VCC = 14 V — 400 600 µA Operating power supply current ICC 11 VCC = 18 V — 2.5 3.8 mA Cut off power supply current ICCL 11 VCC = 18 V, OTP = 2 V — 450 680 µA Input current Over Threshold voltage temperature detection Input bias current comparator block [OTP] Output block [Drive] Symbol Output voltage — — *: Standard design value. 7 MB3873 ■ TYPICAL CHARACTERISTICS 5 Power supply current ICC (mA) Ta = +25 °C 4 3 2 1 0 0 10 20 30 40 50 Power supply voltage VCC (V) Cut off power supply current vs. power supply voltage 0.7 Cut off power supply current ICCL (mA) Power supply current vs. power supply voltage 0.5 0.4 0.3 0.2 0.1 0.0 0 Reference voltage vs. power supply voltage Reference voltage VREF (V) Reference voltage VREF (V) 4 2 0 20 30 40 30 10 6 10 20 40 50 Reference voltage vs. VREF load current Ta = +25 °C VREF = 0 mA 0 10 Power supply voltage VCC (V) 10 8 Ta = +25 °C OTP = 2 V 0.6 Ta = +25 °C VCC = 18 V 8 6 4 2 0 50 0 Power supply voltage VCC (V) 10 20 30 40 50 VREF load current IREF (mA) Reference voltage vs. ambient temperature Reference voltage VREF (V) 9.0 VCC = 18 V 8.8 8.6 8.4 8.2 8.0 7.8 7.6 7.4 7.2 7.0 −50 −25 0 25 50 75 100 125 Ambient temperature Ta ( °C) (Continued) 8 MB3873 Triangular oscillator frequency vs. timing resistor 1000 Ta = +25 °C VCC = 18 V CT = 100 pF 100 CT = 220 pF CT = 470 pF CT = 1000 pF 10 CT = 2200 pF CT = 4700 pF 1 10 100 Timing resistor RT (kΩ) Triangular oscillator frequency fOSC (kHz) Triangular oscillator frequency fOSC (kHz) (Continued) 3.4 Ta = +25 °C VCC = 18 V RT = 33 kΩ 3.2 3.0 Upper 2.8 2.6 2.4 2.2 2.0 Lower 1.8 1.6 10 100 1000 10000 Timing capacitor CT (pF) Ta = +25 °C VCC = 18 V RT = 33 kΩ 100 10 1 10 100 1000 10000 Timing capacitor CT (pF) Triangular oscillator frequency vs. FB pin current Triangular oscillator frequency fOSC (kHz) Triangular wave upper and lower limit voltage (V) Triangular wave upper and lower limit voltage vs. timing capacitor Triangular oscillator frequency vs. timing capacitor 1000 1000 Ta = +25 °C VCC = 18 V RT = 33 kΩ CT = 220 pF 800 600 400 200 0 −1200 −1000 −800 −600 −400 −200 0 FB pin current IFB (µA) Triangular oscillator frequency fOSC (kHz) Triangular oscillator frequency vs. ambient temperature 130 VCC = 18 V RT = 33 kΩ CT = 220 pF 120 110 100 90 80 −50 −25 0 25 50 75 100 125 Ambient temperature Ta ( °C) (Continued) 9 MB3873 (Continued) Dead time vs. dead time setting resistor Soft start frequency vs. CS pin voltage Ta = +25 °C VCC = 18 V RT = 33 kΩ CT = 220 pF 400 300 200 100 0 0.0 0.5 1.0 1.5 2.0 CS pin voltage VCS (V) Power dissipation PD (mW) 600 540 500 400 300 200 100 −25 0 25 50 75 100 Ambient temperature Ta ( °C) 10 Ta = +25 °C VCC = 18 V RT = 33 kΩ CT = 220 pF 1200 1000 800 600 400 200 0 0 50 100 150 200 250 Dead time setting resistor RD (kΩ) Power dissipation vs. ambient temperature 0 −50 1400 Dead time tDEAD (ns) Soft start frequency fCS (kHz) 500 125 300 MB3873 ■ FUNCTIONAL DESCRIPTION 1. Switching Regulator Function (1) Reference voltage circuit (Ref) The reference voltage circuit takes the voltage from the Vcc terminal (pin 11) and generates a temperaturecompensated reference voltage ( =: 8V), which is used as the reference voltage supply for the IC internal circuit bias and detection comparator. A reference voltage can be output from the VREF terminal (pin 10) at levels up to 10mA. (2) Triangular-wave oscillator circuit (OSC) This circuit is used to generate a triangular oscillator waveform, by connecting timing capacitor and resistor to the CT terminal (pin 2) and RT terminal (pin 1) respectively. The triangular waveform frequency fosc1 is set according to the timing capacitor and resistor. The triangular oscillator waveform is input to the IC’s internal dead time timing circuit (One-Shot-DTC), and can be output from the CT terminal. (3) Oscillator frequency control circuit (OSC Control) The oscillator control circuit detects the AC/DC converter output voltage and outputs the PFM control signal to the triangular wave oscillator. The FB terminal (pin 5) carries the AC/DC converter output voltage at the V/I converted OSC control current. When an overload occurs, the detection signal to the overload detection circuit (OCP Comp.) is also output here. (4) Dead time timing circuit (One-Shot-DTC) The dead time timing circuit converts the triangular waveform generated by the triangular wave oscillator to a rectangular wave having a pulse width ( = dead time tDEAD) set by the dead time setup resistor that is connected to the RD terminal (pin 3). (5) Output circuit (Drive) The output circuit has totem pole configuration, and outputs the PFM signal from the OUT terminal (pin 8). The output circuit power is supplied from the Vcc (O) terminal (pin 9). 2. Protective Function (1) Undervoltage lockout circuit (UVLO) Power-on surges and momentary drops in power supply voltage can cause errors in control IC operation, which can destroy or damage systems. To prevent the error operation, the UVLO Comp.1 circuit detects low voltage conditions in the supply voltage (Vcc), and sets the VREF terminal (pin 10) to “L” level. The UVLO Comp.2 circuit detects low voltage conditions in the reference voltage, and sets the OUT pin (pin 8) to “L” level. Overvoltage/overload/over temperature conditions cause the error detection latch (Latch) to be set. If the VREF terminal (pin 10) is set to “L” level, and the supply voltage falls below the UVLO circuit threshold voltage (VTHL), the UVLO Comp.1 resets the error detection latch. Operation is restored when the power supply voltage returns above the threshold voltage (VTHL) of the UVLO circuit. The threshold voltage can be set to any desired level by connecting resistor between the ENB terminal (pin 12) and GND terminal (pin 7), or between the ENB terminal (pin 12) and Vcc terminal (pin 11) (for internal resistance constants see “BLOCK DIAGRAM”). (2) Overvoltage detection comparator 1 (OVP Comp. 1) When the input voltage at the OVP terminal (pin 14) is greater than the threshold voltage (=: 2.5V), the overvoltage comparator 1 sets the error detection latch, and sets the VREF terminal (pin 10) and OUT terminal (pin 8) to “L” level. Note that if OVP Comp.1 is not used, the OVP terminal (pin 14) should be shorted to GND by the shortest path (see “PROCESSING WHEN OVP PIN IS NOT USED”). 11 MB3873 (3) Overvoltage detection comparator 2 (OVP Comp.2) When the input voltage at the +IN terminal (pin 15) is greater than the input voltage at the -IN terminal (pin 16), the CS terminal is set to “L” level causing the frequency to increase. When the +IN input voltage falls below the -IN input voltage, soft start processing is performed to restart operation. Overvoltage detection comparator 2 does not provide the same latch operation as OVP Comp.1. Note that if OVP Comp.2 is not used, the +IN terminal (pin 15) should be shorted to GND, and the -IN terminal (pin 16) should be connected to the VREF terminal (pin 10) by the shortest path (see “PROCESSING WHEN OVERVOLTAGE DETECTION COMPARATOR 2 IS NOT USED”). (4) Overload detection comparator circuit (OCP Comp.) When an overload occurs, the OCP Comp. circuit detects the overload signal output by the oscillator frequency control circuit, and after a given interval sets the error detection latch and sets the VREF terminal (pin 10) and OUT terminal (pin 8) to “L” level. The time interval from overload detection to setting of the error latch is determined by the delay interval setting capacitor connected to the CD terminal (pin 4). Note that if the overload detection function is not used, the CD terminal (pin 4) should be shorted to GND by the shortest path (see “PROCESSING WHEN THE CD PIN IS NOT USED”). (5) Overtemperature detection comparator (OTP Comp.) The over temperature detection comparator detects the input voltage at the OTP terminal (pin 13) and if greater than the threshold voltage ( =: 0.98V) sets the error detection latch, and sets the VREF terminal (pin 10) and OUT terminal (pin 8) to “L” level. Note that if the overtemperature detection function is not used, the OTP terminal (pin 13) should be shorted to GND by the shortest path (see “PROCESSING WHEN OTP PIN IS NOT USED”). 3. Soft Start Function Soft Start Circuit (CS) The MB3873 oscillator frequency control circuit includes an on-chip soft start circuit. Soft starting can be provided by connecting a capacitor to the CS terminal (pin 6). At start up, this causes the PFM control signal to be input to the triangular wave oscillator, thereby controlling the control frequency and preventing current rush. Note that if the soft start function is not used, the CS terminal (pin 6) should be left open. (See “PROCESSING WHEN CS PIN IS NOT USED.”) ■ SETTING THE OSCILLATOR FREQUENCY The oscillator frequency is set by the timing capacitor CT and timing resistor RT connected to the CT pin and RT pin respectively. Oscillator frequency fOSC (when frequency control is not exerted by the FB, CS pins) 7.6 × 105 fOSC [kHz] =: CT [pF] × RT [kΩ] ■ SETTING THE DEAD TIME The dead time is set by the dead time resistor RD connected to the RD pin. Dead time (output pin square wave pulse width) tDEAD [ns] =: 4.8 × RD [kΩ] – 44 12 MB3873 ■ SETTING THE SOFT START TIME When the MB3873 is started, the soft start capacitor (Cs) connected to the CS terminal begins charging. While the CS terminal voltage is =: 0 to 1.1V, the oscillator frequency is controlled by the CS terminal voltage, thereby controlling the output voltage. The soft start capacitor charging current is as follows ICS1 =: 25 µA (CS pin voltage =: 0 to 1.1V) ICS2 =: 2.5 µA (CS pin voltage =: 1.1 to 3.1V (CS pin clamp voltage)) Soft start time (time until CS pin voltage reaches 1.1V) 1.2 × CS [µF] tCS [s] =: 25 [µA] ■ SETTNG THE OVERLOAD DETECTION DELAY TIME When an overload condition is detected, the delay capacitor (CD) connected to the CD terminal starts charging ( =: 10 µA), increasing the CD terminal voltage. When the CD terminal voltage exceeds the threshold voltage ( =: 4V), the error detection latch is set, and the VREF terminal (pin 10) and OUT terminal (pin 8) are set to “L” level. Overload detection delay time (time from overload detection until error latch is set) 3.9 × CD [µF] tCS [s] =: 10 [µA] 13 MB3873 ■ OVERVOLTAGE DETECTION COMPARATOR 2 EQUIVALENT CIRCUIT +IN 15 CS + OVP Comp. 2 − −IN 16 ■ PROCESSING WHEN OVERVOLTAGE DETECTION COMPARATOR 2 IS NOT USED When the overvoltage detection comparator 2 is not used, the +IN terminal (pin 15) should be shorted to GND by the shortest possible path, and the -IN terminal (pin 16) should be connected to the VREF terminal (pin 10) by the shortest possible path. −IN 16 +IN 15 VREF 10 When overvoltage detection comparator 2 is not used 14 MB3873 ■ PROCESSING WHEN CD PIN IS NOT USED When the overload detection function is not used, the CD terminal (pin 4) should be shorted to GND by the shortest possible path. 4 CD When CD pin is not used ■ PROCESSING WHEN OTP PIN IS NOT USED When the over temperature detection function is not used, the OTP terminal (pin 13) should be shorted to GND by the shortest possible path. OTP 13 When OTP pin is not used 15 MB3873 ■ PROCESSING WHEN OVP PIN IS NOT USED When the overvoltage detection function is not used, the OVP terminal (pin 14) should be shorted to GND by the shortest possible path. OVP 14 When OVP pin is not used ■ PROCESSING WHEN CS PIN IS NOT USED When the soft start function is not used, the CS terminal (pin 6) should be left open. “Open” 6 CS When the soft start time is not set 16 MB3873 ■ PROCESSING WHEN ENB PIN IS NOT USED When not connecting a specified resistance to the UVLO Comp.1, the ENB terminal (pin 12) should be left open. “Open” ENB 6 When ENB pin is not used 17 18 − − 1000 pF 1000 pF 33 kΩ 100 µF 100 µF + + 8 VDD 9 IN 10 11 12 VSS 13 14 HO 7 VB 6 VS 5 4 VCC 3 COM 2 LO 1 1 2 3 4 5 6 7 8 MB3873 16 15 14 13 12 11 10 9 0.1 µF 100 pF 0.039 µF 1 kΩ 0.022 µF 100 pF 22 µF − + 2SK2543 22 Ω 2.2 µF − + 0.1 µF 2SK2543 22 Ω 20 V∗ 3 2 1 3 kΩ 1 µF − + 2 kΩ 680 Ω 12 kΩ − + − + 18 V 3 A 330 µF 330 µF 330 µF 1000 pF HA17431P 1 kΩ YG805C04 2 kΩ 21 V∗ 2 kΩ 8 7 6 5 YG805C04 TLP521-1 10 kΩ 1 kΩ TLP521-1 4.7 kΩ + 22 µF 4 15 V∗ − 2SC3233 120 kΩ IR2116ÅiHIGH AND LOW SIDE DRIVER) : International Rectifier Corp. ECQU2A224MV : Matsushita Electronic Components Co., Ltd. D3SBA60 : SHINDENGEN ELECTRIC MANUFACTURING Co., Ltd. 2SK2543 : TOSHIBA CORPORATION 2SC3233 : TOSHIBA CORPORATION TLP521-1 : TOSHIBA CORPORATION YG805C04 : Fuji Electric Co.,Ltd. HA17431P : Hitachi, Ltd. 200 pF 0.22 µF 120 kΩ 2.5 kΩ OUT GND CS FB CD RD CT RT ∗ : Dielectric strength of zener diode ECQU2A224MV 0.22 µF D3SBA60 VREF VCC ENB OTP OVP +IN −IN + IR2116 VCC (O) − Vin MB3873 ■ APPLICATION EXAMPLE MB3873 ■ REFERENCE DATA Output voltage vs. input voltage (Output voltage = 18 V) OUT = 3 A RT = 33 kΩ CT = 220 pF Vin frequency = 50 Hz 18.1 18.0 17.9 18.2 Output voltage VO (V) Output voltage VO (V) 18.2 Output voltage vs. load current (Output voltage = 18 V) 17.8 0 50 100 150 200 250 Vin = AC100 V (50 Hz) RT = 33 kΩ CT = 220 pF 18.1 18.0 17.9 17.8 300 0 0.5 1 Input voltage Vin (V) Conversion efficiency η (%) Conversion efficiency η (%) 90 OUT = 3 A RT = 33 kΩ CT = 220 pF Vin frequency = 50 Hz 60 50 0 50 100 150 200 2.5 3 3.5 Conversion efficiency vs. load current (Output voltage = 18 V) 100 70 2 Load current IO (A) Conversion efficiency vs. input voltage (Output voltage = 18 V) 80 1.5 250 300 100 Vin = AC100 V (50 Hz) RT = 33 kΩ CT = 220 pF 90 80 70 60 50 0 Input voltage Vin (V) 0.5 1 1.5 2 2.5 3 3.5 Load current IO (A) Control frequency vs. input voltage (Output voltage = 18 V) Control frequency fOSC (kHz) 300 RT = 33 kΩ CT = 220 pF 280 260 240 220 200 OUT = 0 A 180 160 OUT = 3 A 140 120 100 0 50 100 150 200 250 300 Input voltage Vin (V) 19 MB3873 ■ USAGE PRECAUTIONS 1. Never use settings exceeding maximum rated conditions. Exceeding maximum rated conditions may cause permanent damage to the LSI. Also, it is recommended that recommended operating conditions be observed in normal use. Exceeding recommended operating conditions may adversely affect LSI reliability. 2. Use this device within recommended operating conditions. Recommended operating conditions are values within which normal LSI operation is warranted. Standard electrical characteristics are warranted within the range of recommended operating conditions and within the listed conditions for each parameter. 3. Printed circuit board ground lines should be set up with consideration for common impedance. 4. Take appropriate static electricity measures. • • • • Containers for semiconductor materials should have anti-static protection or be made of conductive material. After mounting, printed circuit boards should be stored and shipped in conductive bags or containers. Work platforms, tools, and instruments should be properly grounded. Working personnel should be grounded with resistance of 250 kΩ to 1 MΩ between body and ground. ■ ORDERING INFORMATION Part number MB3873PF 20 Package 16-pin plastic SOP (FPT-16P-M06) Remarks MB3873 ■ PACKAGE DIMENSION 16-pin Plastic SOP (FPT-16P-M06) +0.25 2.25(.089)MAX (Mounting height) +.010 10.15 –0.20 .400 –.008 INDEX 0.05(.002)MIN (STAND OFF) 5.30±0.30 (.209±.012) +0.40 6.80 –0.20 7.80±0.40 (.307±.016) +.016 .268 –.008 "B" 1.27(.050) TYP 0.45±0.10 (.018±.004) +0.05 Ø0.13(.005) 0.15 –0.02 M +.002 .006 –.001 Details of "A" part Details of "B" part 0.40(.016) 0.15(.006) 0.20(.008) "A" 0.10(.004) 8.89(.350)REF C 0.50±0.20 (.020±.008) 0.20(.008) 0.18(.007)MAX 0.18(.007)MAX 0.68(.027)MAX 0.68(.027)MAX 1994 FUJITSU LIMITED F16015S-2C-4 Dimension in mm (inches) 21 MB3873 FUJITSU LIMITED For further information please contact: Japan FUJITSU LIMITED Corporate Global Business Support Division Electronic Devices KAWASAKI PLANT, 4-1-1, Kamikodanaka Nakahara-ku, Kawasaki-shi Kanagawa 211-8588, Japan Tel: 81(44) 754-3763 Fax: 81(44) 754-3329 http://www.fujitsu.co.jp/ North and South America FUJITSU MICROELECTRONICS, INC. Semiconductor Division 3545 North First Street San Jose, CA 95134-1804, USA Tel: (408) 922-9000 Fax: (408) 922-9179 Customer Response Center Mon. - Fri.: 7 am - 5 pm (PST) Tel: (800) 866-8608 Fax: (408) 922-9179 http://www.fujitsumicro.com/ Europe FUJITSU MIKROELEKTRONIK GmbH Am Siebenstein 6-10 D-63303 Dreieich-Buchschlag Germany Tel: (06103) 690-0 Fax: (06103) 690-122 http://www.fujitsu-ede.com/ Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE LTD #05-08, 151 Lorong Chuan New Tech Park Singapore 556741 Tel: (65) 281-0770 Fax: (65) 281-0220 http://www.fmap.com.sg/ F9906 FUJITSU LIMITED Printed in Japan All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. The information and circuit diagrams in this document are presented as examples of semiconductor device applications, and are not intended to be incorporated in devices for actual use. Also, FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of this information or circuit diagrams. FUJITSU semiconductor devices are intended for use in standard applications (computers, office automation and other office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.). CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with FUJITSU sales representatives before such use. The company will not be responsible for damages arising from such use without prior approval. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be required for export of those products from Japan.