FUJITSU MB54608B

FUJITSU SEMICONDUCTOR
DATA SHEET
DS04-23510-2E
ASSP
1.0 GHz band Low Power I/Q Modulator
For Direct Conversion
MB54608L/MB54608B
■ DESCRIPTION
The MB54608L/B is an I/Q Modulator for direct conversion method, and is used for up to 1.0 GHz band digital
cellular phones such as GSM, PDC and so on.
MB54608L consists of a frequency doubler, a Flip-flop type quadrature phase shifter, I/Q modulator and a mixer
for frequency offset with a separate power supply.
Fujitsu’s advanced Bipolar process has realized very low current operation(ICC = 16.5 mA @3 V).
SSOP-20 and BCC-16 package are available.(MB54608L: SSOP-20, MB54608B: BCC-16)
■ FEATURES
• Supporting GSM frequency band
Output frequency: 1.0 GHz (max.) Output power: –4 dBm(Typical, VBB = 1.0 Vp-p input)
• Low voltage operation: VCC = 2.6 V to 3.8 V
(Continued)
■ PACKAGES
20-pin plastic SSOP
16-pad plastic BCC
(FPT-20P-M03)
(LCC-16P-M04)
MB54608L/MB54608B
(Continued)
• Low current: Please refer to below table.
• Offset mixer on-chip: The separate power supply control is possible. (only MB54608L)
• Output power level switch (Mode) enables high power mode
Offset Mixer not used
Offset Mixer used
Mode = Open Mode = GND Mode = Open Mode = GND
Normal
operation
Icc
16.5 mA
19.0 mA
22.5 mA
25.0 mA
Pout(VBB=1.0 Vp–p)
–4 dBm
–2 dBm
–4 dBm
–2 dBm
Power down
Ips
0.22 mA
0.44 mA
Note:Typical values
Further increase of the output power is possible by attaching a resistor at Pcnt pin.
• Operating temperature range: Ta = –20 to +75°C
2
MB54608L/MB54608B
■ PIN ASSIGNMENTS
• MB54608L (SSOP-20)
(TOP VIEW)
RFin 1
20 Pcnt
GND 2
19 PSQ
IFin 3
18 Out
VCCM 4
17 PSM
16 VCC
LO 5
LOX 6
15 Mode
VCC 7
14 I
GND 8
13 XI
GND 9
12 XQ
GND 10
11 Q
(FPT-20P-M03)
• MB54608B (BBC-16)
(TOP VIEW)
XQ
1
XI
Q
GND
16
15
14
GND
2
13
VCC
I
3
12
LOX
Mode
4
11
LO
VCC
5
10
N.C.
Out
6
9
GND
7
8
PSQ N.C.
(LCC-16P-M04)
Note: MB54608B doesn’t have the off-set Mixer and Pcnt pin.
3
MB54608L/MB54608B
■ PIN DESCRIPTIONS
• MB54608L (SSOP-20)
4
Pin no.
Symbol
I/O
Descriptions
1
RFin
I
2
GND
—
3
IFin
I
4
VccM
—
Power supply for the offset mixer. Power-on/off is possible indepently to the
modulator. When the offset mixer is not used, this pin should be switched
OFF.
5
Lo
I/O
Lo input for the I/Q modulator (Output for the offset mixer.)
6
Lox
I/O
Lo complementary input for the I/Q modulator (Complementary output for
the offset mixer.)
7
Vcc
—
Power supply for the I/Q modulator.
8
GND
—
Ground.
9
GND
—
Ground.
10
GND
—
Ground.
11
Q
I
Q signal input for the I/Q modulator.
12
XQ
I
Q signal complementary input for the I/Q modulator.
13
XI
I
I signal complementary input for the I/Q modulator.
14
I
I
I signal input for the I/Q modulator.
15
Mode
—
Output mode switch. Mode = Open: Low power mode.
Mode = GND: High power mode.
This pin should be connected to ground or left open.
16
Vcc
—
Power supply for the I/Q modulator.
17
PSM
I
Power saving control for the offset mixer. When PSM = L(GND), power
down mode is selected. When the offset mixer is not used, this pin should
be connected to Vcc voltage level or ground.
18
Out
O
Output for the I/Q modulator. (Open collector)
Open is prohibited when power is supplied to Vcc pin.
19
PSQ
I
Power saving control for the I/Q modulator. When PSQ = L(GND), power
down mode is selected.
20
Pcnt
—
RF input for the offset mixer. When the offset mixer is not used, this pin
should be opened.
Ground.
IF input for the offset mixer. When the offset mixer is not used, this pin
should be opened.
Further, increasing the output power level is possible by attaching a resistor
between Pcnt pin and ground externally.
MB54608L/MB54608B
• MB54608B (BCC-16)
Pin no.
Pin nane
I/O
Descriptions
1
XQ
I
Q signal complementary input for the I/Q modulator.
2
XI
I
I signal complementary input for the I/Q modulator.
3
I
I
I signal input for the I/Q modulator.
4
Mode
—
Output mode switch. Mode=Open: Low power mode.
Mode=GND: High power mode.
This pin should be connected to ground or left open.
5
Vcc
—
Power supply for the I/Q modulator.
6
Out
O
Output for the I/Q modulator. (Open collector)
Open is prohibited when power is supplied to Vcc pin.
7
PSQ
I
Power saving control for the I/Q modulator. When PSQ = L(GND), power
down mode is selected.
8
N.C.
—
No connection.
9
GND
—
Ground.
10
N.C.
—
No connection.
11
Lo
I/O
Lo input for the I/Q modulator (Output for the offset mixer.)
12
Lox
I/O
Lo complementary input for the I/Q modulator (Complementary output for
the offset mixer.)
13
Vcc
—
Power supply for the I/Q modulator.
14
GND
—
Ground.
15
GND
—
Ground.
16
Q
I
Q signal input for the I/Q modulator.
5
MB54608L/MB54608B
■ BLOCK DIAGRAM
VCCM
PSM
Offset Mixer
LO
I
XI
PSQ
VCC
I/Q Modulator
0°
×2
RFin
φ 1/2
Σ
−90°
Out
Pcnt
Mode
IFin
LOX
GND
Q
XQ
Note: MB54608B doesn’t have VCCM, PSM, RFin, IFin and Pcnt pins.
6
MB54608L/MB54608B
■ ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Rating
Min.
Max.
Unit
Power supply voltage
VCC
–0.5
+5.0
V
Output voltage
VO
–0.5
VCC + 0.5 (<5.0)
V
Input voltage
VI
–0.5
VCC + 0.5 (<5.0)
V
VOC
VCC – 0.3
(–0.5)
VCC + 0.3
(5.0)
V
IO
0
+10
mA
Tstg
–55
+125
°C
Allowed voltage on the open
collector pin
Output current
Storage temperature
Remarks
Out pin,
Open is prohibited.
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
■ RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Value
Unit
Remarks
Min.
Typ.
Max.
VCC
2.6
3.0
3.8
V
VI
GND
—
VCC
V
Allowed voltage on the open
collector pin
VOC
VCC – 0.2
—
VCC + 0.2
V
Out pin.
Open is prohibited.
Operating temperature
Ta
–20
—
+75
V
Ambient temperature.
Power supply voltage
Input voltage
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
7
MB54608L/MB54608B
■ ELECTRICAL CHARACTERISTICS
1. DC CHARACTERISTICS (MB54608L, MB54608B)
(Ta = +25°C, VCC = 3.0 V)
Parameter
Power supply current
Power down current
Power down pin input voltage
Power down pin input current
Pcnt pin load resistance
Symbol
Value
Min.
Typ.
Max.
Unit
Remarks
Offset
mix.
Mode pin
12.0
16.5
24.5
mA
Not used
Open
13.5
19.0
28.0
mA
Not used
GND
16.0
22.5
33.5
mA
Used
Open
18.0
25.0
37.0
mA
Used
GND
—
220
310
µA
Not used
—
440
620
µA
Used
Don’t
care
VIHPS
VCC × 0.7
—
—
V
VILPS
—
—
VCC × 0.3
V
IIHPS
—
—
5.0
µA
VIH = VCC
IILPS
–50
—
—
µA
VIL = GND
Rcnt
50
—
—
Ω
ICC
IPS
DC.
No AC
signal
input.
PSM,
PSQ
Value
Note: MB54608B doesn’t have Offset mix., so please refer to “offset mix. = Not used” column in regard to power
supply current.
8
MB54608L/MB54608B
2. AC CHARACTERISTICS
• A case of the offset mixer is used. (only MB54608L)
(Ta = +25°C, VCC = 3.0 V)
Parameter
Baseband
input
Min.
Typ.
Max.
Unit
Remarks
fBB
DC
—
10
MHz
Input amplitude
VBB
0.3
1.0
1.3
Vp-p Single ended input
Offset voltage
VOS
1.4
1.5
1.6
V
Offset current
IOS
—
3.0
4.0
µA
fRF
—
1078.5
1100
MHz
fIF
—
130.5
500
MHz
fLO
800
948
1000
MHz Output
Input power
level
PRF
–15
–10
0
dBm
PIF
–15
–10
0
dBm
Operating band
fOUT
800
948
1000
MHz
–8
–4
–
dBm
Mode pin is
opened
–6
–2
–
dBm
Mode pin is
grounded
Offset Mixer
Modulation
accuracy
Value
Operating band
Operating band
RF output
Symbol
External offset voltage
SSB output
power level
POUT
Amplitude error
AERR
—
2.0
3.0
%
RMS value
Phase error
PERR
—
1.5
2.0
deg.
RMS value
Vector error
VERR
—
3.0
4.0
%
RMS value
External
offset.
No offset
adjustment.
Carrier suppression
CS
—
–35
–27
dBc
Image rejection
IR
—
–40
–28
dBc
Adjucent channel power
ACP
—
–65
–60
dB
IF × 7 spurious
IF × 7
—
–65
–60
dBc
VBB = 1.0 Vp-p
(single ended
input)
fRF = 1078.5 MHz
PRF = –10 dBm
fIF = 130.5 MHz
PIF = –10 dBm
fOUT = 948 MHz
∆f = 50 kHz
9
MB54608L/MB54608B
• A case of the offset mixer is not used. (MB54608L, MB54608B)
(Ta = +25°C, VCC = 3.0 V)
Parameter
Baseband
input
Lo input
RF output
Modulation
accuracy
Symbol
Value
Min.
Typ.
Max.
Unit
Remarks
Operating band
fBB
DC
—
10
MHz
Input amplitude
VBB
0.3
1.0
1.3
Vp-p Single ended input
Offset voltage
VOS
1.4
1.5
1.6
V
Offset current
IOS
—
3.0
4.0
µA
Operating band
fLO
800
948
1000
Input power
PLO
–15
–10
0
dBm
Operating band
fOUT
800
948
1000
MHz
–8
–4
—
dBm
Mode pin is
opened
–6
–2
—
dBm
Mode pin is
grounded
External offset voltage
MHz Differential input with balun.
SSB output
power level
POUT
Amplitude error
AERR
—
2.0
3.0
%
RMS value
Phase error
PERR
—
1.5
2.0
deg.
RMS value
Vector error
VERR
—
3.0
4.0
%
RMS value
External
offset.
No offset
ajustment.
Carrier suppression
CS
—
–35
–27
dBc
Image rejection
IR
—
–40
–28
dBc
ACP
—
–65
–60
dB
Adjucent channel power
VBB = 1.0 Vp-p
(single ended
input)
fLO = 948 MHz
PLO = –10 dBm
(Differential input
with balun).
∆f = 50 kHz
Notes: • Spec. of MB54608B is identical with MB54608L.
• When the offset mixer is not used, using a differential balun is recommended for input. (When the balun
is not used, the changing carrier suppression may happen depending on the timing of powering up.)
10
MB54608L/MB54608B
■ APPLICATION EXAMPLE (MB54608L)
1) A case of the offset mixer is used.
Output
15 nH
10 pF
0.1 µF
18 nH
Vbi I Vbix
Open
VCC
Pcnt
VCC
PSQ
20
19
Out
PSM
18
17
100 µF
1 kΩ
Mode
VCC
16
100 µF
15
Vbqx Q Vbq
100 µF
1 kΩ
I
1 kΩ
XQ
XI
100 µF
1 kΩ
Q
14
13
12
11
7
8
9
10
MB54608L
1
2
fRF = 1078.5 MHz
3
RFin
4
GND
IFin
5
6
LO
3.9 nH
VCCM
LOX
GND
VCC
GND
GND
S.G. 1000 pF
3.0 V
fRF = 130.5 MHz
1.5-5 pF
S.G.100 pF
0.1 µF
0.1 µF
2) A case of the offset mixer is not used.
Output
15 nH
0.1 µF
18 nH
10 pF
Vbi I Vbix
Open
VCC
Pcnt
20
VCC
PSQ
19
Out
18
PSM
17
15
100 µF
100 µF
1 kΩ
1 kΩ
Mode
VCC
16
100 µF
Vbqx Q Vbq
I
14
100 µF
1 kΩ
XQ
XI
1 kΩ
Q
13
12
11
8
9
10
MB54608L
1
2
RFin
3
GND
4
IFin
5
VCCM
100 pF
LDB25C201A0950
fLO = 948 MHz
S.G.
6
LO
7
LOX
100 pF
VCC
GND
GND
GND
3.0 V
0.1 µF
Note: LDB25C201A0950: Murata Mfg. Co., Ltd.
(Continued)
11
MB54608L/MB54608B
(Continued)
(MB54608L)
VCC = 3.0 V
0.1 µF
fLO = 948 MHz
100 pF
100 pF
14
13
12
11
10
9
GND
VCC
LOX
LO
N.C.
GND
15
N.C. 8
GND
MB54608B
16
Q
Vbq
PSQ 7
Q
100 µF
XI
XQ
1 kΩ
1
Out
5
6
1 kΩ
Vbix I Vbi
22 nH
0.1 µF
Open
1 kΩ
4
VCC
30 pF
100 µF
Vbqx
Mode
3
100 µF
100 µF
1 kΩ
2
I
Output
18 nH
■ ORDERING INFORMATION
Part number
12
Package
Remarks
MB54608L PFV
20-pin, Plastic SSOP
(FPT-20P-M03)
MB54608L
MB54608L PV1
16-pad, Plastic BCC
(LCC-16P-M04)
MB54608B
MB54608L/MB54608B
■ PACKAGE DIMENSION
Note 1) *:This dimension does not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
20-pin Plastic SSOP
(FPT-20P-M03)
* 6.50±0.10(.256±.004)
0.17±0.03
(.007±.001)
20
11
* 4.40±0.10
6.40±0.20
(.173±.004) (.252±.008)
INDEX
Details of "A" part
+0.20
1.25 –0.10
+.008
.049 –.004
LEAD No.
1
10
0.65(.026)
"A"
0.24±0.08
(.009±.003)
0.10(.004)
C
(Mounting height)
1999 FUJITSU LIMITED F20012S-3C-5
0.13(.005)
M
0~8°
0.50±0.20
(.020±.008)
0.45/0.75
(.018/.030)
0.10±0.10
(Stand off)
(.004±.004)
0.25(.010)
Dimensions in mm (inches)
(Continued)
13
MB54608L/MB54608B
(Continued)
16-pad Plastic BCC
(LCC-16P-M04)
4.55±0.10
(.179±.004)
0.80(.031)MAX
Mounting height
3.40(.134)TYP
0.65(.026)
TYP
14
9
0.325±0.10
(.013±.004)
9
14
0.80(.031)
REF
INDEX AREA
4.20±0.10
(.165±.004)
3.25(.128)
TYP
"A"
0.40±0.10
(.016±.004)
1
6
0.075±0.025
(.003±.001)
(Stand off)
6
Details of "A" part
0.75±0.10
(.030±.004)
1.55(.061)
REF
"B"
1.725(.068)
REF
1
Details of "B" part
0.60±0.10
(.024±.004)
0.05(.002)
0.40±0.10
(.016±.004)
C
14
1999 FUJITSU LIMITED C16015S-1C-1
0.60±0.10
(.024±.004)
Dimensions in mm (inches)
MB54608L/MB54608B
FUJITSU LIMITED
For further information please contact:
Japan
FUJITSU LIMITED
Corporate Global Business Support Division
Electronic Devices
KAWASAKI PLANT, 4-1-1, Kamikodanaka,
Nakahara-ku, Kawasaki-shi,
Kanagawa 211-8588, Japan
Tel: +81-44-754-3763
Fax: +81-44-754-3329
http://www.fujitsu.co.jp/
North and South America
FUJITSU MICROELECTRONICS, INC.
3545 North First Street,
San Jose, CA 95134-1804, USA
Tel: +1-408-922-9000
Fax: +1-408-922-9179
Customer Response Center
Mon. - Fri.: 7 am - 5 pm (PST)
Tel: +1-800-866-8608
Fax: +1-408-922-9179
http://www.fujitsumicro.com/
Europe
FUJITSU MICROELECTRONICS EUROPE GmbH
Am Siebenstein 6-10,
D-63303 Dreieich-Buchschlag,
Germany
Tel: +49-6103-690-0
Fax: +49-6103-690-122
http://www.fujitsu-fme.com/
Asia Pacific
FUJITSU MICROELECTRONICS ASIA PTE LTD
#05-08, 151 Lorong Chuan,
New Tech Park,
Singapore 556741
Tel: +65-281-0770
Fax: +65-281-0220
http://www.fmap.com.sg/
F0001
 FUJITSU LIMITED Printed in Japan
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The contents of this document are subject to change without
notice.
Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information and circuit diagrams in this document are
presented as examples of semiconductor device applications,
and are not intended to be incorporated in devices for actual use.
Also, FUJITSU is unable to assume responsibility for
infringement of any patent rights or other rights of third parties
arising from the use of this information or circuit diagrams.
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without the permission of FUJITSU LIMITED.
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responsible for damages arising from such use without prior
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