TI CC3000MOD Simplelink wi-fi cc3000 module from texas instrument Datasheet

CC3000
www.ti.com
SWRS127 – OCTOBER 2012
SimpleLink™ Wi-Fi® CC3000 Module from Texas Instruments
FEATURES
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Wireless Network Processor
– IEEE 802.11 b/g
– Embedded IPv4 TCP/IP Stack
Best-in-class Radio Performance:
– Tx Power: +18dBm at 11Mbps, CCK
– Rx Sensitivity: –86dBm, 8% PER, 11Mbps
Works with low MIPS, Low Cost
Microcontrollers with Compact Memory
Footprint:
– 2KBytes Flash
– 250Bytes RAM
FCC, IC and CE Certified with Chip Antenna
HW Design Files and Design Guide Available
from TI
Integrated Crystal and Power Management
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Small Form Factor
16.3mm x 13.5mm x 2mm
Operating Temperature Range:
–20°C to 70°C
Based in TI's 7th Generation of Proven Wi-Fi
Solutions
Complete Platform Solution Including User
and Porting Guides, API Guide, Sample
Applications, and Support Community
APPLICATIONS
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Home Automation
Home Security
Connected Appliances
Smart Energy
M2M Communication
DESCRIPTION
The CC3000 is a self-contained wireless network processor that simplifies the process of implementing Internet
connectivity. SimpleLink™ Wi-Fi minimizes host microcontroller (MCU) software requirements making it the ideal
solution for embedded applications using any low-cost and low-power MCU.
The CC3000 is provided as a module by TI to reduce development time, lower manufacturing costs, save board
space, ease certification and minimize RF expertise required. Additionally, it is provided as a complete platform
solution including software drivers, sample applications, API guide, user documentation and a world-class
support community.
More information on TI’s wireless platform solutions for Wi-Fi can be found on TI's Wireless Connectivity Wiki
(www.ti.com/connectivitywiki).
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCT PREVIEW information concerns products in the
formative or design phase of development. Characteristic data and
other specifications are design goals. Texas Instruments reserves
the right to change or discontinue these products without notice.
Copyright © 2012, Texas Instruments Incorporated
PRODUCT PREVIEW
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PACKAGE OPTION ADDENDUM
www.ti.com
8-May-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
CC3000MOD
ACTIVE
46
84
TBD
Call TI
Call TI
-20 to 70
CC3000MODR
ACTIVE
46
1200
TBD
Call TI
Call TI
-20 to 70
XCC3000MOD
PREVIEW
46
TBD
Call TI
Call TI
-20 to 70
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
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