CMS08 TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type CMS08 Switching Mode Power Supply Applications Portable Equipment Battery Applications · · · · Unit: mm Forward voltage: VFM = 0.37 V (max) Average forward current: IF (AV) = 1.0 A Repetitive peak reverse voltage: VRRM = 30 V Suitable for compact assembly due to small surface-mount package “M−FLATTM” (Toshiba package name) Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit VRRM 30 V IF (AV) (Note) 1.0 (Ta = 51°C) A IF (AV) 1.0 (Tℓ = 106°C) A IFSM 25 (50 Hz) A Junction temperature Tj -40~125 °C Storage temperature Tstg -40~150 °C Repetitive peak reverse voltage Average forward current Peak one cycle surge forward current (non-repetitive) Note: Device mounted on a ceramic board (board size: 50 mm ´ 50 mm, soldering land: 2 mm ´ 2 mm) JEDEC ― JEITA ― TOSHIBA 3-4E1A Weight: 0.023 g (typ.) Electrical Characteristics (Ta = 25°C) Characteristics Peak forward voltage Repetitive peak reverse current Junction capacitance Thermal resistance Thermal resistance Symbol Test Condition Min Typ. Max VFM (1) IFM = 0.1 A ¾ 0.23 ¾ VFM (2) IFM = 0.5 A ¾ 0.29 ¾ VFM (3) IFM = 1.0 A ¾ 0.32 0.37 IRRM VRRM = 5 V ¾ 0.04 ¾ IRRM VRRM = 30 V ¾ 0.38 1.5 VR = 10 V, f = 1.0 MHz ¾ 70 ¾ Device mounted on a ceramic board (soldering land: 2 mm ´ 2 mm) ¾ ¾ 60 Device mounted on a glass-epoxy board (soldering land: 6 mm ´ 6 mm) ¾ ¾ 135 ¾ ¾ 16 Cj Rth (j-a) ¾ Rth (j-ℓ) 1 Unit V mA pF °C/W °C/W 2003-02-17 CMS08 Marking Following Indicates the Data of Manufacture Type code Lot No. S8 Cathode mark Month of manufacture January to December are denoted by letter A to L repectively. Year of manufacture Last decimal digit of the year of manufacture 0 1 2 3 4 5 6 7 8 9 Standard Soldering Pad 2.1 Unit: mm 1.4 3.0 1.4 Handling Precaution Schottky barrier diodes are having large-reverse-current-leakage characteristic compare to the other rectifier products. This current leakage and improper operating temperature or voltage may cause thermal runaway. Please take forward and reverse loss into consideration when you design. 2 2003-02-17 CMS08 iF – vF PF (AV) – IF (AV) 05 125°C 1 75°C 25°C 0.1 0 0.1 02 03 0.4 05 Instantaneous forward voltage 0.7 vF (V) 120 Rectangular waveform a = 120° 20 0.2 0.4 06 0.8 Average forward current 10 12 IF (AV) 1.4 a = 60° 02 0.1 0.2 0.4 06 0.8 10 12 IF (AV) 1.4 16 (A) DC 120 100 Rectangular waveform a = 120° 60 40 0° a 360° IF (AV) 20 Conduction angle: a VR = 15 V 0 0 16 a = 180° a = 60° 80 0.2 (A) 0.4 06 0.8 Average forward current 10 12 IF (AV) 1.4 16 (A) (°C/W) rth (j-a) – t rth (j-a) 0 0 0° a 360° IF (AV) Conduction angle: a VR = 15 V a = 60° 03 a = 180° a = 120° Tℓ max – IF (AV) 60 40 0° a 360° Conduction angle: a 140 100 a = 180° DC 0.4 Average forward current DC 80 Rectangular waveform 0 0 08 Ta max – IF (AV) Device mounted on a ceramic board (board size: 50 mm ´ 50 mm) Transient thermal impedance Maximum allowable ambient temperature Ta max (°C) 140 06 Maximum allowable lead temperature Tℓ max (°C) Instantaneous forward current iF Average forward power dissipation PF (AV) (W) (A) 10 500 Device mounted on a glass-epoxy board Soldering land: 2.1 mm ´ 1.4 mm 100 Device mounted on a glass-epoxy board Soldering land: 6 0 mm ´ 6.0 mm 10 Device mounted on a ceramic board Soldering land: 2 0 mm ´ 2.0 mm 1 05 0 001 0.01 0.1 1 10 100 1000 Time t (s) 3 2003-02-17 CMS08 Cj – VR Surge forward current (non-repetitive) Ta = 25°C f = 50 Hz f = 1 MHz Ta = 25°C (pF) 24 (typ.) 1000 Cj 20 16 Junction capacitance Peak surge forward current IFSM (A) 28 12 8 4 0 1 10 100 100 10 1 Number of cycles 10 100 Reverse voltage VR I R – Tj (typ.) 1000 PR (AV) – VR 10 VR = 20 V VR = 15 V 1 VR = 10 V VR = 5 V VR = 3 V 0.1 Average reverse power dissipation PR (AV) (W) Reverse current IR (mA) 36 VR = 30 V (typ.) 40 Pulse test 100 (V) 32 28 2.4 20 Rectangular waveform 360° 0° VR DC 300° a Conduction angle: a Tj = 125°C 240° 180° 16 120° 12 60° 08 0.4 0.01 0 20 40 60 80 100 Junction temperature Tj 120 0 0 140 (°C) 10 20 Reverse voltage VR 4 30 (V) 2003-02-17 CMS08 RESTRICTIONS ON PRODUCT USE 000707EAA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 5 2003-02-17