AD HMC311LP3E Ingap hbt gain block mmic amplifier, dc - 6 ghz Datasheet

HMC311LP3 / 311LP3E
v06.0617
DRIVER & GAIN BLOCK AMPLIFIERS - SMT
InGaP HBT GAIN BLOCK
MMIC AMPLIFIER, DC - 6 GHz
Typical Applications
Features
The HMC311LP3(E) is ideal for:
P1dB Output Power: +15.5 dBm
• Cellular / PCS / 3G
Output IP3: +32 dBm
• Fixed Wireless & WLAN
Gain: 14.5 dB
• CATV & Cable Modem
50 Ohm I/O’s
• Microwave Radio
16 Lead 3x3mm SMT Package: 9mm2
Functional Diagram
General Description
The HMC311LP3(E) is a GaAs InGaP Heterojunction
Bipolar Transistor (HBT) Gain Block MMIC
SMT DC to 6 GHz ampliiers. This 3x3mm
QFN packaged ampliier can be used as either a
cascadable 50 Ohm gain stage or to drive the LO of
HMC mixers with up to +17 dBm output power. The
HMC311LP3(E) offers 14.5 dB of gain and an output
IP3 of +32 dBm while requiring only 56 mA from a
+5V supply. The Darlington feedback pair used results
in reduced sensitivity to normal process variations
and yields excellent gain stability over temperature
while requiring a minimal number of external bias
components.
Electrical Speciications, Vs= 5V, Rbias= 22 Ohm, TA = +25° C
Parameter
Min.
Typ.
13.0
12.5
12.0
14.5
14.3
14.0
Max.
Units
Gain
DC - 1.0 GHz
1.0 - 4.0 GHz
4.0 - 6.0 GHz
Gain Variation Over Temperature
DC - 2.0 GHz
2.0 - 4.0 GHz
4.0 - 6.0 GHz
0.005
0.008
0.012
Return Loss Input / Output
DC - 1.0 GHz
1.0 - 3.0 GHz
3.0 - 6.0 GHz
13
11
15
dB
dB
dB
DC - 6 GHz
18
dB
15.5
15.0
13.0
dBm
dBm
dBm
Reverse Isolation
0.008
0.012
0.016
dB/ °C
dB/ °C
dB/ °C
Output Power for 1 dB Compression (P1dB)
DC - 2.0 GHz
2.0 - 4.0 GHz
4.0 - 6.0 GHz
Output Third Order Intercept (IP3)
DC - 1.0 GHz
1.0 - 2.0 GHz
2.0 - 4.0 GHz
4.0 - 6.0 GHz
32
30
28
24
dBm
dBm
dBm
dBm
DC - 6 GHz
4.5
dB
Noise Figure
Supply Current (Icq)
13.5
12.0
10.0
dB
dB
dB
55
74
mA
Note: Data taken with broadband bias tee on device output.
1
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Speciications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
HMC311LP3 / 311LP3E
v06.0617
InGaP HBT GAIN BLOCK
MMIC AMPLIFIER, DC - 6 GHz
Gain vs. Temperature
20
10
5
GAIN (dB)
RESPONSE (dB)
15
0
-5
-10
-15
-20
-25
0
1
2
3
4
5
6
7
8
9
FREQUENCY (GHz)
S21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
0
S11
1
2
3
S22
4
5
+25 C
Input Return Loss vs. Temperature
7
8
+85 C
-40 C
Output Return Loss vs. Temperature
0
OUTPUT RETURN LOSS (dB)
0
INPUT RETURN LOSS (dB)
6
FREQUENCY (GHz)
-5
-10
-15
-5
-10
-15
-20
-20
0
1
2
3
4
5
6
7
0
8
1
2
3
+25 C
4
5
6
7
8
FREQUENCY (GHz)
FREQUENCY (GHz)
+85 C
+25 C
-40 C
Reverse Isolation vs. Temperature
+85 C
-40 C
DRIVER & GAIN BLOCK AMPLIFIERS - SMT
Gain & Return Loss
Noise Figure vs. Temperature
0
10
8
NOISE FIGURE (dB)
REVERSE ISOLATION (dB)
9
-5
-10
-15
-20
7
6
5
4
3
2
1
-25
0
0
1
2
3
4
5
6
7
8
1
2
3
FREQUENCY (GHz)
+25 C
+85 C
4
5
6
7
8
FREQUENCY (GHz)
-40 C
+25 C
+85 C
-40 C
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
2
HMC311LP3 / 311LP3E
v06.0617
InGaP HBT GAIN BLOCK
MMIC AMPLIFIER, DC - 6 GHz
20
20
18
18
16
16
14
14
Psat (dBm)
P1dB (dBm)
Psat vs. Temperature
12
10
8
12
10
8
6
6
4
4
2
2
0
0
0
1
2
3
4
5
6
7
8
0
1
2
3
FREQUENCY (GHz)
+25 C
+85 C
-40 C
-6
-4
-2
0
2
4
6
8
Gain
24
22
20
18
16
14
12
10
5
6
7
FREQUENCY (GHz)
+25 C
+85 C
-40 C
-4
-2
0
2
4
6
Gain
PAE
-40 C
8
80
40
35
60
30
25
40
20
15
Icq (mA)
IP3 (dBm)
26
GAIN (dB), P1dB (dBm), Psat (dBm), OIP3 (dBm)
28
4
8
Gain, Power, Output IP3 & Supply Current
vs. Supply Voltage @ 1 GHz
30
3
-6
Pout
32
2
+85 C
20
18
16
14
12
10
8
6
4
2
0
-2
-4
-6
-8
-10
-20 -18 -16 -14 -12 -10 -8
PAE
34
1
7
INPUT POWER (dBm)
Output IP3 vs. Temperature
0
6
Power Compression @ 6 GHz
INPUT POWER (dBm)
Pout
5
+25 C
Pout (dBm), GAIN (dB), PAE (%)
20
18
16
14
12
10
8
6
4
2
0
-2
-4
-6
-8
-10
-20 -18 -16 -14 -12 -10 -8
4
FREQUENCY (GHz)
Power Compression @ 1 GHz
Pout (dBm), GAIN (dB), PAE (%)
DRIVER & GAIN BLOCK AMPLIFIERS - SMT
P1dB vs. Temperature
20
10
5
0
4.5
0
4.75
5
Vs(Vdc)
5.25
Gain
P1dB
5.5
Psat
OIP3
Icq
3
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
HMC311LP3 / 311LP3E
v06.0617
InGaP HBT GAIN BLOCK
MMIC AMPLIFIER, DC - 6 GHz
Collector Bias Voltage (Vcc)
+7V
RF Input Power (RFIN)(Vs = +5V)
+10 dBm
Junction Temperature
150 °C
Continuous Pdiss (T = 85 °C)
(derate 5.21 mW/°C above 85 °C)
0.339 W
Thermal Resistance
(junction to ground paddle)
192 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
ESD Sensitivity (HBM)
Class 1A,
Passed 250V
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
DRIVER & GAIN BLOCK AMPLIFIERS - SMT
Absolute Maximum Ratings
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Package Information
Part Number
Package Body Material
Lead Finish
MSL Rating
HMC311LP3
Low Stress Injection Molded Plastic
Sn/Pb Solder
MSL1
HMC311LP3E
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
MSL1
Package Marking [3]
[1]
311
XXXX
[2]
311
XXXX
[1] Max peak relow temperature of 235 °C
[2] Max peak relow temperature of 260 °C
[3] 4-Digit lot number XXXX
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
4
HMC311LP3 / 311LP3E
v06.0617
InGaP HBT GAIN BLOCK
MMIC AMPLIFIER, DC - 6 GHz
DRIVER & GAIN BLOCK AMPLIFIERS - SMT
Pin Descriptions
Pin Number
Function
Description
1, 2, 4 - 9,
11 - 16
Interface Schematic
N/C
This pin may be connected to RF ground.
3
RFIN
This pin is DC coupled.
An off chip DC blocking capacitor is required.
10
RFOUT
RF output and DC Bias for the output stage.
GND
Package bottom must be connected to RF/DC ground.
Application Circuit
Note:
1. Select Rbias to achieve Icq using equation below,
Rbias > 22 Ohm.
2. External blocking capacitors are required on
RFIN and RFOUT.
Icq = Vs - 3.8
Rbias
Recommended Component Values
Component
5
Frequency (MHz)
50
900
1900
2200
2400
3500
5200
5800
L1
270 nH
56 nH
18 nH
18 nH
15 nH
8.2 nH
3.3 nH
3.3 nH
C1, C2
0.01 µF
100 pF
100 pF
100 pF
100 pF
100 pF
100 pF
100 pF
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
HMC311LP3 / 311LP3E
v06.0617
InGaP HBT GAIN BLOCK
MMIC AMPLIFIER, DC - 6 GHz
DRIVER & GAIN BLOCK AMPLIFIERS - SMT
Evaluation PCB
J3
Pin Number
Description
1, 2, 3
Vs
4, 5, 6
GND
List of Materials for Evaluation PCB 106789
Item
Description
J1 - J2
PC Mount SMA Connector
J3
2 mm DC Header
C1, C2
Capacitor, 0402 Pkg.
C3
10,000 pF Capacitor, 0805 Pkg.
R1
22 Ohm Resistor, 0805 Pkg.
L1
Inductor, 0805 Pkg.
U1
HMC311LP3 / HMC311LP3E
PCB [2]
106493 Evaluation PCB
[1] Reference this number when ordering complete evaluation PCB
[1]
The circuit board used in the inal application
should use RF circuit design techniques. Signal
lines should have 50 Ohm impedance while the
package ground leads and exposed paddle should
be connected directly to the ground plane similar to
that shown. A sufficient number of via holes should
be used to connect the top and bottom ground
planes. The evaluation board should be mounted
to an appropriate heat sink. The evaluation circuit
board shown is available from Hittite upon request.
[2] Circuit Board Material: Rogers 4350
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
6
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