UMS CHX2090-QDG 12-24ghz frequency multiplier Datasheet

CHX2090-QDG
RoHS COMPLIANT
12-24GHz Frequency Multiplier
GaAs Monolithic Microwave IC in SMD leadless package
Description
The CHX2090-QDG is a cascadable
frequency doubler monolithic circuit, which
integrate an output buffer amplifier that
produces a constant output power over a
range of input powers. It is designed for a
wide range of applications, from military to
commercial communication systems.
The circuit is manufactured with a pHEMT
process, 0.25µm gate length, via holes
through the substrate, air bridges and
electron beam gate lithography.
It is supplied in RoHS compliant SMD
package.
typical measurements
Main Features
■ Broadband performances: 11-13GHz
■ 13dBm output power for +14dBm input
power
■ DC bias: Vd=3.5Volt@Id=65mA
■ 24L-QFN4x4 SMD package
Main Characteristics
Tamb. = 25°C
Symbol
Fin
Parameter
Min
Typ
Max
Unit
Input frequency range
11
13
GHz
Fout
Output frequency range
22
26
GHz
Pin
Input power
14
dBm
Output power for +14dBm input power
13
dBm
Pout
ESD Protection: Electrostatic discharge sensitive device. Observe handling precautions!
Ref. : DSCHX2090QDG0211 - 30 Jul 2010
1/10
Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Route Départementale 128 - BP46 - 91401 Orsay Cedex France
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
12-24GHz Frequency Multiplier
CHX2090-QDG
Electrical Characteristics
Tamb = +25°C, Vd = 3.5V, Vg1 = -0.9V, Vg2 tuned for Id=65mA.
Symbol
Parameter
Fin
Min
Typ
Max
Unit
Input frequency range
11
13
GHz
Fout
Output frequency range
22
26
GHz
Pin
Input power
Pout 2Fin 2Fin Output power for (11 < Fin < 12GHz)
for Fin = 13GHz
Is/Fin
Fin level at the output for (11 < Fin < 12)
for Fin = 13GHz
Is/3Fin
3Fin level at the output
VSWRin
14
dBm
12
dBm
9
dBm
-10
dBm
0
dBm
-15
dBm
Input VSWR
2.0:1
VSWRout Output VSWR
2.5:1
Vd
Drain voltage
3.5
Id
Bias current
65
V
75
mA
Absolute Maximum Ratings
Tamb.= 25°C
(1)
Symbol
Parameter
Values
Unit
Vd
Drain bias voltage
5V
V
Id
Drain bias current
120
mA
Vg
Gate bias voltage
-2 to +0.4
V
Tj
Junction temperature (2)
175
°C
Ta
Operating temperature range
-40 to +85
°C
Storage temperature range
-55 to +155
°C
Tstg
(1) Operation of this device above anyone of these parameters may cause permanent damage.
(2) Thermal Resistance channel to ground paddle =249°C/W for Tamb. = +85°C with 3.5V & 65mA.
Ref. : DSCHX2090QDG0211 - 30 Jul 2010
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Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
Specifications subject to change without notice
12-24GHz Frequency Multiplier
CHX2090-QDG
Typical Measured performances
Measurements in the connector access planes, using the proposed land pattern & board
96270.
Bias conditions : Vd = 3,5V, Vg1 = -0.9V, Vg2 tuned for Id# 65mA.
Pout (2Fin) & Pout (Fin) vs Fin for Pin=14 dBm
Pout 2Fin
Pout Fin
Pout (2Fin) & Pout (3Fin) vs Fin for Pin=14 dBm
Pout 2Fin
Pout 3Fin
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Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
Specifications subject to change without notice
12-24GHz Frequency Multiplier
CHX2090-QDG
Pout (2Fin) & Pout (Fin) vs Vg1 for Fin = 12 GHz, Pin=14dBm & Vg2= -0,7V
Pout 2Fin
Pout Fin
Pout (2Fin) & Pout (Fin) vs Vg2 for Fin = 12 GHz, Pin=14dBm & Vg1= -0,9V
Pout 2Fin
Pout Fin
Ref. : DSCHX2090QDG0211 - 30 Jul 2010
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Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
Specifications subject to change without notice
12-24GHz Frequency Multiplier
CHX2090-QDG
CHX2090-QDG
Drain current versus Vg2, for Fin=12GHz, Pin=14dBm, Vd=3.5V and Vg1=-0.9V
75
70
Id (mA)
65
60
55
50
45
40
-0.8
-0.7
-0.6
-0.5
-0.4
-0.3
-0.2
Vg2 (Volt)
Ref. : DSCHX2090QDG0211 - 30 Jul 2010
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Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
Specifications subject to change without notice
12-24GHz Frequency Multiplier
CHX2090-QDG
Package outline
Matt tin, Lead Free
(Green)
1-
NC
13-
NC
Units
mm
2-
NC
14-
GND
From the standard
JEDEC MO-220
3-
GND
15-
RF OUT
Pin 25 (paddle)
GND
4-
RF IN
16-
GND
5-
GND
17-
NC
6-
NC
18-
NC
7-
NC
19-
NC
8-
NC
20-
Vd
9-
NC
21-
NC
10-
NC
22-
Vg2
11-
NC
23-
Vg1
12-
NC
24-
NC
Ref. : DSCHX2090QDG0211 - 30 Jul 2010
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Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
Specifications subject to change without notice
12-24GHz Frequency Multiplier
CHX2090-QDG
Application note
The design of the motherboard has a strong impact on the over all performance since the
transition from the motherboard to the package is comparably large. In case of the SMD type
packages of United Monolithic Semiconductors the motherboard should be designed
according to the information given in the following to achieve good performance. Other
configurations are also possible but can lead to different results. If you need advise please
contact United Monolithic Semiconductors for further information.
SMD type packages of UMS should allow design and fabrication of micro- and mm-wave
modules at low cost. Therefore, a suitable motherboard environment has been chosen. All
tests and verifications have been performed on Rogers RO4003. This material exhibits a
permittivity of 3.38 and has been used with a thickness of 200µm [8 mils] and a 1/2oz or less
copper cladding. The corresponding 50Ohm transmission line has a strip width of about
460µm [approx. 18 mils].
The contact areas on the motherboard for the package connections should be designed
according to the footprint given above. The proper via structure under the ground pad is very
important in order to achieve a good RF and lifetime performance. All tests have been done
by using a grid of plenty plated through vias with a diameter of less than 300µm [12 mils] and
a spacing of less than 700µm [28 mils] from the centres of two adjacent vias. The via grid
should cover the whole space under the ground pad and the vias closest to the RF ports
should be located near the edge of the pad to allow a good RF ground connection. Since the
vias are important for heat transfer, a proper via filling should be guaranteed during the
mounting procedure to get a low thermal resistance between package and heat sink. For
power devices the use of heat slugs in the motherboard instead of a grid of via’s is
recommended.
For the mounting process the SMD type package can be handled as a standard surface
mount component. The use of either solder or conductive epoxy is possible. The solder
thickness after reflow should be typical 50µm [2 mils] and the lateral alignment between the
package and the motherboard should be within 50µm [2 mils]. Caution should be taken to
obtain a good and reliable contact over the whole pad areas. Voids or other improper
connections, in particular, between the ground pads of motherboard and package will lead to
a deterioration of the RF performance and the heat dissipation. The latter effect can reduce
drastically reliability and lifetime of the product.
Ref. : DSCHX2090QDG0211 - 30 Jul 2010
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Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
Specifications subject to change without notice
12-24GHz Frequency Multiplier
CHX2090-QDG
(For production, design must be adapted
with regard to PCB tolerances and assembly process)
Basic footprint for a 24L-QFN4x4 (all units mm)
(Please, refer to the UMS proposed footprint for optimum
operation in the following “Proposed Assembly board” section)
The RF ports are DC blocked on chip. The DC connection (Vd) does not include any
decoupling capacitor in package, therefore it is mandatory to provide a good external DC
decoupling on the PC board, as close as possible to the package.
SMD mounting procedure
The SMD leadless package has been designed for high volume surface mount PCB
assembly process. The dimensions and footprint required for the PCB (motherboard) are
given in the drawings above.
For the mounting process standard techniques involving solder paste and a suitable reflow
process can be used. For further details, see application note AN0017.
Ref. : DSCHX2090QDG0211 - 30 Jul 2010
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Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
Specifications subject to change without notice
12-24GHz Frequency Multiplier
CHX2090-QDG
Proposed Assembly board “96270” for the 24L-QFN4x4 products
characterization.
-
Compatible with the proposed footprint.
Based on typically Ro4003 / 8mils or equivalent.
Using a microstrip to coplanar transition to access the package.
Recommended for the implementation of this product on a module board.
Ref. : DSCHX2090QDG0211 - 30 Jul 2010
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Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
Specifications subject to change without notice
12-24GHz Frequency Multiplier
CHX2090-QDG
Recommended package footprint
Refer to the application note AN0017 available at http://www.ums-gaas.com for package foot print
recommendations.
SMD mounting procedure
The SMD leadless package has been designed for high volume surface mount PCB assembly process.
The dimensions and footprint required for the PCB (motherboard) are given in the drawings above.
For the mounting process standard techniques involving solder paste and a suitable reflow process can
be used. For further details, see application note AN0017.
Recommended ESD management
Refer to the application note AN0020 available at http://www.ums-gaas.com for ESD sensitivity and
handling recommendations for the UMS package products.
Recommended environmental management
Refer to the application note AN0019 available at http://www.ums-gaas.com for environmental data
on UMS package products.
Ordering Information
QFN 4x4 RoHS compliant package:
CHX2090-QDG/XY
Stick: XY = 20
Tape & reel: XY = 21
Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors
S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of
patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use
as critical components in life support devices or systems without express written approval from United
Monolithic Semiconductors S.A.S.
Ref. : DSCHX2090QDG0211 - 30 Jul 2010
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Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
Specifications subject to change without notice
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