TI MAX3243ECDBE4 3-v to 5.5-v multichannel rs-232 line driver/receiver with â±15-kv iec esd protection Datasheet

MAX3243E
www.ti.com................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
FEATURES
1
DB, DW, OR PW PACKAGE
(TOP VIEW)
27
3
26
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
30
29
C1+
V+
VCC
GND
C1−
FORCEON
FORCEOFF
INVALID
ROUT2B
ROUT1
ROUT2
ROUT3
ROUT4
ROUT5
28 27
26
NC
VCC
V+
C1+
C2+
C2–
V–
NC
32 31
25
RIN1
1
24
GND
RIN2
2
23
C1–
RIN3
3
22
FORCEON
RIN4
4
21
FORCEOFF
20
INVALID
6
19
ROUTB2
DOUT2
7
18
ROUT1
DOUT3
8
17
ROUT2
11
12
13 14
ROUT4
10
ROUT5
9
15
16
NC
5
ROUT3
RIN5
DOUT1
DIN1
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
28
2
DIN2
•
•
•
•
•
•
1
QFN PACKAGE
(TOP VIEW)
NC
APPLICATIONS
C2+
C2−
V−
RIN1
RIN2
RIN3
RIN4
RIN5
DOUT1
DOUT2
DOUT3
DIN3
DIN2
DIN1
DIN3
• Single-Chip and Single-Supply Interface for
IBM™ PC/AT™ Serial Port
• ESD Protection for RS-232 Bus Pins
– ±15-kV Human-Body Model (HBM)
– ±8-kV IEC61000-4-2, Contact Discharge
– ±15-kV IEC61000-4-2, Air-Gap Discharge
• Meets or Exceeds Requirements of
TIA/EIA-232-F and ITU v.28 Standards
• Operates With 3-V to 5.5-V VCC Supply
• Always-Active Noninverting Receiver Output
(ROUT2B)
• Designed to Transmit at a Data Rate up to
500 kbit/s
• Low Standby Current . . . 1 µA Typ
• External Capacitors . . . 4 × 0.1 µF
• Accepts 5-V Logic Input With 3.3-V Supply
• Designed to Be Interchangeable With Maxim
MAX3243E
• Serial-Mouse Driveability
• Auto-Powerdown Feature to Disable Driver
Outputs When No Valid RS-232 Signal Is
Sensed
• Package Options Include Plastic Small-Outline
(DW), Shrink Small-Outline (DB), and Thin
Shrink Small-Outline (PW) Packages
2
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
IBM, PC/AT are trademarks of International Business Machines Corporation.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2009, Texas Instruments Incorporated
MAX3243E
SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009................................................................................................................................................... www.ti.com
DESCRIPTION
The MAX3243E device consists of three line drivers, five line receivers, and a dual charge-pump circuit with
±15-kV ESD (HBM and IEC61000-4-2, Air-Gap Discharge) and ±8-kV ESD (IEC61000-4-2, Contact Discharge)
protection on serial-port connection pins. The device meets the requirements of TIA/EIA-232-F and provides the
electrical interface between an asynchronous communication controller and the serial-port connector. This
combination of drivers and receivers matches that needed for the typical serial port used in an IBM PC/AT, or
compatible. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V
supply. In addition, the device includes an always-active noninverting output (ROUT2B), which allows
applications using the ring indicator to transmit data while the device is powered down. The device operates at
data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate.
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is
set low, both drivers and receivers (except ROUT2B) are shut off, and the supply current is reduced to 1 µA.
Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown condition to occur.
Auto-powerdown can be disabled when FORCEON and FORCEOFF are high, and should be done when driving
a serial mouse. With auto-powerdown enabled, the device is activated automatically when a valid signal is
applied to any receiver input. The INVALID output is used to notify the user if an RS-232 signal is present at any
receiver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than –2.7 V
or has been between –0.3 V and 0.3 V for less than 30 µs. INVALID is low (invalid data) if all receiver input
voltages are between –0.3 V and 0.3 V for more than 30 µs. Refer to Figure 5 for receiver input levels.
The MAX3243EC is characterized for operation from 0°C to 70°C. The MAX3243EI is characterized for operation
from –40°C to 85°C.
ORDERING INFORMATION
PACKAGE (1) (2)
TA
0°C to 70°C
–40°C to 85°C
(1)
(2)
2
SOIC – DW
Tape and reel
SSOP – DB
Tape and reel
TSSOP – PW
Tape and reel
QFN – RHB
Tape and reel
SSOP – DB
Tape and reel
SOIC – DW
Tape and reel
TSSOP – PW
Tape and reel
QFN – RHB
Tape and reel
ORDERABLE PART NUMBER
MAX3243ECDW
MAX3243ECDWR
MAX3243ECDB
MAX3243ECDBR
MAX3243ECPW
MAX3243ECPWR
MAX3243ECRHBR
MAX3243EIDB
MAX3243EIDBR
MAX3243EIDW
MAX3243EIDWR
MAX3243EIPW
MAX3243EIPWR
MAX3243EIRHBR
TOP-SIDE MARKING
MAX3243EC
MAX3243EC
MP243EC
MP243E
MAX3243EI
MAX3243EI
MP243EI
MR243E
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
MAX3243E
www.ti.com................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009
FUNCTION TABLES
ABC
EACH DRIVER (1)
INPUTS
DIN
(1)
FORCEON
FORCEOFF
VALID RIN
RS-232 LEVEL
OUTPUT
DOUT
DRIVER STATUS
X
X
L
X
Z
Powered off
L
H
H
X
H
H
H
H
X
L
Normal operation with
auto-powerdown disabled
L
L
H
Yes
H
H
L
H
Yes
L
L
L
H
No
Z
H
L
H
No
Z
Normal operation with
auto-powerdown enabled
Powered off by
auto-powerdown feature
H = high level, L = low level, X = irrelevant, Z = high impedance
EACH RECEIVER (1)
INPUTS
(1)
OUTPUTS
RIN2
RIN1,
RIN3–RIN5
FORCEOFF
VALID RIN
RS-232
LEVEL
L
X
L
H
X
L
L
L
L
H
H
ROUT2B
ROUT2
ROUT1,
ROUT3–5
RECEIVER STATUS
X
L
Z
Z
X
H
Z
Z
Powered off while
ROUT2B is active
H
YES
L
H
H
H
YES
L
L
L
L
H
YES
H
H
H
H
H
H
YES
H
L
L
Open
Open
H
YES
L
H
H
Normal operation with
auto-powerdown
disabled/enabled
H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
3
MAX3243E
SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009................................................................................................................................................... www.ti.com
LOGIC DIAGRAM (POSITIVE LOGIC)
DIN1
DIN2
DIN3
FORCEOFF
FORCEON
ROUT1
ROUT2B
ROUT2
ROUT3
ROUT4
ROUT5
4
14
9
13
10
12
11
DOUT1
DOUT2
DOUT3
22
23
Auto-powerdown
19
21
4
INVALID
RIN1
20
18
5
17
6
16
7
15
8
RIN2
RIN3
RIN4
Submit Documentation Feedback
RIN5
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
MAX3243E
www.ti.com................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range (2)
–0.3
6
V
V+
Positive output supply voltage range (2)
–0.3
7
V
0.3
–7
V
13
V
V–
Negative output supply voltage range
V+ – V–
Output supply voltage difference (2)
VI
Input voltage range
VO
Output voltage range
θJA
Package thermal impedance (3) (4)
(2)
Driver (FORCEOFF, FORCEON)
–0.3
6
Receiver
–25
25
Driver
Receiver (INVALID)
–13.2
13.2
–0.3
VCC + 0.3
DB package
62
DW package
46
PW package
62
Lead temperature 1,6 mm (1/16 in) from case for 10 s
Tstg
(1)
(2)
(3)
(4)
Storage temperature range
–65
UNIT
V
V
C/W
260
C
150
C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) - TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS (1)
See Figure 6
VCC = 3.3 V
Supply voltage
VCC = 5 V
VIH
Driver and control high-level input voltage
DIN, FORCEOFF, FORCEON
VIL
Driver and control low-level input voltage
DIN, FORCEOFF, FORCEON
VI
Driver and control input voltage
DIN, FORCEOFF, FORCEON
VI
Receiver input voltage
TA
Operating free-air temperature
(1)
VCC = 3.3 V
MIN
NOM
MAX UNIT
3
3.3
3.6
4.5
5
5.5
V
2
VCC = 5 V
V
2.4
MAX3243EC
MAX3243EI
0.8
V
0
5.5
V
–25
25
V
0
70
–40
85
C
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
ELECTRICAL CHARACTERISTICS (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
II
ICC
(1)
(2)
Input leakage current
Supply current
(TA = 25°C)
TEST CONDITIONS
MIN
FORCEOFF, FORCEON
TYP (2) MAX
UNIT
0.01
1
µA
0.3
1
mA
Auto-powerdown disabled
No load,
FORCEOFF and FORCEON at VCC
Powered off
No load, FORCEOFF at GND
1
10
Auto-powerdown enabled
No load, FORCEOFF at VCC,
FORCEON at GND,
All RIN are open or grounded,
All DIN are grounded
1
10
µA
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
5
MAX3243E
SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009................................................................................................................................................... www.ti.com
DRIVER SECTION
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
MIN TYP (2) MAX
TEST CONDITIONS
UNIT
VOH
High-level output voltage
All DOUT at RL = 3 kΩ to GND
5
5.4
V
VOL
Low-level output voltage
All DOUT at RL = 3 kΩ to GND
–5
–5.4
V
VO
Output voltage
(mouse driveability)
DIN1 = DIN2 = GND, DIN3 = VCC, 3-kΩ to GND at DOUT3,
DOUT1 = DOUT2 = 2.5 mA
±5
IIH
High-level input current
VI = VCC
±0.01
±1
µA
IIL
Low-level input current
VI at GND
±0.01
±1
µA
Vhys
Input hysteresis
±1
V
±60
mA
±25
µA
VCC = 3.6 V,
VO = 0 V
VCC = 5.5 V,
VO = 0 V
IOS
Short-circuit output current (3)
ro
Output resistance
VCC, V+, and V– = 0 V,
VO = ±2 V
Ioff
Output leakage current
FORCEOFF = GND,
VO = ±12 V,
(1)
(2)
(3)
300
V
Ω
10M
VCC = 0 to 5.5 V
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics (1)
switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise
noted) (see Figure 6)
PARAMETER
MIN TYP (2)
TEST CONDITIONS
MAX
Maximum data rate
CL = 1000 pF,
One DOUT switching,
RL = 3 kΩ
See Figure 1
tsk(p)
Pulse skew (3)
CL = 150 pF to 2500 pF,
RL = 3 kΩ to 7 kΩ, See Figure 2
Slew rate, transition region
(see Figure 1)
VCC = 3.3 V,
RL = 3 kΩ to 7 kΩ,
PRR = 250 kbit/s
CL = 150 pF to 1000 pF
6
30
SR(tr)
CL = 150 pF to 2500 pF
4
30
(1)
(2)
(3)
250
UNIT
500
kbit/s
100
ns
V/µs
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V + 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
PARAMETER
Driver outputs (pins 9–11)
6
TYP
UNIT
HBM
TEST CONDITIONS
±15
kV
IEC61000-4-2, Air-Gap Discharge
±15
kV
IEC61000-4-2, Contact Discharge
±8
kV
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
MAX3243E
www.ti.com................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009
RECEIVER SECTION
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
IOH = –1 mA
VOL
Low-level output voltage
IOH = 1.6 mA
TYP (2)
VCC – 0.6
VCC – 0.1
MAX
VCC = 3.3 V
1.6
2.4
VCC = 5 V
1.9
2.4
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input hysteresis (VIT+ – VIT– )
Ioff
Output leakage current (except ROUT2B)
FORCEOFF = 0 V
ri
Input resistance
VI = ±3 V or ±25 V
VCC = 3.3 V
0.6
1.1
VCC = 5 V
0.8
1.4
UNIT
V
0.4
VIT+
(1)
(2)
MIN
V
V
V
0.5
V
±0.05
±10
µA
5
7
kΩ
3
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
tPLH
Propagation delay time, low- to high-level output
tPHL
Propagation delay time, high- to low-level output
ten
Output enable time
tdis
Output disable time
tsk(p)
Puse skew (3)
(1)
(2)
(3)
CL = 150 pF, See Figure 3
CL = 150 pF, RL = 3 kΩ, See Figure 4
See Figure 3
TYP (2)
UNIT
150
ns
150
ns
200
ns
200
ns
50
ns
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH - tPHL| of each channel of the same device.
ESD Protection
PARAMETER
Driver outputs (pins 4–8)
TYP
UNIT
HBM
TEST CONDITIONS
±15
kV
IEC61000-4-2, Air-Gap discharge
±15
kV
IEC61000-4-2, Contact Discharge
±8
kV
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
7
MAX3243E
SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009................................................................................................................................................... www.ti.com
AUTO-POWERDOWN SECTION
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
VIT+(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
VIT–(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
–2.7
VT(invalid)
Receiver input threshold
for INVALID low-level output voltage
FORCEON = GND,
FORCEOFF = VCC
–0.3
VOH
INVALID high-level output voltage
IOH = -1 mA, FORCEON = GND,
FORCEOFF = VCC
VOL
INVALID low-level output voltage
IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC
MAX
UNIT
2.7
V
V
0.3
V
VCC – 0.6
V
0.4
V
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
TYP (1)
UNIT
tvalid
Propagation delay time, low- to high-level output
VCC = 5 V
1
µs
tinvalid
Propagation delay time, high- to low-level output
VCC = 5 V
30
µs
ten
Supply enable time
VCC = 5 V
100
µs
(1)
8
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
MAX3243E
www.ti.com................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009
PARAMETER MEASUREMENT INFORMATION
3V
Generator
(see Note B)
Input
RS-232
Output
50 Ω
RL
CL
(see Note A)
3V
FORCEOFF
TEST CIRCUIT
0V
tTHL
Output
6V
SR(tr) +
t THL or tTLH
tTLH
VOH
3V
3V
−3 V
−3 V
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
Input
1.5 V
1.5 V
0V
CL
(see Note A)
tPHL
tPLH
VOH
3V
FORCEOFF
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
3 V or 0 V
FORCEON
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
tPHL
50 Ω
3V
FORCEOFF
tPLH
CL
(see Note A)
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
9
MAX3243E
SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009................................................................................................................................................... www.ti.com
PARAMETER MEASUREMENT INFORMATION
3V
Input
VCC
3 V or 0 V
FORCEON
1.5 V
GND
S1
−3 V
tPZH
(S1 at GND)
tPHZ
(S1 at GND)
RL
3 V or 0 V
1.5 V
VOH
Output
50%
Output
CL
(see Note A)
FORCEOFF
Generator
(see Note B)
50 Ω
0.3 V
tPLZ
(S1 at VCC)
tPZL
(S1 at VCC)
0.3 V
Output
50%
VOL
TEST CIRCUIT
NOTES: A.
B.
C.
D.
VOLTAGE WAVEFORMS
CL includes probe and jig capacitance.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
tPLZ and tPHZ are the same as tdis.
tPZL and tPZH are the same as ten.
Figure 4. Receiver Enable and Disable Times
10
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
MAX3243E
www.ti.com................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009
PARAMETER MEASUREMENT INFORMATION
2.7 V
2.7 V
0V
Receiver
Input
0V
−2.7 V
−2.7 V
ROUT
Generator
(see Note B)
3V
50 Ω
tinvalid
tvalid
50% VCC
50% VCC
−3 V
VCC
Autopowerdown
ten
INVALID
≈V+
V+
CL = 30 pF
(see Note A)
0.3 V
VCC
0V
0.3 V
Supply
Voltages
FORCEOFF
FORCEON
0V
INVALID
Output
DIN
DOUT
V−
TEST CIRCUIT
≈V−
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
VOLTAGE WAVEFORMS
Valid RS-232 Level, INVALID High
2.7 V
Indeterminate
0.3 V
0V
−0.3 V
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low†
Indeterminate
−2.7 V
Valid RS-232 Level, INVALID High
†
Auto-powerdown disables drivers and reduces supply
current to 1 µA.
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 5. INVALID Propagation Delay Timnes and Supply Enabling Time
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
11
MAX3243E
SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009................................................................................................................................................... www.ti.com
APPLICATION INFORMATION
C1+
1
+
C2
−
2
3
C2−
VCC
V−
GND
+
C1−
RIN1
RIN2
RS-232 Inputs
RIN3
RIN4
RIN5
DOUT1
RS-232 Outputs
DOUT2
4
27
+
−
26
25
C3†
+
−
+ CBYPASS
− = 0.1 µF
C1
24
23
FORCEON
5
Autopowerdown
C4
−
V+
C2+
28
6
7
22
FORCEOFF
8
21
9
20
10
19
INVALID
ROUT2B
ROUT1
5 kΩ
DOUT3
11
18
ROUT2
5 kΩ
DIN3
12
Logic Outputs
17
ROUT3
5 kΩ
Logic Inputs
DIN2
13
16
ROUT4
5 kΩ
DIN1
14
15
ROUT5
5 kΩ
†
C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or
electrolytic capacitors are used, they should be connected as shown.
VCC vs CAPACITOR VALUES
VCC
C1
C2, C3, and C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
Figure 6. Typical Operating Circuit and Capacitor Values
12
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
MAX3243E
www.ti.com................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009
APPLICATION INFORMATION
ESD Protection
TI MAX3243E devices have standard ESD protection structures incorporated on the pins to protect against
electrostatic discharges encountered during assembly and handling. In addition, the RS232 bus pins (driver
outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures
were designed to successfully protect these bus pins against ESD discharge of ±15-kV in all states: normal
operation, shutdown, and powered down. The MAX3243E devices are designed to continue functioning properly
after an ESD occurrence without any latchup.
The MAX3243E devices have three specified ESD limits on the driver outputs and receiver inputs, with respect to
GND:
• ±15-kV Human Body Model (HBM)
• ±15-kV IEC61000-4-2, Air-Gap Discharge (formerly IEC1000-4-2)
• ±8-kV IEC61000-4-2, Contact Discharge
ESD Test Conditions
ESD testing is stringently performed by TI, based on various conditions and procedures. Please contact TI for a
reliability report that documents test setup, methodology, and results.
Human Body Model (HBM)
The Human Body Model of ESD testing is shown in Figure 7, while Figure 8 shows the current waveform that is
generated during a discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the
ESD voltage of concern, and subsequently discharged into the DUT through a 1.5k-Ω resistor.
RD
1.5 kΩ
VHBM
+
−
CS
100 pF
DUT
Figure 7. HBM ESD Test Circuit
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
13
MAX3243E
SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009................................................................................................................................................... www.ti.com
APPLICATION INFORMATION
1.5
VHBM = 2 kV
I DUT (A)
1.0
0.5
DUT = 10-V 1-Ω Zener Diode
0.0
0
50
100
150
200
Time (ns)
Figure 8. Typical HBM Current Waveform
IEC61000-4-2 (Formerly Known as IEC1000-4-2)
Unlike the HBM, MM, and CDM ESD tests that apply to component level integrated circuits, the IEC61000-4-2 is
a system-level ESD testing and performance standard that pertains to the end equipment. The MAX3243E is
designed to enable the manufacturer in meeting the highest level (Level 4) of IEC61000-4-2 ESD protection with
no further need of external ESD protection circuitry. The more stringent IEC test standard has a higher peak
current than the HBM, due to the lower series resistance in the IEC model.
Figure 9 shows the IEC61000-4-2 model, and Figure 10 shows the current waveform for the corresponding
±8-kV Contact-Discharge (Level 4) test. This waveform is applied to a probe that has been connected to the
DUT. On the other hand, the corresponding ±15-kV (Level 4) Air-Gap Discharge test involves approaching the
DUT with an already energized probe.
High-Voltage
DC Source
+
−
50−100 MΩ
330 Ω
RC
RD
CS
150 pF
DUT
Figure 9. Simplified IEC61000-4-2 ESD Test Circuit
14
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
MAX3243E
www.ti.com................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009
APPLICATION INFORMATION
I
(30A) 100%
(Vcontact = 8 kV)
I Peak
90%
(16A)
(8A)
10%
t
30 ns
60 ns
tr = 0.7 ns to 1 ns
Figure 10. Typical Current Waveform of IEC61000-4-2 ESD Generator
Machine Model
The Machine Model (MM) ESD test applies to all pins using a 200-pF capacitor with no discharge resistance.
The purpose of the MM test is to simulate possible ESD conditions that can occur during the handling and
assembly processes of manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins.
However, after PC board assembly, the MM test is no longer as pertinent to the RS-232 pins.
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
15
PACKAGE OPTION ADDENDUM
www.ti.com
16-Apr-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
MAX3243ECDB
ACTIVE
SSOP
DB
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243ECDBE4
ACTIVE
SSOP
DB
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243ECDBG4
ACTIVE
SSOP
DB
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243ECDBR
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243ECDBRE4
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243ECDBRG4
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243ECDW
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243ECDWG4
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243ECDWR
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243ECDWRG4
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243ECPW
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243ECPWE4
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243ECPWG4
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243ECPWR
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243ECPWRE4
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243ECPWRG4
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243ECRHBR
ACTIVE
QFN
RHB
32
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MAX3243ECRHBRG4
ACTIVE
QFN
RHB
32
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MAX3243EIDB
ACTIVE
SSOP
DB
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243EIDBG4
ACTIVE
SSOP
DB
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243EIDBR
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243EIDBRG4
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243EIDW
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243EIDWG4
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243EIDWR
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
16-Apr-2009
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
MAX3243EIDWRG4
ACTIVE
SOIC
DW
28
MAX3243EIPW
ACTIVE
TSSOP
PW
28
50
MAX3243EIPWE4
ACTIVE
TSSOP
PW
28
MAX3243EIPWG4
ACTIVE
TSSOP
PW
28
MAX3243EIPWR
ACTIVE
TSSOP
PW
MAX3243EIPWRE4
ACTIVE
TSSOP
MAX3243EIPWRG4
ACTIVE
MAX3243EIRHBR
MAX3243EIRHBRG4
1000 Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
QFN
RHB
32
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ACTIVE
QFN
RHB
32
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Feb-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
MAX3243ECDBR
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SSOP
DB
28
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
MAX3243ECDWR
SOIC
DW
28
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
MAX3243ECPWR
TSSOP
PW
28
2000
330.0
16.4
7.1
10.4
1.6
12.0
16.0
Q1
MAX3243ECPWR
TSSOP
PW
28
2000
330.0
16.4
6.9
10.2
1.8
12.0
16.0
Q1
MAX3243ECRHBR
QFN
RHB
32
3000
330.0
12.4
5.3
5.3
1.5
8.0
12.0
Q2
MAX3243EIDBR
SSOP
DB
28
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
MAX3243EIDWR
SOIC
DW
28
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
MAX3243EIPWR
TSSOP
PW
28
2000
330.0
16.4
7.1
10.4
1.6
12.0
16.0
Q1
MAX3243EIPWR
TSSOP
PW
28
2000
330.0
16.4
6.9
10.2
1.8
12.0
16.0
Q1
MAX3243EIRHBR
QFN
RHB
32
3000
330.0
12.4
5.3
5.3
1.5
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Feb-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MAX3243ECDBR
SSOP
DB
28
2000
346.0
346.0
33.0
MAX3243ECDWR
SOIC
DW
28
1000
346.0
346.0
49.0
MAX3243ECPWR
TSSOP
PW
28
2000
346.0
346.0
33.0
MAX3243ECPWR
TSSOP
PW
28
2000
346.0
346.0
33.0
MAX3243ECRHBR
QFN
RHB
32
3000
346.0
346.0
29.0
MAX3243EIDBR
SSOP
DB
28
2000
346.0
346.0
33.0
MAX3243EIDWR
SOIC
DW
28
1000
346.0
346.0
49.0
MAX3243EIPWR
TSSOP
PW
28
2000
346.0
346.0
33.0
MAX3243EIPWR
TSSOP
PW
28
2000
346.0
346.0
33.0
MAX3243EIRHBR
QFN
RHB
32
3000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated
Similar pages