HITACHI HA13556AF

HA13566AF
Combo (Spindle & VCM) Driver
ADE-207-250 (Z)
1st Edition
December 1997
Description
The HA13566AF is combination of Spindle and VCM Driver designed for HDD and have following
functions and features.
Functions
•
•
•
•
•
•
•
•
•
•
•
•
1.0 A max/3-phase spindle motor driver
400 mA max VCM driver
100 mA max retract driver
11 bit serial interface
9 bit DAC for VCM control
Commutation logic for sensor-less motor
Center tap pull-up driver for half wave driver
Soft switching matrix
Charge pump
Booster
Power monitor
OTSD
Features
• Low output saturation voltage
Spindle driver
1.0 V typ (@0.8 A)
0.2 V typ (@0.1 A)
VCM driver
1.0 V typ (@400 mA)
• Soft switching drive
• Minimum surface mount package
body size 7 × 7 mm
HA13566AF
LVI1
RETOUT
RETPOW
SPNCOMP
VREF2
CDELAY
Pin Arrangement
RS
VCMN
VCMP
CT
20 19 18
21
TAB
17 16 15
14
22
13
23
12
24
11
TAB
TAB
W
V
25
10
26
9
RNF
PCOMP
27
8
28
7
TAB
4
5 6
VB
BC1
BC2
U
VCMIN
VCC2
1 2 3
DACOUT
POWGOOD
CHAGPMP
DATA
(Top view)
2
CLK
SERENAB
COMM
PHASE
HA13566AF
Block Diagram
VCC2
C101
3
B - EMF
Soft
switching
matrix
Amps
PHASE
COMM
7
8
Commutation
logic
U
1
D1
V
26
D2
W
25
D3
Spindle
driver
SOFTSW
BRAKE
EXTCOM
Center
tap
pull-up
CHAGPMP 12
24
HALF
CT
VREF2 (1.25 V)
R1
SPNCOMP
C2
R2
17
C102
VCC2
SPNENAB
5
6
FBOOST
4
18
RETRACT
POWGOOD
V CC
19
CLK
10
(10MHz Max)
DATA 11
VCMP
P
DACOUT 14
Serial port
(11 bit)
SERENAB 9
VCMN
N
LVI
20
LVI1
23
RETOUT
R101
RS
R103
22
C104
SPNENAB
BRAKE
HALF
EXTCOM
SOFTSW
RETRACT
FBOOST
21
VCMENAB
1.25 V
VCC2
RETPOW
C108
C103
VCM
Driver
VCC2
2
PCOMP
Retract
VCMIN 2
DAC
(9 bit)
28
D0
Booster
C106
VB
Current
control
Charge
pump
C1
C105
RNF
27
16
POR
delay
CDELAY
15
C107
3
13
POWGOOD
TAB
R104
RS
HA13566AF
Serial Port
Construction
MD0 to MD9
Serial
port
SERENAB
CLK
D0 to D9
Mode Control Register
Mode Control
A0 = 1
DATA
DD0 to DD9
A0
Input Data Register
for DAC & VCM
A0 = 0
Decoder
VCM Control
Figure 1 Serial Port
Data construction
Input Data Construction
MSB
A0
D9
LSB
D8
D7
D6
for selecting
register
D5
D4
D3
D2
D1
D0
Register Data
Figure 2 Input Data (1)
The serial port is required the 11 bit data (D0 to D9 and A0). Address bit A0 is used to select the register
as follows. When the data length is less than 11 bits, the internal register will not be up dated. And when
the data length is more than 11 bits, this register will take late 10 bits and ignore the faster bit.
A0
Register
0
Input data register of DAC & VCMGAIN
1
Mode control register
4
HA13566AF
Mode Control Register (A0 = 1)
Bit
Symbol
1
0
Note
MD0
SPNENAB
Spindle enable
Spindle disable
1
MD1
BRAKE
Brake enable
Brake disable
1
MD2
Not use
—
—
MD3
HALF
Half wave drive
Full wave drive
MD4
EXTCOM
External commutation
Internal commutation
MD5
SOFTSW
Soft switching
Switching
MD6
VCMENAB
VCM enable
VCM disable
MD7
RETRACT
Retracting
Not retracting
MD8
POLESEL
for 12 poles motor
for 8 poles motor
3
MD9
FBOOST
Low frequency
High frequency
4
2
Notes: 1. The spindle motor is independently winding to the value of the MD2, during the MD1 is true.
2. The bit MD4 select a commutation mode at driving by B-EMF sensing. (See Commutation
timing)
3. In order to prevent the misdetection of back-EMF amplifier, the bit MD8 should be chosen as
shown above table.
4. The bit MD9 determine the operating frequency of Booster Circuit. According to the frequency of
Input CLK at pin 10, the value of MD9 should be chosen as shown below.
CLK (at pin 10)
MD9
7.1 MHz to 10 MHz
0
4.0 MHz to 7.0 MHz
1
Input Data Register (A0 = 0)
Bit / DD0 to DD9: These input data are used to control the output current at VCM driver as shown follows.
MSB
DD9
VCMGAIN
DD8
LSB
DD7
DD6
DD5
DD4
DD3
Input data of DAC
Figure 3 Input Data (2)
5
DD2
DD1
DD0
HA13566AF
The data bit DD9 determine the transfer gain GVCM which is specified as the relationship between the input
data at the input data register and the output current at VCM amplifier. (See the under table)
DD9
DATA
I O [mA]
1
1FF
+199.2/RS
1
100
0.000
1
000
–200.0/R S
0
1FF
+24.9/RS
0
100
0.000
0
000
–25.0/R S
Data Input Timing
t1
Vth (= 1/2VCC2 Typ)
SERENAB
t0
CLK
t3
t2
Vth
Up date point
t4
DATA
Latch point
t5
A0 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
Vth
t0 ≥ 20ns
t1 ≥ 20ns
t2 ≥ 50ns
Figure 4 Input Timing on Serial Port
SERENAB
t6
t6
Internal
DAC output
t6 : Conversion time of DAC ≤ 1µs
Figure 5 Conversion Timing on DAC
6
t3 ≥ 40ns
t4 ≥ 40ns
t5 ≥ 40ns
HA13566AF
Commutation Timing
Commutation for starting up
Pulsewidth ≥ 10µs
1/fCOMM
COMM
Delay
PHASE
IU
+
0
–
IV
+
0
–
IW
+
0
–
Synchronous
(≅0.2s to 0.3s)
driving by B-EMF sensing
Note: 1. The frequency of COMM signal fCOMM can be designed as follows.
fCOMM (max) = 2.5
P · KT · IO
J
(Hz)
(for begin of synchronous driving)
(1)
fCOMM (min) = 0.5
P · KT · IO
J
(Hz)
(for end of synchronous driving)
(2)
Where,
P : Pole number of spindle motor (Hz)
KT : Torque constant (kg · cm/A)
IO : Start up current (A)
J : Moment of inertia (kg · cm · S2)
7
HA13566AF
External Commutation Mode (Full Wave Drive)
U
V
W
+
B-EMF
0
–
PHASE
0
Delay
*2
COMM
0
+
U-Current
Switching
mode
U-Current
Soft
switching
mode
0
–
+
+ 50 %
0
– 50 %
–
Note: 2. Provided by MPU.
8
HA13566AF
External Commutation Mode (Half Wave Mode)
U
V
W
+
B-EMF
(VCC)
0
–
PHASE
0
COMM
0
+
U-Current
Switching
mode
U-Current
Soft
switching
mode
0
–
+
0
– 50 %
–
9
HA13566AF
Internal Commutation Mode (Full Wave Mode)
U
V
W
+
B-EMF
0
–
PHASE
0
COMM
*3
U-Current
Switching
mode
U-Current
Soft
switching
mode
0
+
0
–
+
+ 50 %
0
– 50 %
–
Note: 3. When the internal commutation mode is selected, the commutation of the motor is automatically
selected at the B-EMF sensing drive. But don’t open the COMM terminal.
10
HA13566AF
Internal Commutation Mode (Half Wave Mode)
U
V
W
+
B-EMF
0
–
PHASE
0
COMM
U-Current
Switching
mode
U-Current
Soft
switching
mode
0
+
0
–
+
0
– 50 %
–
11
HA13566AF
Application
C105
VCC2
C106
C101
R2
C2
VCC2
Booster
U
SPNCOMP
C1
R1
Serial data
D1
VREF
PHASE
V
D2
W
D3
COMM
CT
CHAGPMP
MPU
Spindle
motor
RNF
POWGOOD PCOMP
CLK
RETOUT
DATA
VCMP
SERENAB
RNF
C102
R101
RS
C103 R103
DACOUT
VCMN
VCMIN
C104
R104
RS
C107
CDELAY RETPOW
TAB
12
C108
RL
HA13566AF
External Component
Parts No.
Recommended Value
Purpose
Notes
R1
≤ 47 kΩ
Integral constant
1
R2
—
Integral constant
1
R101
—
Set retract current
2
R103, R104
2.2 Ω
For stability
RNF
≥ 0.2 Ω
Spindle current sense
RS
0.47 Ω
VCM current sense
C1, C2
—
Integral constant
C101
0.1 µF
Power supply bypass
C102
0.1 µF
Phase compensation for spindle driver
C103, C104
0.1 µF
For stability
C105
0.47 µF
For booster
C106
4.7 µF
For booster
C107
—
POR delay
C108
—
Retpower filter
D1, D2, D3
—
For retract
Notes: 1. This integral constants can be designed as follows.
2πNO
ωO =
600
(3)
R2
R1
C1 =
=
J ωO NO RNF
9.55Kt Gctl Vref2
(4)
1
10 ωO R2
C2 = 10C1
(5)
(6)
Where,
ωO = Time constant of servo loop
NO = Rotation number (rpm)
J = Moment of inertia (kg cm•s2)
RNF = Current sense resistor (Ω)
Gctl = Control gain (see electrical characteristics)
Vref2 = Internal reference voltage (See electrical characteristics)
13
3
1
4
HA13566AF
2. The retract current is determined as follows.
Vretpow – Vsatret
Iret =
R101 + RL + RS
(7)
where,
RL = VCM coil Resistor.
Vsatret = Retout saturation voltage (See electrical characteristics)
3. The motor start up current IO is determined as follows.
IO =
Vref1
RNF
(A)
(8)
Where, Vref1 = Current limiter reference voltage
(See electrical characteristics)
4. The power on reset delay time is determined as follows.
t POR = 105•C 107 (See electrical characteristics)
(9)
14
HA13566AF
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Value
Units
Notes
Power supply voltage
VCC2
7.0
V
1
Spindle current
Ispn
1.0
A
2
VCM current
Ivcm
400
mA
2
Retract current
Iret
100
mA
2
Input voltage
Vin
0 to V CC
V
Power dissipation (Ta = 65°C)
P T1
1.0
W
3
Power dissipation (Tc = 100°C)
P T2
2.0
W
3
Junction temperature
Tj
150
°C
4
Storage temperature range
Tstg
–55 to +125
°C
Notes: 1. Operating voltage range is 4.25 V to 5.75 V.
2. ASO of each output transistor is shown below. Operating locus must be with in the ASO.
3. Thermal resistance is shown below.
θj-c ≤ 25°C/W
θj-a ≤ 80°C/W
4. Operating junction temperature range is 0 to +125°C.
4
t = 1 ms
Collector Current IC (A)
t = 10 ms
t = 100 ms
1
0.5
0.1
1
5
10
20
Collector Emitter Voltage VCE (V)
Figure 6 ASO of Output Transistor (Spindle Driver)
15
HA13566AF
4
t = 1 ms
Collector Current IC (A)
t = 10 ms
t = 100 ms
1
0.5
0.1
1
5
10
20
Collector Emitter Voltage VCE (V)
Figure 7 ASO of Output Transistor (VCM Driver)
16
HA13566AF
Electrical Characteristics (Ta = 25°C, VCC = 5 V)
Item
Symbol
Min
Typ
Max
Units
Test
Conditions
Applicable
Terminal
Supply current
ICC1
—
15
20
mA
Enable m ode
3
Logic
Input low current
IIL
—
0
±10
µA
VIL=0V
8, 9, 10, 11
input
Input high current
IIH
—
—
±10
µA
VIH=5V
Input low voltage
VIL
—
—
1.5
V
Input high voltage
VIH
3.5
—
—
V
Clock frequency
fCLK
—
—
10
MHz
Output high
voltage
VOH
4.4
—
—
V
IOH =1mA
Output low voltage
VOL
—
—
0.4
V
IOL=1mA
Spindle
Total saturation
Vsatspn
—
1.0
1.4
V
Ispn=0.8A
driver
voltage
—
0.2
0.3
V
Ispn=100mA
Logic
output
7, 13
1, 25, 26
Output leak current
Icer1
—
—
5
mA
MD3=1,
VO=VCC+3V
Current limiter
reference voltage
Vref1
139
155
171
mV
RNF =1.0Ω
Current control
gain
Gctl
–14
–12
–10
dB
B-EMF
amps
Input sensitivity
Vmin
—
50
—
mVp-p
1, 25, 26
Charge
Input high voltage
VIHCP
3.5
—
—
V
12
pump
Input low voltage
VILCP
—
—
1.5
V
Input high current
IIHCP
—
150
200
µA
Input dead current
IIDCP
—
±10
µA
Input low current
IILCP
—
–150
–200
µA
VILCP=0V
Output current
Charge
current
+44
+54
+64
µA
R1=24kΩ
Discharge
current
–64
–54
–44
µA
R1=24kΩ
Output cutoff
current
Ioff
—
—
±50
nA
Reference voltage
Vref2
1.32
1.39
1.46
V
VCM
VCM input resistor
Rin
42
60
78
kΩ
2
driver
Output quiescent
voltage
Vq
VCC2/2
VCC2/2
+5%
VCC2/2
+10%
V
22, 23
Output leak current
Icer2
—
—
±5
mA
Total output
Vsatvcm
—
1.0
1.35
V
Ivcm=400mA
—
0.8
1.0
V
Ivcm=200mA
saturation voltage
17
VIHCP=5V
R1=24kΩ
Note
17
16
1
HA13566AF
Electrical Characteristics (Ta = 25°C, VCC = 5 V) (cont)
Item
Symbol
Min
Typ
Max
Units
Test
Conditions
Applicable
Terminal
Note
1
VCM
Resolution
Ires
—
1/512
—
—
21, 22, 23
driver
DAC output
resistor
Rout
—
—
50
Ω
14
Output current full
IFS1
345
385
425
mA
DD9=1, RS=
scale
IFS2
45
50
55
mA
1Ω, RL=14Ω
Gain ratio
IFS1 / IFS2
7.5
8.0
8.5
—
Offset
Ioff1
—
—
±15
LSB
DD9=1, RS=
Ioff2
—
—
±20
LSB
1Ω, RL=14Ω
Ioff3
—
—
±80
LSB
Ioff1×8–Ioff2
Linearity
ILIN
—
—
±1
LSB
Gain Bandwidth
B
—
40
—
kHz
DD9=1, RS=
1Ω, RL=14Ω
—
95
—
kHz
DD9=0, RS=
1Ω, RL=14Ω
Retract
driver
2, 14
21, 22, 23
1
Retpow voltage
Vretpow
1.4
—
—
V
RS=1.0Ω,
RL=14Ω
Iret=100mA
18
Retout saturation
voltage
Vsatret
—
1.0
1.2
V
Iret=100mA
19
Operating voltage
Vsd
3.55
3.85
4.15
V
Recovery voltage
Vrec
3.9
4.2
4.5
V
POR
Power on reset
delay time
POR
5
10
20
ms
OTSD
Operating
temperature
Tsd
125
150
—
°C
Hysteresis
Thys
—
25
—
°C
LVI
Note:
1. Design guide only
2. Specified by shorting between VCMIN and DACOUT.
18
2
3
1
C107=0.1µF
13
1
HA13566AF
Package Dimensions
21
14
28
7
6
0.575
2.25 ± 0.10
0.10
M
1.40
1.70 Max
0.13
0.17 ± 0.05
0.15 ± 0.04
1
0.32 ± 0.08
0.30 ± 0.06
0.09
0.13 +– 0.05
9.0 ± 0.2
9.0 ± 0.2
7.0
20
15
0.65
Unit: mm
1.0
0.575
0° – 8°
0.95 ± 0.10
0.50 ± 0.10
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
Dimension including the plating thickness
Base material dimension
19
FP-28T
—
—
0.2 g
Cautions
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copyright, trademark, or other intellectual property rights for information contained in this document.
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intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
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products.
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