NXP CGY888C 34 db, 870 mhz gaas push-pull forward amplifier Datasheet

CGY888C
34 dB, 870 MHz GaAs push-pull forward amplifier
Rev. 03 — 14 October 2009
Product data sheet
1. Product profile
1.1 General description
Hybrid amplifier module in a SOT115J package, operating at a supply voltage of 24 V
Direct Current (DC), employing Hetero junction Field Effect Transistor (HFET) GaAs
MMIC.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features
n
n
n
n
n
n
n
n
n
n
High gain
Excellent linearity
Superior levels of ESD protection
Extremely low noise
Excellent return loss properties
Gain compensation over temperature
Rugged construction
Unconditionally stable
Thermally optimized design
Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances
(RoHS)
n Integrated ring wave surge protection
1.3 Applications
n CATV systems operating in the 40 MHz to 870 MHz frequency range
CGY888C
NXP Semiconductors
34 dB, 870 MHz GaAs push-pull forward amplifier
1.4 Quick reference data
Table 1.
Quick reference data
Bandwidth to 870 MHz; VB = 24 V (DC); Tmb = 35 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Gp
power gain
f = 45 MHz
-
34
-
dB
Itot
total current
f = 870 MHz
[1]
[1]
34.5
-
36.5
dB
260
280
300
mA
Direct Current (DC).
2. Pinning information
Table 2.
Pinning
Pin
Description
1
input
2, 3
common
5
+VB
7, 8
common
9
output
Simplified outline
Graphic symbol
5
1 3 5 7 9
1
9
2 3 7 8
sym095
3. Ordering information
Table 3.
Ordering information
Type number
CGY888C
Package
Name
Description
Version
-
rectangular single-ended package; aluminium flange;
2 vertical mounting holes; 2 × 6-32 UNC and 2 extra
horizontal mounting holes; 7 gold-plated in-line leads
SOT115J
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
VB
supply voltage
Vi(RF)
RF input voltage
VESD
electrostatic discharge voltage Human Body Model (HBM);
According JEDEC standard
22-A114E
single tone
Biased; According IEC61000-4-2
Unit
-
30
V
-
70
dBmV
-
2000 V
-
2000 V
Tstg
storage temperature
−40 +100 °C
Tmb
mounting base temperature
−20 +100 °C
CGY888C_3
Product data sheet
Min Max
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 14 October 2009
2 of 7
CGY888C
NXP Semiconductors
34 dB, 870 MHz GaAs push-pull forward amplifier
5. Characteristics
Table 5.
Characteristics
Bandwidth to 870 MHz; VB = 24 V (DC); Tmb = 35 °C; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
f = 45 MHz
-
34
-
dB
Gp
power gain
34.5
-
36.5
dB
SLsl
slope straight line
f = 45 MHz to 870 MHz
[1]
-
1.5
-
dB
FL
flatness of frequency response
f = 45 MHz to 870 MHz
[2]
-
0.25
-
dB
112 NTSC channels
[3]
-
-
−65
dBc
98 PAL channels
[4]
-
−68
-
dBc
112 NTSC channels
[3]
-
-
−63
dBc
98 PAL channels
[4]
-
−66
-
dBc
112 NTSC channels
[3]
-
−72
-
dB
f = 870 MHz
CTB
CSO
composite triple beat
composite second-order distortion
Xmod
cross modulation
RLin
input return loss
RLout
NF
output return loss
noise figure
f = 45 MHz to 320 MHz
20
-
-
dB
f = 320 MHz to 870 MHz
18
-
-
dB
f = 45 MHz to 320 MHz
20
-
-
dB
f = 320 MHz to 870 MHz
17
-
-
dB
f = 50 MHz
-
3.5
4.0
dB
f = 870 MHz
-
4.0
5.0
dB
260
280
300
mA
[5]
total current
Itot
[1]
Gp at 870 MHz minus Gp at 45 MHz.
[2]
Flatness straight line (peak to valley).
[3]
f = 55.25 MHz to 745.25 MHz; Vo = 44 dBmV, flat output level.
[4]
f = 49.75 MHz to 847.25 MHz; Vo = 44 dBmV, flat output level.
[5]
Direct Current (DC).
CGY888C_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 14 October 2009
3 of 7
CGY888C
NXP Semiconductors
34 dB, 870 MHz GaAs push-pull forward amplifier
6. Package outline
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads
SOT115J
D
E
Z
p
A2
1
2
3
5
7
8
9
A
L
F
S
W
c
e
b
w M
e1
d
U2
q2
Q
B
y M B
q1
x M B
y M B
p
U1
q
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A2
A
max. max.
mm 20.8
9.1
OUTLINE
VERSION
b
c
d
D
E
max. max. max.
e
e1
F
L
min.
p
4.15
0.51
0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8
3.85
0.38
Q
max.
q
JEDEC
JEITA
S
U1
U2
W
w
x
EUROPEAN
PROJECTION
y
Z
max.
0.1
3.8
ISSUE DATE
99-02-06
04-02-04
SOT115J
Fig 1.
q2
2.4 38.1 25.4 10.2 4.2 44.75 8.2 6-32 0.25 0.7
44.25 7.8 UNC
REFERENCES
IEC
q1
Package outline SOT115J
CGY888C_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 14 October 2009
4 of 7
CGY888C
NXP Semiconductors
34 dB, 870 MHz GaAs push-pull forward amplifier
7. Abbreviations
Table 6.
Abbreviations
Acronym
Description
CATV
Community Antenna TeleVision
GaAs
Gallium-Arsenide
MMIC
Monolithic Microwave Integrated Circuit
NTSC
National Television Standard Committee
PAL
Phase Alternating Line
RF
Radio Frequency
UNC
UNified Coarse
8. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
CGY888C_3
20091014
Product data sheet
-
CGY888C_2
Modifications:
•
•
•
Section 1.2 on page 1: some features were added.
Table 5 on page 3: Xmod characteristic was added.
Table 5 on page 3: Max values for NF were added.
CGY888C_2
20090921
Product data sheet
-
CGY888C_1
CGY888C_1
20080619
Product data sheet
-
-
CGY888C_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 14 October 2009
5 of 7
CGY888C
NXP Semiconductors
34 dB, 870 MHz GaAs push-pull forward amplifier
9. Legal information
9.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
9.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
9.3
Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
9.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
CGY888C_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 14 October 2009
6 of 7
CGY888C
NXP Semiconductors
34 dB, 870 MHz GaAs push-pull forward amplifier
11. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
9.1
9.2
9.3
9.4
10
11
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
General description. . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quick reference data. . . . . . . . . . . . . . . . . . . . .
Pinning information . . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
2
2
2
2
3
4
5
5
6
6
6
6
6
6
7
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 14 October 2009
Document identifier: CGY888C_3
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