TI1 DRV135UA/2K5E4 Audio balanced line driver Datasheet

DRV134
DRV135
DRV
134
DRV
134
DRV
135
SBOS094A – JANUARY 1998 – REVISED APRIL 2007
AUDIO BALANCED LINE DRIVERS
FEATURES
DESCRIPTION
● BALANCED OUTPUT
● LOW DISTORTION: 0.0005% at f = 1kHz
● WIDE OUTPUT SWING: 17Vrms into 600Ω
● HIGH CAPACITIVE LOAD DRIVE
● HIGH SLEW RATE: 15V/µs
● WIDE SUPPLY RANGE: ±4.5V to ±18V
● LOW QUIESCENT CURRENT: ±5.2mA
● 8-PIN DIP, SO-8, AND SOL-16 PACKAGES
● COMPANION TO AUDIO DIFFERENTIAL
LINE RECEIVERS: INA134 and INA137
● IMPROVED REPLACEMENT FOR SSM2142
The DRV134 and DRV135 are differential output amplifiers that convert a single-ended input to a balanced
output pair. These balanced audio drivers consist of
high performance op amps with on-chip precision resistors. They are fully specified for high performance audio
applications and have excellent ac specifications, including low distortion (0.0005% at 1kHz) and high slew
rate (15V/µs).
The on-chip resistors are laser-trimmed for accurate gain
and optimum output common-mode rejection. Wide output
voltage swing and high output drive capability allow use in
a wide variety of demanding applications. They easily drive
the large capacitive loads associated with long audio
cables. Used in combination with the INA134 or INA137
differential receivers, they offer a complete solution for
transmitting analog audio signals without degradation.
APPLICATIONS
●
●
●
●
●
●
●
●
●
AUDIO DIFFERENTIAL LINE DRIVERS
AUDIO MIX CONSOLES
DISTRIBUTION AMPLIFIERS
GRAPHIC/PARAMETRIC EQUALIZERS
DYNAMIC RANGE PROCESSORS
DIGITAL EFFECTS PROCESSORS
TELECOM SYSTEMS
HI-FI EQUIPMENT
INDUSTRIAL INSTRUMENTATION
The DRV134 is available in 8-pin DIP and SOL-16 surface-mount packages. The DRV135 comes in a spacesaving SO-8 surface-mount package. Both are specified
for operation over the extended industrial temperature
range, –40°C to +85°C and operate from –55°C to +125°C.
V+
50Ω
+VO
A2
+Sense
10kΩ
–Sense
VIN
A1
50Ω
Gnd
–VO
A3
10kΩ
All resistors 30kΩ unless otherwise indicated.
V–
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright © 1998-2007, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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SPECIFICATIONS: VS = ±18V
At TA = +25°C, VS = ±18V, RL = 600Ω differential connected between +VO and –VO, unless otherwise noted.
DRV134PA, UA
DRV135UA
PARAMETER
AUDIO PERFORMANCE
Total Harmonic Distortion + Noise
CONDITIONS
THD+N
Noise Floor, RTO(1)
Headroom, RTO(1)
INPUT
Input Impedance(2)
Input Current
ZIN
IIN
FREQUENCY RESPONSE
Small-Signal Bandwidth
Slew Rate
Settling Time: 0.01%
Overload Recovery
POWER SUPPLY
Rated Voltage
Voltage Range
Quiescent Current
TEMPERATURE RANGE
Specification Range
Operation Range
Storage Range
Thermal Resistance
8-Pin DIP
SO-8 Surface Mount
SOL-16 Surface Mount
TYP
f = 20Hz to 20kHz,VO = 10Vrms
f = 1kHz, VO = 10Vrms
20kHz BW
THD+N < 1%
0.001
0.0005
–98
+27
VIN = ±7.07V
10
±700
MAX
UNITS
%
%
dBu
dBu
±1000
kΩ
µA
[(+VO) – (–VO)]/VIN
VIN = ±10V
GAIN
Differential
Initial
Error
vs Temperature
Single-Ended
Initial
Error
vs Temperature
Nonlinearity
OUTPUT
Common-Mode Rejection, f = 1kHz
Signal Balance Ratio, f = 1kHz
Output Offset Voltage
Offset Voltage, Common-Mode
vs Temperature
Offset Voltage, Differential
vs Temperature
vs Power Supply
Output Voltage Swing, Positive
Negative
Impedance
Load Capacitance, Stable Operation
Short-Circuit Current
MIN
5.8
6
±0.1
±10
±2
dB
%
ppm/°C
VIN = ±5V
5.8
OCMR
SBR
See OCMR Test Circuit, Figure 4
See SBR Test Circuit, Figure 5
VOCM(3)
VIN = 0
VOD(4)
VIN = 0
PSRR
VS = ±4.5V to ±18V
No Load(5)
No Load(5)
CL
ISC
46
35
80
(V+) – 3
(V–) + 2
CL Tied to Ground (each output)
6
±0.7
±10
0.0003
68
54
±50
±150
±1
±5
110
(V+) – 2.5
(V–) + 1.5
50
1
±85
VOUT = 10V Step
Output Overdriven 10%
±250
±10
±4.5
±5.2
IO = 0
–40
–55
–55
θJA
100
150
80
mV
µV/°C
mV
µV/°C
dB
V
V
Ω
µF
mA
MHz
V/µs
µs
µs
±18
VS
dB
%
ppm/°C
% of FS
dB
dB
1.5
15
2.5
3
SR
IQ
±2
±18
±5.5
V
V
mA
+85
+125
+125
°C
°C
°C
°C/W
°C/W
°C/W
NOTES: (1) dBu = 20log (Vrms /0.7746); RTO = Referred-to-Output.
(2) Resistors are ratio matched but have ±20% absolute value.
(3) VOCM = [(+VO) + (–VO)]/ 2. (4) VOD = (+VO) – (–VO). (5) Ensures linear operation. Includes common-mode offset.
2
DRV134, DRV135
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SBOS094A
PIN CONFIGURATIONS
Top View
8-Pin DIP/SO-8
–VO
1
8
+VO
–Sense
2
7
+Sense
Gnd
3
6
V+
VIN
4
5
V–
Top View
SOL-16
NC
1
16
NC
NC
2
15
NC
–VO
3
14
+VO
–Sense
4
13
+Sense
Gnd
5
12
V+
VIN
6
11
V–
NC
7
10
NC
NC
8
9
NC
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage, V+ to V– .................................................................... 40V
Input Voltage Range .................................................................... V– to V+
Output Short-Circuit (to ground) .............................................. Continuous
Operating Temperature .................................................. –55°C to +125°C
Storage Temperature ..................................................... –55°C to +125°C
Junction Temperature .................................................................... +150°C
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may affect
device reliability.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe proper handling and installation procedures can
cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated
circuits may be more susceptible to damage because
very small parametric changes could cause the device
not to meet its published specifications.
PACKAGE/ORDERING INFORMATION(1)
PRODUCT
PACKAGE-LEAD
PACKAGE
DESIGNATOR
DRV134PA
DRV134UA
"
DRV135UA
"
DIP-8
SOL-16 Surface Mount
"
SO-8 Surface Mount
"
P
DW
"
D
"
SPECIFIED
TEMPERATURE
RANGE
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
–40°C to +85°C
–40°C to +85°C
"
–40°C to +85°C
"
DRV134PA
DRV134UA
DRV134UA/1K
DRV135UA
DRV135UA/2K5
Rails, 50
Rails, 48
Tape and Reel. 1000
Rails, 100
Tape and Reel, 2500
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI wwebsite at www.ti.com.
DRV134, DRV135
SBOS094A
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3
TYPICAL PERFORMANCE CURVES
At TA = +25°C, VS = ±18V, RL = 600Ω differential connected between +VO and –VO, unless otherwise noted.
TOTAL HARMONIC DISTORTION+NOISE
vs FREQUENCY
TOTAL HARMONIC DISTORTION+NOISE
vs FREQUENCY
0.01
0.01
Differential Mode
VO = 10Vrms
No Cable
A
B
0.001
Differential Mode
VO = 10Vrms
500 ft cable
See Figure 3 for Test Circuit
A: R1 = R2 = RL = ∞ (no load)
B: R1 = R2 = 600Ω, RL = ∞
C: R1 = R2 = ∞, RL = 600Ω
A
B
THD+N (%)
THD+N (%)
See Figure 3 for Test Circuit
A: R1 = R2 = RL = ∞ (no load)
B: R1 = R2 = 600Ω, RL = ∞
C: R1 = R2 = ∞, RL = 600Ω
0.001
C
C
DRV134 Output
DRV134 Output
0.0001
0.0001
20
100
1k
10k 20k
100
1k
10k 20k
Frequency (Hz)
TOTAL HARMONIC DISTORTION+NOISE
vs FREQUENCY
SYSTEM TOTAL HARMONIC DISTORTION+NOISE
vs FREQUENCY
0.1
0.01
Single-Ended Mode
VO = 10Vrms
See Figure 3 for Test Circuit
A: R1 = R2 = RL = ∞ (no load)
B: R1 = R2 = ∞ RL = 600Ω
0.01
A
B
THD+N (%)
–VO or +VO Grounded
A: R1 = 600Ω (250 ft cable)
B: R1 = ∞ (no cable)
THD+N (%)
20
Frequency (Hz)
Differential Mode
VO = 10Vrms
A (no cable)
0.001
0.001
B (500ft cable)
INA137 Output
DRV134 Output
0.0001
0.0001
20
100
1k
10k 20k
20
10k
HEADROOM—TOTAL HARMONIC DISTORTION+NOISE
vs OUTPUT AMPLITUDE
DIM INTERMODULATION DISTORTION
vs OUTPUT AMPLITUDE
20k
1
f = 1kHz
Single-Ended
Mode
Differential
Mode
500 ft Cable
RL = 600Ω
500 ft Cable
RL = 600Ω
Differential Mode
0.1
0.1
500 ft Cable
RL = 600Ω
DIM (%)
THD+N (%)
1k
Frequency (Hz)
1
0.01
0.01
0.001
0.001
5
10
15
20
25
No Cable
RL = ∞
BW = 30kHz
No Cable
RL = ∞
DRV134 Output
0.0001
0.0001
30
5
Output Amplitude (dBu)
4
100
Frequency (Hz)
10
15
20
25
30
Output Amplitude (dBu)
DRV134, DRV135
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SBOS094A
TYPICAL PERFORMANCE CURVES
(Cont.)
At TA = +25°C, VS = ±18V, RL = 600Ω differential connected between +VO and –VO, unless otherwise noted.
HARMONIC DISTORTION PRODUCTS
vs FREQUENCY
0.01
5
0.001
Voltage Gain (dB)
Amplitude (% of Fundamental)
GAIN vs FREQUENCY
10
No Cable, RL = ∞
500 ft Cable,
RL = 600Ω
Differential Mode
2nd Harmonic
0.0001
3rd Harmonic
0.00001
20
100
1k
10k
–5
–10
20k
1k
100k
1M
Frequency (Hz)
OUTPUT VOLTAGE NOISE SPECTRAL DENSITY
vs FREQUENCY
OUTPUT VOLTAGE NOISE
vs NOISE BANDWIDTH
10M
Voltage Noise (µVrms)
100
1k
100
10
10
1
0.1
1
10
100
1k
10k
100k
1M
1
100
1k
10k
Frequency (Hz)
POWER SUPPLY REJECTION vs FREQUENCY
MAXIMUM OUTPUT VOLTAGE SWING
vs FREQUENCY
100k
Output Voltage Swing (Vrms)
20
100
+PSRR
80
60
–PSRR
40
20
10
Frequency (Hz)
120
Power Supply Rejection (dB)
10k
Frequency (Hz)
10k
Voltage Noise (nV/√Hz)
0
VS = ±4.5V to ±18V
0
16
0.1% Distortion
12
0.01% Distortion
8
4
RL = 600Ω
Diff Mode
0
10
100
1k
10k
100k
1M
10k
Frequency (Hz)
50k
80k 100k
Frequency (Hz)
DRV134, DRV135
SBOS094A
20k
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5
TYPICAL PERFORMANCE CURVES
(Cont.)
At TA = +25°C, VS = ±18V, RL = 600Ω differential connected between +VO and –VO, unless otherwise noted.
THD+N ≤ 0.1%
OUTPUT VOLTAGE SWING
vs OUTPUT CURRENT
OUTPUT VOLTAGE SWING
vs SUPPLY VOLTAGE
18
THD+N ≤ 0.1%
16
+25°C
14
16
Output Voltage Swing (V)
Differential Output Voltage (Vrms)
20
12
8
4
12
8
–8
+25°C
–10
–12
–14
–18
±4
±6
±8
±10
±12
±14
±16
±18
±20
0
QUIESCENT CURRENT
vs SUPPLY VOLTAGE
Short-Circuit Current (mA)
Quiescent Current (mA)
±80
±100
±120
±5.4
T = –55°C
±5.2
T = +25°C
±5
T = +125°C
±4.8
±100
±4
±6
±8
±10
±12
±14
±16
+ISC
±80
–ISC
±60
±40
±4.6
±20
±18
–75
–50
–25
0
25
50
75
Supply Voltage (V)
Temperature (°C)
DIFFERENTIAL OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
COMMON-MODE OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
45
100
125
35
Typical production
distribution of packaged
units. All package types
included.
30
Percent of Units (%)
35
±60
SHORT-CIRCUIT CURRENT vs TEMPERATURE
±5.6
40
±40
Output Current (mA)
Supply Voltage (V)
Percent of Units (%)
–55°C
+125°C
–16
0
30
25
20
15
10
25
15
10
5
0
0
–250
–225
–200
–175
–150
–125
–100
–75
–50
–25
0
25
50
75
100
125
150
175
200
225
250
–10
–9
–8
–7
–6
–5
–4
–3
–2
–1
0
1
2
3
4
5
6
7
8
9
10
Typical production
distribution of packaged
units. All package types
included.
20
5
Differential Offset Voltage (mV)
6
–55°C
+125°C
10
Common-Mode Offset Voltage (mV)
DRV134, DRV135
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SBOS094A
TYPICAL PERFORMANCE CURVES
(Cont.)
At TA = +25°C, VS = ±18V, RL = 600Ω differential connected between +VO and –VO, unless otherwise noted.
SMALL-SIGNAL STEP RESPONSE
CL = 100pF
CL = 1000pF
50mV/div
50mV/div
SMALL-SIGNAL STEP RESPONSE
2µs/div
LARGE-SIGNAL STEP RESPONSE
LARGE-SIGNAL STEP RESPONSE
CL = 100pF
CL = 1000pF
5V/div
5V/div
2µs/div
2µs/div
2µs/div
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
40
100mV Step
Overshoot (%)
30
20
10
0
10
100
1k
10k
Load Capacitance (pF)
DRV134, DRV135
SBOS094A
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7
APPLICATIONS INFORMATION
resistors. Characterized by low differential-mode output
impedance (50Ω) and high common-mode output impedance (1.6kΩ), the DRV134 is ideal for audio applications.
Normally, +VO is connected to +Sense, –VO is connected to
–Sense, and the outputs are taken from these junctions as
shown in Figure 1. For applications with large dc cable
offset errors, a 10µF electrolytic nonpolarized blocking
capacitor at each sense pin is recommended as shown in
Figure 2.
The DRV134 (and DRV135 in SO-8 package) converts a
single-ended, ground-referenced input to a floating differential output with +6dB gain (G = 2). Figure 1 shows the
basic connections required for operation. Decoupling capacitors placed close to the device pins are strongly recommended in applications with noisy or high impedance power
supplies.
The DRV134 consists of an input inverter driving a crosscoupled differential output stage with 50Ω series output
V–
V+
1µF
1µF
5
6 (12)
(11)
DRV134
DRV135
50Ω
8
A2
+VO
(14)
7
(13)
+Sense
10kΩ
VIN
4
G = +6dB
(6)
2
Gnd
A1
3
(4)
1
50Ω
A3
(5)
(3)
–Sense
–VO
10kΩ
All resistors 30kΩ unless otherwise indicated.
SOL-16 pin numbers in parentheses.
FIGURE 1. Basic Connections.
DRIVER
DRV134
DRV135
RECEIVER
50Ω
A2
8
7
10µF(1)
+VO
BALANCED
CABLE PAIR
–VO
5
2
10kΩ
VIN
4
6
2
Gnd
3
A1
50Ω
A3
VO
10µF(1)
1
–VO
3
1
+VO
INA134, INA137
INA134 (G = 1): VO = 2VIN
INA137 (G = 1/2): VO = VIN
10kΩ
All resistors 30kΩ unless otherwise indicated.
Pin numbers shown for DIP and SO-8 versions.
NOTE: (1) Optional 10µF electrolytic (nonpolarized) capacitors reduce common-mode offset errors.
FIGURE 2. Complete Audio Driver/Receiver Circuit.
8
DRV134, DRV135
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SBOS094A
Excellent internal design and layout techniques provide low
signal distortion, high output level (+27dBu), and a low
noise floor (–98dBu). Laser trimming of thin film resistors
assures excellent output common-mode rejection (OCMR)
and signal balance ratio (SBR). In addition, low dc voltage
offset reduces errors and minimizes load currents.
Up to approximately 10kHz, distortion is below the measurement limit of commonly used test equipment. Furthermore, distortion remains relatively constant over the wide
output voltage swing range (approximately 2.5V from the
positive supply and 1.5V from the negative supply). A
special output stage topology yields a design with minimum
distortion variation from lot-to-lot and unit-to-unit. Furthermore, the small and large signal transient response curves
demonstrate the DRV134’s stability under load.
For best system performance, it is recommended that a high
input-impedance difference amplifier be used as the receiver. Used with the INA134 (G = 0dB) or the INA137 (G
= ±6dB) differential line receivers, the DRV134 forms a
complete solution for driving and receiving audio signals,
replacing input and output coupling transformers commonly
used in professional audio systems (Figure 2). When used
with the INA137 (G = –6dB) overall system gain is unity.
OUTPUT COMMON-MODE REJECTION
Output common-mode rejection (OCMR) is defined as the
change in differential output voltage due to a change in
output common-mode voltage. When measuring OCMR,
VIN is grounded and a common-mode voltage, VCM, is
applied to the output as shown in Figure 4. Ideally no
differential mode signal (VOD) should appear. However, a
small mode-conversion effect causes an error signal whose
magnitude is quantified by OCMR.
AUDIO PERFORMANCE
The DRV134 was designed for enhanced ac performance.
Very low distortion, low noise, and wide bandwidth provide
superior performance in high quality audio applications.
Laser-trimmed matched resistors provide optimum output
common-mode rejection (typically 68dB), especially when
compared to circuits implemented with op amps and discrete
precision resistors. In addition, high slew rate (15V/µs) and
fast settling time (2.5µs to 0.01%) ensure excellent dynamic
response.
+18V
1µF
VIN
The DRV134 has excellent distortion characteristics. As
shown in the distortion data provided in the typical performance curves, THD+Noise is below 0.003% throughout the
audio frequency range under various output conditions. Both
differential and single-ended modes of operation are shown.
In addition, the optional 10µF blocking capacitors used to
minimize VOCM errors have virtually no effect on performance. Measurements were taken with an Audio Precision
System One (with the internal 80kHz noise filter) using the
THD test circuit shown in Figure 3.
6
4
7
8
VOD
DRV134
Gnd
1
2
5
3
300Ω(1)
+VO
300Ω(1)
–VO
600Ω
1µF
VCM = 10Vp-p
–18V
OCMR = –20 Log
(
VOD
VCM
)
at f = 1kHz, VOD = (+VO) – (–VO)
NOTE: (1) Matched to 0.1%.
FIGURE 4. Output Common-Mode Rejection Test Circuit.
+18V
+18V
1µF
VIN
4
6
1µF
Test Point
or
+VO
7
–In
DRV134
5
INA137
RL
1
2
3
7
2
8
–VO
1
+In
3
R1
5
6
VOUT
4
R2
1µF
1µF
–18V
–18V
NOTE: Cable loads, where indicated, are Belden 9452 cable.
FIGURE 3. Distortion Test Circuit.
DRV134, DRV135
SBOS094A
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9
SIGNAL BALANCE RATIO
Signal balance ratio (SBR) measures the symmetry of the
output signals under loaded conditions. To measure SBR an
input signal is applied and the outputs are summed as shown
in Figure 5. VOUT should be zero since each output ideally
is exactly equal and opposite. However, an error signal
results from any imbalance in the outputs. This error is
quantified by SBR. The impedances of the DRV134’s out
put stages are closely matched by laser trimming to minimize SBR errors. In an application, SBR also depends on the
balance of the load network.
+18V
1µF
VIN = 10Vp-p
6
4
+VO
7
8
1
2
5
3
300Ω(1)
VOUT
–VO
600Ω
1µF
–18V
SBR = –20 Log
(
VOUT
VIN
)
CABLE
The DRV134 is capable of driving large signals into 600Ω
loads over long cables. Low impedance shielded audio
cables such as the standard Belden 8451 or 9452 (or similar)
are recommended, especially in applications where long
cable lengths are required.
THERMAL PERFORMANCE
The DRV134 and DRV135 have robust output drive capability and excellent performance over temperature. In most
applications there is no significant difference between the
DIP, SOL-16, and SO-8 packages. However, for applications with extreme temperature and load conditions, the
SOL-16 (DRV134UA) or DIP (DRV134PA) packages are
recommended. Under these conditions, such as loads greater
than 600Ω or very long cables, performance may be degraded in the SO-8 (DRV135UA) package.
300Ω(1)
DRV134
Gnd
For best rejection of line noise and hum differential mode
operation is recommended. However, single-ended performance is adequate for many applications. In general singleended performance is comparable to differential mode (see
THD+N typical performance curves), but the commonmode and noise rejection inherent in balanced-pair systems
is lost.
at f = 1kHz
NOTE: (1) Matched to 0.1%.
FIGURE 5. Signal Balance Ratio Test Circuit.
SINGLE-ENDED OPERATION
The DRV134 can be operated in single-ended mode without
degrading output drive capability. Single-ended operation
requires that the unused side of the output pair be grounded
(both the VO and Sense pins) to a low impedance return path.
Gain remains +6dB. Grounding the negative outputs as
shown in Figure 6 results in a noninverted output signal
(G = +2) while grounding the positive outputs gives an
inverted output signal (G = –2).
LAYOUT CONSIDERATIONS
A driver/receiver balanced-pair (such as the DRV134 and
INA137) rejects the voltage differences between the grounds
at each end of the cable, which can be caused by ground
currents, supply variations, etc. In addition to proper bypassing, the suggestions below should be followed to achieve
optimal OCMR and noise rejection.
• The DRV134 input should be driven by a low impedance
source such as an op amp or buffer.
• As is the case for any single-ended system, the source’s
common should be connected as close as possible to the
DRV134’s ground. Any ground offset errors in the source
will degrade system performance.
• Symmetry on the outputs should be maintained.
V+
VIN
VOUT = 2VIN
6
7
4
8
DRV134
600Ω
1
2
3
5
• Shielded twisted-pair cable is recommended for all applications. Physical balance in signal wiring should be maintained. Capacitive differences due to varying wire lengths
may result in unequal noise pickup between the pair and
degrade OCMR. Follow industry practices for proper system grounding of the cables.
G = +6dB
V–
FIGURE 6. Typical Single-Ended Application.
10
DRV134, DRV135
www.ti.com
SBOS094A
PACKAGE OPTION ADDENDUM
www.ti.com
7-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
DRV134PA
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
DRV134PA
DRV134PAG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
DRV134PA
DRV134UA
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
DRV134UA
DRV134UA/1K
ACTIVE
SOIC
DW
16
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
DRV134UA
DRV134UA/1KE4
ACTIVE
SOIC
DW
16
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
DRV134UA
DRV134UAE4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
DRV134UA
DRV135UA
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
DRV
135UA
DRV135UA/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
DRV
135UA
DRV135UA/2K5E4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
DRV
135UA
DRV135UAG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
DRV
135UA
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(3)
7-Apr-2013
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DRV134UA/1K
SOIC
DW
16
1000
330.0
16.4
10.75
10.7
2.7
12.0
16.0
Q1
DRV135UA/2K5
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DRV134UA/1K
SOIC
DW
16
1000
367.0
367.0
38.0
DRV135UA/2K5
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
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