ATMEL AT28BV64B-20TU 64k (8k x 8) battery-voltage parallel eeprom with page write and software data protection Datasheet

Features
• Single 2.7V to 3.6V Supply
• Hardware and Software Data Protection
• Low Power Dissipation
•
•
•
•
•
•
•
•
– 15 mA Active Current
– 20 µA CMOS Standby Current
Fast Read Access Time – 200 ns
Automatic Page Write Operation
– Internal Address and Data Latches for 64 Bytes
– Internal Control Timer
Fast Write Cycle Times
– Page Write Cycle Time: 10 ms Maximum
– 1 to 64 Byte Page Write Operation
DATA Polling for End of Write Detection
High-reliability CMOS Technology
– Endurance: 100,000 Cycles
– Data Retention: 10 Years
JEDEC Approved Byte-wide Pinout
Industrial Temperature Ranges
Green (Pb/Halide-free) Packaging Only
64K (8K x 8)
Battery-Voltage
Parallel
EEPROM
with Page Write
and Software
Data Protection
1. Description
The AT28BV64B is a high-performance electrically erasable programmable read onlymemory (EEPROM). Its 64K of memory is organized as 8,192 words by 8 bits. Manufactured with Atmel’s advanced nonvolatile CMOS technology, the device offers
access times to 200 ns with power dissipation of just 54 mW. When the device is
deselected, the CMOS standby current is less than 20 µA.
AT28BV64B
The AT28BV64B is accessed like a static RAM for the read or write cycle without the
need for external components. The device contains a 64 byte page register to allow
writing of up to 64 bytes simultaneously. During a write cycle, the addresses and 1 to
64 bytes of data are internally latched, freeing the address and data bus for other
operations. Following the initiation of a write cycle, the device will automatically write
the latched data using an internal control timer. The end of a write cycle can be
detected by DATA polling of I/O7. Once the end of a write cycle has been detected a
new access for a read or write can begin.
Atmel’s AT28BV64B has additional features to ensure high quality and manufacturability. A software data protection mechanism guards against inadvertent writes. The
device also includes an extra 64 bytes of EEPROM for device identification or
tracking.
0299I–PEEPR–4/09
2. Pin Configurations
32-lead PLCC Top View
A0 - A12
Addresses
CE
Chip Enable
OE
Output Enable
WE
Write Enable
I/O0 - I/O7
Data Inputs/Outputs
NC
No Connect
DC
Don’t Connect
A6
A5
A4
A3
A2
A1
A0
NC
I/O0
5
6
7
8
9
10
11
12
13
29
28
27
26
25
24
23
22
21
14
15
16
17
18
19
20
Function
A8
A9
A11
NC
OE
A10
CE
I/O7
I/O6
I/O1
I/O2
GND
DC
I/O3
I/O4
I/O5
Pin Name
4
3
2
1
32
31
30
A7
A12
NC
DC
VCC
WE
NC
2.2
2.1
28-lead SOIC Top View
NC
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
WE
NC
A8
A9
A11
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
Note:
PLCC package pins 1 and 17 are Don’t Connect.
2.3
28-lead TSOP Top View
OE
A11
A9
A8
NC
WE
VCC
NC
A12
A7
A6
A5
A4
A3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A1
A2
AT28BV64B
0299I–PEEPR–4/09
AT28BV64B
3. Block Diagram
4. Device Operation
4.1
Read
The AT28BV64B is accessed like a static RAM. When CE and OE are low and WE is high, the
data stored at the memory location determined by the address pins is asserted on the outputs.
The outputs are put in the high impedance state when either CE or OE is high. This dual-line
control gives designers flexibility in preventing bus contention in their systems.
4.2
Byte Write
A low pulse on the WE or CE input with CE or WE low (respectively) and OE high initiates a write
cycle. The address is latched on the falling edge of CE or WE, whichever occurs last. The data is
latched by the first rising edge of CE or WE. Once a byte write has been started, it will automatically time itself to completion. Once a programming operation has been initiated and for the
duration of tWC, a read operation will effectively be a polling operation.
4.3
Page Write
The page write operation of the AT28BV64B allows 1 to 64 bytes of data to be written into the
device during a single internal programming period. A page write operation is initiated in the
same manner as a byte write; the first byte written can then be followed by 1 to 63 additional
bytes. Each successive byte must be written within 100 µs (tBLC) of the previous byte. If the tBLC
limit is exceeded, the AT28BV64B will cease accepting data and commence the internal programming operation. All bytes during a page write operation must reside on the same page as
defined by the state of the A6 to A12 inputs. For each WE high to low transition during the page
write operation, A6 to A12 must be the same.
The A0 to A5 inputs specify which bytes within the page are to be written. The bytes may be
loaded in any order and may be altered within the same load period. Only bytes which are specified for writing will be written; unnecessary cycling of other bytes within the page does not occur.
3
0299I–PEEPR–4/09
4.4
DATA Polling
The AT28BV64B features DATA Polling to indicate the end of a write cycle. During a byte or
page write cycle an attempted read of the last byte written will result in the complement of the
written data to be presented on I/O7. Once the write cycle has been completed, true data is valid
on all outputs, and the next write cycle may begin. DATA Polling may begin at anytime during the
write cycle.
4.5
Toggle Bit
In addition to DATA Polling, the AT28BV64B provides another method for determining the end of
a write cycle. During the write operation, successive attempts to read data from the device will
result in I/O6 toggling between one and zero. Once the write has completed, I/O6 will stop toggling and valid data will be read. Reading the toggle bit may begin at any time during the write
cycle.
4.6
Data Protection
If precautions are not taken, inadvertent writes may occur during transitions of the host system
power supply. Atmel® has incorporated both hardware and software features that will protect the
memory against inadvertent writes.
4.6.1
Hardware Protection
Hardware features protect against inadvertent writes to the AT28BV64B in the following ways:
(a) VCC power-on delay – once VCC has reached 1.8V (typical) the device will automatically time
out 10 ms (typical) before allowing a write; (b) write inhibit – holding any one of OE low, CE high
or WE high inhibits write cycles; and (c) noise filter – pulses of less than 15 ns (typical) on the
WE or CE inputs will not initiate a write cycle.
4.6.2
Software Data Protection
A software-controlled data protection feature has been implemented on the AT28BV64B. Software data protection (SDP) helps prevent inadvertent writes from corrupting the data in the
device. SDP can prevent inadvertent writes during power-up and power-down as well as any
other potential periods of system instability.
The AT28BV64B can only be written using the software data protection feature. A series of three
write commands to specific addresses with specific data must be presented to the device before
writing in the byte or page mode. The same three write commands must begin each write operation. All software write commands must obey the page mode write timing specifications. The
data in the 3-byte command sequence is not written to the device; the addresses in the command sequence can be utilized just like any other location in the device.
Any attempt to write to the device without the 3-byte sequence will start the internal write timers.
No data will be written to the device; however, for the duration of tWC, read operations will effectively be polling operations.
4.7
Device Identification
An extra 64 bytes of EEPROM memory are available to the user for device identification. By raising A9 to 12V ± 0.5V and using address locations 7FC0H to 7FFFH, the additional bytes may be
written to or read from in the same manner as the regular memory array.
4
AT28BV64B
0299I–PEEPR–4/09
AT28BV64B
5. DC and AC Operating Range
AT28BV64B-20
Operating Temperature (Case)
-40°C - 85°C
VCC Power Supply
2.7V to 3.6V
6. Operating Modes
Mode
CE
OE
WE
I/O
Read
VIL
VIL
VIH
DOUT
VIL
VIH
VIL
DIN
VIH
X(1)
X
High Z
Write Inhibit
X
X
VIH
Write Inhibit
X
VIL
X
Output Disable
X
VIH
X
High Z
Chip Erase
VIL
VH(3)
VIL
High Z
Write
(2)
Standby/Write Inhibit
Notes:
1. X can be VIL or VIH.
2. Refer to AC Programming Waveforms.
3. VH = 12.0V ± 0.5V.
7. Absolute Maximum Ratings*
Temperature Under Bias................................ -55°C to +125°C
Storage Temperature ..................................... -65°C to +150°C
All Input Voltages
(including NC Pins)
with Respect to Ground ...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground .............................-0.6V to VCC + 0.6V
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability
Voltage on OE and A9
with Respect to Ground ...................................-0.6V to +13.5V
5
0299I–PEEPR–4/09
8. DC Characteristics
Symbol
Parameter
Condition
ILI
Input Load Current
ILO
Min
Max
Units
VIN = 0V to VCC + 1V
10
µA
Output Leakage Current
VI/O = 0V to VCC
10
µA
ISB
VCC Standby Current CMOS
CE = VCC - 0.3V to VCC + 1V
50
µA
ICC
VCC Active Current
f = 5 MHz; IOUT = 0 mA
15
mA
VIL
Input Low Voltage
0.6
V
VIH
Input High Voltage
VOL
Output Low Voltage
IOL = 1.6 mA
VOH
Output High Voltage
IOH = -100 µA
2.0
V
0.45
2.0
V
V
9. AC Read Characteristics
AT28BV64B-20
Symbol
Parameter
tACC
tCE(1)
tOE(2)
OE to Output Delay
tDF(3)(4)
tOH
Min
Max
Units
Address to Output Delay
200
ns
CE to Output Delay
200
ns
0
80
ns
CE or OE to Output Float
0
55
ns
Output Hold from OE, CE or Address, Whichever Occurred First
0
ns
10. AC Read Waveforms(1)(2)(3)(4)
Notes:
1. CE may be delayed up to tACC - tCE after the address transition without impact on tACC.
2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by tACC - tOE after an address change
without impact on tACC.
3. tDF is specified from OE or CE whichever occurs first (CL = 5 pF).
4. This parameter is characterized and is not 100% tested.
6
AT28BV64B
0299I–PEEPR–4/09
AT28BV64B
11. Input Test Waveforms and Measurement Level
tR, tF < 20 ns
12. Output Test Load
13. Pin Capacitance
f = 1 MHz, T = 25°C(1)
Symbol
Typ
Max
Units
Conditions
CIN
4
6
pF
VIN = 0V
COUT
8
12
pF
VOUT = 0V
Note:
1. This parameter is characterized and is not 100% tested.
7
0299I–PEEPR–4/09
14. AC Write Characteristics
Symbol
Parameter
tAS, tOES
Address, OE Set-up Time
tAH
Address Hold Time
tCS
Min
Max
Units
0
ns
100
ns
Chip Select Set-up Time
0
ns
tCH
Chip Select Hold Time
0
ns
tWP
Write Pulse Width (WE or CE)
200
ns
tDS
Data Set-up Time
100
ns
tDH, tOEH
Data, OE Hold Time
0
ns
tDV
Time to Data Valid
tWPH
Write Pulse Width High
Notes:
NR
(1)
100
ns
1. NR = No Restriction
2. All byte write operations must be preceded by the SDP command sequence.
15. AC Write Waveforms
15.1
WE Controlled
15.2
CE Controlled
8
AT28BV64B
0299I–PEEPR–4/09
AT28BV64B
16. Page Mode Characteristics
Symbol
Parameter
tWC
Write Cycle Time
tAS
Address Set-up Time
tAH
Min
Max
Units
10
ms
0
ns
Address Hold Time
100
ns
tDS
Data Set-up Time
100
ns
tDH
Data Hold Time
0
ns
tWP
Write Pulse Width
200
ns
tBLC
Byte Load Cycle Time
tWPH
Write Pulse Width High
100
100
µs
ns
17. Write Algorithm(1)
LOAD DATA AA
TO
ADDRESS 1555
LOAD DATA 55
TO
ADDRESS 0AAA
LOAD DATA A0
TO
ADDRESS 1555
WRITES ENABLED(2)
LOAD DATA XX
TO
ANY ADDRESS(3)
LOAD LAST BYTE
TO
LAST ADDRESS
Notes:
ENTER DATA
PROTECT STATE
1. Data Format: I/O7 - I/O0 (Hex); Address Format: A12 - A0 (Hex).
2. Data protect state will be re-activated at the end of the write cycle.
3. 1 to 64 bytes of data are loaded.
9
0299I–PEEPR–4/09
18. Software Data Protection Write Cycle Waveforms(1)(2)(3)
Notes:
1. A0 - A12 must conform to the addressing sequence for the first three bytes as shown above.
2. A6 through A12 must specify the same page address during each high to low transition of WE (or CE) after the software
code has been entered.
3. OE must be high only when WE and CE are both low.
19. Data Polling Characteristics(1)
Symbol
Parameter
tDH
Data Hold Time
tOEH
OE Hold Time
Min
OE to Output Delay
tWR
Write Recovery Time
Notes:
Max
Units
0
ns
0
ns
(2)
tOE
Typ
ns
0
ns
1. These parameters are characterized and not 100% tested.
2. See AC Read Characteristics.
20. Data Polling Waveforms
10
AT28BV64B
0299I–PEEPR–4/09
AT28BV64B
21. Toggle Bit Characteristics(1)
Symbol
Parameter
tDH
Data Hold Time
10
ns
tOEH
OE Hold Time
10
ns
tOE
OE to Output Delay(2)
tOEHP
OE High Pulse
tWR
Write Recovery Time
Notes:
Min
Typ
Max
Units
ns
150
ns
0
ns
1. These parameters are characterized and not 100% tested.
2. See AC Read Characteristics.
22. Toggle Bit Waveforms
Notes:
1. Toggling either OE or CE or both OE and CE will operate toggle bit.
2. Beginning and ending state of I/O6 will vary.
3. Any address location may be used, but the address should not vary.
11
0299I–PEEPR–4/09
23. Ordering Information
23.1
Green Package Option (Pb/Halide-free)
ICC (mA)
tACC
(ns)
Active
Standby
200
15
0.05
23.2
Ordering Code
Package
AT28BV64B-20JU
AT28BV64B-20SU
AT28BV64B-20TU
32J
28S
28T
Operation Range
Industrial
(-40°C to 85°C)
Die Products
Contact Atmel Sales in regards to die and wafer sales.
Package Type
32J
32-lead, Plastic J-leaded Chip Carrier (PLCC)
28S
28-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC)
28T
28-lead, Plastic Thin Small Outline Package (TSOP)
12
AT28BV64B
0299I–PEEPR–4/09
AT28BV64B
24. Packaging Information
24.1
32J – PLCC
1.14(0.045) X 45˚
PIN NO. 1
IDENTIFIER
1.14(0.045) X 45˚
0.318(0.0125)
0.191(0.0075)
E1
E
E2
B1
B
e
A2
D1
A1
D
A
0.51(0.020)MAX
45˚ MAX (3X)
COMMON DIMENSIONS
(Unit of Measure = mm)
D2
Notes:
1. This package conforms to JEDEC reference MS-016, Variation AE.
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.102 mm) maximum.
SYMBOL
MIN
NOM
MAX
A
3.175
–
3.556
A1
1.524
–
2.413
A2
0.381
–
–
D
12.319
–
12.573
D1
11.354
–
11.506
D2
9.906
–
10.922
E
14.859
–
15.113
E1
13.894
–
14.046
E2
12.471
–
13.487
B
0.660
–
0.813
B1
0.330
–
0.533
e
NOTE
Note 2
Note 2
1.270 TYP
10/04/01
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
32J, 32-lead, Plastic J-leaded Chip Carrier (PLCC)
DRAWING NO.
REV.
32J
B
13
0299I–PEEPR–4/09
24.2
28S – SOIC
Dimensions in Millimeters and (Inches).
Controlling dimension: Millimeters.
0.51(0.020)
0.33(0.013)
7.60(0.2992) 10.65(0.419)
7.40(0.2914) 10.00(0.394)
PIN 1
1.27(0.50) BSC
TOP VIEW
18.10(0.7125)
17.70(0.6969)
2.65(0.1043)
2.35(0.0926)
0.30(0.0118)
0.10(0.0040)
SIDE VIEWS
0.32(0.0125)
0.23(0.0091)
0º ~ 8º
1.27(0.050)
0.40(0.016)
8/4/03
R
14
2325 Orchard Parkway
San Jose, CA 95131
TITLE
28S, 28-lead, 0.300" Body, Plastic Gull Wing Small Outline (SOIC)
JEDEC Standard MS-013
DRAWING NO.
REV.
28S
B
AT28BV64B
0299I–PEEPR–4/09
AT28BV64B
24.3
28T – TSOP
PIN 1
0º ~ 5º
c
Pin 1 Identifier Area
D1 D
L
b
e
L1
A2
E
A
GAGE PLANE
SEATING PLANE
COMMON DIMENSIONS
(Unit of Measure = mm)
A1
MIN
NOM
MAX
A
–
–
1.20
A1
0.05
–
0.15
A2
0.90
1.00
1.05
D
13.20
13.40
13.60
D1
11.70
11.80
11.90
Note 2
E
7.90
8.00
8.10
Note 2
L
0.50
0.60
0.70
SYMBOL
Notes:
1. This package conforms to JEDEC reference MO-183.
2. Dimensions D1 and E do not include mold protrusion. Allowable
protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side.
3. Lead coplanarity is 0.10 mm maximum.
L1
NOTE
0.25 BASIC
b
0.17
0.22
0.27
c
0.10
–
0.21
e
0.55 BASIC
12/06/02
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
28T, 28-lead (8 x 13.4 mm) Plastic Thin Small Outline
Package, Type I (TSOP)
DRAWING NO.
REV.
28T
C
15
0299I–PEEPR–4/09
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Atmel Corporation
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0299I–PEEPR–4/09
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