TSC DB3RI 150mw bi-directional trigger diode Datasheet

DB3-DB3TG
150mW Bi-directional Trigger Diode
Small Signal Diode
DO-35 Axial Lead
HERMETICALLY SEALED GLASS
D
Features
—Designed for through-Hole Device Type Mounting.
C
A
—Hermetically Sealed Glass.
—All external surface are corrosion resistant and
terminals are readily solderable.
B
—High reliability glass passivation insuring parameter
stability and protection against junction contamination.
—Pb free version and RoHS compliant
Dimensions
Mechanical Data
Unit (mm)
Unit (inch)
Min
Max
Min
Max
—Case :DO-35 Solder Hot Dip Tin (Sn) lead finish
A
0.45
0.55
0.018 0.022
—Terminal: Pure tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
B
3.05
4.00
0.120 0.157
C
25.4
38.1
1.000 1.500
—High temperature soldering guaranteed: 260°C/10s
D
1.53
2.28
0.060 0.090
—Marking : DB3/DB3TG
—Weight : 0.1255 gram (approximately)
Ordering Information
Part No.
Package
Packing
Marking
DO-35
DB3 RI
5K / 10" Reel
DB3
DO-35
DB3TG RI
5K / 10" Reel DB3TG
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Maximum Ratings
Type Number
Power Dissipation
Repetitive Peak Forward Current
Pulse Width=
20μsec
Thermal Resistance (Junction to Ambient) (Note 1)
Junction and Storage Temperature Range
Symbol
Value
Units
PD
150
mW
IFRM
2
A
RθJA
400
°C/W
TJ, TSTG
-40 to + 125
°C
Notes:1. Valid provided that electrodes are kept at ambient temperature
Version : D10
DB3-DB3TG
150mW Bi-directional Trigger Diode
Small Signal Diode
Electrical Characteristics
Type Number
Symbol
Break-over Voltage
C=
Break-over Voltage Symmetry
Break-over Current
Dynamic Breakover Voltage
Leakage Current
C=
22nF
22nF
C=
22nF
IBO to IF=10mA
DB3
DB3TG
30
Units
Min.
28
Typ.
32
32
Max.
36
34
+ / -VBO
IBO
Max.
+/-3
+/-2
V
Max.
100
15
μA
5
9
V
VBO
V
ΔV
Min.
VB= 0.5VBO (MAX)
IB
Max.
10
μA
*see diagram 1
VO
Min.
5
V
Output Voltage
Tape & Reel specification
Item
Overall width
Tape spacing
Component Pitch
Untaped lead
Bent
Tape Mismatch
Glass offset
Taped lead
lead beyond tape
Reel outside diameter
Reel inner diameter
Feed hole width
Reel width
Symbol
A
B
C
L1-L2
K
E
F
G
H
D
D1
D2
W1
Dimension(mm)
64+1.69/-0.69
52.0+/-0.69
5.08+/-0.40
+/-0.69
1.2 Max
0.55(MAX)
0.69(MAX)
3.2Min
0
260+/-3
48+/-1
20+/-0.5
72+3/-1
H
G
W1
L1
F
D
D2
B
D1
A
L2
E
C
K
Version : D10
DB3-DB3TG
150mW Bi-directional Trigger Diode
Small Signal Diode
Rating and Characteristic Curves
I
IF=10m
IBO
V
IB
VB=0.5*VBO
VF
ΔV
VBO
VBO
:Break-Over Voltage
IBO
: Break-Over Current
ΔV
: Dynamic Breakover Voltage
IB
: Leakage Current at V B=0.5*VBO
VF
: Voltage at Current I F=10mA
Diagram 1: Test Circuit
FIG 1 Admissible Power Dissipation Curve
Power Dissipation (mW)
160
120
80
40
0
0
10 20 30 40 50 60 70 80 90 100 110 120 130
Ambient Tempeatature ( oC)
FIG 3 Repetitive peak pulse current versus pulse
duration (maximum values)
FIG 2 Relative variation of VBO versus junction
temperature (typical values)
Repetitive peak pulse current (A)
VBO [Tj] / VBO [Tj=25°C]
1.08
1.07
1.06
1.05
1.04
1.03
1.02
1.01
1.00
25
50
75
Tj(°C)
100
125
100
10
1
0.1
1
10
100
tp (μs)
Version : D10
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