TI1 DS26F32MQML Ds26f32mqml quad differential line receiver Datasheet

DS26F32MQML
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SNOSAS5A – MARCH 2006 – REVISED APRIL 2013
DS26F32MQML Quad Differential Line Receivers
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FEATURES
DESCRIPTION
•
The DS26F32 is a quad differential line receiver
designed to meet the requirements of EIA Standards
RS-422 and RS-423, and Federal Standards 1020
and 1030 for balanced and unbalanced digital data
transmission.
1
2
•
•
•
•
Input Voltage Range of ±7.0V (Differential or
Common Mode) ±0.2V Sensitivity over the
Input Voltage Range
High Input Impedance
Operation from Single +5.0V Supply
Input Pull-Down Resistor Prevents Output
Oscillation on Unused Channels
TRI-STATE Outputs, with Choice of
Complementary Enables, for Receiving
Directly onto a Data Bus
The DS26F32 offers improved performance due to
the use of state-of-the-art L-FAST bipolar technology.
The L-FAST technology allows for higher speeds and
lower currents by utilizing extremely short gate delay
times. Thus, the DS26F32 features lower power,
extended temperature range, and improved
specifications.
The device features an input sensitivity of 200 mV
over the input common mode range of ±7.0V. The
DS26F32 provides an enable function common to all
four receivers and TRI-STATE outputs with 8.0 mA
sink capability. Also, a fail-safe input/output
relationship keeps the outputs high when the inputs
are open.
The DS26F32 offers optimum performance when
used with the DS26F31 Quad Differential Line Driver.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2013, Texas Instruments Incorporated
DS26F32MQML
SNOSAS5A – MARCH 2006 – REVISED APRIL 2013
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Connection Diagrams
Figure 2. 20-Lead LCCC Package-Top View
See Package Number NAJ0020A
Figure 1. 16-Lead CDIP Package-Top View
See Package Number NAC0016A, NFE0016A, or
NAD0016A
Table 1. Function Table (Each Receiver) (1)
Differential Inputs
Outputs
VID = (V I+) − (VI−)
E
E
OUT
VID ≥ 0.2V
H
X
H
X
L
H
H
X
L
X
L
L
L
H
Z
VID ≤ −0.2V
X
(1)
Enables
H = High Level
L = Low Level
X = Immaterial
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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Absolute Maximum Ratings
(1)
Storage Temperature Range
−65°C ≤ TA ≤ +150°C
Operating Temperature Range
−55°C ≤ TA ≤ +125°C
Lead Temperature
(soldering, 60 sec)
300°C
Supply Voltage
7.0V
Common Mode Voltage Range
±25V
Differential Input Voltage
±25V
Enable Voltage
7.0V
Output Sink Current
50 mA
Maximum Power Dissipation (PD maxat 25°C)
(2) (3)
,
500 mW
Thermal Resistance
θJA
NFE0016A package
100°C/W
NAD0016A package
142°C/W
NAJ0020A package
87°C/W
θJC
Junction-to- case
(1)
(2)
(3)
See MIL-STD-1835
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not verify specific performance limits. For verified specifications and test conditions, see the
Electrical Characteristics. The verified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
Derate J package 10.0mW/°C above +25°C, derate W package 7.1mW/°C above +25°C, derate E package 11.5mW/°C above +25°C.
Power dissipation must be externally controlled at elevated temperatures.
Recommended Operating Range
−55°C ≤ TA ≤ +125°C
Operating Temperature
Supply Voltage
4.5V to 5.5V
Table 2. Radiation Features
DS26F32MJRQMLV
100 krads (Si)
DS26F32MWRQMLV
100 krads (Si)
DS26F32MWGRQMLV
100 krads (Si)
Table 3. Quality Conformance Inspection Mil-Std-883, Method 5005 - Group A
Subgroup
Description
Temp °C
1
Static tests at
25
2
Static tests at
125
3
Static tests at
-55
4
Dynamic tests at
25
5
Dynamic tests at
125
6
Dynamic tests at
-55
7
Functional tests at
25
8A
Functional tests at
125
8B
Functional tests at
-55
9
Switching tests at
25
10
Switching tests at
125
11
Switching tests at
-55
12
Settling time at
25
13
Settling time at
125
14
Settling time at
-55
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DS26F32 Electrical Characteristics DC Parameters
The following conditions apply, unless otherwise specified.
DC:
VCC = 5V (1)
Parameter
IIn
Input Current
Max
Units
Subgroups
Pin under test
VCC = 4.5V, VI = 15V
Other inputs -15V ≤ VI ≤ +15V
2.3
mA
1, 2, 3
Pin under test
VCC = 5.5V, VI = -15V
Other inputs -15V ≤ VI ≤ +15V
-2.8
mA
1, 2, 3
-360
µA
1, 2, 3
10
µA
1, 2, 3
Test Conditions
Notes
Min
IIL
Logical "0" Enable Current
VCC = 5.5V, VEn = 0.4V
IIH
Logical "1" Enable Current
VCC = 5.5V, VI = 2.7V
II
Logical "1" Enable Current
VCC = 5.5V, VI = 5.5V
50
µA
1, 2, 3
VIK
Input Clamp Voltage (Enable)
VCC = 4.5V, II = -18mA
-1.5
V
1, 2, 3
VOH
Logical "1" Output Voltage
VCC = 4.5V, IOH = -440µA,
ΔVI = 1V, VEn = .8 = VEn
V
1, 2, 3
VOL
Logical "0" Output Voltage
VCC = 4.5V, VEn =0.8V = VEn,
IOL = 4mA, ΔVI = -1V
0.4
V
1, 2, 3
VCC = 4.5V, VEn = 8V = VEn,
IOL = 8mA, ΔVI = -1V
.45
V
1, 2, 3
2.5
ICC
Supply Current
VCC = 5.5V, All VI = Gnd,
VEn = 0V, VEn = 2V
50
mA
1, 2, 3
IOZ
Off-State Output Current
VCC = 5.5V, VO = 0.4V,
VEn = 0.8V, VEn = 2V
-20
µA
1, 2, 3
VCC = 5.5V, VO = 2.4V,
VEn = 0.8V, VEn = 2V
20
µA
1, 2, 3
RI
Input Resistance
-15 ≤ VCM ≤ 15V
KΩ
1, 2, 3
VTh
Differential Input Voltage
VCC = 4.5V, VOUT = VOL or VOH
-7V ≤ VCM ≤ 7V,
VEn = VEn = 2.5V
(2)
-0.2
0.2
V
1, 2, 3
VCC = 5.5V, VOUT = VOL or VOH
-7V ≤ VCM ≤ 7V,
VEn = VEn = 2.5V
(2)
-0.2
0.2
V
1, 2, 3
0.8
14
VIL
Logical "0" Input Voltage (Enable)
VCC = 5.5V
(2)
VIH
Logical "1" Input Voltage (Enable)
VCC = 4.5V
(2)
ISC Min
Output Short Circuit Current
VCC = 4.5V, VO = 0V,
ΔVI = 1V
ISC Max
Output Short Circuit Current
VCC = 5.5V, VO = 0V,
ΔVI = 1V
(1)
(2)
4
V
1, 2, 3
2.0
V
1, 2, 3
-15
mA
1, 2, 3
mA
1, 2, 3
-85
Pre and post irradiation limits are identical to those listed under AC and DC electrical characteristics. These parts may be dose rate
sensitive in a space environment and demonstrate enhanced low dose rate effect. Radiation end point limits for the noted parameters
are specified only for the conditions as specified in Mil-Std-883, Method 1019.5, Condition A
Parameter tested go-no-go only.
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DS26F32 Electrical Characteristics AC Parameters
The following conditions apply, unless otherwise specified.
AC:
VCC = 5V (1)
Parameter
tPLH
Test Conditions
CL = 50pF
CL = 15pF
tPHL
CL = 50pF
CL = 15pF
tPZH
Enable Time
CL = 50pF
CL = 15pF
tPZL
Enable Time
CL = 50pF
CL = 15pF
tPHZ
Disable Time
CL = 50pF
CL = 5pF
tPLZ
Disable Time
CL = 50pF
CL = 5pF
(1)
(2)
(3)
Notes
Min
Subgroups
Max
Units
(2)
23
nS
9
(2)
31
nS
10, 11
(3)
22
nS
9
(3)
30
nS
10, 11
(2)
23
nS
9
(2)
31
nS
10, 11
(3)
22
nS
9
(3)
30
nS
10, 11
(2)
18
nS
9
(2)
29
nS
10, 11
(3)
16
nS
9
(3)
27
nS
10, 11
(2)
20
nS
9
(2)
29
nS
10, 11
(3)
18
nS
9
(3)
27
nS
10, 11
(2)
55
nS
9
(2)
62
nS
10, 11
(3)
20
nS
9
(3)
27
nS
10, 11
(2)
30
nS
9
(2)
42
nS
10, 11
(3)
18
nS
9
(3)
30
nS
10, 11
Pre and post irradiation limits are identical to those listed under AC and DC electrical characteristics. These parts may be dose rate
sensitive in a space environment and demonstrate enhanced low dose rate effect. Radiation end point limits for the noted parameters
are specified only for the conditions as specified in Mil-Std-883, Method 1019.5, Condition A
Tested at 50pF, system capacitance exceeds 5pF to 15pF.
Tested at 50pF specifies limit at 15pF & 5pF.
DS26F32 Electrical Characteristics DC Drift Parameters
This section applies to -QMLV devices only. Devices shall be read & recorded at TA = 25°C before and after each burn-in and
shall not change by more than the limits indicated. The delta rejects shall be included in the PDA calculation.
Parameter
Test Conditions
Notes
Min
Max
Units
Subgroups
VOH
Logical "1" Output Voltage
VCC = 4.5V, IOH = -440µA,
ΔVI = 1V, VEn = 0.8V = VEn
-250
250
mV
1
VOL
Logical "0" Output Voltage
VCC = 4.5V, IOL = 4mA,
ΔVI = -1V, VEn = 0.8V = VEn
-45
45
mV
1
VCC = 4.5V, IOL = 8mA,
Δ VI = -1V, VEn = 0.8V = VEn
-45
45
mV
1
Pin under test
VCC = 4.5V, VI = 15V
Other inputs -15V ≤ VI ≤ +15V
-0.28
0.28
mA
1
Pin under test
VCC = 5.5V, VI = -15V
Other inputs -15V ≤ VI ≤ +15V
-0.28
0.28
mA
1
II
Input Current
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Figure 3. Logic Symbol
(A)
(B)
C L includes probe and jig capacitance.
A.
Parameter tested go-no-go only.
B.
Tested at 50pF specifies limit at 15pF and 5pF.
Figure 4. Load Test Circuit for Three-State Outputs
Diagram shown for ENABLE Low.
S1 and S2 of Load Circuit are closed except where shown.
Pulse Generator of all Pulses: Rate ≤ 1.0 MHz, ZO = 50Ω, tr ≤ 6.0 ns, tf ≤ 6.0 ns.
Figure 5. Propagation Delay
6
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Diagram shown for ENABLE Low.
S1 and S2 of Load Circuit are closed except where shown.
Pulse Generator of all Pulses: Rate ≤ 1.0 MHz, ZO = 50Ω, tr ≤ 6.0 ns, tf ≤ 6.0 ns.
All diodes are IN916 or IN3064.
Figure 6. Enable and Disable Times
TYPICAL APPLICATION
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REVISION HISTORY
Released
8
Revision
3/01/06
*
4/15/2013
A
Section
New Release, Corporate format
Originator
Changes
L. Lytle
1 MDS data sheet converted into one Corp.
data sheet format. MNDS26F32M-X-RH Rev
0C0 will be archived.
TIS
Changed layout of National Data Sheet to TI
format
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PACKAGE OPTION ADDENDUM
www.ti.com
19-Jul-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962-7802005M2A
ACTIVE
LCCC
NAJ
20
50
TBD
Call TI
Call TI
-55 to 125
DS26F32ME/
883 Q
5962-78020
05M2A ACO
05M2A >T
5962-7802005MFA
ACTIVE
CFP
NAD
16
19
TBD
Call TI
Call TI
-55 to 125
DS26F32MW
/883 Q
5962-78020
05MFA ACO
05MFA >T
5962R7802005VEA
ACTIVE
CDIP
NFE
16
25
TBD
Call TI
Call TI
-55 to 125
DS26F32MJRQMLV
5962R7802005VEA Q
5962R7802005VFA
ACTIVE
CFP
NAD
16
19
TBD
Call TI
Call TI
-55 to 125
DS26F32MWR
QMLV Q
5962R78020
05VFA ACO
05VFA >T
DS26F32 MW8
ACTIVE
WAFERSALE
YS
0
1
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 125
DS26F32ME/883
ACTIVE
LCCC
NAJ
20
50
TBD
Call TI
Call TI
-55 to 125
DS26F32ME/
883 Q
5962-78020
05M2A ACO
05M2A >T
DS26F32MJRQMLV
ACTIVE
CDIP
NFE
16
25
TBD
Call TI
Call TI
-55 to 125
DS26F32MJRQMLV
5962R7802005VEA Q
DS26F32MW/883
ACTIVE
CFP
NAD
16
19
TBD
Call TI
Call TI
-55 to 125
DS26F32MW
/883 Q
5962-78020
05MFA ACO
05MFA >T
DS26F32MWRQMLV
ACTIVE
CFP
NAD
16
19
TBD
Call TI
Call TI
-55 to 125
DS26F32MWR
QMLV Q
5962R78020
05VFA ACO
05VFA >T
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
19-Jul-2016
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF DS26F32MQML, DS26F32MQML-SP :
• Military: DS26F32MQML
• Space: DS26F32MQML-SP
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
19-Jul-2016
NOTE: Qualified Version Definitions:
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 3
MECHANICAL DATA
NFE0016A
J0016A
J16A (REV L)
www.ti.com
MECHANICAL DATA
NAJ0020A
E20A (Rev F)
www.ti.com
MECHANICAL DATA
NAD0016A
W16A (Rev T)
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