Rohm BU2507FV 10bit 4ch/6ch d/a converter Datasheet

Datasheet
D/A Converter Series for Electronic Adjustment
10bit 4ch/6ch D/A Converters
BU2507FV
BU2508FV
General Description
Key Specifications
The BU2507FV and BU2508FV ICs are 10bit R-2R type
D/A converters with 6ch and 4ch outputs, respectively.
Each channel incorporates a full swing output-type buffer
amplifier with high speed output response characteristics,
resulting in a greatly shortened D/A output settling time.
The ICs also have digital input pins compatible with TTL
levels, and the maximum value of the data transfer
frequency is 10MHz. With the variable output range
function, the upper and lower limits of the output voltage
can be set separately from the power supply voltage.
■ Operating Supply Voltage Range:
■ Number of Channels:
BU2507FV:
BU2508FV:
■ Differential Non Linearity Error:
■ Integral Non Linearity Error:
■ Data Transfer Frequency:
Packages
6ch
4ch
±1.0LSB(Max)
±3.5LSB(Max)
10MHz(Max)
W(Typ) x D(Typ) x H(Max)
5.00mm x 6.40mm x 1.35mm
SSOP-B14
Features
4.5V to 5.5V
■ Built-in Multi-channel R-2R Type 10bit D/A Converter
(BU2508FV: 4 Channels, BU2507FV: 6 Channels)
■ Built-in Full Swing Output Buffer Amplifier for All
Channels
■ RESET Terminal to fix the Output Voltage to the Lower
Reference Level for All Channels
■ Digital Inputs Compatible with TTL Levels
■ 3-wire Serial Interface and RESET Signal to send a
14bit Format Word (4bit Address and 10bit Data)
Applications
SSOP-B14
■ Control of the Various Types of Consumer and
Industrial Equipment
Typical Application Circuit
VCC
VCC
VDD
VrefH
(VrefH)
VSS
VrefL
(VrefL)
AO1
AO1
CH1
CH1
AO2
AO2
CH2
CH2
AO3
AO3
CH3
CH3
AO6
AO6
CH6
CH6
RESET
Reset
Controller
Controller
○Product structure:Silicon monolithic integrated circuit
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p
TSZ22111・14・001
LD
LD
CLK
CLK
DI
DI
GND
GND
○This product has no designed protection against radioactive rays.
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BU2507FV
BU2508FV
Pin Configurations
SSOP-B14
(TOP VIEW)
14 13 12 11 10 9 8
1 2 3 4 5 6 7
Pin Descriptions
Description of terminal
No.
Terminal
name
Analog /
Digital
I/O
1
VSS
Analog
-
D/A converter lower side reference voltage (VrefL) input terminal
5
2
AO2
Analog
O
10bit D/A output (CH2)
3
3
AO3(TEST1)
Analog
O
10bit D/A output (CH3)
4
RESET
Digital
I
Fixes the output voltage to the lower reference level for all
channels.
5
AO4(TEST2)
Digital
I
10bit D/A output (CH4)
test terminal
6
AO5 (AO3)
Analog
O
10bit D/A output (CH5)
10bit D/A output (CH3)
7
VDD
Analog
-
D/A converter upper reference voltage (VrefH) input terminal
4
8
VCC
-
-
Power supply
-
9
AO6 (AO4)
Analog
O
10bit D/A output (CH6)
10
LD
Digital
I
11
CLK
Digital
I
12
DI
Digital
I
13
AO1
Analog
O
10bit D/A output (CH1)
3
14
GND
-
-
GND terminal
-
BU2507FV
BU2508FV
test terminal
(Note 1)
(Note 1)
10bit D/A output (CH4)
When the LD terminal is set to the high level voltage, 14bit data in
the shift register is loaded on to the address decoder and a
specified D/A output register.
Shift clock input terminal. At the rising edge of the CLK input, an
input value on the DI terminal is input to the 14bit shift register.
Serial data input terminal. Serial data length is 14bit (4bit address
and 10bit data).
Equivalent
circuit No.
3
2
3
3
3
1
1
1
(Note 1) The TEST1 and TEST2 terminals of the BU2508FV should be left open. These terminals are used for testing.
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BU2507FV
BU2508FV
Block Diagrams
VDD
(VrefH)
7
6
AO3
TEST2
5
4
Reset
RESET
10bit R-2R
converter
DA
D/Aコンバータ
10bit R-2R
10bit Latch
3
converter
DA
D/Aコンバータ
Address
アドレス
decoder
デコーダ
・・・
10bit Latch
4
10bit R-2R
converter
DA
D/Aコンバータ
D13
12
11
D10
D9
8
6
4
14bit
7
5
2
3
3
2
AO2
1
VSS
(VrefL)
Buffer
バッファ
operation
オペアンプ
amplifier
10bit Latch
CH2
10bit Latch
CH1
TEST1
D0
1
10bit R-2R
converter
DA
D/Aコンバータ
DI
13
14
12
AO1
GND
3
AO3
2
AO2
1
VSS
(VrefL)
Buffer
バッファ
operation
amplifier
オペアンプ
10bit Latch
10bit Latch
10bit Latch
CH1
CH2
D0
10bit R-2R
converter
DA
D/Aコンバータ
DI
13
14
12
AO1
GND
register
Shift
シフトレジスタ
VCC
8
9
AO4
LD
10
11
CLK
7
6
AO5
AO4
5
4
Reset
RESET
10bit R-2R
converter
DA
D/Aコンバータ
10bit R-2R
converter
DA
D/Aコンバータ
10bit R-2R
converter
DA
D/Aコンバータ
10bit R-2R
converter
DA
D/Aコンバータ
5
10bit Latch
10bit Latch
4
3
Address
アドレス
decoder
デコーダ
・・・
10bit Latch
6
10bit R-2R
converter
DA
D/Aコンバータ
D13
12
11
D10
D9
8
7
6
1
2
3
4
5
VDD
(VrefH)
BU2508FV
8
14bit
Shift register
シフトレジスタ
AO6
9
10
LD
CLK
11
VCC
BU2507FV
Absolute Maximum Ratings(TA=25°C)
Parameter
Symbol
Rating
Unit
Supply voltage
VCC
6.0
V
D/A converter upper reference voltage
VDD
6.0
V
Input voltage
VIN
6.0
V
VOUT
6.0
V
Output voltage
Power dissipation
PD
Storage temperature range
Tstg
0.70
(Note 2)
-55 to +125
W
°C
(Note 2) Derate by 7.0mW/°C when operating above TA=25°C (when mounted on ROHM’s standard board).
Mounted on a FR4 glass epoxy PCB 70mm x 70mm x 1.6mm (copper foil area less than 3%).
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Symbol
Limit
Unit
Power supply voltage range
VCC
4.5 to 5.5
V
Operating temperature range
Topr
-30 to +85
°C
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TSZ02201-0RLR0GZ10150-1-2
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BU2507FV
BU2508FV
Electrical Characteristics(Unless otherwise specified, VCC=5V, VrefH=5V, VrefL=0V, TA=25°C)
Parameter
Symbol
Limit
Min
Typ
Max
Unit
Conditions
<Digital unit>
Supply current
ICC
-
0.85
2.8
mA
At CLK=10MHz, IAO=0μA
Input leak current
IILK
-5
-
+5
μA
VIN=0V to VCC
Input voltage L
VIL
-
-
0.8
V
-
Input voltage H
VIH
2.0
-
-
V
-
Output voltage L
VOL
0
-
0.4
V
IOL=+2.5mA
Output voltage H
VOH
4.6
-
5
V
IOH=-2.5mA
-
4.5
7.5
mA
Data condition : at maximum current
-
2.0
3.4
mA
(Note 3)
VrefH
3.0
-
5
V
VrefL
0
-
1.5
V
0.1
-
4.9
0.2
-
4.75
<Analog unit>
Consumption current
D/A converter upper reference voltage
setting range
D/A converter lower reference voltage
setting range
Buffer amplifier output voltage range
Buffer amplifier output drive range
Precision
IrefH
-
VO
V
IO
-2
-
+2
Differential non-linearity error
DNL
-1.0
-
+1.0
Integral non-linearity error
INL
-3.5
-
+3.5
Zero point error
SZERO
-25
-
+25
Full scale error
SFULL
-25
-
+25
RO
-
5
15
Ω
Rup
12.5
25
37.5
kΩ
Buffer amplifier output impedance
Pull-up I/O internal resistance value
(Note 4)
mA
LSB
mV
IO=±100μA
IO=±1.0mA
High side saturation voltage =0.35V
(on full scale setting, current sourcing)
Low side saturation voltage =0.23V
(on zero scale setting, current sinking)
VrefH =4.796V
VrefL=0.7V
VCC=5.5V (4mV/LSB)
At no load (IO=+0mA )
Input voltage = 0V
(The resistance value has input
voltage dependence)
(Note 3) Under the condition that CH1 to CH4 are set to maximum current
(Note 4) The specification is applied to pin 4 (RESET)
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TSZ02201-0RLR0GZ10150-1-2
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BU2507FV
BU2508FV
Timing Characteristics(Unless otherwise specified, VCC=5V, VrefH=5V, VrefL=0V, TA=25°C)
Limits
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
The voltage levels of the measured time
points are 20% or 80% of VCC.
Reset L pulse width
tRTL
50
-
-
-
Clock L pulse width
tCKL
50
-
-
-
Clock H pulse width
tCKH
50
-
-
-
Clock rise time
tcr
-
-
50
-
Clock fall time
tcf
-
-
50
Data setup time
tDCH
20
-
-
Data hold time
tCHD
40
-
-
-
Load setup time
tCHL
50
-
-
-
Load hold time
tLDC
50
-
-
-
Load H pulse width
tLDH
50
-
-
-
ns
-
(Note 5)
D/A output settling time
tLDD
-
7
20
μs
CL≤100pF
, VO: 0.5V↔4.5V
The time interval from the start time to
change an output voltage to the time at
which the output voltage reaches to its
final value within 1/2 LSB.
(Note 5) A capacitor should be placed between the analog output and ground in order to eliminate noise.
A capacitance up to 100pF is recommended (including the capacitance of the wire).
RESET
tRTL
tcr
tCKH
tcf
CLK
tCKL
tLDC
DI
tLDH
tDCH
LD
tCHD
tCHL
tLDD
Output
Applicational information
LD input
The LD input is a level trigger signal. When LD=H, an internal shift register value is loaded into a latch. It doesn’t
have to be cared whether CLK is H or L when LD changes to H. However CLK must not be changed while LD is H.
The shift register values pass through the latches if LD=H and CLK is toggled.
Power-on operation
The BU2507FV and the BU2508FV does not have a power-on reset function. Therefore, after power-on, data in
the internal registers are unknown. When RESET changes from H to L, all latch outputs turn into L, although the
shift registers are not reset.
Pull-down resister
Pin 4 is pulled up internally. If putting the external pull-down resister on it, the recommended value is less than
1kΩ.
Truth Table
Pin 4: RESET
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L
H
Reset
Normal
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TSZ02201-0RLR0GZ10150-1-2
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BU2507FV
BU2508FV
D/A Converter Variable Output Range Function
BU2507FV and BU2508FV have terminals with which the upper and lower limits of the output voltage range can be changed
separately. The upper limit of the output voltage range is set with the VrefH terminal and the lower limit is set with VrefL terminal. In
general usage, the VrefH terminal is connected to the VCC terminal and the V refL terminal is connected to the GND terminal.
When the power supply voltage on the VCC terminal is 5V, 1LSB is almost 5mV. In other cases, it is possible to achieve a
finer resolution. For example, if VrefH = 3.5V and VrefL = 1.5V, then 1LSB is almost 2mV.
VOUT
VOUT
5V
5V
3.5V
1024
step
ステップ
1024
step
ステップ
0V
000h
1.5V
0V
3FFh Input Code 000h
1LSB≈5.0mV
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VrefH
VrefL
3FFh Input Code
1LSB≈2.0mV
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BU2507FV
BU2508FV
Command Transmission
1) In the case of BU2507FV
(1) Data format [data : LSB first]
D13
D12
D11
D/
D10
D9
D8
D7
D6
D5
D4
D3
A converter output setting DATA
D2
D1
D3
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
D0
address select
(2) Data timing diagram
ADDRESS
LSB
D0
DI
ADDRESS
MSB
D1
D2
DATA
LSB
D3
DATA
MSB
D4
D11
D12
D13
CLK
LD
DACOUT
D2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
D1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
D0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Address selection
n/a
n/a
AO1
AO2
n/a
AO3
AO4
n/a
AO5
AO6
n/a
n/a
n/a
n/a
n/a
n/a
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D/A output (VrefH=VDD, VrefL=VSS)
0
0
0
0
:
1
1
0
0
0
0
:
1
1
0
0
0
0
:
1
1
0
0
0
0
:
1
1
0
0
0
0
:
1
1
0
0
0
0
:
1
1
0
0
0
0
:
1
1
0
0
0
0
:
1
1
0
0
1
1
:
1
1
0
1
0
1
:
0
1
VrefL
(VrefH-VrefL)/1024×1+VrefL
(VrefH-VrefL)/1024×2+VrefL
(VrefH-VrefL)/1024×3+VrefL
:
(VrefH-VrefL)/1024×1022+VrefL
(VrefH-VrefL)/1024×1023+VrefL
2) In the case of BU2508FV
(1) Data format [Data: LSB first ]
D13
D12
D11
D/
D10
D9
D8
D7
D6
D5
D4
A converter output setting DATA
D3
D2
D1
D3
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
D0
address select
(2) Data timing diagram
ADDRESS
LSB
DI
D0
ADDRESS
MSB
D1
D2
DATA
LSB
D3
DATA
MSB
D4
D11
D12
D13
CLK
LD
DACOUT
D13
0
0
0
0
:
1
1
D12
0
0
0
0
:
1
1
D11
0
0
0
0
:
1
1
D10
0
0
0
0
:
1
1
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D9
0
0
0
0
:
1
1
D8
0
0
0
0
:
1
1
D7
0
0
0
0
:
1
1
D6
0
0
0
0
:
1
1
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D5
0
0
1
1
:
1
1
D2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
D4
0
1
0
1
:
0
1
D1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
D0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Address selection
n/a
n/a
AO1
AO2
n/a
n/a
n/a
n/a
AO3
AO4
n/a
n/a
n/a
n/a
n/a
n/a
D/A output (VrefH=VDD, VrefL=VSS)
VrefL
(VrefH-VrefL)/1024×1+VrefL
(VrefH-VrefL)/1024×2+VrefL
(VrefH-VrefL)/1024×3+VrefL
:
(VrefH-VrefL)/1024×1022+VrefL
(VrefH-VrefL)/1024×1023+VrefL
TSZ02201-0RLR0GZ10150-1-2
11.Dec.2015 Rev.001
BU2507FV
BU2508FV
6
6
5
5
4
4
VOUT [V]
VOUT [V]
Typical Performance Curves (reference data)
3
3
2
2
1
1
0
0
0
200
400
600
800
1000
1200
0
200
400
600
800
1000
1200
Input Code [decimal]
Input Code [decimal]
Figure 2. VOUT vs Input Code
(Output voltage linearity, TA=+25°C)
Figure 1. VOUT vs Input Code
(Output voltage linearity, TA=-30°C)
6
5
VOUT [V]
4
3
2
1
0
0
200
400
600
800
1000
1200
Input Code [decimal]
Figure 3. VOUT vs Input Code
(Output voltage linearity, TA=+85°C)
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BU2507FV
BU2508FV
1.5
1.5
1
1
0.5
0.5
DNL [LSB]
DNL [LSB]
Typical Performance Curves(reference data) - continued
0
0
-0.5
-0.5
-1
-1
-1.5
-1.5
0
200
400
600
800
1000
0
1200
Input Code [decimal]
200
400
600
800
1000
1200
Input Code [decimal]
Figure 4. DNL vs Input Code
(Differential linearity error, TA=-30°C)
Figure 5. DNL vs Input Code
(Differential linearity error, TA=+25°C)
1.5
1
DNL [LSB]
0.5
0
-0.5
-1
-1.5
0
200
400
600
800
1000
1200
Input Code [decimal]
Figure 6. DNL vs Input Code
(Differential linearity error, TA=+85°C)
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BU2507FV
BU2508FV
Typical Performance Curves(reference data) - continued
1
1
0.5
0.5
INL [LSB]
1.5
INL [LSB]
1.5
0
0
-0.5
-0.5
-1
-1
-1.5
-1.5
0
200
400
600
800
1000
1200
0
Input Code [decimal]
200
400
600
800
1000
1200
Input Code [decimal]
Figure 7. INL vs Input Code
(Integral linearity error, TA=-30°C)
Figure 8. INL vs Input Code
(Integral linearity error, TA=+25°C)
1.5
1
INL [LSB]
0.5
0
-0.5
-1
-1.5
0
200
400
600
800
1000
1200
Input Code [decimal]
Figure 9. INL vs Input Code
(Integral linearity error, TA=+85°C)
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BU2507FV
BU2508FV
Typical Performance Curves(reference data) - continued
6
2.52
5
2.51
TA=25°C
VOUT [V]
ICC [mA]
4
code=1FFh
3
TA=-30°C
2.5
TA=85°C
2
2.49
code=000h
1
code=3FFh
0
2.48
-40
10
60
-2.5
Temp. [°C]
-1.5
-0.5
0.5
1.5
2.5
IOUT [mA]
Figure 11. VOUT vs IOUT
(Output load fluctuation characteristic(input code: 1FFh))
Figure 10. ICC vs Temp
(Circuit current temperature characteristic)
40
35
TA=85°C
RUP [kΩ]
30
TA=25°C
25
20
TA=-30°C
15
10
4
4.2
4.4
4.6
4.8
5
5.2
5.4
5.6
5.8
6
VIN [V]
Figure 12. RUP vs VIN
(Built-in Pull-up resistance characteristic)
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BU2507FV
BU2508FV
Power Dissipation
Power dissipation(total loss) indicates the power that can be consumed by IC at TA=25°C (normal temperature).IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal
resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θJA°C/W. The temperature of IC inside the package can be estimated by this
thermal resistance. Figure 13(a) shows the model of thermal resistance of the package. Thermal resistance θJA, ambient
temperature TA, junction temperature TJmax, and power dissipation PD can be calculated by the equation below
θJA = (TJmax - TA) / PD
°C /W
Derating curve in Figure 13(b) indicates power that can be consumed by IC with reference to ambient temperature. Power
that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal
resistance θJA. Thermal resistance θJA depends on chip size, power consumption, package, ambient temperature, package
condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value
measured at a specified condition. Figure 14(a) show a derating curve for an example of BU2507FV and BU2508FV.
Power
dissipation
Power
of LSI
LSI [W]
の消
LSIのdissipation
消
費 電 力 [W]
費電力
θJA =(TJmax-TA)/P
PPd
D(max)
(max)
°C /W
θ
JA2 <
JA1
θja2
< θθja1
P2
Ambient temperature TA[°C]
周囲温度 Ta [℃]
θ’
θ'JA2
ja2
P1
θ’θ'JA1
ja1
0
表面温度 Tj
Chip surfaceチップ
temperature
TJ[℃]
[°C]
消費電力 P [W]
(a) Thermal Resistance
θθJA2
ja2
T’Jmax TJmax
Tj ' (max)
Tj (max)
θθJA1
ja1
25
50
75
100
125
Ambient
TA [℃
[ °C][°C
] ]
周
囲 温 度 Ta
Ambient
temperature
T
A
temperature 周囲温度
150
(b) Derating Curve
Figure 13. Thermal resistance and derating
curve
(a) BU2507FV・BU2508FV
Derating curve
UNIT
7.0
mW/°C
When using the IC above TA=25°C, subtract the value above per °C
Mounted on a FR4 glass epoxy board 70mm x 70mm x 1.6mm (cooper foil area less than 3%).
Figure 14. Derating curve
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
12/17
TSZ02201-0RLR0GZ10150-1-2
11.Dec.2015 Rev.001
BU2507FV
BU2508FV
I/O Equivalent Circuit
No.
(Note 6)
Equivalent circuit
1
(Note 7)
*1
2
3
・
4
3
4
・
5
5
(Note 6) Please refer to the equivalent circuit number in the Pin Descriptions table.
(Note 7) 25kΩ at VCC = 5.0V (changes according to the applied voltage)
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
13/17
TSZ02201-0RLR0GZ10150-1-2
11.Dec.2015 Rev.001
BU2507FV
BU2508FV
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
14/17
TSZ02201-0RLR0GZ10150-1-2
11.Dec.2015 Rev.001
BU2507FV
BU2508FV
Operational Notes – continued
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins
when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the
input pins have voltages within the values specified in the electrical characteristics of this IC.
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
Ordering Information
B
U
2
Part Number
5
0
5:BU2507FV
6:BU2508FV
x
F
V
-
Package
FV:SSOP-B14
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
SSOP-B14(TOP VIEW)
SSOP-B14(TOP VIEW)
Part Number Marking
2 5 0 7 F V
LOT Number
2 5 0 8 F V
1PIN MARK
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Part Number Marking
LOT Number
1PIN MARK
15/17
TSZ02201-0RLR0GZ10150-1-2
11.Dec.2015 Rev.001
BU2507FV
BU2508FV
Physical Dimension, Tape and Reel Information
Package Name
www.rohm.co.jp
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
SSOP-B14
16/17
TSZ02201-0RLR0GZ10150-1-2
11.Dec.2015 Rev.001
BU2507FV
BU2508FV
Revision History
Date
Revision
11.Dec.2015
001
Changes
New Release
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
17/17
TSZ02201-0RLR0GZ10150-1-2
11.Dec.2015 Rev.001
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BU2507FV - Web Page
Buy
Distribution Inventory
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BU2507FV
SSOP-B14
2500
2500
Taping
inquiry
Yes
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