ON NL17SZU04DFT2G Single unbuffered inverter Datasheet

NL17SZU04
Single Unbuffered Inverter
The NL17SZU04 is a single unbuffered inverter in two tiny
footprint package. The device performs much as LCX multi−gate
products in speed and drive.
Features
•
•
•
•
•
•
•
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Tiny SOT−353 and SOT−553 Packages
Source/Sink 16 mA at 4.5 V VCC
Over−Voltage Tolerant Inputs and Outputs
Pin For Pin with NC7SZU04P5X, TC7SZU04FU and TC7SZU04AFE
Chip Complexity: FETs = 20
Designed for 1.65 V to 5.5 V VCC Operation
Pb−Free Packages are Available
MARKING
DIAGRAMS
5
5
L6d
1
SOT−353/SC70−5/SC−88A
DF SUFFIX
CASE 419A
1
d = Date Code
5
5
NC
1
A
2
GND
3
5
L6 D
1
SOT−553
XV5 SUFFIX
CASE 463B
VCC
L6
D
4
1
= Device Marking
= One Digit Date Code
Y
PIN ASSIGNMENT
Figure 1. Pinout (Top View)
A
1
Y
Pin
Function
1
NC
2
A
3
GND
4
Y
5
VCC
Figure 2. Logic Symbol
FUNCTION TABLE
Output
Input
Y=A
A
Y
L
H
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
 Semiconductor Components Industries, LLC, 2005
January, 2005 − Rev. 4
1
Publication Order Number:
NL17SZU04/D
NL17SZU04
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
0.5 to 7.0
V
VIN
DC Input Voltage
0.5 to 7.0
V
DC Output Voltage
0.5 to 7.0
V
VOUT
IIK
DC Input Diode Current
50
mA
IOK
DC Output Diode Current
50
mA
IOUT
DC Output Sink Current
50
mA
ICC
DC Supply Current per Supply Pin
100
mA
65 to 150
°C
260
°C
TSTG
Storage Temperature Range
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature Under Bias
JA
Thermal Resistance
PD
Power Dissipation in Still Air at 85°C
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
150
°C
SOT−353 (Note 1)
SOT−553
350
496
°C/W
SOT−353
SOT−553
186
135
mW
Level 1
Oxygen Index: 28 to 34
ESD Withstand Voltage
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Class IC
Class A
N/A
V
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B.
3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Max
Unit
1.65
1.5
5.5
5.5
V
VCC
DC Supply Voltage
VIN
DC Input Voltage
0
5.5
V
DC Output Voltage
0
5.5
V
−40
+85
°C
0
0
100
20
ns/V
VOUT
TA
Operating Temperature Range
tr, tf
Input Rise and Fall Time
(Operating)
Data Retention Only
Min
VCC = 3.0 V 0.3 V
VCC = 5.0 V 0.5 V
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2
NL17SZU04
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
VIH
High−Level Input Voltage
VIL
Low−Level Input Voltage
VOH
VIN = VIL or VIH
VOL
Low−Level Output Voltage
VIN = VIH or VOH
IIN
(V)
Min
1.65 to 1.85
0.85 VCC
0.85 VCC
2.3 to 5.5
0.8 VCC
0.8 VCC
Condition
High−Level Output Voltage
IOH = −100 A
IOH = −3 mA
40C TA 85C
TA = 25C
VCC
Typ
Max
Min
Max
Unit
V
1.65 to 1.85
0.15
VCC
0.15 VCC
2.3 to 5.5
0.2 VCC
0.2 VCC
V
V
1.65 to 5.5
1.65
VCC − 0.1
1.29
VCC
1.52
VCC − 0.1
1.29
IOH = −4 mA
2.3
1.9
2.1
1.9
IOH = −6 mA
2.7
2.2
2.4
2.2
IOH = −8 mA
3.0
2.4
2.7
2.4
IOH = −12 mA
3.0
2.3
2.5
2.3
IOH = −16 mA
4.5
3.8
4.0
3.8
IOL = 100 A
IOL = 3 mA
1.65 to 5.5
1.65
0.08
0.1
0.24
0.1
0.24
IOL = 4 mA
2.3
0.20
0.3
0.3
IOL = 6 mA
2.7
0.22
0.4
0.4
IOL = 8 mA
3.0
0.28
0.4
0.4
IOL = 12 mA
3.0
0.38
0.55
0.55
IOL = 16 mA
4.5
0.42
0.55
0.55
0 to 5.5
0.1
1.0
A
0
1
10
A
1.65 to 5.5
1
10
A
Input Leakage Current
VIN = VCC or GND
IOFF
Power Off−Output Leakage
Current
VOUT = 5.5 V
ICC
Quiescent Supply Current
VIN = VCC or GND
V
AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns
VCC
Symbol
tPLH
tPHL
Parameter
Propagation Delay
(Fi
(Figure
3 and
d 4))
TA = 25C
40C TA 85C
Condition
(V)
Min
Max
Min
Max
Unit
RL = 1 M CL = 15 pF
1.8 0.15
1.0
11.7
1.0
12.1
ns
RL = 1 M CL = 15 pF
2.5 0.2
0.8
6.2
0.8
6.5
RL = 1 M CL = 15 pF
3.3 0.3
0.5
4.5
0.5
4.8
1.0
6.0
1.0
6.5
0.5
3.9
0.5
1.0
0.8
5.0
0.8
5.5
RL = 500 CL = 50 pF
RL = 1 M CL = 15 pF
5.0 0.5
RL = 500 CL = 50 pF
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Condition
Typical
Unit
CIN
Input Capacitance
VCC = 5.5 V, VI = 0 V or VCC
4.5
pF
CPD
Power Dissipation Capacitance
(
(Note
5))
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
6.5
pF
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
10
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
NL17SZU04
tf = 3 ns
tf = 3 ns
90%
INPUT
A and B
VCC
90%
50%
50%
10%
10%
tPHL
OUTPUT
GND
tPLH
RL
INPUT
CL
VOH
OUTPUT Y
50%
50%
A 1−MHz square input wave is recommended for
propagation delay tests.
VOL
Figure 3. Switching Waveform
Figure 4. Test Circuit
DEVICE ORDERING INFORMATION
Device Nomenclature
Logic
Circuit
Indicator
No. of
Gates per
Package
Temp
Range
Identifier
NL17SZU04DFT2
NL
1
NL17SZU04DFT2G
NL
NL17SZU04XV5T2
NL
Device Order
Number
Technology
Device
Function
Package
Suffix
Tape and
Reel
Suffix
7
SZ
U04
DF
1
7
SZ
U04
1
7
SZ
U04
Package
Type
Tape and
Reel Size†
T2
SOT−353/
SC70−5/
SC−88A
178 mm,
3000 Unit
DF
T2
SOT−353/
SC70−5/
SC−88A
(Pb−Free)
178 mm,
3000 Unit
XV5
T2
SOT−553*
178 mm,
4000 Unit
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*All Devices in Package SOT553 are Inherently Pb−Free.
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4
NL17SZU04
PACKAGE DIMENSIONS
SOT−353
DF SUFFIX
5−LEAD PACKAGE
CASE 419A−02
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
A
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
B
M
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
−−−
0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
J
C
K
H
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
−−−
0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
NL17SZU04
PACKAGE DIMENSIONS
SOT−553
XV5 SUFFIX
5−LEAD PACKAGE
CASE 463B−01
ISSUE A
A
−X−
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
C
K
4
1
2
B
−Y−
3
D
G
S
DIM
A
B
C
D
G
J
K
S
J
5 PL
0.08 (0.003)
M
X Y
MILLIMETERS
MIN
MAX
1.50
1.70
1.10
1.30
0.50
0.60
0.17
0.27
0.50 BSC
0.08
0.18
0.10
0.30
1.50
1.70
STYLE 1:
PIN 1.
2.
3.
4.
5.
INCHES
MIN
MAX
0.059
0.067
0.043
0.051
0.020
0.024
0.007
0.011
0.020 BSC
0.003
0.007
0.004
0.012
0.059
0.067
BASE 1
EMITTER 1/2
BASE 2
COLLECTOR 2
COLLECTOR 1
STYLE 2:
PIN 1.
2.
3.
4.
5.
CATHODE
ANODE
CATHODE
CATHODE
CATHODE
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
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For additional information, please contact your
local Sales Representative.
NL17SZU04/D
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