CALMIRCO CM1300-03CP 4 channel emi filter network Datasheet

CM1300
4 Channel EMI Filter Network
Features
Product Description
•
•
The CM1300 is a 4-channel low pass EMI filter (R-C-R
configuration) manufactured in a Chip Scale Package
(CSP). Many portable applications require the attenuation of signals in the 800-3000 MHz band. California
Micro Devices’ unique thin film technology provides a
minimum of –25dB of attenuation over this frequency
band.
•
•
•
•
•
•
•
Functionally and pin compatible with CSPRC032A
OptiGuardTM coated for improved reliability at
assembly
4 EMI filter lines per device
Filters attenuate to –30dB at 3GHz
CSP package minimizes cross-talk
9-bump 2.485mm X 0.985mm Chip Scale
Package (CSP), 0.5mm pitch
0.30mm Eutectic solder bumps
Ultra small footprint suitable for portable devices
Lead-free version available
Applications
•
•
•
•
•
•
EMI filtering for RF sections of wireless devices
Cellular phones
Cordless phones
Internet appliances
PDAs
Laptop computers
Electrical Schematic
A1
The bump size and pitch of these filters are selected
such that the device can be placed directly on an FR4
printed circuit board using conventional assembly techniques. The pin-out for the device features a signal
‘flow through’ design, allowing optimal PCB signal routing. The solder bump contacts are a 63/37 Sn/Pb alloy
(Sn/Ag/Cu for lead-free finish) and are 0.30 mm in
diameter.
The CM1300 incorporates OptiGuardTM coating which
results in improved reliability at assembly. The device
is available in a space-saving, low-profile Chip Scale
Package with optional lead-free finishing.
50Ω
50Ω
R
A2
50Ω
C R
43pF
GND
R
50Ω
50Ω
GND
B3
50Ω
50Ω
B4
C R
43pF
R
A5
B2
C R
43pF
GND
A4
B1
GND
R
50Ω
B5
C R
43pF
GND
© 2005 California Micro Devices Corp. All rights reserved.
11/07/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
1
CM1300
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
TOP VIEW
(Bumps Up View)
(Bumps Down View)
Orientation
Marking
(see note 2)
1
2
3
4
Orientation
Marking
5
A
A
M003
B
A5
A4
B5
B4
B3
A2
A1
B2
B1
CM1300
Notes:
CSP Package
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish2
Standard Finish
Bumps
Package
Ordering Part
Number1
Part Marking
Ordering Part
Number1
Part Marking
9
CSP
CM1300-03CS
M003
CM1300-03CP
M003
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Storage Temperature Range
RATING
UNITS
-55 to +150
°C
25
mW
RATING
UNITS
-40 to +85
°C
Power Rating per Resistor
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
© 2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
11/07/05
CM1300
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL
ILEAK
PARAMETER
CONDITIONS
Leakage Current, An or Bn to GND
VIN=6.0V
MIN
TYP
MAX
UNITS
1
µA
R
Resistance
45
50
55
Ω
C
Capacitance
34
43
52
pF
TOLR
Resistor Absolute Tolerance
R = 50Ω
+10
%
TOLC
Capacitor Absolute Tolerance
C=43pF
+20
%
TCR
Temperature Coefficient of
Resistance
Note 2
+150
ppm/°C
TCC
Temperature Coefficient of
Capacitance
Note 2
+500
ppm/°C
Filter Cutoff Frequency
ZSOURCE=0Ω, ZLOAD=∞
ZSOURCE=50Ω, ZLOAD=50Ω
R=50Ω, C=43pF;
FC
74
82
MHz
MHz
Note 1: Electrical Operating Characteristics are guaranteed over the Operating Temperature Range unless otherwise specified.
Note 2: Parameters guaranteed by design or characterization.
Filter Performance
CM1300 Filter Typical Measured Frequency Response (S21) Measurement
The measurement is done with 50Ω-source and 50Ω-load impedance using a HP8753C Network Analyzer with a
HP85047A S-parameter Test Set.
© 2005 California Micro Devices Corp. All rights reserved.
11/07/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
3
CM1300
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50µm
Solder Ball Side Coplanarity
+20µm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Eutectic Devices using Eutectic Solder Paste
240°C
Maximum Soldering Temperature for Lead-free Devices using Lead-free Solder Paste
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 1. Recommended Non-Solder Mask Defined Pad Illustration
Temperature (°C)
250
200
150
100
50
0
Figure 2. Eutectic (SnPb) Solder
Ball Reflow Profile
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 3. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
11/07/05
CM1300
Mechanical Details
CSP Mechanical Specifications
Mechanical Package Diagrams
The CM1300 is offered in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CMD’s Chip Scale Packaging, see
the California Micro Devices CSP Package Information
document.
BOTTOM VIEW
A1
5
PACKAGE DIMENSIONS
Custom CSP
Bumps
9
4
Inches
Min
Nom
Max
A1
0.940
0.985
1.030
0.0370 0.0388 0.0406
A2
2.440
2.485
2.530
0.0961 0.0978 0.0996
B1
0.495
0.500
0.505
0.0195 0.0197 0.0199
B2
0.495
0.500
0.505
0.0195 0.0197 0.0199
C1
0.1925 0.2425 0.2925 0.0076 0.0095 0.0115
C2
0.1925 0.2425 0.2925 0.0076 0.0095 0.0115
D1
0.575
0.644
0.714
0.0226 0.0254 0.0281
D2
0.368
0.419
0.470
0.0145 0.0165 0.0185
# per tape
and reel
Min
Nom
2
Max
A2
3
B
A
B
A
C2
Millimeters
Dim
B2
B1
.
Package
OptiGuardTM
Coating
C1
1
D1
0.30 DIA.
D2
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1300 9-bump Chip Scale Package
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
PKG. SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
CM1300
2.485 X 0.985 X 0.644
2.62 X 1.12 X 0.762
TAPE WIDTH
W
REEL
DIA.
QTY
PER
REEL
P0
P1
8mm
178mm (7")
3500
4mm
4mm
Po
Top
Cover
Tape
10 Pitches Cumulative
Tolerance On Tape
±0.2 mm
Ao
W
Bo
Ko
For tape feeder reference
only including draft.
Concentric around B.
Embossment
Center Lines
of Cavity
P1
User Direction of Feed
Figure 4. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
11/07/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
5
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