AD ADG1406BRUZ-REEL7 9.5 ohm ron, 16-channel, differential 8-channel, â±15 v/12 v/â±5 v icmos multiplexer Datasheet

9.5 Ω RON, 16-Channel, Differential 8-Channel,
±15 V/+12 V/±5 V iCMOS Multiplexers
ADG1406/ADG1407
APPLICATIONS
Medical equipment
Audio and video routing
Automatic test equipment
Data acquisition systems
Battery-powered systems
Sample-and-hold systems
Communication systems
GENERAL DESCRIPTION
The ADG1406 and ADG1407 are monolithic iCMOS® analog
multiplexers comprising 16 single channels and eight differential
channels, respectively. The ADG1406 switches one of 16 inputs
to a common output, as determined by the 4-bit binary address
lines (A0, A1, A2, and A3). The ADG1407 switches one of eight
differential inputs to a common differential output, as determined
by the 3-bit binary address lines (A0, A1, and A2). An EN input
on both devices enables or disables the device. When disabled,
all channels switch off. When on, each channel conducts equally
well in both directions and has an input signal range that extends
to the supplies.
The iCMOS (industrial CMOS) modular manufacturing
process combines high voltage CMOS (complementary metaloxide semiconductor) and bipolar technologies. It enables the
development of a wide range of high performance analog ICs
capable of 33 V operation in a footprint that no other generation
of high voltage parts has been able to achieve. Unlike analog ICs
using conventional CMOS processes, iCMOS components can
tolerate high supply voltages while providing increased performance, dramatically lower power consumption, and reduced
package size.
FUNCTIONAL BLOCK DIAGRAMS
ADG1406
S1
D
S16
1-OF-16
DECODER
A0 A1 A2 A3 EN
07419-001
9.5 Ω on resistance @ 25°C
Up to 300 mA of continuous current
Fully specified at ±15 V/+12 V/±5 V
3 V logic-compatible inputs
Rail-to-rail operation
Break-before-make switching action
28-lead TSSOP and 32-lead, 5 mm × 5 mm LFCSP_VQ
Figure 1.
ADG1407
S1A
DA
S8A
S1B
DB
S8B
1-OF-8
DECODER
A0 A1 A2 EN
07419-002
FEATURES
Figure 2.
Table 1. Related Devices
Part No.
ADG1206/ADG1207
Description
Low capacitance, low charge injection,
and low leakage 8-/16-channel ±15 V
multiplexers
The ultralow on resistance and on-resistance flatness of these
switches make them ideal solutions for data acquisition and
gain switching applications where low distortion is critical.
iCMOS construction ensures ultralow power dissipation,
making the parts ideally suited for portable and batterypowered instruments.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2008 Analog Devices, Inc. All rights reserved.
ADG1406/ADG1407
TABLE OF CONTENTS
Features .............................................................................................. 1
Absolute Maximum Ratings ............................................................8
Applications ....................................................................................... 1
Thermal Resistance .......................................................................8
General Description ......................................................................... 1
ESD Caution...................................................................................8
Functional Block Diagrams ............................................................. 1
Pin Configurations and Function Descriptions ............................9
Revision History ............................................................................... 2
Typical Performance Characteristics ........................................... 13
Specifications..................................................................................... 3
Terminology .................................................................................... 17
±15 V Dual Supply ....................................................................... 3
Test Circuits ..................................................................................... 18
12 V Single Supply ........................................................................ 4
Outline Dimensions ....................................................................... 20
±5 V Dual Supply ......................................................................... 6
Ordering Guide .......................................................................... 20
Continuous Current per Channel .............................................. 7
REVISION HISTORY
8/08—Revision 0: Initial Version
Rev. 0 | Page 2 of 20
ADG1406/ADG1407
SPECIFICATIONS
±15 V DUAL SUPPLY
VDD = +15 V ± 10%, VSS = –15 V ± 10%, GND = 0 V, unless otherwise noted. 1
Table 2.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
On-Resistance Match Between
Channels (ΔRON)
On-Resistance Flatness (RFLAT(ON))
+25°C
−40°C to
+85°C
VSS to VDD
9.5
11.5
0.55
1
1.6
1.9
14
16
1.5
1.7
2.15
2.3
LEAKAGE CURRENTS
Source Off Leakage, IS (Off )
±0.01
±0.25
±0.01
±1
Drain Off Leakage, ID (Off )
±0.5
±0.05
±0.5
Channel On Leakage, ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
−40°C to
+125°C1
Break-Before-Make Time Delay, tBBM
±4
nA max
nA typ
VS = ±10 V, VD = ∓10 V; see Figure 28
±3
±20
VS = VD = ±10 V; see Figure 29
±3
±20
nA max
nA typ
nA max
V min
V max
μA typ
μA max
pF typ
VIN = VGND or VDD
±0.002
3
200
225
10
tON (EN)
tOFF (EN)
Charge Injection
Off Isolation
Channel-to-Channel Crosstalk
Total Harmonic Distortion (THD + N)
−3 dB Bandwidth
ADG1406
ADG1407
Insertion Loss
CS (Off )
CD (Off )
ADG1406
ADG1407
83
110
98
120
10
−73
−70
0.07
VDD = +13.5 V, VSS = −13.5 V, VS = ±10 V,
IS = −10 mA; see Figure 27
VDD = +13.5 V, VSS = −13.5 V , VS = ±10 V, IS =
−10 mA
VDD = +13.5 V, VSS = −13.5 V, VS = ±10 V, IS =
−10 mA
VDD = +16.5 V, VSS = −16.5 V
VS = ±10 V, VD = ∓10 V; see Figure 28
2.0
0.8
105
160
40
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Ω max
Test Conditions/Comments
nA typ
±0.1
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS 2
Transition Time, tTRANSITION
Unit
140
155
145
165
ns typ
ns max
ns typ
ns min
ns typ
ns max
ns typ
ns max
pC typ
dB typ
dB typ
% typ
RL = 100 Ω, CL = 35 pF
VS = 10 V, see Figure 30
RL = 100 Ω, CL = 35 pF
VS1 = VS2 = 10 V; see Figure 31
RL = 100 Ω, CL = 35 pF
VS = 10 V; see Figure 32
RL = 100 Ω, CL = 35 pF
VS = 10 V; see Figure 32
VS = 0 V, RS = 0 Ω, CL = 1 nF; see Figure 33
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 34
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 35
RL = 110 Ω, 15 V p-p, f = 20 Hz to 20 kHz; see
Figure 37
RL = 50 Ω, CL = 5 pF; see Figure 36
60
110
0.6
8
MHz typ
MHz typ
dB typ
pF typ
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 36
f = 1 MHz
90
45
pF typ
pF typ
f = 1 MHz
f = 1 MHz
Rev. 0 | Page 3 of 20
ADG1406/ADG1407
Parameter
CD, CS (On)
ADG1406
ADG1407
POWER REQUIREMENTS
IDD
+25°C
−40°C to
+85°C
−40°C to
+125°C1
115
70
0.002
1
IDD
280
400
ISS
0.002
1
±4.5/±16.5
VDD/VSS
1
2
Unit
Test Conditions/Comments
pF typ
pF typ
f = 1 MHz
f = 1 MHz
VDD = +16.5 V, VSS = −16.5 V
Digital inputs = 0 V or VDD
μA typ
μA max
μA typ
μA max
μA typ
μA max
V min/max
Digital inputs = 5 V
Digital inputs = 0 V, 5 V or VDD
Temperature range for B version is −40°C to +125°C.
Guaranteed by design, not subject to production test.
12 V SINGLE SUPPLY
VDD = 12 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted.
Table 3.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
On-Resistance Match Between
Channels (ΔRON)
On-Resistance Flatness (RFLAT(ON))
+25°C
−40°C to
+85°C
−40°C to
+125°C 1
0 to VDD
18
21.5
0.55
1.2
5
6
26
28.5
1.6
1.8
6.9
7.3
LEAKAGE CURRENTS
Source Off Leakage, IS (Off )
±0.01
±0.25
±0.01
±1
Drain Off Leakage, ID (Off )
±0.5
±0.01
±0.5
±3
±20
±3
±20
Channel On Leakage, ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
±4
2.0
0.8
±0.002
Break-Before-Make Time Delay, tBBM
4
170
250
75
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Ω max
nA typ
±0.1
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS 2
Transition Time, tTRANSITION
Unit
310
350
30
Rev. 0 | Page 4 of 20
nA max
nA typ
Test Conditions/Comments
VDD = 10.8 V, VSS = 0 V; VS = 0 V to 10 V,
IS = −10 mA; see Figure 27
VDD = 10.8 V, VSS = 0 V; VS = 0 V to 10 V,
IS = −10 mA
VDD = 10.8 V, VSS = 0 V; VS = 0 V to 10 V,
IS = −10 mA
VDD = 10.8 V
VS = 1 V/10 V, VD = 10 V/1 V; see
Figure 28
VS = 1 V/10 V, VD = 10 V/1 V; see
Figure 28
nA max
nA typ
nA max
VS = VD = 1 V or 10 V; see Figure 29
V min
V max
μA typ
μA max
pF typ
VIN = VGND or VDD
ns typ
ns max
ns typ
ns min
RL = 100 Ω, CL = 35 pF
VS = 8 V; see Figure 29
RL = 100 Ω, CL = 35 pF
VS1 = VS2 = 8 V; see Figure 31
ADG1406/ADG1407
Parameter
tON (EN)
tOFF (EN)
Charge Injection
+25°C
145
205
112
150
−40°C to
+85°C
−40°C to
+125°C 1
250
285
175
200
pC typ
Off Isolation
−73
dB typ
Channel-to-Channel Crosstalk
−70
dB typ
−3 dB Bandwidth
ADG1406
ADG1407
Insertion Loss
35
70
0.6
MHz typ
MHz typ
dB typ
12
pF typ
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 36
f = 1 MHz
145
72
pF typ
pF typ
f = 1 MHz
f = 1 MHz
166
93
pF typ
pF typ
f = 1 MHz
f = 1 MHz
VDD = 13.2 V
Digital inputs = 0 V or VDD
0.002
1
IDD
150
VDD
2
Test Conditions/Comments
RL = 100 Ω, CL = 35 pF
VS = 8 V; see Figure 31
RL = 100 Ω, CL = 35 pF
VS = 8 V; see Figure 31
VS = 6 V, RS = 0 Ω, CL = 1 nF; see
Figure 33
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 34
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 35
RL = 50 Ω, CL = 5 pF; see Figure 36
10
CS (Off )
CD (Off )
ADG1406
ADG1407
CD, CS (On)
ADG1406
ADG1407
POWER REQUIREMENTS
IDD
1
Unit
ns typ
ns max
ns typ
ns max
240
5/16.5
Temperature range for B version: −40°C to +125°C.
Guaranteed by design, not subject to production test.
Rev. 0 | Page 5 of 20
μA typ
μA max
μA typ
μA max
V min/max
Digital inputs = 5 V
VSS = 0 V, GND = 0 V
ADG1406/ADG1407
±5 V DUAL SUPPLY
VDD = +5 V ± 10%, VSS = −5 V ± 10%, GND = 0 V, unless otherwise noted.
Table 4.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
On -Resistance Match Between
Channels (ΔRON)
On -Resistance Flatness (RFLAT(ON))
+25°C
−40°C to
+85°C
VSS to VDD
21
25
0.6
1.3
5.2
6.4
29
32
1.7
1.9
7.3
7.6
LEAKAGE CURRENTS
Source Off Leakage, IS (Off )
±0.01
±1
Drain Off Leakage, ID (Off )
±0.25
±0.01
±0.5
±0.01
±0.5
Channel On Leakage, ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
−40°C to
+125°C 1
Break-Before-Make Time Delay, tBBM
VS = ±4.5 V, VD = ∓4.5 V; see Figure 28
nA max
nA typ
VS = ±4.5 V, VD = ∓4.5 V; see Figure 28
±3
±20
VS = VD = ±4.5 V; see Figure 29
±3
±20
nA max
nA typ
nA max
V min
V max
μA typ
μA max
pF typ
VIN = VGND or VDD
±0.002
3.5
510
565
30
tON (EN)
tOFF (EN)
Charge Injection
Off Isolation
Channel-to-Channel Crosstalk
Total Harmonic Distortion, THD + N
−3 dB Bandwidth
ADG1406
ADG1407
Insertion Loss
CS (Off )
CD (Off )
ADG1406
ADG1407
CD, CS (On)
ADG1406
ADG1407
230
335
205
290
10
–73
–70
0.18
VDD = +4.5 V, VSS = −4.5 V, VS = ±4.5 V,
IS = −10 mA; see Figure 27
VDD = +4.5 V, VSS = −4.5 V, VS = ±4.5V,
IS = −10 mA
VDD = +4.5 V, VSS = −4.5 V, VS = ±4.5 V;
IS = −10 mA
VDD = +5.5 V, VSS = −5.5 V
±4
2.0
0.8
260
435
90
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Ω max
Test Conditions/Comments
nA typ
±0.1
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS 2
Transition Time, tTRANSITION
Unit
400
445
340
370
ns typ
ns max
ns typ
ns min
ns typ
ns max
ns typ
ns max
pC typ
dB typ
dB typ
% typ
RL = 100 Ω, CL = 35 pF
VS = 5 V; see Figure 30
RL = 100 Ω, CL = 35 pF
VS1 = VS2 = 5 V; see Figure 31
RL = 100 Ω, CL = 35 pF
VS = 5 V; see Figure 32
RL = 100 Ω, CL = 35 pF
VS = 5 V; see Figure 32
VS = 0 V, RS = 0 Ω, CL = 1 nF; see Figure 33
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 34
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 35
RL = 110 Ω, 5 V p-p, f = 20 Hz to 20 kHz; see
Figure 37
RL = 50 Ω, CL = 5 pF; see Figure 36
40
80
1.15
10
MHz typ
MHz typ
dB typ
pF typ
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 36
f = 1 MHz
123
62
pF typ
pF typ
f = 1 MHz
f = 1 MHz
148
88
pF typ
pF typ
f = 1 MHz
f = 1 MHz
Rev. 0 | Page 6 of 20
ADG1406/ADG1407
Parameter
POWER REQUIREMENTS
IDD
+25°C
−40°C to
+85°C
−40°C to
+125°C 1
0.002
1
ISS
0.002
1
±4.5/±16.5
VDD/VSS
1
2
Unit
μA typ
μA max
μA typ
μA max
V min/max
Test Conditions/Comments
VDD = +5.5 V, VSS = −5.5 V
Digital inputs = 0 V or VDD
Digital inputs = 0 V, 5 V, or VDD
Temperature range for B version: −40°C to +125°C.
Guaranteed by design, not subject to production test.
CONTINUOUS CURRENT PER CHANNEL
Table 5. ADG1406
Parameter
CONTINUOUS CURRENT PER CHANNEL 1
15 V Dual Supply
28-Lead TSSOP
32-Lead LFCSP
12 V Single Supply
28-Lead TSSOP
32-Lead LFCSP
5 V Dual Supply
28-Lead TSSOP
32-Lead LFCSP
1
25°C
85°C
125°C
Unit
180
300
100
150
50
60
mA max
mA max
150
260
90
130
50
55
mA max
mA max
140
245
85
130
45
55
mA max
mA max
25°C
85°C
125°C
Unit
135
235
85
125
45
55
mA max
mA max
110
190
70
110
40
50
mA max
mA max
105
180
65
100
40
50
mA max
mA max
Test Conditions/Comments
VDD = +13.5 V, VSS = −13.5 V
VDD = 10.8 V, VSS = 0 V
VDD = +4.5 V, VSS = −4.5 V
Guaranteed by design, not subject to production test.
Table 6. ADG1407
Parameter
CONTINUOUS CURRENT PER CHANNEL 1
15 V Dual Supply
28-Lead TSSOP
32-Lead LFCSP
12 V Single Supply
28-Lead TSSOP
32-Lead LFCSP
5 V Dual Supply
28-Lead TSSOP
32-Lead LFCSP
1
Test Conditions/Comments
VDD = +13.5 V, VSS = −13.5 V
VDD = 10.8 V, VSS = 0 V
VDD = +4.5 V, VSS = −4.5 V
Guaranteed by design, not subject to production test.
Rev. 0 | Page 7 of 20
ADG1406/ADG1407
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE
Table 7.
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Parameter
VDD to VSS
VDD to GND
VSS to GND
Analog, Digital Inputs1
Continuous Current, Sx or Dx Pins
Peak Current, Sx or Dx Pins (Pulsed
at 1 ms, 10% Duty Cycle
Maximum)
28-Lead TSSOP
32-Lead LFCSP_VQ
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature
Reflow Soldering, Pb-Free
Peak Temperature
Time at Peak Temperature
1
Rating
35 V
−0.3 V to +25 V
+0.3 V to −25 V
VSS − 0.3 V to VDD + 0.3 V
or 30 mA, whichever
occurs first
Table 5 and Table 6
specifications + 15%
Table 8. Thermal Resistance
Package Type
28-Lead TSSOP
32-Lead LFCSP_VQ
ESD CAUTION
300 mA
550 mA
–40°C to +125°C
–65°C to +150°C
150°C
260 (+0/−5)°C
10 sec to 40 sec
Overvoltages at the Ax, EN, Sx, or Dx pins are clamped by internal diodes.
Limit current to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any
one time.
Rev. 0 | Page 8 of 20
θJA
97.9
27.27
θJC
14
Unit
°C/W
°C/W
ADG1406/ADG1407
3
26
S8
S16
4
25
S7
S15
5
24
S6
S14
6
23
S5
S13
7
22
S4
S12
8
21
S3
S11
9
20
S2
S10 10
19
S1
S9 11
18
EN
GND 12
17
A0
NC 13
16
A1
A3 14
15
A2
ADG1406
TOP VIEW
(Not to Scale)
NC = NO CONNECT
S16
S15
S14
S13
S12
S11
S10
S9
1
2
3
4
5
6
7
8
PIN 1
INDICATOR
ADG1406
TOP VIEW
(Not to Scale)
24
23
22
21
20
19
18
17
S8
S7
S6
S5
S4
S3
S2
S1
07419-004
VSS
NC
32
31
30
29
28
27
26
25
D
27
9
10
11
12
13
14
15
16
28
2
GND
A3
A2
NC
NC
A1
A0
EN
1
NC
NOTES
1. NC = NO CONNECT.
2. EXPOSED PAD TIED TO SUBSTRATE, VSS.
07419-003
VDD
NC
VDD
NC
D
NC
NC
NC
VSS
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 4. ADG1406 LFCSP Pin Configuration
Figure 3. ADG1406 TSSOP Pin Configuration
Table 9. ADG1406 Pin Function Descriptions
TSSOP
1
2, 3, 13
4
5
6
7
8
9
10
11
12
14
15
16
17
18
Pin No.
LFCSP_VQ
31
12, 13, 26,
27, 28, 30, 32
1
2
3
4
5
6
7
8
9
10
11
14
15
16
Mnemonic
VDD
NC
Description
Most Positive Power Supply Potential.
No Connect.
S16
S15
S14
S13
S12
S11
S10
S9
GND
A3
A2
A1
A0
EN
Source Terminal 16. This pin can be an input or an output.
Source Terminal 15. This pin can be an input or an output.
Source Terminal 14. This pin can be an input or an output.
Source Terminal 13. This pin can be an input or an output.
Source Terminal 12. This pin can be an input or an output.
Source Terminal 11. This pin can be an input or an output.
Source Terminal 10. This pin can be an input or an output.
Source Terminal 9. This pin can be an input or an output.
Ground (0 V) Reference.
Logic Control Input.
Logic Control Input.
Logic Control Input.
Logic Control Input.
Active High Digital Input. When this pin is low, the device is disabled and all switches are
turned off. When this pin is high, the Ax logic inputs determine which switch is turned on.
Source Terminal 1. This pin can be an input or an output.
Source Terminal 2. This pin can be an input or an output.
Source Terminal 3. This pin can be an input or an output.
Source Terminal 4. This pin can be an input or an output.
Source Terminal 5. This pin can be an input or an output.
Source Terminal 6. This pin can be an input or an output.
Source Terminal 7. This pin can be an input or an output.
Source Terminal 8. This pin can be an input or an output.
Most Negative Power Supply Potential. In single-supply applications, this pin can be
connected to ground. The exposed pad is tied to the substrate, VSS.
Drain Terminal. This pin can be an input or an output.
19
20
21
22
23
24
25
26
27
17
18
19
20
21
22
23
24
25
S1
S2
S3
S4
S5
S6
S7
S8
VSS
28
29
D
Rev. 0 | Page 9 of 20
ADG1406/ADG1407
Table 10. ADG1406 Truth Table
A3
X
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
A2
X
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
A1
X
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
A0
X
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
EN
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Rev. 0 | Page 10 of 20
On Switch
None
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
3
26
S8A
S8B
4
25
S7A
S7B
5
24
S6A
S6B
6
23
S5A
S5B
7
22
S4A
S4B
8
21
S3A
S3B
9
20
S2A
S2B 10
19
S1A
S1B 11
18
EN
GND 12
17
A0
NC 13
16
A1
NC 14
15
A2
ADG1407
TOP VIEW
(Not to Scale)
NC = NO CONNECT
S8B
S7B
S6B
S5B
S4B
S3B
S2B
S1B
1
2
3
4
5
6
7
8
PIN 1
INDICATOR
ADG1407
TOP VIEW
(Not to Scale)
24
23
22
21
20
19
18
17
S8A
S7A
S6A
S5A
S4A
S3A
S2A
S1A
07419-037
VSS
NC
32
31
30
29
28
27
26
25
DA
27
9
10
11
12
13
14
15
16
28
2
GND
A2
NC
NC
NC
A1
A0
EN
1
DB
NOTES
1. NC = NO CONNECT.
2. EXPOSED PAD TIED TO SUBSTRATE, VSS.
07419-036
VDD
NC
DB
NC
VDD
NC
DA
NC
VSS
ADG1406/ADG1407
Figure 5. ADG1407 TSSOP Pin Configuration
Figure 6. ADG1407 LFCSP_VQ Pin Configuration
Table 11. ADG1407 Pin Function Descriptions
TSSOP
1
2
3, 13, 14
4
5
6
7
8
9
10
11
12
15
16
17
18
Pin No.
LFCSP_VQ
29
31
11, 12, 13, 26,
28, 30, 32
1
2
3
4
5
6
7
8
9
10
14
15
16
Mnemonic
VDD
DB
NC
Description
Most Positive Power Supply Potential.
Drain Terminal B. This pin can be an input or an output.
No Connect.
S8B
S7B
S6B
S5B
S4B
S3B
S2B
S1B
GND
A2
A1
A0
EN
Source Terminal 8B. This pin can be an input or an output.
Source Terminal 7B. This pin can be an input or an output.
Source Terminal 6B. This pin can be an input or an output.
Source Terminal 5B. This pin can be an input or an output.
Source Terminal 4B. This pin can be an input or an output.
Source Terminal 3B. This pin can be an input or an output.
Source Terminal 2B. This pin can be an input or an output.
Source Terminal 1B. This pin can be an input or an output.
Ground (0 V) Reference.
Logic Control Input.
Logic Control Input.
Logic Control Input.
Active High Digital Input. When this pin is low, the device is disabled and all switches are
turned off. When this pin is high, the Ax logic inputs determine which switch is turned on.
Source Terminal 1A. This pin can be an input or an output.
Source Terminal 2A. This pin can be an input or an output.
Source Terminal 3A. This pin can be an input or an output.
Source Terminal 4A. This pin can be an input or an output.
Source Terminal 5A. This pin can be an input or an output.
Source Terminal 6A. This pin can be an input or an output.
Source Terminal 7A. This pin can be an input or an output.
Source Terminal 8A. This pin can be an input or an output.
Most Negative Power Supply Potential. In single-supply applications, this pin can be
connected to ground. The exposed pad is tied to the substrate, VSS.
Drain Terminal A. This pin can be an input or an output.
19
20
21
22
23
24
25
26
27
17
18
19
20
21
22
23
24
25
S1A
S2A
S3A
S4A
S5A
S6A
S7A
S8A
VSS
28
27
DA
Rev. 0 | Page 11 of 20
ADG1406/ADG1407
Table 12. ADG1407 Truth Table
A2
X
0
0
0
0
1
1
1
1
A1
X
0
0
1
1
0
0
1
1
A0
X
0
1
0
1
0
1
0
1
EN
0
1
1
1
1
1
1
1
1
On Switch Pair
None
1
2
3
4
5
6
7
8
Rev. 0 | Page 12 of 20
ADG1406/ADG1407
TYPICAL PERFORMANCE CHARACTERISTICS
16
18
VDD = +10V
VSS = –10V
14
VDD = +13.5V
VSS = –13.5V
15
ON RESISTANCE (Ω)
VDD = +12V
VSS = –12V
10
8
6
VDD = +16.5V
VSS = –16.5V
VDD = +15V
VSS = –15V
4
12
TA = +125°C
TA = +85°C
9
TA = +25°C
6
TA = –40°C
3
TA = 25°C
IS = –10mA
VDD = +15V
VSS = –15V
0
–16.5 –13.5 –10.5 –7.5 –4.5
–1.5
4.5
1.5
7.5
0
–15
10.5 13.5 16.5
–10
07419-009
2
07419-006
ON RESISTANCE (Ω)
12
–5
0
VS, VD (V)
Figure 7. On Resistance as a Function of VD (VS), Dual Supply
30
25
VDD = +5.0V
VSS = –5.0V
20
15
VDD = +5.5V
VSS = –5.5V
10
VDD = +7V
VSS = –7V
5
0
–7
–3
1
–1
TA = +85°C
15
TA = +25°C
10
TA = –40°C
5
TA = 25°C
IS = –10mA
–5
TA = +125°C
20
3
5
VDD = +5V
VSS = –5V
0
–5
7
–4
–3
07419-010
25
ON RESISTANCE (Ω)
VDD = +4.5V
VSS = –4.5V
07419-007
ON RESISTANCE (Ω)
15
VDD = +3.V
VSS = –3.V
30
–2
–1
VS, VD (V)
0
1
2
3
4
5
VS, VD (V)
Figure 11. On Resistance as a Function of VD (VS)
for Different Temperatures, 5 V Dual Supply
Figure 8. On Resistance as a Function of VD (Vs), Dual Supply
25
40
VDD = +5V
VSS = 0V
30
20
25
20
VDD = +10.8V
VSS = 0V
15
ON RESISTANCE (Ω)
VDD = +8V
VSS = 0V
VDD = +12V
VSS = 0V
10
VDD = +15V
VSS = 0V
TA = 25°C
IS = –10mA
0
1.5
3.0
4.5
6.0
7.5
9.0
10.5
12.0 13.5
TA = +85°C
TA = +25°C
10
TA = –40°C
5
VDD = +13.2V
VSS = 0V
VDD = +12V
VSS = 0V
07419-008
5
TA = +125°C
15
0
15.0
0
2
07419-011
35
ON RESISTANCE (Ω)
10
Figure 10. On Resistance as a Function of VD (VS)
for Different Temperatures, 15 V Dual Supply
35
0
5
VS, VD (V)
4
6
8
10
VS, VD (V)
VS, VD (V)
Figure 12. On Resistance as a Function of VD (VS)
for Different Temperatures, 12 V Single Supply
Figure 9. On Resistance as a Function of VD (VS), Single Supply
Rev. 0 | Page 13 of 20
12
ADG1406/ADG1407
1.0
1.4
VDD = +15V
VSS = –15V
VBIAS = +10V/–10V
0.4
0.2
0
–0.2
IS (OFF) +–
ID (OFF) +–
IS (OFF) –+
ID (OFF) –+
ID, IS (ON) ++
ID, IS (ON) ––
–0.4
–0.6
–0.8
07419-012
–1.0
–1.2
–1.4
0
10
20
30
VDD = +12V
VSS = 0V
VBIAS = +1V/+10V
1.2
LEAKAGE CURRENT (nA)
LEAKAGE CURRENT (nA)
0.6
40
60
50
70
1.0
0.8
IS (OFF) +–
ID (OFF) +–
IS (OFF) –+
ID (OFF) –+
ID, IS (ON) ++
ID, IS (ON) ––
0.6
0.4
0.2
0
07419-015
0.8
–0.2
–0.4
80
20
0
40
TEMPERATURE (°C)
Figure 13. Leakage Current as a Function of Temperature (up to 85°C),
15 V Dual Supply
4
120
2
IDD (µA)
100
0
IS (OFF) +–
ID (OFF) +–
IS (OFF) –+
ID (OFF) –+
ID, IS (ON) ++
ID, IS (ON) ––
–4
–6
0
20
80
VDD = +15V
VSS = –15V
60
VDD = +12V
VSS = 0V
40
20
40
60
80
100
0
120
07419-016
–2
07419-013
LEAKAGE CURRENT (nA)
120
TA = 25°C
IDD PER LOGIC INPUT
140
–8
VDD = +5V
VSS = –5V
0
1.5
3.0
TEMPERATURE (°C)
6.0
4.5
7.5
9.0
10.5
12.0
13.5
15.0
LOGIC LEVEL (Ax, EN) (V)
Figure 14. Leakage Current as a Function of Temperature,
15 V Dual Supply
Figure 17. IDD vs. Logic Level
7
100
TA = 25°C
VDD = +5V
VSS = –5V
VBIAS = +4.5V/–4.5V
IS (OFF) +–
ID (OFF) +–
IS (OFF) –+
ID (OFF) –+
ID, IS (ON) ++
ID, IS (ON) – –
4
3
2
1
0
–1
07419-014
–2
–3
0
20
40
60
80
100
VDD = +15V
VSS = –15V
60
40
VDD = +5V
VSS = –5V
20
0
VDD = +12V
VSS = 0V
–20
–40
–60
–80
–15
120
TEMPERATURE (°C)
07419-017
5
80
CHARGE INJECTION (pC)
6
LEAKAGE CURRENT (nA)
100
160
VDD = +15V
VSS = –15V
VBIAS = +10V/–10V
6
–4
80
Figure 16. Leakage Current as a Function of Temperature,
12 V Single Supply
8
–10
60
TEMPERATURE (°C)
–10
–5
0
5
10
VS (V)
Figure 15. Leakage Current as a Function of Temperature,
5 V Dual Supply
Figure 18. Charge Injection vs. Source Voltage
Rev. 0 | Page 14 of 20
15
ADG1406/ADG1407
350
0
TIME (ns)
200
CROSSTALK (dB)
VDD = +5V
VSS = +5V
250
VDD = +12V
VSS = 0V
150
100
VDD = +15V
VSS = –15V
0
–40
–20
0
20
40
60
ADJACENT CHANNELS
(S1A TO S2A)
–40
–60
–80
ADJACENT SWITCHES
(S1A TO S1B)
–100
07419-018
50
VDD = +15V
VSS = –15V
TA = 25°C
–20
80
100
–120
1k
120
10k
100k
1M
10M
FREQUENCY (Hz)
TEMPERATURE (°C)
1G
Figure 22. ADG1407 Crosstalk vs. Frequency
Figure 19. Transition Time vs. Temperature
0
–20
100M
07419-021
300
0
VDD = +15V
VSS = –15V
TA = 25°C
–0.5
–60
–80
–100
–2.0
–2.5
–3.0
–3.5
10k
100k
1M
10M
FREQUENCY (Hz)
100M
1G
VDD = +15V
VSS = –15V
TA = 25°C
–4.0
100
07419-019
–120
1k
–1.5
Figure 20. Off Isolation vs. Frequency
100M
0.14
VDD = +15V
VSS = –15V
TA = 25°C
VS = 20V p-p
0.12
0.10
THD + N (%)
–50
–70
–90
VS = 15V p-p
0.06
0.04
–130
0.02
10k
100k
1M
10M
FREQUENCY (Hz)
100M
1G
Figure 21. ADG1406 Crosstalk vs. Frequency
VDD = +15V
VSS = –15V
TA = 25°C
RL = 100Ω
0.08
–110
–150
1k
10M
Figure 23. ADG1406 On Response vs. Frequency
07419-020
CROSSTALK (dB)
–30
10k
100k
1M
FREQUENCY (Hz)
0
VS = 10V p-p
07419-023
–10
1k
07419-022
INSERTION LOSS (dB)
OFF ISOLATION (dB)
–1.0
–40
0
2
4
6
8
10
12
14
16
18
FREQUENCY (kHz)
Figure 24. THD + N vs. Frequency, 15 V Dual Supply
Rev. 0 | Page 15 of 20
20
ADG1406/ADG1407
0
1.2
–20
VS = 10V p-p
VDD = +5V
VSS = –5V
TA = 25°C
RL = 110Ω
ACPSRR (dB)
–40
0.6
0.4
VS = 5V p-p
0.2
VS = 2.5V p-p
0
0
2
4
6
8
10
NO DECOUPLING
CAPACITORS
–60
–80
DECOUPLING
CAPACITORS
ON SUPPLIES
–100
07419-024
THD + N (%)
0.8
12
14
16
18
–120
100
20
FREQUENCY (kHz)
1k
10k
100k
FREQUENCY (Hz)
Figure 26. ACPSRR vs. Frequency
Figure 25. THD + N vs. Frequency, 5 V Dual Supply
Rev. 0 | Page 16 of 20
1M
10M
07419-025
1.0
VDD = +15V
VSS = –15V
TA = 25°C
V p-p = 0.63V
ADG1406/ADG1407
TERMINOLOGY
tBBM
Off time measured between the 80% points of the switches
when switching from one address state to another.
RON
Ohmic resistance between the D and S terminals.
ΔRON
Difference between the RON of any two channels.
RFLAT(ON)
Flatness is defined as the difference between the maximum and
minimum value of on resistance as measured.
VINL
Maximum input voltage for Logic 0.
VINH
Minimum input voltage for Logic 1.
IS (Off)
Source leakage current when the switch is off.
IINL, IINH
Input current of the digital input.
ID (Off)
Drain leakage current when the switch is off.
IDD
Positive supply current.
ID, IS (On)
Channel leakage current when the switch is on.
ISS
Negative supply current.
VD, VS
Analog voltage on Terminal D and Terminal S.
Off Isolation
A measure of unwanted signal coupling through an off channel.
CS (Off)
Channel input capacitance for the off condition.
Charge Injection
A measure of the glitch impulse transferred from the digital
input to the analog output during switching.
CD (Off)
Channel output capacitance for the off condition.
Bandwidth
The frequency at which the output is attenuated by 3 dB.
CD, CS (On)
On switch capacitance.
On Response
The frequency response of the on switch.
CIN
Digital input capacitance.
THD + N
The ratio of the harmonic amplitude plus noise of the signal to
the fundamental.
tON (EN)
Delay time between the 50% and 90% points of the digital input
and the switch on condition.
tOFF (EN)
Delay time between the 50% and 90% points of the digital input
and the switch off condition.
tTRANSITION
Delay time between the 50% and 90% points of the digital
inputs and the switch on condition when switching from one
address state to another.
ACPSRR (AC Power Supply Rejection Ratio)
Measures the ability of a part to avoid coupling noise and
spurious signals that appear on the supply voltage pin to the
output of the switch. The dc voltage on the device is modulated by a sine wave of 0.62 V p-p. The ratio of the amplitude
of signal on the output to the amplitude of the modulation is
the ACPSRR.
Rev. 0 | Page 17 of 20
ADG1406/ADG1407
TEST CIRCUITS
V
A
IDS
ID (ON)
ID (OFF)
A
S
NC
VD
Figure 27. On Resistance
50%
50%
D
A
VD
NC = NO CONNECT
Figure 28. Off Leakage
3V
ADDRESS
DRIVE (VIN)
D
VS
07419-125
VS
S
Figure 29. On Leakage
tr < 20ns
tf < 20ns
VDD
VSS
VDD
VSS
A0
0V
VIN
tTRANSITION
S1
A1
50Ω
VS1
S2 TO S15
A2
A3
tTRANSITION
VS16
S16
ADG14061
90%
2.4V
OUTPUT
OUTPUT
D
EN
GND
300Ω
35pF
1SIMILAR
07419-028
90%
CONNECTION FOR ADG1407.
Figure 30. Address to Output Switching Times, tTRANSITION
3V
ADDRESS
DRIVE (VIN)
VDD
VSS
VDD
VSS
A0
VIN
0V
S1
A1
50Ω
VS
S2 TO S15
A2
A3
S16
80%
ADG14061
80%
OUTPUT
2.4V
OUTPUT
D
EN
GND
300Ω
35pF
07419-029
tBBM
1SIMILAR CONNECTION FOR ADG1407.
Figure 31. Break-Before-Make Delay, tBBM
3V
ENABLE
DRIVE (VIN)
50%
VDD
VSS
VDD
VSS
A0
50%
S1
A1
A2
0V
VS
S2 TO S16
A3
tOFF (EN)
0.9VOUT
OUTPUT
ADG14061
0.9VOUT
VIN
50Ω
OUTPUT
D
EN
GND
300Ω
1SIMILAR CONNECTION FOR ADG1407.
Figure 32. Enable Delay, tON (EN), tOFF (EN)
Rev. 0 | Page 18 of 20
35pF
07419-030
tON (EN)
07419-027
IS (OFF)
D
07419-026
S
ADG1406/ADG1407
3V
VDD
VSS
VDD
A0
VSS
A1
A2
VIN
A3
ADG14061
VOUT
ΔVOUT
S
D
EN
VS
QINJ = CL × ΔVOUT
GND
VIN
CL
1nF
VOUT
07419-031
RS
1SIMILAR CONNECTION FOR ADG1407.
Figure 33. Charge Injection
VDD
VSS
VDD
NETWORK
ANALYZER
NETWORK
ANALYZER
VSS
S
VOUT
0.1µF
VDD
D
VS
VOUT
OFF ISOLATION = 20 log
VS
VOUT
VS
07419-032
RL
50Ω
R
50Ω
S2
D
GND
VSS
S1
RL
50Ω
50Ω
50Ω
GND
CHANNEL-TO-CHANNEL CROSSTALK = 20 log
Figure 34. Off Isolation
VDD
VSS
0.1µF
0.1µF
VOUT
VS
07419-034
VDD
0.1µF
Figure 36. Channel-to-Channel Crosstalk
VSS
0.1µF
0.1µF
VDD
VDD
VSS
VSS
0.1µF
0.1µF
NETWORK
ANALYZER
AUDIO PRECISION
VDD
50Ω
VS
GND
IN
VOUT
VOUT WITHOUT SWITCH
RL
10kΩ
07419-033
GND
INSERTION LOSS = 20 log
VS
V p-p
D
VIN
VOUT WITH SWITCH
RS
S
D
RL
50Ω
VSS
Figure 37. THD + Noise
Figure 35. Bandwidth
Rev. 0 | Page 19 of 20
VOUT
07419-035
S
ADG1406/ADG1407
OUTLINE DIMENSIONS
9.80
9.70
9.60
28
15
4.50
4.40
4.30
1
6.40 BSC
14
PIN 1
0.65
BSC
1.20 MAX
0.15
0.05
COPLANARITY
0.10
0.30
0.19
SEATING
PLANE
8°
0°
0.20
0.09
0.75
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153-AE
Figure 38. 28-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-28)
Dimensions shown in millimeters
0.60 MAX
5.00
BSC SQ
0.60 MAX
PIN 1
INDICATOR
0.50
BSC
4.75
BSC SQ
0.50
0.40
0.30
12° MAX
17
16
0.80 MAX
0.65 TYP
0.30
0.23
0.18
3.25
3.10 SQ
2.95
EXPOSED
PAD
(BOTTOM VIEW)
9
8
0.25 MIN
3.50 REF
0.05 MAX
0.02 NOM
SEATING
PLANE
1
0.20 REF
COPLANARITY
0.08
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
011708-A
TOP
VIEW
1.00
0.85
0.80
PIN 1
INDICATOR
32
25
24
Figure 39. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADG1406BRUZ 1
ADG1406BRUZ-REEL71
ADG1406BCPZ-REEL71
ADG1407BRUZ1
ADG1407BRUZ-REEL71
ADG1407BCPZ-REEL71
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Description
28-Lead Thin Shrink Small Outline Package [TSSOP]
28-Lead Thin Shrink Small Outline Package [TSSOP]
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
28-Lead Thin Shrink Small Outline Package [TSSOP]
28-Lead Thin Shrink Small Outline Package [TSSOP]
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Z = RoHS Compliant Part.
©2008 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07419-0-8/08(0)
Rev. 0 | Page 20 of 20
Package Option
RU-28
RU-28
CP-32-2
RU-28
RU-28
CP-32-2
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