OKI MSM6353L-XX Built-in 8 or 5 bit serial port 4-bit microcontroller Datasheet

E2E0012-27-Y3
¡ Semiconductor
MSM6353/6353L-xx
¡ Semiconductor
This version: Jan. 1998
Previous version: Mar. 1996
MSM6353/6353L-xx
Built-in 8 or 5 bit Serial Port 4-Bit Microcontroller
GENERAL DESCRIPTION
The MSM6353/6353L is a low-power 4-bit microcontroller manufactured in CMOS process
technology. It is best suited for the control of battery-driven equipment. The built-in 8-bit or
5-bit serial port provides a data communication capability with external apparatus.
FEATURES
• Low power consumption
• Large capacity memory
• ROM
: 4096 words ¥ 15 bits
• RAM
: 1024 words ¥ 4 bits
• I/O port
Input-output port
: 5 ports ¥ 4 bits (input or output can be specified for each port)
• 1.5 V single-power-supply operation (MSM6353)
Can be changed to 3.0 V specification by mask option (MSM6353L).
• Built-in watchdog timer
• Built-in serial port of 8 bits or 5 bits (asynchronous)
• 32.768 kHz built-in crystal oscillator circuit
• Package options:
42-pin shrink DIP (SDIP42-P-600-1.78) (Product name: MSM6353-xxSS, MSM6353L-xxSS)
44-pin plastic QFP (QFP44-P-910-0.80-K) (Product name:MSM6353-xxGS-K, MSM6353L-xxGS-K)
(QFP44-P-910-0.80-2K) (Product name: MSM6353-xxGS-2K,MSM6353L-xxGS-2K)
xx indicates the code number.
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PORT3
PORT4
P4.0
P4.1
P4.2
P4.3
XT
TEST1
TEST2
TEST3
SYSTEM
CLOCK
GENERATOR
INSTRUCTION
DECODER
INSTRUCTION
REGISTER
IRQEX
IRQRT IEXM0 IEXM1 IEXM2
PROGRAM COUNTER
RESET
WDOG 0
XT
WDOG 1
TMOUT
4096 ¥ 15 bits
SCND
D-BUS
SCNT
INTERRUPT CONTROL
EIRT
SBFFl
SBFF u
PROGRAM
ROM
P1 ¥ C
P00C
ADDER
FRMT
TIME BASE COUNTER
P2.0-2.3
P2 ¥ C
P3 ¥ C
WATCHDOG
TIMER
P01C
P02C
FLAG
ALU
ACC
PAGE
OSC
PORT2
P3.0
P3.1
P3.2
P3.3
P4 ¥ C
P03C
SERIAL
I/O
SOUT SCLK
BANK
XTOUT
PORT1
P2.0
P2.1
P2.2
P2.3
PORT0
P1.0
P1.1
P1.2
P1.3
P0.0
P0.1
P0.2
P0.3
SIN
VCP VCM
VOLTAGE
CONVERTER
REGURATOR
1024 ¥ 4 bits
DATA
RAM
VEE
VSS1
VSS2
VDD
¡ Semiconductor
MSM6353/6353L-xx
BLOCK DIAGRAM
WORK
STACK
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¡ Semiconductor
MSM6353/6353L-xx
PIN CONFIGURATION (TOP VIEW)
VDD
1
42
XT
VSS2
2
41
XT
VSS1
3
40
XTOUT
VEE
4
39
P1.0
NC
5
38
P1.1
VCP
6
37
P1.2
VCM
7
36
P1.3
NC
8
35
NC
SOUT
9
34
TEST3
SIN 10
SCLK 11
33
32
TEST2
TEST1
NC 12
31
RESET
P0.0 13
30
P4.3
P0.1 14
29
P4.2
P0.2 15
28
P4.1
P0.3 16
27
P4.0
NC 17
P2.0 18
26
25
NC
P3.3
P2.1 19
24
P3.2
P2.2
20
23
P3.1
P2.3
21
22
P3.0
NC : No-connection pin
42-Pin Shrink DIP
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¡ Semiconductor
MSM6353/6353L-xx
34 P1.0
35 XTOUT
36 XT
37 XT
38 VDD
39 VDD
40 VSS2
41 VSS1
42 VEE
43 NC
44 NC
PIN CONFIGURATION (TOP VIEW) (Continued)
NC
1
33 P1.1
VCP
2
32 P1.2
VCM
3
31 P1.3
NC
4
30 TEST3
SOUT
5
29 TEST2
NC 22
23 P4.0
P3.3 21
24 P4.1
P0.3 11
P3.2 20
P0.2 10
P3.1 19
25 P4.2
P3.0 18
26 P4.3
9
P2.3 17
8
P0.1
P2.3 16
P0.0
P2.2 15
27 RESET
P2.1 14
28 TEST1
7
P2.0 13
6
NC 12
SIN
SCLK
NC : No-connection pin
44-Pin Plastic QFP
4/9
¡ Semiconductor
MSM6353/6353L-xx
ABSOLUTE MAXIMUM RATINGS (MSM6353, 1.5 V)
VDD=0 V (VSS1=VSS2=battery voltage)
Parameter
Symbol
VSS1
Condition
Input Voltage
VIN
Ta=25°C
Output Voltage
VOUT
Storage Temperature
TSTG
Power Supply Voltage
Rating
Unit
–6.0 to +0.3
VSS–0.3 to VSS+0.3
V
VSS–0.3 to VSS+0.3
—
–55 to +125
°C
RECOMMENDED OPERATING CONDITIONS (MSM6353, 1.5 V)
VDD=0 V (VSS1=VSS2=battery voltage)
Symbol
Vop
Condition
Range
BUF=Fixed to "0"
–1.25 to –1.75
V
Operating Temperature
Top
—
–20 to +70
°C
Operating Frequency
fOSC
—
32.768
kHz
Parameter
Operating Voltage
Unit
ELECTRICAL CHARACTERISTICS (MSM6353, 1.5 V)
DC Characteristics
(VDD=0 V, VSS1=VSS2=–1.5 V (battery voltage), fOSC=32,768 Hz, CX=35 pF, Ta=25°C)
Parameter
Current Consumption
Oscillation Start Voltage
Output Current 1
Output Current 2
—
3.0
—
mA
–VOSC
Within 2 sec.
—
—
1.4
V
–IOH1
VO=–0.5 V
150
—
—
IOL1
VO=–1.0 V
150
—
—
–IOH2
VO=–0.5 V
7
—
—
IOL2
VO=–1.0 V
20
—
—
75
150
300
mA
—
—
1
mA
—
4
—
mA RESET
–IIH1
Input Leakage Current
| IIL2 |
Input Voltage
Min. Typ. Max. Unit Applied Pin
*1 *2
IDD
Input Current 1
Input Current 3
Condition
Symbol
–IIL3
VI=0 V, input state,
with pull-down resistor
VI=0V, –1.5 V, input state,
without pull-down resistor
VI=0 V,
with pull-down resistor
–VIH
—
—
—
0.3
–VIL
—
1.2
—
—
mA
—
—
PORT0 to PORT4*3
SOUT, SCLK, XTOUT
mA BD
V
PORT0 to PORT4
PORT0 to PORT4
SCLK, SIN, SOUT
All input pins
*1 This value depends on program.
*2 Backup flag (BUF)=fixed to "0".
*3 PORT0=P0.0-P0.3, PORT1=P1.0-P1.3, PORT2=P2.0-P2.3, PORT3=P3.0-P3.3, PORT4=P4.0P4.3.
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¡ Semiconductor
MSM6353/6353L-xx
ABSOLUTE MAXIMUM RATINGS (MSM6353L, 3.0 V)
VDD=0 V (VSS1=VSS2=battery voltage)
Parameter
Power Supply Voltage
Symbol
VSS1
Condition
Ta=25°C
Input Voltage
VIN
Output Voltage
VOUT
Storage Temperature
TSTG
Rating
Unit
–6.0 to +0.3
VSS–0.3 to VSS+0.3
V
VSS–0.3 to VSS+0.3
—
–55 to +125
°C
RECOMMENDED OPERATING CONDITIONS (MSM6353L, 3.0 V)
VDD=0 V (VSS1=VSS2=battery voltage)
Symbol
Vop
Condition
Range
BUF=Fixed to "1"
–2.2 to –3.5
V
Operating Temperature
Top
—
–20 to +70
°C
Operating Frequency
fOSC
—
32.768
kHz
Parameter
Operating Voltage
Unit
ELECTRICAL CHARACTERISTICS (MSM6353L, 3.0 V)
DC Characteristics
(VDD=0 V, VSS1=VSS2=–3.0 V (battery voltage), fOSC=32,768 Hz, CX=35 pF, Ta=25°C)
Parameter
Current Consumption
Oscillation Start Voltage
Output Current 1
Output Current 2
Symbol
—
3.0
—
mA
–VOSC
Within 2 sec.
—
—
2.4
V
–IOH1
VO=–0.5 V
500
—
—
IOL1
VO=–2.5 V
500
—
—
–IOH2
VO=–0.5 V
7
—
—
IOL2
VO=–2.5 V
20
—
—
150
300
600
mA
—
—
1
mA
—
25
—
mA RESET
–IIH1
Input Leakage Current
| IIL2 |
Input Voltage
Min. Typ. Max. Unit Applied Pin
*1 *2
IDD
Input Current 1
Input Current 3
Condition
–IIL3
VI=0 V, input state,
with pull-down resistor
VI=0 V, –3 V, input state,
without pull-down resistor
VI=0 V,
with pull-down resistor
–VIH
—
—
—
0.5
–VIL
—
2.5
—
—
mA
—
—
PORT0 to PORT4*3
SOUT, SCLK, XTOUT
mA BD
V
PORT0 to PORT4
PORT0 to PORT4
SCLK, SIN, SOUT
All input pins
*1 This value depends on program.
*2 Backup flag (BUF)=fixed to "1".
*3 PORT0=P0.0-P0.3, PORT1=P1.0-P1.3, PORT2=P2.0-P2.3, PORT3=P3.0-P3.3, PORT4=P4.0P4.3.
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¡ Semiconductor
MSM6353/6353L-xx
PACKAGE DIMENSIONS
(Unit : mm)
SDIP42-P-600-1.78
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
4.52 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
7/9
¡ Semiconductor
MSM6353/6353L-xx
(Unit : mm)
QFP44-P-910-0.80-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.35 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
8/9
¡ Semiconductor
MSM6353/6353L-xx
(Unit : mm)
QFP44-P-910-0.80-2K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Epoxy resin
42 alloy
Solder plating
5 mm or more
Package weight (g)
0.41 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
9/9
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