HLMP-3301, HLMP-3401, HLMP-3507, HLMP-3762, HLMP-3862, HLMP-3962, HLMP-D401 T-13/4 (5 mm) Diffused LED Lamps Data Sheet Description Features T-1 3/ 4 This family of tinted, diffused LED lamps is widely used in general purpose indicator applications. Diffusants, tints, and optical design are balanced to yield superior light output and wide viewing angles. Several intensity choices are available in each color for increased design flexibility. Device Selection Guide Material/Color GaP HER GaP Yellow GaP Orange GaP Green Part Number Luminous Intensity, Iv (mcd) at 10mA Min. Max. HLMP-3301 6.1 - HLMP-3301-D00xx 2.4 - HLMP-3301-F00xx 6.1 - HLMP-3301-FG0xx 6.1 15.5 HLMP-3762 9.7 - HLMP-3762-G00xx 9.7 - HLMP-3401 6.5 - HLMP-3401-E00xx 6.5 - HLMP-3862 10.3 - HLMP-D401 6.1 - HLMP-D401-EF0xx 3.8 9.7 HLMP-3507 4.7 - HLMP-3507-D00xx 4.7 - HLMP-3507-EF0xx 7.6 19.1 HLMP-3962 12.0 - HLMP-3962-F00xx 12.0 - • High intensity • Choice of 4 bright colors – High Efficiency Red – Orange – Yellow – High Performance Green • Popular T-13/4 diameter package • Selected minimum intensities • Wide viewing angle • General purpose leads • Reliable and rugged • Available on tape and reel Part Numbering System HLMP - x x xx - x x x xx Mechanical Option 00: Bulk 01: Tape & Reel, Crimped Leads 02: Tape & Reel, Straight Leads B1: Right Angle Housing, Uneven Leads B2: Right Angle Housing, Even Leads DD: Ammo Pack R4: Tape & Reel, Counter Clockwise Color Bin Options 0: Full Color Bin Distribution Maximum Iv Bin Options 0: Open (no max. limit) Others: Please refer to the Iv Bin Table Minimum Iv Bin Options Please refer to the Iv Bin Table Brightness Level 0x: Less Brightness 62: Higher Brightness Color Options 3,7: GaP HER 4,8: GaP Yellow (except D4xx) 5,9: GaP Green Package Options 3: T-1 3/4 (5 mm) D: T-1 3/4 (5 mm) GaP Orange Package Dimensions 6.10 (0.240) 5.59 (0.220) 0.89 (0.035) 0.64 (0.025) 0.65 (0.026) max SQUARE TYP. 0.55 (0.022) 0.40 (0.016) 5.08 (0.200) 4.57 (0.180) 2.54 (0.100) NOM. 9.19 (0.362) 8.43 (0.332) CATHODE LEAD 25.40(1.00) MINIMUM Notes: 1. All dimensions are in mm (inches). 2. An epoxy meniscus may extend about 1 mm (0.040") down the leads. 3. For PCB hole recommendations, see the Precautions section. 2 1.27(0.050) NOM. Optical/Electrical Characteristics at TA = 25°C Symbol Parameter Color Min. Typ. Max. Units Test Condition 2q1/2 Included Angle High Efficiency Red 60 Deg. IF = 10 mA Between Half Orange 60 See Note 1 Luminous Intensity Yellow 60 Points Green60 lPEAK Peak Wavelength High Efficiency Red 635 nm Measurement Orange 600at Peak Yellow583 Green565 Dl1/2 Spectral Line Halfwidth HER/Orange 40 nm Yellow36 Green28 ld Dominant Wavelength High Efficiency Red 626 nm See Note 2 Orange602 Yellow585 Green569 ts Speed of Response High Efficiency Red 90 ns Orange280 Yellow90 Green500 C Capacitance High Efficiency Red 11 pF VF = 0; Orange 4 f = 1 MHz Yellow15 Green18 RqJ-PIN Thermal Resistance All 260 °C/W Junction to Cathode Lead VF Forward Voltage HER/Orange 1.9 2.4 V IF = 10 mA Yellow 2.0 2.4 Green 2.1 2.7 VR Reverse Breakdown All 5.0V IR = 100 µA Voltage hV Luminous Efficacy High Efficiency Red – 145 lumens See Note 3 Orange 380 Watt Yellow – 500 Green595 Notes: 1. q1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant intensity, Ie, in Watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/Watt. 3 Absolute Maximum Ratings at TA = 25°C Green/ Parameter HER/Orange Yellow Emerald Green Units Peak Forward Current 90 60 90 mA Average Forward Current[1] 25 20 25 mA DC Current[2] 30 20 30 mA Power Dissipation[3] 135 85 135 mW Reverse Voltage (IR = 100 µA) 5 5 5 V Transient Forward Current[4] (10 µsec Pulse) 500 500 500 mA LED Junction Temperature 110 110 110 °C Operating Temperature Range -40 to +100 -40 to +100 -20 to +100 °C Storage Temperature Range -40 to +100 -40 to +100 -40 to +100 °C Notes: 1. See Figure 5 (Red/Orange), 10 (Yellow), or 15 (Green) to establish pulsed operating conditions. 2. For Red, Orange and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C. 3. 1.8 mW/°C. For Yellow series derate power linearly from 50°C at 1.6 mW/°C. 4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum Ratings. RELATIVE INTENSITY 1.0 ORANGE EMERALD GREEN TA = 25 C GREEN HIGH EFFICIENCY RED 0.5 YELLOW 0 500 550 600 650 WAVELENGTH – nm Figure 1. Relative intensity vs. wavelength 4 700 750 T-13/4 High Efficiency Red, Orange Diffused Lamps Figure 2. Forward current vs. forward voltage characteristics Figure 3. Relative luminous intensity vs. DC forward current Figure 5. Maximum tolerable peak current vs. pulse duration. (IDC MAX as per MAX ratings) Figure 6. Relative luminous intensity vs. angular displacement 5 Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak LED current T-13/4 Yellow Diffused Lamps Figure 7. Forward current vs. forward voltage characteristics Figure 8. Relative luminous intensity vs. forward current Figure 10. Maximum tolerable peak current vs. pulse duration. (IDC MAX as per MAX ratings) Figure 11. Relative luminous intensity vs. angular displacement 6 Figure 9. Relative efficiency (luminous intensity per unit current) vs. peak current T-13/4 Green/Emerald Green Diffused Lamps Figure 12. Forward current vs. forward voltage characteristics Figure 13. Relative luminous intensity vs. DC forward current Figure 15. Maximum tolerable peak current vs. pulse duration. (IDC MAX as per MAX ratings) Figure 16. Relative luminous intensity vs. angular displacement 7 Figure 14. Relative efficiency (luminous intensity per unit current) vs. peak LED current Intensity Bin Limits Color Bin Red/Orange Yellow 8 Intensity Range (mcd) Min. Max. D 2.4 3.8 E 3.8 6.1 F 6.1 9.7 G 9.7 15.5 H 15.5 24.8 I 24.8 39.6 J 39.6 63.4 K 63.4 101.5 L 101.5 162.4 M 162.4 234.6 N 234.6 340.0 O 340.0 540.0 P 540.0 850.0 Q 850.0 1200.0 R 1200.0 1700.0 S 1700.0 2400.0 T 2400.0 3400.0 U 3400.0 4900.0 V 4900.0 7100.0 W 7100.0 10200.0 X 10200.0 14800.0 Y 14800.0 21400.0 Z 21400.0 30900.0 E 6.5 10.3 F 10.3 16.6 G 16.6 26.5 H 26.5 42.3 I 42.3 67.7 J 67.7 108.2 K 108.2 173.2 L 173.2 250.0 M 250.0 360.0 N 360.0 510.0 O 510.0 800.0 P 800.0 1250.0 Q 1250.0 1800.0 R 1800.0 2900.0 S 2900.0 4700.0 T 4700.0 7200.0 U 7200.0 11700.0 V 11700.0 18000.0 W 18000.0 27000.0 Intensity Bin Limits, continued Color Bin Green Intensity Range (mcd) Min. Max. D 4.7 7.6 E 7.6 12.0 F 12.0 19.1 G 19.1 30.7 H 30.7 49.1 I 49.1 78.5 J 78.5 125.7 K 125.7 201.1 L 201.1 289.0 M 289.0 417.0 N 417.0 680.0 O 680.0 1100.0 P 1100.0 1800.0 Q 1800.0 2700.0 R 2700.0 4300.0 S 4300.0 6800.0 T 6800.0 10800.0 U 10800.0 16000.0 V 16000.0 25000.0 W 25000.0 40000.0 Maximum tolerance for each bin limit is ±18%. Color Categories Color Category # Green Yellow Orange Lambda (nm) Min. Max. 6 561.5 564.5 5 564.5 567.5 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 1 582.0 584.5 3 584.5 587.0 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 1 597.0 599.5 2 599.5 602.0 3 602.0 604.5 4 604.5 607.5 5 607.5 610.5 6 610.5 613.5 7 613.5 616.5 8 616.5 619.5 Tolerance for each bin limit is ±0.5 nm. 9 Mechanical Option Matrix Mechanical Option Code Definition 00 Bulk Packaging, minimum increment 500 pcs/bag 01 Tape & Reel, crimped leads, minimum increment 1300 pcs/bag 02 Tape & Reel, straight leads, minimum increment 1300 pcs/bag B1 Right Angle Housing, uneven leads, minimum increment 500 pcs/bag B2 Right Angle Housing, even leads, minimum increment 500 pcs/bag DD Ammo Pack, straight leads with minimum increment 2K/pack R4 Tape & Reel, straight leads, counter clockwise, anode lead leaving the reel first Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative for further clarification/information. 10 Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through hole sizes for LED component leads: • Recommended soldering conditions: LED Component Lead Size Diagonal Plated ThroughHole Diameter Lead size (typ.) 0.45 × 0.45 mm (0.018 × 0.018 in.) 0.636 mm (0.025 in) 0.98 to 1.08 mm (0.039 to 0.043 in) 0.65 mm (0.026 in) 0.919 mm (0.036 in) Wave Soldering Manual Solder Dipping Pre-heat Temperature 105 °C Max. – Pre-heat Time 30 sec Max. – Dambar shearoff area (max.) Peak Temperature 250 °C Max. 260 °C Max. Lead size (typ.) Dwell Time 3 sec Max. 5 sec Max. 0.50 × 0.50 mm (0.020 × 0.020 in.) 0.707 mm (0.028 in) Dambar shearoff area (max.) 0.70 mm (0.028 in) 0.99 mm (0.039 in) 1.05 to 1.15 mm (0.041 to 0.045 in) Note: Refer to application note AN1027 for more information on soldering LED components. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE TEMPERATURE – C 250 BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 200 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA 150 FLUXING 100 50 30 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 30 40 50 60 70 80 90 100 TIME – SECONDS Figure 17. Recommended wave soldering profile For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2015 Avago Technologies. All rights reserved. Obsoletes 5989-4258EN AV02-1558EN - March 30, 2015