Fairchild FAN1589 2.7a, 1.2v low dropout linear regulator for vrm8.5 Datasheet

www.fairchildsemi.com
FAN1589
2.7A, 1.2V Low Dropout Linear Regulator for VRM8.5
Features
Description
•
•
•
•
•
•
The FAN1589 is a low dropout three-terminal regulator with
2.7A output current capability. This device has been optimized
for VTT bus termination, where transient response and minimum input voltage are critical. The FAN1589 offers fixed
1.2V with 2.7A current capability for a GTL+ bus VTT
termination.
Fast transient response
Low dropout voltage at up to 2.7A
Load regulation: 0.05% typical
Trimmed current limit
On-chip thermal limiting
Standard TO-220, TO-263, TO-263 center cut and
TO-252 (DPAK) packages
Current limit is trimmed to ensure specified output current and
controlled short-circuit current. On-chip thermal limiting provides protection against any combination of overload and
ambient temperature that would create excessive junction
temperatures.
Applications
• A GTL+ bus supply for VRM 8.5
• Low voltage logic supply
• Post regulator for switching supply
The FAN1589 is available in the industry-standard TO-220,
TO-263, TO-263 center cut and TO-252 (DPAK) power
packages.
Typical Application
FAN1589
VOUT
VIN
VIN = 3.3V
+
10µF
GND
1.2V at 2.7A
+
22µF
REV. 1.0.5 11/10/03
FAN1589
PRODUCT SPECIFICATION
Pin Assignments
FAN1589T
FRONT VIEW
FAN1589M
Tab is OUT
FRONT VIEW
1
Tab is OUT
1
2
2
3
3
GND OUT IN
GND OUT IN
3-Lead Plastic TO-263
θJC = 3°C/W*
3-Lead Plastic TO-220
θJC = 3°C/W
FAN1589MC
FRONT VIEW
FAN1589D
FRONT VIEW
Tab is OUT
1
2
3
Tab is OUT
1 2 3
GND
IN
3-Lead Plastic TO-263 Center Cut
θJC = 3°C/W*
GND OUT IN
3-Lead Plastic TO-252
θJC = 3°C/W*
*With package soldered to 0.5 square inch copper area over backside ground plane or internal power plane, ΘJA can vary from
30°C/W to more than 40°C/W. Other mounting techniques can provide a thermal resistance lower than 30°C/W.
Absolute Maximum Ratings
Parameter
Min.
Max.
Unit
7
V
0
125
°C
-65
150
°C
300
°C
VIN
Operating Junction Temperature Range
Storage Temperature Range
Lead Temperature (Soldering, 10 sec.)
2
REV. 1.0.5 11/10/03
PRODUCT SPECIFICATION
FAN1589
Electrical Characteristics
Tj = 25°C unless otherwise specified.
The • denotes specifications which apply over the specified operating temperature range.
Parameter
Conditions
Min.
Typ.
Max
Units
Output Voltage
3.3V ≤ VIN ≤ 7V
10mA ≤ IOUT ≤ 2.7A
•
1.176
1.200
1.224
V
Line Regulation1, 2
(VOUT + 1.5V) ≤ VIN ≤ 7V,
IOUT = 10mA
•
0.005
0.2
%
Load Regulation1, 2
(VIN – VOUT) = 3V
10mA ≤ IOUT ≤ 2.7A
•
0.15
1.5
%
Dropout Voltage
∆VREF = 1%, IOUT = 2.7A
•
1.150
1.300
V
Current Limit
(VIN – VOUT) = 2V
•
3.1
Minimum Load Current
1.5V ≤ (VIN – VOUT) ≤ 5.75V
•
10
Quiescent Current
VIN = 5V
•
Ripple Rejection
f = 120Hz, COUT = 22µF Tantalum,
(VIN – VOUT) = 3V, IOUT = 2.7A
Thermal Regulation
TA = 25°C, 30ms pulse
A
mA
4
60
13
72
0.004
•
Temperature Stability
4
mA
dB
0.02
0.5
%/W
%
Long-Term Stability
TA = 125°C, 1000 hrs.
0.03
RMS Output Noise
(% of VOUT)
TA = 25°C, 10Hz ≤ f ≤ 10kHz
0.003
%
Thermal Resistance,
Junction to Case
TO-220
3
°C/W
TO-263, TO-252
3
°C/W
150
°C
Thermal Shutdown
1.0
%
Notes:
1. See thermal regulation specifications for changes in output voltage due to heating effects. Load and line regulation are
measured at a constant junction temperature by low duty cycle pulse testing.
2. Line and load regulation are guaranteed up to the maximum power dissipation (18W). Power dissipation is determined by
input/output differential and the output currrent. Guaranteed maximum output power will not be available over the full input/
output voltage range.
REV. 1.0.5 11/10/03
3
FAN1589
PRODUCT SPECIFICATION
Typical Performance Characteristics
0.10
1.5
OUTPUT VOLTAGE DEVIATION (%)
DROPOUT VOLTAGE (V)
1.4
1.3
1.2
1.1
1.0
T=0°C
0.9
T=125°C
T=25°C
0.8
0.7
0.6
0.5
0
0.5
1
1.5
2
2.5
3.0
0.05
0
-0.05
-0.10
-0.15
-0.20
-75 -50 -25
OUTPUT CURRENT (A)
Figure 1. Dropout Voltage vs. Output Current
∆I = 2.7A
0
25 50 75 100 125 150 175
JUNCTION TEMPERATURE (°C)
Figure 2. Load Regulation vs. Temperature
5
1.30
MINIMUM LOAD CURRENT (mA)
REFERENCE VOLTAGE (V)
VOUT SET WITH 1% RESISTORS
1.20
1.10
1.00
0.90
0.80
-75 -50 -25
0
4
3
2
1
0
-75 -50 -25
25 50 75 100 125 150 175
Figure 3. Output Voltage vs. Temperature
0
25 50 75 100 125 150 175
JUNCTION TEMPERATURE (°C)
JUNCTION TEMPERATURE (°C)
Figure 4. Minimum Load Current vs. Temperature
90
5.0
RIPPLE REJECTIONS (dB)
SHORT-CIRCUIT CURRENT (A)
80
4.5
4.0
3.5
70
60
50
40
30
20
10
3.0
-75 -50 -25
0
25 50 75 100 125 150 175
JUNCTION TEMPERATURE (°C)
Figure 5. Short-Circuit Current vs. Temperature
4
0
10
(VIN – VOUT) ≤ 3V
0.5V ≤ VRIPPLE ≤ 2V
IOUT = 2.7A
100
1K
10K
100K
FREQUENCY (Hz)
Figure 6. Ripple Rejection vs. Frequency
REV. 1.0.5 11/10/03
PRODUCT SPECIFICATION
FAN1589
Typical Performance Characteristics (continued)
2.5
15
10
5
0
50 60 70 80 90 100 110 120 130 140 150
CASE TEMPERATURE (°C)
Figure 7. Maximum Power Dissipation
OUTPUT CAPACITANCE ESR, (Ω)
POWER (W)
20
2
1.5
Area of Instability
1
0.5
Stable Area
0
0
1000
2000
2700
LOAD CURRENT (mA)
Figure 9. Stability Region
REV. 1.0.5 11/10/03
5
FAN1589
PRODUCT SPECIFICATION
Applications Information
Load Regulation
General
The FAN1589 is a three-terminal regulator optimized for a
GTL+ VTT termination applications. It is short-circuit protected, and offers thermal shutdown to turn off the regulator
when the junction temperature exceeds about 150°C. The
FAN1589 provides low dropout voltage and fast transient
response. Frequency compensation uses capacitors with low
ESR while still maintaining stability. This is critical in addressing the needs of low voltage high speed microprocessor buses
like a GTL+.
It is not possible to provide true remote load sensing because
the FAN1589 is a three-terminal device. Load regulation is
limited by the resistance of the wire connecting the regulators to the load. Load regulation per the data sheet specification is measured at the bottom of the package.
For fixed voltage devices, negative side sensing is a true
Kelvin connection with the ground pin of the device returned
to the negative side of the load. This is illustrated in Figure 10.
FAN1589
Stability
VIN
The FAN1589 requires an output capacitor as a part of the
frequency compensation. It is recommended to use a 22µF
solid tantalum or a 100µF aluminum electrolytic on the output to ensure stability. The frequency compensation of these
devices optimizes the frequency response with low ESR
capacitors. In general, it is suggested to use capacitors with
an ESR of <1Ω.
IN
RP
PARASITIC
LINE RESISTANCE
OUT
GND
RL
Figure 9. Connection for Best Load Regulation
Thermal Considerations
Protection Diodes
In normal operation, the FAN1589 does not require any protection diodes.
A protection diode between the input and output pins is usually not needed. An internal diode between the input and output pins on the FAN1589 can handle microsecond surge
currents of 50A to 100A. Even with large value output
capacitors it is difficult to obtain those values of surge currents in normal operation. Only with large values of output
capacitance, such as 1000µF to 5000µF, and with the input
pin instantaneously shorted to ground can damage occur. A
crowbar circuit at the input can generate those levels of current; a diode from output to input is then recommended, as
shown in Figure 9. Usually, normal power supply cycling or
system “hot plugging and unplugging” will not generate current large enough to do any damage.
As with any IC regulator, exceeding the maximum input-tooutput voltage differential causes the internal transistors to
break down and none of the protection circuitry is then
functional.
D1
1N4002
(OPTIONAL)
The FAN1589 protects itself under overload conditions with
internal power and thermal limiting circuitry. However, for
normal continuous load conditions, do not exceed maximum
junction temperature ratings. It is important to consider all
sources of thermal resistance from junction-to-ambient.
These sources include the junction-to-case resistance, the
case-to-heat sink interface resistance, and the heat sink resistance. Thermal resistance specifications have been developed
to more accurately reflect device temperature and ensure safe
operating temperatures.
For example, look at using an FAN1589 to generate 2.7A @
1.2V ± 2% from a 3.3V source (3.2V to 3.6V).
Assumptions:
VIN = 3.6V worst case
VOUT = 1.176V worst case
IOUT = 2.7A continuous
TA = 70°C
θCase-to-Ambient = 3°C/W (assuming both a heatsink and
a thermally conductive material)
The power dissipation in this application is:
•
•
•
•
•
PD = (VIN – VOUT) * (IOUT) = (3.6 – 1.18) * (2.7) = 6.53W
From the specification table:
FAN1589
VIN
C1
10µF
+
IN
OUT
GND
+
VOUT
C2
22µF
TJ = TA + (PD) * (θCase-to-Ambient + θJC)
= 70 + (6.53) * (3 + 3) = 109°C
The junction temperature is below the maximum rating.
Figure 8. Optional Protection
6
REV. 1.0.5 11/10/03
PRODUCT SPECIFICATION
FAN1589
Junction-to-case thermal resistance is specified from the IC
junction to the bottom of the case directly below the die. This
is the lowest resistance path for heat flow. Proper mounting
ensures the best thermal flow from this area of the package to
the heat sink. Use of a thermally conductive material at the
case-to-heat sink interface is recommended. Use a thermally
conductive spacer if the case of the device must be electrically
isolated and include its contribution to the total thermal
resistance. The case of the FAN1589 is directly connected to
the output of the device.
U1
FAN1589
VIN
3.3V
VIN
C1
10µF
+
VOUT
1.2V
VOUT
GND
+
C3
100µF
Figure 10. Application Circuit (FAN1589)
Table 1. Bill of Materials for Application Circuit for the FAN1589
Item
Quantity
Manufacturer
C1
1
Xicon
L10V10
10µF, 10V Aluminum
C3
1
Xicon
L10V100
100µF, 10V Aluminum
U1
1
Fairchild
FAN1589T
REV. 1.0.5 11/10/03
Part Number
Description
2.7A Regulator
7
FAN1589
PRODUCT SPECIFICATION
Mechanical Dimensions
3-Lead TO-263 Package
Symbol
Inches
Millimeters
Notes
Min.
Max.
Min.
Max.
A
b
b2
c2
D
E
e
.160
.020
.190
.036
4.06
0.51
4.83
0.91
L
L1
L2
R
α
.575
.090
—
.017
0°
.049
.051
.045
.055
.340
.380
.380
.405
.100 BSC
.625
.110
.055
.019
8°
1.25
1.30
1.14
1.40
8.64
9.65
9.65
10.29
2.54 BSC
14.61
2.29
—
0.43
0°
Notes:
1. Dimensions are exclusive of mold flash and metal burrs.
2. Standoff-height is measured from lead tip with ref. to Datum -B-.
3. Foot length is measured with ref. to Datum -A- with lead surface
(at inner R).
4. Dimensiuon exclusive of dambar protrusion or intrusion.
5. Formed leads to be planar with respect to one another at seating
place -C-.
15.88
2.79
1.40
0.78
8°
E
@PKG/
@HEATSINK
L2
c2
D
E-PIN
L
R (2 PLCS)
b2
L1
b
e
-B-
-A-
A
-C-
8
REV. 1.0.5 11/10/03
PRODUCT SPECIFICATION
FAN1589
Mechanical Dimensions (continued)
3-Lead TO-263 Center Cut Package
Inches
Symbol
Millimeters
Notes
Min.
Max.
Min.
Max.
A
b
b2
c2
D
E
e
.160
.020
.190
.036
4.06
0.51
4.83
0.91
L
L1
L2
.575
.090
—
.050
.017
0°
.049
.051
.045
.055
.340
.380
.380
.405
.100 BSC
L3
R
α
.625
.110
.055
.070
.019
8°
1.25
1.30
1.14
1.40
8.64
9.65
9.65
10.29
2.54 BSC
14.61
2.29
—
1.27
0.43
0°
Notes:
1. Dimensions are exclusive of mold flash and metal burrs.
2. Standoff-height is measured from lead tip with ref. to Datum -B-.
3. Foot length is measured with ref. to Datum -A- with lead surface
(at inner R).
4. Dimensiuon exclusive of dambar protrusion or intrusion.
5. Formed leads to be planar with respect to one another at seating
place -C-.
15.88
2.79
1.40
1.78
0.78
8°
E
@PKG/
@HEATSINK
L2
c2
D
E-PIN
L
R (2 PLCS)
b2
L1
L3
b
e
-B-
-A-
A
-C-
REV. 1.0.5 11/10/03
9
FAN1589
PRODUCT SPECIFICATION
Mechanical Dimensions (continued)
3-Lead TO-220 Package
Inches
Symbol
Min.
A
b
b1
c1
øP
D
E
e
Millimeters
Max.
Min.
.140
.190
.015
.040
.045
.070
.014
.022
.139
.161
.560
.650
.380
.420
.090
.110
.190
.210
.045
—
.020
.055
.230
.270
.080
.115
.500
.580
.250 BSC
.100
.135
3°
7°
e1
e3
F
H1
J1
L
L1
Q
α
Notes
Max.
3.56
4.83
.38
1.02
1.14
1.78
.36
.56
3.53
4.09
14.22
16.51
9.65
10.67
2.29
2.79
4.83
5.33
1.14
—
.51
1.40
5.94
6.87
2.04
2.92
12.70
14.73
6.35 BSC
2.54
3.43
3°
7°
Notes:
1. Dimension c1 apply for lead finish.
H1
Q
L
e3
b1
e
e1
E
b
L1
E-PIN
øP
α (5X)
c1
A
J1
D
10
F
REV. 1.0.5 11/10/03
PRODUCT SPECIFICATION
FAN1589
Mechanical Dimensions (continued)
3-Lead TO-252 Package
Symbol
Inches
Millimeters
Notes:
Notes
Min.
Max.
Min.
Max.
A
b
b2
b3
c
c2
.086
.025
.030
.205
.018
.018
.094
.035
2.19
0.64
0.76
5.21
0.46
0.46
2.39
0.89
D
E
e
H
5.33
6.22
6.35
6.73
2.29 BSC
9.40
10.41
1.40
1.78
2.74 REF
1
L
L1
.210
.245
.250
.265
.090 BSC
.370
.410
.055
.070
.108 REF
L3
L4
.035
.025
0.89
0.64
4
.045
.215
.024
.023
.080
.040
1.14
5.46
0.61
0.58
2.03
1.02
E
@PKG/
@HEATSINK
b3
4
1
1.
Dimensions are exclusive of mold flash, metal burrs or interlead
protrusion.
2.
Stand off-height is measured from lead tip with ref. to Datum -B-.
3.
Foot length is measured with ref. to Datum -A- with lead surface.
4.
Thermal pad contour optional within dimension b3 and L3.
5.
Formed leads to be planar with respect to one another at seating
place -C-.
6.
Dimensions and tolerances per ASME Y14.5M-1994.
3
L3
c2
D
E-PIN
H
L4
b2
L1
L
b
e
-B-
α = 0° – 10°
-A-
A
-C-
REV. 1.0.5 11/10/03
11
FAN1589
PRODUCT SPECIFICATION
Ordering Information
Product Number
Package
FAN1589MX
TO-263 in tape and reel
FAN1589MCX
TO-263 center cut in tape and reel
FAN1589T
TO-220
FAN1589DX
TO-252 in tape and reel
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support device
or system, or to affect its safety or effectiveness.
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