MC10EL52, MC100EL52 5 V ECL Differential Data and Clock D Flip‐Flop Description The MC10EL/100EL52 is a differential data, differential clock D flip-flop with reset. The device is functionally equivalent to the E452 device with higher performance capabilities. With propagation delays and output transition times significantly faster than the E452, the EL52 is ideally suited for those applications which require the ultimate in AC performance. Data enters the master portion of the flip-flop when the clock is LOW and is transferred to the slave, and thus the outputs, upon a positive transition of the clock. The differential clock inputs of the EL52 allow the device to also be used as a negative edge triggered device. The EL52 employs input clamping circuitry so that under open input conditions (pulled down to VEE) the outputs of the device will remain stable. The 100 Series contains temperature compensation. • 365 ps Propagation Delay • 2.0 GHz Toggle Frequency • ESD Protection: • • • • • • 1 1 SOIC−8 NB D SUFFIX CASE 751−07 TSSOP−8 DT SUFFIX CASE 948R−02 MARKING DIAGRAMS* 8 8 HEL52 ALYW 1 > 1 kV Human Body Model > 100 V Machine Model PECL Mode Operating Range: VCC = 4.2 V to 5.7 V with VEE = 0 V NECL Mode Operating Range: VCC = 0 V with VEE = −4.2 V to −5.7 V Internal Input Pulldown Resistors on D and CLK Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test Moisture Sensitivity: ♦ Level 1 for SOIC−8 NB ♦ Level 3 for TSSOP−8 ♦ For Additional Information, see Application Note AND8003/D Flammability Rating: UL 94 V−0 @ 0.125 in, Oxygen: Index 28 to 34 Transistor Count = 48 Devices These Devices are Pb-Free, Halogen Free and are RoHS Compliant ♦ HL52 ALYW 8 8 ♦ • 8 8 1 Features • www.onsemi.com KEL52 ALYW 1 1 SOIC−8 NB KL52 ALYW TSSOP−8 H = MC10 Y = Year K = MC100 W = Work Week A = Assembly Location = Pb-Free Package L = Wafer Lot (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION Package Shipping† MC10EL52DG Device SOIC−8 NB (Pb-Free) 98 Units/Tube MC10EL52DR2G SOIC−8 NB (Pb-Free) 2500 Tape & Reel MC10EL52DTG TSSOP−8 (Pb-Free) 100 Units/Tube MC100EL52DG SOIC−8 NB (Pb-Free) 48 Units/Tube MC100EL52DR2G SOIC−8 NB (Pb-Free) 2500 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2016 July, 2016 − Rev. 7 1 Publication Order Number: MC10EL52/D MC10EL52, MC100EL52 Table 1. TRUTH TABLE D D 1 8 D 2 7 VCC Q D* CLK* Q L H Z Z L H Z = LOW to HIGH Transition * Pin will default low when left open. CLK 3 6 Table 2. PIN DESCRIPTION Q PIN CLK 4 5 FUNCTION D, D CLK, CLK Q, Q VCC VEE VEE Figure 1. Logic Diagram and Pinout Assignment ECL Data Input ECL Clock Input ECL Data Output Positive Supply Negative Supply Table 3. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC PECL Mode Power Supply VEE = 0 V 8 V VEE NECL Mode Power Supply VCC = 0 V −8 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 −6 V Iout Output Current Continuous Surge 50 100 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm SOIC−8 NB SOIC−8 NB 190 130 °C/W qJC Thermal Resistance (Junction-to-Case) Standard Board SOIC−8 NB 41 to 44 °C/W qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm TSSOP−8 TSSOP−8 185 140 °C/W qJC Thermal Resistance (Junction-to-Case) Standard Board TSSOP−8 41 to 44 ±5% °C/W Tsol Wave Solder (Pb-Free) < 2 to 3 sec @ 260°C 265 °C VI ≤ VCC VI ≥ VEE Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. www.onsemi.com 2 MC10EL52, MC100EL52 Table 4. 10EL SERIES PECL DC CHARACTERISTICS (VCC = 5.0 V; VEE = 0 V (Note 1)) −40°C Symbol Characteristic Min 25°C Typ Max 21 25 Min 85°C Typ Max 21 25 Min Typ Max Unit 21 25 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 2) 3920 4010 4110 4020 4105 4190 4090 4185 4280 mV VOL Output LOW Voltage (Note 2) 3050 3200 3350 3050 3210 3370 3050 3227 3405 mV VIH Input HIGH Voltage (Single-Ended) 3770 4110 3870 4190 3940 4280 mV VIL Input LOW Voltage (Single-Ended) 3050 3500 3050 3520 3050 3555 mV VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) D CLK IIH Input HIGH Current IIL Input LOW Current V 3.4 2.5 4.6 4.4 3.4 2.5 4.6 4.4 150 0.5 3.4 2.5 4.6 4.4 150 0.5 150 0.3 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.25 V / −0.5 V for +25°C and +85°C. or VEE can vary +0.06 V / −0.5 V for −40°C. 2. Outputs are terminated through a 50 ohm resistor to VCC − 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPPmin and 1 V. Table 5. 10EL SERIES NECL DC CHARACTERISTICS (VCC = 0 V; VEE = −5.0 V (Note 1)) −40°C Symbol Characteristic Min Typ 25°C Max Min Typ 85°C Max Min Typ Max Unit IEE Power Supply Current 21 25 21 25 21 25 mA VOH Output HIGH Voltage (Note 2) −1080 −990 −890 −980 −895 −810 −910 −815 −720 mV VOL Output LOW Voltage (Note 2) −1950 −1800 −1650 −1950 −1790 −1630 −1950 −1773 −1595 mV VIH Input HIGH Voltage (Single-Ended) −1230 −890 −1130 −810 −1060 −720 mV VIL Input LOW Voltage (Single-Ended) −1950 −1500 −1950 −1480 −1950 −1445 mV VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) D CLK IIH Input HIGH Current IIL Input LOW Current V −1.6 −2.5 −0.4 −0.6 −1.6 −2.5 150 0.5 −0.4 −0.6 −1.6 −2.5 150 0.5 −0.4 −0.6 150 0.3 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.25 V / −0.5 V for +25°C and +85°C. or VEE can vary +0.06 V / −0.5 V for −40°C. 2. Outputs are terminated through a 50 ohm resistor to VCC − 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPPmin and 1 V. www.onsemi.com 3 MC10EL52, MC100EL52 Table 6. 100EL SERIES PECL DC CHARACTERISTICS (VCC = 5.0 V; VEE = 0 V (Note 1)) −40°C Symbol Characteristic Min 25°C Typ Max 21 25 Min 85°C Typ Max 21 25 Min Typ Max Unit 24 29 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 2) 3915 3995 4120 3975 4045 4120 3975 4050 4120 mV VOL Output LOW Voltage (Note 2) 3170 3305 3445 3190 3295 3380 3190 3295 3380 mV VIH Input HIGH Voltage (Single-Ended) 3835 4120 3835 4120 3835 4120 mV VIL Input LOW Voltage (Single-Ended) 3190 3525 3190 3525 3190 3525 mV 2.6 2.5 4.6 4.2 2.6 2.5 4.6 4.2 2.6 2.5 4.6 4.2 VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) D CLK IIH Input HIGH Current IIL Input LOW Current V 150 0.5 150 0.5 150 0.5 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.8 V / −0.5 V. 2. Outputs are terminated through a 50 ohm resistor to VCC − 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPPmin and 1 V. Table 7. 100EL SERIES NECL DC CHARACTERISTICS (VCC = 0 V; VEE = −5.0 V (Note 1)) −40°C Symbol Characteristic Min 25°C Typ Max 21 25 Min 85°C Typ Max 21 25 Min Typ Max Unit 24 29 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 2) −1085 −1005 −880 −1025 −955 −880 −1025 −955 −880 mV VOL Output LOW Voltage (Note 2) −1830 −1695 −1555 −1810 −1705 −1620 −1810 −1705 −1620 mV VIH Input HIGH Voltage (Single-Ended) −1165 −880 −1165 −880 −1165 −880 mV VIL Input LOW Voltage (Single-Ended) −1810 −1475 −1810 −1475 −1810 −1475 mV −2.4 −2.5 −0.4 −0.8 −2.4 −2.5 −0.4 −0.8 −2.4 −2.5 −0.4 −0.8 VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) D CLK IIH Input HIGH Current IIL Input LOW Current V 150 0.5 150 0.5 150 0.5 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.8 V / −0.5 V. 2. Outputs are terminated through a 50 ohm resistor to VCC − 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPPmin and 1 V. www.onsemi.com 4 MC10EL52, MC100EL52 Table 8. AC CHARACTERISTICS (VCC = 5.0 V; VEE = 0 V or VCC = 0 V; VEE = −5.0 V (Note 1)) −40°C Symbol Characteristic Min Typ 25°C Max Min Typ 2.2 2.8 275 365 85°C Max Min Typ 2.2 2.8 320 410 Max Unit fmax Maximum Toggle Frequency 1.8 2.5 tPLH tPHL Propagation Delay to Output CLK 225 335 tS Setup Time 125 0 125 0 125 0 ps tH Hold Time 150 50 150 50 150 50 ps tPW Minimum Pulse Width 400 VPP Input Swing (Note 2) 150 tJITTER Cycle-to-Cycle Jitter tr tf Output Rise/Fall Times Q (20%−80%) 515 400 1000 150 350 100 TBD 100 465 225 GHz 510 400 1000 150 350 100 TBD 225 ps ps 1000 TBD 225 mV ps 350 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. 10 Series: VEE can vary +0.25 V / −0.5 V for +25°C and +85°C. or VEE can vary +0.06 V / −0.5 V for −40°C 100 Series: VEE can vary +0.8 V / −0.5 V. 2. VPP(min) is minimum input swing for which AC parameters guaranteed. The device has a DC gain of ≈40. www.onsemi.com 5 MC10EL52, MC100EL52 Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 3.0 V Figure 2. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices) Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPS I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices www.onsemi.com 6 MC10EL52, MC100EL52 PACKAGE DIMENSIONS SOIC−8 NB D SUFFIX CASE 751−07 ISSUE AK −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 0.25 (0.010) M Y M 1 4 −Y− K G C N DIM A B C D G H J K M N S X 45 SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 7 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0 8 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 8 0.010 0.020 0.228 0.244 MC10EL52, MC100EL52 PACKAGE DIMENSIONS TSSOP−8 DT SUFFIX CASE 948R−02 ISSUE A 8x 0.15 (0.006) T U 0.10 (0.004) S 2X L/2 L 8 5 1 PIN 1 IDENT 0.15 (0.006) T U K REF M T U V S 0.25 (0.010) B −U− 4 M A −V− S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. S F DETAIL E C 0.10 (0.004) −T− SEATING PLANE D −W− G DETAIL E DIM A B C D F G K L M MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0 6 INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0 6 ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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