CALMIRCO CM1411-03CS 2 channel headset/speaker emi filter with esd protection Datasheet

CM1411
2 Channel Headset/Speaker EMI Filter with ESD Protection
Features
Product Description
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The CM1411 is a dual low-pass filter array integrating
two pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection.
This part is custom-designed to interface with a
speaker port on a cellular telephone or similar device.
Each high quality filter provides more than 35dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both
to and from a speaker element. They also support AC
signals with a cutoff frequency of 31MHz, enabling
audio signals to pass through without distortion.
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Functionally and pin compatible with CMD’s
CSPEMI201A
OptiGuard™ coated for improved reliability at
assembly
Two channels of EMI filtering
Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
Greater than 40dB attenuation at 1GHz
+8kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
+15kV ESD protection in each channel (HBM)
Supports AC signals—ideal for audio applications
Extremely low lead inductance for optimum filter
and ESD performance
5-bump, 0.950mm X 1.410mm footprint
Chip Scale Package (CSP)
Lead-free version available
In addition, the CM1411 provides a very high level of
protection for sensitive electronic components that may
be subjected to electrostatic discharge (ESD). The
CM1411 can safely dissipate ESD strikes of 8kV, the
maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the
device provides protection for contact discharges to
greater than 15kV.
Applications
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The CM1411 is particularly well-suited for portable
electronics (e.g., cellular telephones, PDAs, notebook
computers) because of its small package format and
low weight. The CM1411 incorporates OptiGuard™
coating which results in improved reliability at assembly and is available in a space-saving, low-profile Chip
Scale Package with optional lead-free finishing.
EMI filtering and ESD protection for
headset/speaker ports
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Digital Camcorders
Notebooks
Desktop PCs
Electrical Schematic
SPKR_IN1
10Ω
A1
100pF
SPKR_IN2
SPKR_OUT1
100pF
10Ω
A3
100pF
GND
C1
C3
SPKR_OUT2
100pF
B2
© 2005 California Micro Devices Corp. All rights reserved.
09/15/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
1
CM1411
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
1 2 3
SPKR_OUT1 SPKR_OUT2
A
CA
B
C1
C3
GND
B2
Pin "A1"
Marking
C
SPKR_IN1
SPKR_IN2
A1
A3
A1
CM1411
CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN
NAME
A1
SPKR_IN1
DESCRIPTION
Speaker Input 1 (from audio circuitry)
A3
SPKR_IN2
Speaker Input 2 (from audio circuitry)
B2
GND
C1
SPKR_OUT1
Speaker Output 1 (to speaker)
C3
SPKR_OUT2
Speaker Output 2 (to speaker)
Device Ground
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish2
Standard Finish
Pins
Package
Ordering Part
Number1
5
CSP
CM1411-03CS
Part Marking
Ordering Part
Number1
Part Marking
CA
CM1411-03CP
CA
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
09/15/05
CM1411
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Storage Temperature Range
RATING
UNITS
-65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
200
mW
RATING
UNITS
-40 to +85
°C
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
R
Resistance
9
10
11
Ω
C
Capacitance
80
100
120
pF
1.0
μA
15
-15
V
V
ILEAK
Diode Leakage Current
VIN=5.0V
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
VESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2,4 and 5
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3,4 and 5
Cut-off frequency
ZSOURCE = 50Ω, ZLOAD = 50Ω
R = 10Ω, C = 100pF
VCL
fC
5
-5
7
-10
±15
kV
±8
kV
+15
-19
V
V
31
MHz
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: These parameters are guaranteed by design and characterization.
© 2005 California Micro Devices Corp. All rights reserved.
09/15/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
3
CM1411
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B2)
Figure 2. Insertion Loss vs. Frequency (A3-C3 to GND B2)
© 2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
09/15/05
CM1411
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste
240°C
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
Temperature (°C)
250
200
150
100
50
0
Figure 4. Eutectic (SnPb) Solder
Ball Reflow Profile
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 5. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2005 California Micro Devices Corp. All rights reserved.
09/15/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
5
CM1411
Mechanical Details
CSP Mechanical Specifications
Mechanical Package Diagrams
The CM1411 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on the CSP, see the California Micro
Devices CSP Package Information document.
BOTTOM VIEW
PACKAGE DIMENSIONS
Bumps
5
Dim
Millimeters
Min
Nom
Max
C
B
Inches
Min
Nom
A2
Custom CSP
C1
B2
B1
B4
B3
Package
OptiGuardTM
Coating
A1
A
Max
0.905 0.950 0.995 0.0356 0.0374 0.0392
1 2 3
A2
1.365 1.410 1.455 0.0537 0.0555 0.0573
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.30 DIA.
D2
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.175 0.225 0.275 0.0069 0.0089 0.0108
C2
0.220 0.270 0.320 0.0087 0.0106 0.0126
D1
0.575 0.644 0.714 0.0226 0.0254 0.0281
D2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
C2
A1
SIDE
VIEW
D1
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1411 Chip Scale Package
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1411
1.41 X 0.95 X 0.644
1.52 X 1.07 X 0.720
8mm
178mm (7")
3500
4mm
4mm
10 Pitches Cumulative
Tolerance On Tape
±0.2 mm
Po
Top
Cover
Tape
Ao
W
Bo
Ko
For Tape Feeder Reference
Only including Draft.
Concentric Around B.
Embossment
Center Lines
of Cavity
P1
User Direction of Feed
Figure 6. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
09/15/05
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