NEW 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. FH 25 Series (51pos. type) 0.9mm 3.45mm 17 .1m m ■Features No exposed contacts 1. Extremely light weight The largest version, with all contacts loaded, weights only 0.11gramms. 2. Conductive traces on the PCB can run under the connector No exposed contacts on the bottom of the connector. 3. High density together with reliable solderability on the board Staggered contact points and the leads plus the nickel barriers assure sufficient distance to prevents solder bridging. 4. Easy FPC insertion and reliable electrical connection Proven Flip Lock® actuator allows easy insertion of FPC. Tactile sensation when fully closed confirms complete electrical and mechanical connection. Metal fittings do not protrude outside of the connector body Absence of protrusions on each side of connector allows closer side-by-side mounting of the connectors or closer component placement in miniaturized devices. Mounting pitch Nickel barrier prevents solder bridges 0.6mm Contacts Insulator body 5. Accepts standard thickness FPC 0.2 mm thick standard Flexible Printed Circuit board can be used. This is the only ultra-low profile ZIF connector allowing the use of standard FPC. 0.3mm Solid bottom surface 6. Board placement with automatic equipment Flat top surface and packaging on the tape-and-reel allows use of vacuum nozzles. Standard reel contains 5,000 connectors. Actuator open ■Applications Mobile phones, PDA’s, digital cameras, digital video cameras, LCD connections, plasma displays (PDP), camera modules and other compact devices requiring Flexible Printed Circuit connections using high reliability ultra-small profile connectors. FPC FPC insertion direction Actuator closed FPC fully inserted 2004.6 1 ■Product Specifications Rated current 0.15 A DC Rated voltage 30 V AC Rating Recommended FPC Operating temperature range -55ç to +85ç (Note 1) Operating humidity range Relative humidity 90% max. (No condensation) Storage temperature range -10ç to +50ç (Note 2) Storage humidity range Relative humidity 90% max. Thickness: = 0.2±0.03mm thick, gold plated connecting traces Item Specification Conditions 1. Insulation resistance 50 M ohms min. 2. Withstanding voltage No flashover or insulation breakdown. 100 m ohms max. 3. Contact resistance * Including FPC conductor resistance Contact resistance: 100 m ohms max. 4. Durability (insertion/ withdrawal) No damage, cracks, or parts dislocation. No electrical discontinuity of 1 µs or more. Contact resistance: 100 m ohms max. 5. Vibration No damage, cracks, or parts dislocation. No electrical discontinuity of 1 µs. min. Contact resistance: 100 m ohms max. 6. Shock No damage, cracks, or parts dislocation. Contact resistance: 100 m ohms max. 7. Humidity Insulation resistance: 50 M ohms min. (Steady state) No affect on appearance or performance. Contact resistance: 100 m ohms max. Insulation resistance: 50 M ohms min. 8. Temperature cycle No damage, cracks, or parts looseness. 9. Resistance to No deformation of components affecting performance. soldering heat 100 V DC 90 V AC /one minute 1 mA 10 cycles Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 10 cycles,3 axis. Acceleration of 981 m/s2, 6 ms duration, sine half-wave waveform, 3 cycles,3 axis. 96 hours at temperature of 40ç and humidity of 90% to 95%. Temperature: -55ç / +15ç to +35ç / +85ç / +15ç to +35ç Time: 30 / 2 to 3 / 30 / 2 to 3 (Minutes) 5 cycles Reflow: At the recommended temperature profile Manual soldering: 350ç±5ç for 5 seconds Note 1: Includes temperature rise caused by current flow. Note 2: The term ”storage” refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. ■Materials Part Insulator Contacts Metal fittings Material Finish LCP LCP Phosphor bronze Phosphor bronze Color: Black Color: Dark brown Gold plated Tin plated(No-lead) ■Ordering information FH25 - 51S - 0.3 - SH (05) 1 2 3 4 5 1 Series name: FH25 2 No. of contacts 3 2 Number of contacts: 21, 27, 33, 39, 45, 51 Contact pitch: 0.3 mm 4 Terminal type SH: SMT horizontal mounting type 5 Plating specifications (05): Gold, selective flash plated Remarks UL94V-0 ----------------------------- BOperation and Precautions Operation 1.FPC insertion procedure. Connector installed on the board. Precautions 1 Do not apply excessive force or use any type of tool to operate the actuator. 1 Lift up the actuator. Use thumb or index finger. 2 Fully insert the FPC in the connector parallel to mounting surface, with the exposed conductive traces facing down. 2 The connector will assure reliable performance when the actuator is open to 130˚maximum. Do not exceed this angle, as this may cause permanent damage to the connector. 130° FPC conductor surface (Bottom side) 3 Rotate down the actuator until firmly closed. It is critical that the inserted FPC is not moved and remains fully inserted. 3 Exercise caution when applying upward force to the connected FPC. FPC conductor surface on opposite side. 2.FPC removal 1 Lift up the actuator. Carefully withdraw the FPC. 3 ■Specifications A B G ∞Number of contacts (0.15) 0.15 G 0.9(Including contact terminal leads) (0.12) 3.05 (1.35) 1.0 0.3 Number of contacts indicator E (1.8) Polarizing mark indicator (0.4) A** 0 0 (0.15) (0.85) (C: FPC insertion slot dimension) 2 1 (1.75) 0.1MAX. D 0.1MAX. 1 2 2.3 Notes 1 The coplanarity of each terminal lead is within 0.1. 2 The contact terminal lead position indicates the dimension from the E surface, the bottom surface of the insulator body. 3 Slight variations in color of the plastic compounds do not affect form, fit or function of the connector. Unit: mm Part Number CL No. Number of Contacts A B C D FH25-21S-0.3SH(05) CL586-1204-3-05 21 8.1 6.0 6.64 7.45 FH25-27S-0.3SH(05) CL586-1205-6-05 27 9.9 7.8 8.44 9.25 FH25-33S-0.3SH(05) CL586-1207-1-05 33 11.7 9.6 10.24 11.05 FH25-39S-0.3SH(05) CL586-1208-4-05 39 13.5 11.4 12.04 12.85 FH25-45S-0.3SH(05) CL586-1209-7-05 45 15.3 13.2 13.84 14.65 FH25-51S-0.3SH(05) CL586-1200-2-05 51 17.1 15.0 15.64 16.45 Embossed tape reel packaging (5,000 pieces/reel). Order by number of reels. 4 BRecommended PCB mounting pattern and metal mask dimensions A (0.2) R (0.2) (0.25) 0.7±0.03 0.7±0.03 FU LL (0.15) (0.15) 0.9±0.03 (0.05) (0.2) B±0.05 (0.15) 2.65±0.05 (0.15) 1.65±0.03 (0.25) H ∞Number of contacts 0.3±0.05(Land) 0.1 H 0.25±0.05(Metal mask) Recommended metal mask thickness: t = 0.1 mm 0.3 0.4±0.03 0.4±0.03 BRecommended FPC Dimensions C±0.05 0.2±0.03 0.3±0.07 2-R0.2 MAX 0.5MIN 0.3 +0.04 - 0.03 Stiffener (2.3) 1.2±0.15 1.1±0.15 0.3±0.15 0.3 +0.04 - 0.03 0.6±0.02 2.8 (0.6) 0.6±0.02 0.3±0.02 0.6±0.07 D±0.03 2 2.8 MIN(Area with removed covering film layer) A±0.03 Covering film layer 1 Polyamide and thermally hardening adhesive is recommended as the stiffener materials. 2 Overlap between covering film layer and stiffener is 0.5mm min. Unit: mm Part Number CL No. Number of Contacts A B C D FH25-21S-0.3SH(05) CL586-1204-3-05 21 6.0 7.2 6.6 5.4 FH25-27S-0.3SH(05) CL586-1205-6-05 27 7.8 9.0 8.4 7.2 FH25-33S-0.3SH(05) CL586-1207-1-05 33 9.6 10.8 10.2 9.0 FH25-39S-0.3SH(05) CL586-1208-4-05 39 11.4 12.6 12.0 10.8 FH25-45S-0.3SH(05) CL586-1209-7-05 45 13.2 14.4 13.8 12.6 FH25-51S-0.3SH(05) CL586-1200-2-05 51 15.0 16.2 15.6 14.4 Embossed tape reel packaging (5,000 pieces/reel). Order by number of reels. 5 BPackaging Specification ●Embossed Carrier Tape Dimensions 8±0.1 1.75±0.1 2±0.15 4±0.1 .5 + 0 0 .1 (1.7) A±0.3 (C) B±0.1 Ø1 (0.3) (3.75) Flat surface for placement with automatic equipment (5.25) Unreeling direction (1.35) Unit: mm Part Number CL No. Number of Contacts A B C FH25-21S-0.3SH(05) CL586-1204-3-05 21 16 7.5 8.4 16.5 FH25-27S-0.3SH(05) CL586-1205-6-05 27 24 11.5 10.2 24.5 FH25-33S-0.3SH(05) CL586-1207-1-05 33 24 11.5 12.0 24.5 FH25-39S-0.3SH(05) CL586-1208-4-05 39 24 11.5 13.8 24.5 FH25-45S-0.3SH(05) CL586-1209-7-05 45 24 11.5 15.6 24.5 FH25-51S-0.3SH(05) CL586-1200-2-05 51 24 11.5 17.4 24.5 5,000 pieces per reel. ●Reel Dimensions (D) End portion Blank portion (10 pockets min.) 6 Mounting portion Embossed carrier tape (Ø80) (Ø380) Ø1 3± 0.5 (2) Lead portion (400mm min.) Blank portion (10 pockets min.) Top cover tape D BRecommended Temperature Profile ●Using Typical Solder Paste 5 sec. max. 250 Temperature 240ç 200 200ç 160ç 150 150ç ç) 100 50 25ç (30sec.) (60sec.) 60 sec. to 90 sec. 20 sec. to 30 sec. 0 Start 60 Preheating 120 Soldering Time (Seconds) HRS test conditions Solder method :Reflow, IR/hot air (Nihon Den-netsu Co., Ltd.’s Part Number: SENSBY NR-2) Environment :Room air Solder composition :Paste, 63%Sn/37%Pb (Senju Metal Industry, Co., Ltd.’s Part Number: OZ63-201C-50-9) Test board :Glass epoxy 70mm∞80mm∞1.6mm thick Land dimensions: 0.3mm∞0.65mm,0.3mm∞0.8mm Metal mask :0.23∞0.55∞0.1mm thick, 0.23∞0.65∞0.1mm thick This temperature profile is based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations. HRS test condition ●Using Lead-free Solder Paste Solder method MAX 250ç :Reflow, IR/hot air (Nihon Den-netsu Co., Ltd.’s Part Number: SENSBY NR-2) 250 230ç Environment :Room air Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu Temperature 200 200ç (Senju Metal Industry, Co., Ltd.’s Part Number: M705-221CM5-42-10.5) Test board 150 150ç :Glass epoxy 70mm∞80mm∞1.6mm thick Land dimensions: ç) 0.3mm∞0.65mm, 0.3mm∞0.8mm Metal mask 100 :0.23∞0.55∞0.1mm thick, 0.23∞0.65∞0.1mm thick 50 The temperature profiles are based on the above conditions. 25ç (60sec.) 60 sec. to 120 sec. (60sec.) In individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board 0 Start 60 Preheating 120 Soldering size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations. Time (Seconds) 7 BFH25 Series FPC Construction (Recommended) 1. Using Single-sided FPC Name Covering film layer Material Thickness (µm) 25 Polyamide 1 mil thick. 25 Cover adhesive Surface treatment Copper foil 1µm to 5µm nickel underplated (3) 0.2µm gold plated Cu 35 1oz 25 Base adhesive Polyamide 1 mil thick Base film 25 Reinforcement material adhesive 30 Polyamide 3 mil thick Stiffener 75 Total 193 2. Using Double-sided FPC Name Covering film layer Material Thickness (µm) Polyamide 1 mil thick Surface treatment 1µm to 5µm nickel underplated 0.2µm gold plated Through-hole copper Cu Copper foil Cu Polyamide 1 mil thick Cu 1/2oz Stiffener 18 25 Polyamide 1 mil thick 25 25 Reinforcement material adhesive Rear side 25 18 Cover adhesive Covering layer film 18 18 Base adhesive Copper foil (3) 15 1/2oz Base adhesive Base film 25 25 Cover adhesive Polyamide 1 mil thick Total 25 197 To prevent release of the lock due to FPC bending, use of the FPC with copper foil on rear side is NOT RECOMMENDED. 3. Precautions Note: Recommended specification for FPC 0.2 ± 0.03 mm thick. ® 8 5-23,OSAKI 5-CHOME,SHINAGAWA-KU,TOKYO 141-8587,JAPAN PHONE: 81-3-3491-9741, FAX: 81-3-3493-2933 http://www.hirose.com http://www.hirose-connectors.com The contents of this catalog are current as of date of publication. Contents are subject to change without notice for the purpose of improvements.