TI1 BQ2201SN-N Sram nonvolatile controller unit Datasheet

bq2201
SRAM Nonvolatile Controller Unit
Features
General Description
➤ Power monitoring and switching
for 3-volt battery-backup applications
The CMOS bq2201 SRAM Nonvolatile
Controller Unit provides all necessary
functions for converting a standard
CMOS SRAM into nonvolatile
read/write memory.
➤ Write-protect control
➤ 3-volt primary cell inputs
➤ Les s than 10ns chip- e nable
propagation delay
➤ 5% or 10% supply operation
A precision comparator monitors the
5V VCC input for an out-of-tolerance
condition. When out of tolerance is
detected, a conditioned chip-enable
output is forced inactive to writeprotect any standard CMOS SRAM.
Pin Connections
During a power failure, the external
SRAM is switched from the V CC
supply to one of two 3V backup supplies. On a subsequent power-up, the
SRAM is write-protected until a
power-valid condition exists.
The bq2201 is footprint- and timingcompatible with industry standards with the added benefit of a
chip-enable propagation delay of
less than 10ns.
Pin Names
NC
1
16
NC
VOUT
2
15
VCC
VOUT
Supply output
BC1—BC2
3-volt primary backup cell inputs
THS
Threshold select input
CE
chip-enable active low input
CECON
Conditioned chip-enable output
VOUT
1
8
VCC
NC
3
14
NC
BC2
2
7
BC1
BC2
4
13
BC1
THS
3
6
CECON
NC
5
12
NC
VCC
+5-volt supply input
VSS
4
5
CE
THS
6
11
CECON
VSS
Ground
NC
7
10
NC
NC
No Connect
VSS
8
9
CE
8-Pin Narrow DIP or SOIC
PN220101.eps
16-Pin SOIC
PN2201E.eps
Functional Description
An external CMOS static RAM can be battery-backed
using the VOUT and the conditioned chip-enable output
pin from the bq2201. As VCC slews down during a power
failure, the conditioned chip-enable output CE CON is
forced inactive independent of the chip-enable input CE.
If THS is tied to VSS, power-fail detection occurs at 4.62V
typical for 5% supply operation. If THS is tied to VCC,
power-fail detection occurs at 4.37V typical for 10% supply operation. The THS pin must be tied to VSS or VCC for
proper operation.
This activity unconditionally write-protects external
SRAM as VCC falls to an out-of-tolerance threshold VPFD.
VPFD is selected by the threshold select input pin, THS.
If a memory access is in process during power-fail detection, that memory cycle continues to completion before the
memory is write-protected. If the memory cycle is not terminated within time tWPT, the CECON output is unconditionally driven high, write-protecting the memory.
Oct. 1998 D
1
bq2201
A valid isolation signal requires CE low as VCC crosses
both VPFD and VSO during a power-down. See Figure 2.
Between these two points in time, CE must be brought
to the point of (0.48 to 0.52)*VCC and held for at least
700ns. The isolation signal is invalid if CE exceeds
0.54*VCC at any point between VCC crossing VPFD and
VSO.
As the supply continues to fall past VPFD, an internal
switching device forces VOUT to one of the two external
backup energy sources. CECON is held high by the VOUT
energy source.
During power-up, VOUT is switched back to the VCC supply as VCC rises above the backup cell input voltage
sourcing VOUT. The CECON output is held inactive for
time t CER (120 ms maximum) after the supply has
reached VPFD, independent of the CE input, to allow for
processor stabilization.
The appropriate battery is connected to VOUT and CECON
immediately on subsequent application and removal of VCC.
During power-valid operation, the CE input is fed
through to the CECON output with a propagation delay
of less than 10ns. Nonvolatility is achieved by hardware
hookup, as shown in Figure 1.
VPFD
Energy Cell Inputs—BC1, BC2
Two primary backup energy source inputs are provided
on the bq2201. The BC1 and BC2 inputs accept a 3V primary battery, typically some type of lithium chemistry.
If no primary cell is to be used on either BC1 or BC2, the
unused input should be tied to VSS.
VCC
VSO
If both inputs are used, during power failure the VOUT
output is fed only by BC1 as long as it is greater than
2.5V. If the voltage at BC1 falls below 2.5V, an internal
isolation switch automatically switches VOUT from BC1
to BC2.
0.5 VCC
CE
700ns
To prevent battery drain when there is no valid data to
retain, VOUT and CECON are internally isolated from
BC1 and BC2 by either of the following:
■
Initial connection of a battery to BC1 or BC2, or
■
Presentation of an isolation signal on CE.
TD220101.eps
Figure 2. Battery Isolation Signal
5V
VCC
From Address Decoder
VOUT
VCC
CE
bq2201
BC1
CE
CECON
CMOS
SRAM
THS
3V
Primary
Cell
VSS
BC2
3V
Primary
Cell
FG220101.eps
Figure 1. Hardware Hookup (5% Supply Operation)
Oct. 1998 D
2
bq2201
Absolute Maximum Ratings
Symbol
Parameter
Value
Unit
Conditions
VCC
DC voltage applied on VCC relative to VSS
-0.3 to 7.0
V
VT
DC voltage applied on any pin excluding VCC
relative to VSS
-0.3 to 7.0
V
VT ≤ VCC + 0.3
TOPR
0 to +70
°C
Commercial
Operating temperature
-40 to +85
°C
Industrial “N”
TSTG
Storage temperature
-55 to +125
°C
TBIAS
Temperature under bias
-40 to +85
°C
TSOLDER
Soldering temperature
260
°C
IOUT
VOUT current
200
mA
Note:
For 10 seconds
Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Exposure to conditions beyond the operational limits for extended periods of time may affect device reliability.
Recommended DC Operating Conditions (TA = TOPR)
Symbol
VCC
Parameter
Minimum
Typical
Maximum
Unit
4.75
5.0
5.5
V
THS = VSS
4.50
5.0
5.5
V
THS = VCC
0
0
0
V
Supply voltage
VSS
Supply voltage
VIL
Input low voltage
-0.3
-
0.8
V
VIH
Input high voltage
2.2
-
VCC + 0.3
V
VBC1,
VBC2
Backup cell voltage
2.0
-
4.0
V
THS
Threshold select
-0.3
-
VCC + 0.3
V
Note:
Typical values indicate operation at TA = 25°C, VCC = 5V or VBC.
Oct. 1998 D
3
Notes
bq2201
DC Electrical Characteristics (TA = TOPR, VCC = 5V ± 10%)
Symbol
Parameter
Minimum
Typical
Maximum
Unit
Conditions/Notes
-
-
±1
µA
2.4
-
-
V
IOH = -2.0mA
VBC - 0.3
-
-
V
VBC > VCC, IOH = -10µA
IOL = 4.0mA
ILI
Input leakage current
VOH
Output high voltage
VOHB
VOH, BC supply
VOL
Output low voltage
-
-
0.4
V
ICC
Operating supply current
-
3
5
mA
VPFD
4.55
4.62
4.75
V
Power-fail detect voltage
THS = VSS
4.30
4.37
4.50
V
THS = VCC
VIN = VSS to VCC
No load on VOUT and CECON.
VSO
Supply switch-over voltage
-
VBC
-
V
ICCDR
Data-retention mode
current
-
-
100
nA
VOUT1
VOUT voltage
VCC - 0.2
-
-
V
VCC > VBC, IOUT = 100mA
VCC - 0.3
-
-
V
VCC > VBC, IOUT = 160mA
VBC - 0.3
-
-
V
VCC < VBC, IOUT = 100µA
VOUT data-retention current
to additional memory not included.
VOUT2
VOUT voltage
VBC
Active backup cell
voltage
-
VBC2
-
V
VBC1 < 2.5V
-
VBC1
-
V
VBC1 > 2.5V
IOUT1
VOUT current
-
-
160
mA
VOUT > VCC - 0.3V
IOUT2
VOUT current
-
100
-
µA
VOUT > VBC - 0.2V
Note:
Typical values indicate operation at TA = 25°C, VCC = 5V or VBC.
Oct. 1998 D
4
bq2201
Capacitance (TA = 25°C, F = 1MHz, VCC = 5.0V)
Minimum
Typical
Maximum
Unit
CIN
Symbol
Input capacitance
-
-
8
pF
Input voltage = 0V
COUT
Output capacitance
-
-
10
pF
Output voltage = 0V
Note:
Parameter
Conditions
This parameter is sampled and not 100% tested.
AC Test Conditions
Parameter
Test Conditions
Input pulse levels
0V to 3.0V
Input rise and fall times
5ns
Input and output timing reference levels
1.5V (unless otherwise specified)
Output load (including scope and jig)
See Figure 3
5V
960
CECON
510
100pF
FG220102.eps
Figure 3. Output Load
Oct. 1998 D
5
bq2201
Power-Fail Control (TA = TOPR)
Symbol
Parameter
Minimum
Typical
Maximum
Unit
Notes
tPF
VCC slew, 4.75V to 4.25V
300
-
-
µs
tFS
VCC slew, 4.25V to VSO
10
-
-
µs
tPU
VCC slew, 4.25V to 4.75V
0
-
-
µs
tCED
Chip-enable propagation
delay
-
7
10
ns
tCER
Chip-enable recovery
40
80
120
ms
Time during which SRAM is
write-protected after VCC
passes VPFD on power-up.
tWPT
Write-protect time
40
100
150
µs
Delay after VCC slews down
past VPFD before SRAM is
write-protected.
Note:
Typical values indicate operation at TA = 25°C.
Caution: Negative undershoots below the absolute maximum rating of -0.3V in battery-backup mode
may affect data integrity.
Power-Down Timing
tPF
4.75
VPFD
VCC
tFS
4.25
VSO
CE
tWPT
VOHB
CECON
TD220102.eps
Oct. 1998 D
6
bq2201
Power-Up Timing
tPU
VCC
4.25
VSO
4.75
VPFD
tCER
CE
CECON
tCED
VOHB
tCED
TD220103.eps
Oct. 1998 D
7
bq2201
8-Pin DIP Narrow (PN)
8-Pin DIP Narrow (PN)
Dimension
A
A1
B
B1
C
D
E
E1
e
G
L
S
Minimum
0.160
0.015
0.015
0.055
0.008
0.350
0.300
0.230
0.300
0.090
0.115
0.020
Maximum
0.180
0.040
0.022
0.065
0.013
0.380
0.325
0.280
0.370
0.110
0.150
0.040
All dimensions are in inches.
8-Pin SOIC Narrow (SN)
8-Pin SOIC Narrow (SN)
Dimension
A
A1
B
C
D
E
e
H
L
Minimum
0.060
0.004
0.013
0.007
0.185
0.150
0.045
0.225
0.015
Maximum
0.070
0.010
0.020
0.010
0.200
0.160
0.055
0.245
0.035
All dimensions are in inches.
Oct. 1998 D
8
bq2201
S: 16-Pin SOIC
16-Pin S (SOIC)
D
Dimension
Minimum
A
0.095
A1
0.004
B
0.013
C
0.008
D
0.400
E
0.290
e
0.045
H
0.395
L
0.020
All dimensions are in inches.
B
e
E
H
A
C
.004
L
A1
Oct. 1998 D
9
Maximum
0.105
0.012
0.020
0.013
0.415
0.305
0.055
0.415
0.040
bq2201
Data Sheet Revision History
Change No.
Page No.
1
Note:
Description
Nature of Change
Added industrial temperature range
Was: THS tied to VOUT
Is: THS tied to VCC
2
1, 3, 4
10% supply operation
3
1, 9, 11
Added 16-pin package option
Change 1 = Sept. 1991 B changes from Sept. 1990 A.
Change 2 = Aug. 1997 C changes from Sept. 1991 B.
Change 3 = Oct. 1998 D changes from Aug. 1997 C.
Oct. 1998 D
10
bq2201
Ordering Information
bq2201
Temperature Range:
blank = Commercial (0 to +70°C)
N = Industrial (-40 to +85°C)
Package Option:
PN = 8-pin narrow plastic DIP
SN = 8-pin narrow SOIC
S = 16-pin SOIC
Device:
bq2201 Nonvolatile SRAM Controller
Oct. 1998 D
11
PACKAGE OPTION ADDENDUM
www.ti.com
13-Nov-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
BQ2201PN
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
BQ2201PNE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
BQ2201SN
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ2201SN-N
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ2201SN-NG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ2201SN-NTR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ2201SN-NTRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ2201SNG4
ACTIVE
SOIC
D
8
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ2201SNTR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BQ2201SNTRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
75
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
BQ2201SN-NTR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
BQ2201SNTR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ2201SN-NTR
SOIC
D
8
2500
346.0
346.0
29.0
BQ2201SNTR
SOIC
D
8
2500
346.0
346.0
29.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated
Similar pages