ON NL17SZ32DFT2G Single 2−input or gate Datasheet

NL17SZ32
Single 2−Input OR Gate
The NL17SZ32 is a single 2−input OR Gate in two tiny footprint
packages. The device performs much as LCX multi−gate products in
speed and drive. They should be used wherever the need for higher
speed and drive are needed.
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Features
•
•
•
•
•
•
•
•
Tiny SOT−353 and SOT−553 Packages
2.4 ns TPD at 5.0 V (typ)
Source/Sink 24 mA at 3.0 V
Over−Voltage Tolerant Inputs
Pin For Pin with NC7SZ32P5X, TC7SZ32FU and TC7SZ32AFE
Chip Complexity: FETs = 20
Designed for 1.65 V to 5.5 V VCC Operation
Pb−Free Packages are Available
B
1
A
2
GND
3
5
5
5
L4 M G
G
1
SOT−353/SC70−5/SC−88A
DF SUFFIX
CASE 419A
1
5
5
L4 M G
G
1
SOT−553
XV5 SUFFIX
CASE 463B
VCC
4
MARKING
DIAGRAMS
1
L4
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
Y
PIN ASSIGNMENT
Figure 1. Pinout (Top View)
A
B
w1
Y
Figure 2. Logic Symbol
Pin
Function
1
A
2
B
3
GND
4
Y
5
VCC
FUNCTION TABLE
Output
Input
Y=A)B
A
B
Y
L
L
L
L
H
H
H
L
H
H
H
H
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 6
1
Publication Order Number:
NL17SZ32/D
NL17SZ32
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
*0.5 to )7.0
V
VIN
DC Input Voltage
*0.5 to )7.0
V
*0.5 to VCC )0.5
V
VOUT
Parameter
DC Output Voltage
IIK
DC Input Diode Current
*50
mA
IOK
DC Output Diode Current
*50
mA
IOUT
DC Output Sink Current
$50
mA
ICC
DC Supply Current per Supply Pin
$100
mA
*65 to )150
°C
260
°C
)150
°C
SOT−353 (Note 1)
SOT−553
350
496
°C/W
SOT−353
SOT−553
186
135
mW
TSTG
Storage Temperature Range
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature Under Bias
qJA
Thermal Resistance
PD
Power Dissipation in Still Air at 85°C
MSL
Moisture Sensitivity
FR
Flammability Rating
ESD
ESD Classification
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Class Z
Class A
N/A
V
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B.
3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage
1.65
5.5
V
VIN
DC Input Voltage
0
5.5
V
DC Output Voltage
0
VCC + 0.5
V
*40
)85
°C
0
0
100
20
ns/V
VOUT
TA
Operating Temperature Range
tr, tf
Input Rise and Fall Time
VCC = 3.0 V $0.3 V
VCC = 5.0 V $0.5 V
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2
NL17SZ32
DC ELECTRICAL CHARACTERISTICS
TA = 255C
VCC
*405C v TA v 855C
(V)
Min
High−Level Input Voltage
1.65 to 1.95
2.3 to 5.5
0.75 VCC
0.7 VCC
VIL
Low−Level Input Voltage
1.65 to 1.95
2.3 to 5.5
VOH
High−Level Output Voltage
IOH = 100 mA
1.65 to 5.5
VCC − 0.1
VCC
VCC − 0.1
VIN = VIL or VIH
IOH = −3 mA
1.65
1.29
1.52
1.29
IOH = −8 mA
2.3
1.9
2.1
1.9
IOH = −12 mA
2.7
2.2
2.4
2.2
IOH = −16 mA
3.0
2.4
2.7
2.4
IOH = −24 mA
3.0
2.3
2.5
2.3
IOH = −32 mA
4.5
3.8
4.0
3.8
Low−Level Output Voltage
IOL = 100 mA
1.65 to 5.5
VIN = VIH or VOH
IOL = 3 mA
1.65
IOL = 8 mA
2.3
IOL = 12 mA
IOL = 16 mA
Symbol
Parameter
VIH
VOL
Condition
Typ
Max
Min
Max
0.75 VCC
0.7 VCC
0.25 VCC
0.3 VCC
Unit
V
0.25 VCC
0.3 VCC
V
V
0.1
0.1
0.08
0.24
0.24
0.20
0.3
0.3
2.7
0.22
0.4
0.4
3.0
0.28
0.4
0.4
IOL = 24 mA
3.0
0.38
0.55
0.55
IOL = 32 mA
4.5
0.42
0.55
0.55
V
IIN
Input Leakage Current
VIN = VCC or GND
0 to 5.5
$0.1
$1.0
mA
ICC
Quiescent Supply Current
VIN = VCC or GND
5.5
1
10
mA
AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns
TA = 255C
VCC
Symbol
tPLH
tPHL
Condition
(V)
RL = 1 MW, CL = 15 pF
1.65
2.0
5.5
12.0
2.0
12.7
RL = 1 MW, CL = 15 pF
1.8
2.0
4.6
10
2.0
10.5
RL = 1 MW, CL = 15 pF
2.5 $ 0.2
0.8
3.0
7
0.8
7.5
RL = 1 MW, CL = 15 pF
3.3 $ 0.3
0.5
2.6
4.7
0.5
5.0
1.5
3.0
5.2
1.5
5.5
0.5
2.2
4.1
0.5
4.4
0.8
2.4
4.5
0.8
4.8
Parameter
Propagation Delay
(Fi
(Figure
3 and
d 4))
*405C v TA v 855C
Min
RL = 500 W, CL = 50 pF
RL = 1 MW, CL = 15 pF
5.0 $ 0.5
RL = 500 W, CL = 50 pF
Typ
Max
Min
Max
Unit
ns
CAPACITIVE CHARACTERISTICS
Symbol
Typical
Unit
CIN
Input Capacitance
Parameter
VCC = 5.5 V, VI = 0 V or VCC
Condition
u4
pF
CPD
Power Dissipation Capacitance
(N
(Note
5))
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
25
pF
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
30
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
NL17SZ32
tf = 3 ns
tf = 3 ns
90%
INPUT
A and B
50%
VCC
90%
50%
10%
10%
tPHL
INPUT
GND
OUTPUT
RL
tPLH
CL
VOH
OUTPUT Y
50%
50%
A 1 MHz square input wave is recommended for
propagation delay tests.
VOL
Figure 3. Switching Waveform
Figure 4. Test Circuit
ORDERING INFORMATION
Device Order
Number
Package
Type
Tape and
Reel Size†
NL17SZ32DFT2
SC70−5/SC−88A/SOT−353
3000 / Tape & Reel
NL17SZ32DFT2G
SC70−5/SC−88A/SOT−353
(Pb−Free)
3000 / Tape & Reel
NL17SZ32XV5T2
SOT−553*
4000 / Tape & Reel
NL17SZ32XV5T2G
SOT−553*
4000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*All Devices in Package SOT553 are Inherently Pb−Free.
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4
NL17SZ32
PACKAGE DIMENSIONS
SC−88A, SOT−353, SC−70
CASE 419A−02
ISSUE J
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
B
M
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
−−−
0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
J
C
K
H
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
−−−
0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
NL17SZ32
PACKAGE DIMENSIONS
SOT−553
XV5 SUFFIX
5−LEAD PACKAGE
CASE 463B−01
ISSUE B
D
−X−
5
A
4
1
e
2
E
−Y−
3
b
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
L
HE
DIM
A
b
c
D
E
e
L
HE
c
5 PL
0.08 (0.003)
M
X Y
MILLIMETERS
NOM
MAX
0.55
0.60
0.22
0.27
0.13
0.18
1.60
1.70
1.20
1.30
0.50 BSC
0.10
0.20
0.30
1.50
1.60
1.70
MIN
0.50
0.17
0.08
1.50
1.10
STYLE 1:
PIN 1.
2.
3.
4.
5.
BASE 1
EMITTER 1/2
BASE 2
COLLECTOR 2
COLLECTOR 1
INCHES
NOM
0.022
0.009
0.005
0.063
0.047
0.020 BSC
0.004
0.008
0.059
0.063
MIN
0.020
0.007
0.003
0.059
0.043
STYLE 2:
PIN 1.
2.
3.
4.
5.
MAX
0.024
0.011
0.007
0.067
0.051
0.012
0.067
CATHODE
ANODE
CATHODE
CATHODE
CATHODE
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NL17SZ32/D
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