FAIRCHILD MM74HCT32

Revised February 1999
MM74HCT32
Quad 2-Input OR Gate
General Description
The MM74HCT32 is a logic function fabricated by using
advanced silicon-gate CMOS technology, which provides
the inherent benefits of CMOS—low quiescent power and
wide power supply range. This device is input and output
characteristic and pin-out compatible with standard 74LS
logic families. All inputs are protected from static discharge
damage by internal diodes to VCC and ground.
MM74HCT devices are intended to interface between TTL
and NMOS components and standard CMOS devices.
These parts are also plug-in replacements for LS-TTL
devices and can be used to reduce power consumption in
existing designs.
Features
■ TTL, LS pin-out and threshold compatible
■ Fast switching: tPLH , tPHL = 10 ns (typ)
■ Low power: 10 µW at DC
■ High fan-out, 10 LS-TTL loads
Ordering Code:
Order Number
Package Number
MM74HCT32M
MM74HCT32SJ
MM74HCT32MTC
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150” Narrow
M14D
14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MTC14
MM74HCT32N
Package Description
M14A
N14A
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001 0.300” Wide
Devices also available in Tape and Reel. Specify by appending suffix the letter “X” to the ordering code.
Connection Diagram
Pin Assignments for DIP, SOIC, SOP and TSSOP
Logic Diagram
© 1999 Fairchild Semiconductor Corporation
DS009396.prf
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MM74HCT32 Quad 2-Input OR Gate
October 1987
MM74HCT32
Absolute Maximum Ratings(Note 1)
Recommended Operating
Conditions
(Note 2)
Supply Voltage (VCC)
−0.5 to +7.0V
DC Input Voltage (VIN )
−1.5 to VCC +1.5V
DC Output Voltage (VOUT)
−0.5 to VCC +0.5V
Clamp Diode Current (IIK, IOK)
±20 mA
DC Output Current, per pin (IOUT)
±25 mA
(VIN, VOUT)
Operating Temperature Range (TA)
600 mW
500 mW
V
0
VCC
V
−40
+85
°C
500
ns
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating — plastic “N” package: −
12 mW/°C from 65°C to 85°C.
Lead Temperature (TL)
(Soldering 10 seconds)
Units
5.5
(tr, tf)
Power Dissipation (PD)
S.O. Package only
Max
4.5
Input Rise or Fall Times
−65°C to +150°C
(Note 3)
Min
DC Input or Output Voltage
±50 mA
DC VCC or GND Current, per pin (ICC)
Storage Temperature Range (TSTG)
Supply Voltage (VCC)
260°C
DC Electrical Characteristics
VCC = 5V ± 10% (unless otherwise specified)
Symbol
VIH
Parameter
TA = 25°C
Conditions
TA = −40°C to +85°C
Typ
Minimum HIGH Level
Units
Guaranteed Limits
2.0
2.0
V
0.8
0.8
V
Input Voltage
VIL
Maximum LOW Level
Input Voltage
VOH
VOL
Minimum HIGH Level
VIN = VIH or VIL
Output Voltage
|IOUT| = 20 µA
VCC
VCC − 0.1
VCC − 0.1
V
|IOUT| = 4.0 mA, VCC = 4.5V
4.2
3.98
3.84
V
|IOUT| = 4.8 mA, VCC = 5.5V
5.2
4.98
4.84
V
Maximum LOW Level
VIN = VIH
Voltage
|IOUT| = 20 µA
0
0.1
0.1
V
|IOUT| = 4.0 mA, VCC = 4.5V
0.2
0.26
0.33
V
|IOUT| = 4.8 mA, VCC = 5.5V
0.2
VIN = VCC or GND, VIH or VIL
IIN
Maximum Input
ICC
Maximum Quiescent
VIN = VCC or GND
Supply Current
IOUT = 0 µA
0.26
0.33
V
± 0.1
± 1.0
µA
2.0
20
µA
1.2
1.4
mA
Current
VIN = 2.4V or 0.5V (Note 4)
Note 4: This is measured per input with all other inputs held at VCC or ground.
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2
VCC = 5.0V, tr = tf = 6 ns, CL = 15 pF, TA = 25C° (unless otherwise noted)
Symbol
tPLH, tPHL
Parameter
Conditions
Typ
Maximum Propagation Delay
Guaranteed
Limit
10
Units
ns
AC Electrical Characteristics
VCC = 5.0V ± 10%, tr = tf = 6 ns, CL = 15 pF (unless otherwise noted)
Symbol
Parameter
Conditions
TA = 25°C
TA = −40°C to +85°C
Typ
Guaranteed Limits
tPLH, tPHL
Maximum Propagation Delay
12
20
25
tTHL, tTLH
Maximum Output Rise & Fall Time
8
15
19
CPD
Power Dissipation Capacitance
CIN
Input Capacitance
(Note 5)
48
5
Units
ns
ns
pF
10
10
pF
Note 5: CPD determines the no load dynamic power consumption, PD = CPD VCC2 f +ICC VCC, and the no load dynamic current consumption,
IS = CPD VCC f + ICC.
3
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MM74HCT32
AC Electrical Characteristics
MM74HCT32
Physical Dimensions inches (millimeters) unless otherwise noted
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150” Narrow
Package Number M14A
14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M14D
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4
MM74HCT32
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC14
5
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MM74HCT32 Quad 2-Input OR Gate
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
Package Number N14A
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SEMICONDUCTOR CORPORATION. As used herein:
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to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
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user.
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