Fujitsu MBM29DL324TD-90 32m (4m x 8/2m x 16) bit dual operation Datasheet

FUJITSU SEMICONDUCTOR
DATA SHEET
DS05-20873-4E
FLASH MEMORY
CMOS
32M (4M × 8/2M × 16) BIT
MBM29DL32XTD/BD
Dual Operation
-80/90/12
■ FEATURES
• 0.33 µm Process Technology
• Simultaneous Read/Write operations (dual bank)
Multiple devices available with different bank sizes (Refer to Table 1)
Host system can program or erase in one bank, then immediately and simultaneously read from the other bank
Zero latency between read and write operations
Read-while-erase
Read-while-program
• Single 3.0 V read, program, and erase
Minimizes system level power requirements
(Continued)
■ PRODUCT LINE UP
Part No.
MBM29DL32XTD/MBM29DL32XBD
VCC = 3.3 V
+0.3 V
–0.3 V
80
—
—
VCC = 3.0 V
+0.6 V
–0.3 V
—
90
12
Max. Address Access Time (ns)
80
90
120
Max. CE Access Time (ns)
80
90
120
Max. OE Access Time (ns)
30
35
50
Ordering Part No.
■ PACKAGES
48-pin plastic TSOP (I)
48-pin plastic TSOP (I)
57-ball plastic FBGA
Marking Side
Marking Side
(FPT-48P-M19)
(FPT-48P-M20)
Em\edded EraseTM and Embedded ProgramTM are trademarks of Advanced Micro Devices, Inc.
(BGA-57P-M01)
MBM29DL32XTD/BD-80/90/12
(Continued)
• Compatible with JEDEC-standard commands
Uses same software commands as E2PROMs
• Compatible with JEDEC-standard world-wide pinouts
48-pin TSOP(I) (Package suffix: PFTN – Normal Bend Type, PFTR – Reversed Bend Type)
57-ball FBGA (Package suffix: PBT)
• Minimum 100,000 program/erase cycles
• High performance
80 ns maximum access time
• Sector erase architecture
Eight 4K word and sixty-three 32K word sectors in word mode
Eight 8K byte and sixty-three 64K byte sectors in byte mode
Any combination of sectors can be concurrently erased. Also supports full chip erase.
• Boot Code Sector Architecture
T = Top sector
B = Bottom sector
• Hidden ROM (Hi-ROM) region
64K byte of Hi-ROM, accessible through a new “Hi-ROM Enable” command sequence
Factory serialized and protected to provide a secure electronic serial number (ESN)
• WP/ACC input pin
At VIL, allows protection of boot sectors, regardless of sector protection/unprotection status
At VIH, allows removal of boot sector protection
At VACC, increases program performance
• Embedded EraseTM Algorithms
Automatically pre-programs and erases the chip or any sector
• Embedded ProgramTM Algorithms
Automatically writes and verifies data at specified address
• Data Polling and Toggle Bit feature for detection of program or erase cycle completion
• Ready/Busy output (RY/BY)
Hardware method for detection of program or erase cycle completion
• Automatic sleep mode
When addresses remain stable, automatically switch themselves to low power mode.
• Low VCC write inhibit ≤ 2.5 V
• Erase Suspend/Resume
Suspends the erase operation to allow a read data and/or program in another sector within the same device
• Sector group protection
Hardware method disables any combination of sector groups from program or erase operations
• Sector Group Protection Set function by Extended sector group protection command
• Fast Programming Function by Extended Command
• Temporary sector group unprotection
Temporary sector group unprotection via the RESET pin.
• In accordance with CFI (Common Flash Memory Interface)
2
MBM29DL32XTD/BD-80/90/12
■ GENERAL DESCRIPTION
The MBM29DL32XTD/BD are a 32M-bit, 3.0 V-only Flash memory organized as 4M bytes of 8 bits each or 2M
words of 16 bits each. The MBM29DL32XTD/BD are offered in a 48-pin TSOP(I) and FBGA Package. These
devices are designed to be programmed in-system with the standard system 3.0 V VCC supply. 12.0 V VPP and
5.0 V VCC are not required for write or erase operations. The devices can also be reprogrammed in standard
EPROM programmers.
MBM29DL32XTD/BD are organized into two banks, Bank 1 and Bank 2, which can be considered to be two
separate memory arrays as far as certain operations are concerned. These devices are the same as Fujitsu’s
standard 3 V only Flash memories with the additional capability of allowing a normal non-delayed read access
from a non-busy bank of the array while an embedded write (either a program or an erase) operation is
simultaneously taking place on the other bank.
In the MBM29DL32XTD/BD, a new design concept is implemented, so called “Sliding Bank Architecture”. Under
this concept, the MBM29DL32XTD/BD can be produced a series of devices with different Bank 1/Bank 2 size
combinations; 0.5 Mb/31.5 Mb, 4 Mb/28 Mb, 8 Mb/24 Mb, 16 Mb/16 Mb.
The standard MBM29DL32XTD/BD offer access times 80 ns, 90 ns and 120 ns, allowing operation of high-speed
microprocessors without wait states. To eliminate bus contention the devices have separate chip enable (CE),
write enable (WE), and output enable (OE) controls.
The MBM29DL32XTD/BD are pin and command set compatible with JEDEC standard E2PROMs. Commands
are written to the command register using standard microprocessor write timings. Register contents serve as
input to an internal state-machine which controls the erase and programming circuitry. Write cycles also internally
latch addresses and data needed for the programming and erase operations. Reading data out of the devices
is similar to reading from 5.0 V and 12.0 V Flash or EPROM devices.
The MBM29DL32XTD/BD are programmed by executing the program command sequence. This will invoke the
Embedded Program Algorithm which is an internal algorithm that automatically times the program pulse widths
and verifies proper cell margin. Typically, each sector can be programmed and verified in about 0.5 seconds.
Erase is accomplished by executing the erase command sequence. This will invoke the Embedded Erase
Algorithm which is an internal algorithm that automatically preprograms the array if it is not already programmed
before executing the erase operation. During erase, the devices automatically time the erase pulse widths and
verify proper cell margin.
A sector is typically erased and verified in 1.0 second. (If already completely preprogrammed.)
The devices also feature a sector erase architecture. The sector mode allows each sector to be erased and
reprogrammed without affecting other sectors. The MBM29DL32XTD/BD are erased when shipped from the
factory.
The devices feature single 3.0 V power supply operation for both read and write functions. Internally generated
and regulated voltages are provided for the program and erase operations. A low VCC detector automatically
inhibits write operations on the loss of power. The end of program or erase is detected by Data Polling of DQ7,
by the Toggle Bit feature on DQ6, or the RY/BY output pin. Once the end of a program or erase cycle has been
completed, the devices internally reset to the read mode.
Fujitsu’s Flash technology combines years of EPROM and E2PROM experience to produce the highest levels
of quality, reliability, and cost effectiveness. The MBM29DL32XTD/BD memories electrically erase the entire
chip or all bits within a sector simultaneously via Fowler-Nordhiem tunneling. The bytes/words are programmed
one byte/word at a time using the EPROM programming mechanism of hot electron injection.
3
MBM29DL32XTD/BD-80/90/12
Table 1
Device
Part Number
Bank 1
Bank 2
Megabits
Sector sizes
Megabits
Sector sizes
MBM29DL321TD/BD
0.5 Mbit
Eight 8K byte/4K word
31.5 Mbit
Sixty-three
64K byte/32K word
MBM29DL322TD/BD
4 Mbit
Eight 8K byte/4K word,
seven 64K byte/32K word
28 Mbit
Fifty-six
64K byte/32K word
8 Mbit
Eight 8K byte/4K word,
fifteen 64K byte/32K word
24 Mbit
Forty-eight
64K byte/32K word
16 Mbit
Eight 8K byte/4K word,
thirty-one 64K byte/
32K word
16 Mbit
Thirty-two
64K byte/32K word
MBM29DL323TD/BD
MBM29DL324TD/BD
4
Organization
MBM29DL32XTD/BD Device Bank Divisions
× 8/× 16
MBM29DL32XTD/BD-80/90/12
■ PIN ASSIGNMENTS
TSOP(I)
A15
A14
A13
A12
A11
A10
A9
A8
A19
A20
WE
RESET
N.C.
WP/ACC
RY/BY
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
(Marking Side)
Standard Pinout
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
BYTE
VSS
DQ 15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE
VSS
CE
A0
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
A0
CE
VSS
OE
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
VCC
DQ4
DQ12
DQ5
DQ13
DQ6
DQ14
DQ7
DQ15/A-1
VSS
BYTE
A16
FPT-48P-M19
A1
A2
A3
A4
A5
A6
A7
A17
A18
RY/BY
WP/ACC
N.C.
RESET
WE
A20
A19
A8
A9
A10
A11
A12
A13
A14
A15
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
(Marking Side)
Reverse Pinout
FPT-48P-M20
5
MBM29DL32XTD/BD-80/90/12
(Continued)
FBGA
(TOP VIEW)
Marking side
A1
A2
A3
A4
A5
A6
B1
B2
B3
B4
B5
B6
C1
C2
C3
C4
C5
C6
D1
D2
D3
D4
D5
D6
E1
E2
E3
E4
E5
E6
F1
F2
F3
F4
F5
F6
G1
G2
G3
G4
G5
G6
H1
H2
H3
H4
H5
H6
(BGA-57P-M01)
A1
A3
A2
A7
A3
RY/BY
B1
A4
B2
A17
B3
C1
A2
C2
A6
D1
A1
D2
E1
A0
F1
A4
WE
A5
A9
A6
A13
WP/ACC B4
RESET
B5
A8
B6
A12
C3
A18
C4
N.C.
C5
A10
C6
A14
A5
D3
A20
D4
A19
D5
A11
D6
A15
E2
DQ0
E3
DQ2
E4
DQ5
E5
DQ7
E6
A16
CE
F2
DQ8
F3
DQ10
F4
DQ12
F5
DQ14
F6
BYTE
G1
OE
G2
DQ9
G3
DQ11
G4
VCC
G5
DQ13
G6
DQ15/A-1
H1
VSS
H2
DQ1
H3
DQ3
H4
DQ4
H5
DQ6
H6
VSS
Regarding additional No Internal Connection balls, please contact a Fujitsu representative for more
information.
6
MBM29DL32XTD/BD-80/90/12
■ BLOCK DIAGRAM
V CC
Cell Matrix
Bank 2 Address
A0 to A20
(A-1)
(Bank 2)
Y-Gating & Data Latch
V SS
X-Decoder
RY/BY
State
Control
&
Command
Register
Status
DQ 0 to DQ 15
Control
X-Decoder
Bank 1 Address
Cell Matrix
(Bank 1)
Y-Gating &
Data Latch
RESET
WE
CE
OE
BYTE
WP/ACC
DQ 0 to DQ 15
7
MBM29DL32XTD/BD-80/90/12
■ LOGIC SYMBOL
Table 2 MBM29DL32XTD/BD Pin Configuration
Pin
A-1
21
A0 to A20
16 or 8
DQ 0 to DQ 15
CE
Function
A-1, A0 to A20
Address Inputs
DQ0 to DQ15
Data Inputs/Outputs
CE
Chip Enable
OE
Output Enable
WE
Write Enable
OE
WE
RESET
BYTE
WP/ACC
RY/BY
RY/BY
Ready/Busy Output
RESET
Hardware Reset Pin/Temporary Sector
Group Unprotection
BYTE
WP/ACC
8
Selects 8-bit or 16-bit mode
Hardware Write Protection/Program
Acceleration
N.C.
No Internal Connection
VSS
Device Ground
VCC
Device Power Supply
MBM29DL32XTD/BD-80/90/12
■ DEVICE BUS OPERATION
Table 3 MBM29DL32XTD/BD User Bus Operations (BYTE = VIH)
Operation
CE OE WE
A0
A1
A6
A9
DQ0 to DQ15 RESET WP/ACC
Auto-Select Manufacturer Code (1)
L
L
H
L
L
L
VID
Code
H
X
Auto-Select Device Code (1)
L
L
H
H
L
L
VID
Code
H
X
Read (3)
L
L
H
A0
A1
A6
A9
DOUT
H
X
Standby
H
X
X
X
X
X
X
HIGH-Z
H
X
Output Disable
L
H
H
X
X
X
X
HIGH-Z
H
X
Write (Program/Erase)
L
H
L
A0
A1
A6
A9
DIN
H
X
Enable Sector Group Protection (2), (4)
L
VID
L
H
L
VID
X
H
X
Verify Sector Group Protection (2), (4)
L
L
H
L
H
L
VID
Code
H
X
Temporary Sector Group Unprotection (5)
X
X
X
X
X
X
X
X
VID
X
Reset (Hardware)/Standby
X
X
X
X
X
X
X
HIGH-Z
L
X
Boot Block Sector Write Protection
X
X
X
X
X
X
X
X
X
L
Table 4 MBM29DL32XTD/BD User Bus Operations (BYTE = VIL)
Operation
15/
CE OE WE DQ
A-1 A0
A1
A6
A9
DQ0 to DQ7 RESET WP/ACC
Auto-Select Manufacturer Code (1)
L
L
H
L
L
L
L
VID
Code
H
X
Auto-Select Device code (1)
L
L
H
L
H
L
L
VID
Code
H
X
Read (3)
L
L
H
A-1
A0
A1
A6
A9
DOUT
H
X
Standby
H
X
X
X
X
X
X
X
HIGH-Z
H
X
Output Disable
L
H
H
X
X
X
X
X
HIGH-Z
H
X
Write (Program/Erase)
L
H
L
A-1
A0
A1
A6
A9
DIN
H
X
Enable Sector Group Protection
(2), (4)
L
VID
L
L
H
L
VID
X
H
X
Verify Sector Group Protection
(2), (4)
L
L
H
L
L
H
L
VID
Code
H
X
Temporary Sector Group
Unprotection (5)
X
X
X
X
X
X
X
X
X
VID
X
Reset (Hardware)/Standby
X
X
X
X
X
X
X
X
HIGH-Z
L
X
Boot Block Sector Write Protection
X
X
X
X
X
X
X
X
X
X
L
Legend: L = VIL, H = VIH, X = VIL or VIH,
= Pulse input. See DC Characteristics for voltage levels.
Notes: 1. Manufacturer and device codes may also be accessed via a command register write sequence. See
Table 12.
2. Refer to the section on Sector Group Protection.
3. WE can be VIL if OE is VIL, OE at VIH initiates the write operations.
4. VCC = 3.3 V ± 10%
5. It is also used for the extended sector group protection.
9
MBM29DL32XTD/BD-80/90/12
■ ABSOLUTE MAXIMUM RATINGS(See WARNING)
Parameter
Symbol
Conditions
Tstg
Ambient Temperature with
Power Applied
Voltage with Respect to
Ground All pins except A9,
OE, RESET (Note 1)
Rating
Unit
Min.
Max.

–55
+125
°C
TA

–40
+85
°C
VIN, VOUT

–0.5
VCC+0.5
V
Power Supply Voltage
(Note 1)
VCC

–0.5
+4.0
V
A9, OE, and RESET
(Note 2)
VIN

–0.5
+13.0
V
WP/ACC (Note 3)
VIN

–0.5
+10.5
V
Storage Temperature
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
Notes: 1. Minimum DC voltage on input or I/O pins are –0.5 V. During voltage transitions, inputs may negative
overshoot VSS to –2.0 V for periods of up to 20 ns. Maximum DC voltage on output and I/O pins are VCC
+0.5 V. During voltage transitions, outputs may positive overshoot to VCC +2.0 V for periods of up to 20 ns.
2. Minimum DC input voltage on A9, OE and RESET pins are –0.5 V. During voltage transitions, A9, OE
and RESET pins may negative overshoot VSS to –2.0 V for periods of up to 20 ns. Maximum DC input
voltage on A9, OE and RESET pins are +13.0 V which may positive overshoot to 14.0 V for periods of
up to 20 ns. when VCC is applied.
3. Minimum DC input voltage on WP/ACC pin is –0.5 V. During voltage transitions, WP/ACC pin may
negative overshoot VSS to –2.0 V for periods of up to 20 ns. Maximum DC input voltage on WP/ACC pin
iis +10.5V which may positive overshoot to +10.5V for periods of up to 20ns when Vcc is applied.
■ RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Ambient Temperature
TA
Power Supply Voltage
VCC
Conditions
Value
Unit
Min.
Max.
MBM29DL32XTD/BD-80
–20
+70
°C
MBM29DL32XTD/BD-90/12
–40
+85
°C
MBM29DL32XTD/BD-80
+3.0
+3.6
V
MBM29DL32XTD/BD-90/12
+2.7
+3.6
V
Operating ranges define those limits between which the functionality of the devices are guaranteed.
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
10
MBM29DL32XTD/BD-80/90/12
■ MAXIMUM OVERSHOOT
+0.6 V
20 ns
20 ns
–0.5 V
–2.0 V
20 ns
Figure 1 Maximum Negative Overshoot Waveform
20 ns
V CC +2.0 V
V CC +0.5 V
+2.0 V
20 ns
20 ns
Figure 2 Maximum Positive Overshoot Waveform 1
20 ns
+14.0 V
+13.0 V
V CC +0.5 V
20 ns
20 ns
*: This waveform is applied for A9, OE, and RESET.
Figure 3 Maximum Positive Overshoot Waveform 2
11
MBM29DL32XTD/BD-80/90/12
■ ELECTRICAL CHARACTERISTICS
1. DC Characteristics
Parameter
Symbol
Value
Conditions
Min.
Max.
Unit
Input Leakage Current
ILI
VIN = VSS to VCC, VCC = VCC Max.
–1.0
+1.0
µA
Output Leakage Current
ILO
VOUT = VSS to VCC, VCC = VCC Max.
–1.0
+1.0
µA
A9, OE, RESET Inputs Leakage
Current
ILIT
VCC = VCC Max.
A9, OE, RESET = 12.5 V
—
35
µA
CE = VIL, OE = VIH,
f = 5 MHz
VCC Active Current (Note 1)
ICC1
CE = VIL, OE = VIH,
f = 1 MHz
Byte
Word
Byte
Word
—
—
16
mA
18
7
mA
7
VCC Active Current (Note 2)
ICC2
CE = VIL, OE = VIH
—
35
mA
VCC Current (Standby)
ICC3
VCC = VCC Max., CE = VCC ± 0.3 V,
RESET = VCC ± 0.3 V
—
5
µA
VCC Current (Standby, Reset)
ICC4
VCC = VCC Max.,WE/ACC = VCC ±
0.3 V, RESET = VSS ± 0.3 V
—
5
µA
VCC Current
(Automatic Sleep Mode) (Note 3)
ICC5
VCC = VCC Max., CE = VSS ± 0.3 V,
RESET = VCC ± 0.3 V
VIN = VCC ± 0.3 V or VSS ± 0.3 V
—
5
µA
VCC Active Current (Note 5)
(Read-While-Program)
ICC6
CE = VIL, OE = VIH
Byte
—
51
Word
—
53
VCC Active Current (Note 5)
(Read-While-Erase)
ICC7
CE = VIL, OE = VIH
Byte
—
51
Word
—
53
VCC Active Current
(Erase-Suspend-Program)
ICC8
CE = VIL, OE = VIH
—
35
mA
ACC Accelerated Program
Current
IACC
VCC = VCC Max.
WP/ACC = VACC Max.
—
20
mA
Input Low Level
VIL
—
–0.5
0.6
V
Input High Level
VIH
—
2.0
VCC+0.3
V
Voltage for WP/ACC Sector
Protection/Unprotection and
Program Acceleration
VACC
—
8.5
9.5
V
Voltage for Autoselect and Sector
Protection (A9, OE, RESET)
(Note 4)
VID
—
11.5
12.5
V
mA
mA
(Continued)
Notes: 1.
2.
3.
4.
5.
12
The ICC current listed includes both the DC operating current and the frequency dependent component.
ICC active while Embedded Algorithm (program or erase) is in progress.
Automatic sleep mode enables the low power mode when address remain stable for 150 ns.
Applicable for only VCC applying.
Embedded Algorithm (program or erase) is in progress. (@5 MHz)
MBM29DL32XTD/BD-80/90/12
(Continued)
Parameter
Output Low Voltage Level
Output High Voltage Level
Low VCC Lock-Out Voltage
Notes: 1.
2.
3.
4.
5.
Symbol
Conditions
Value
Min.
Max.
Unit
VOL
IOL = 4.0 mA, VCC = VCC Min.
—
0.45
V
VOH1
IOH = –2.0 mA, VCC = VCC Min.
2.4
—
V
VOH2
IOH = –100 µA
VCC–0.4
—
V
2.3
2.5
V
VLKO
—
The ICC current listed includes both the DC operating current and the frequency dependent component.
ICC active while Embedded Algorithm (program or erase) is in progress.
Automatic sleep mode enables the low power mode when address remain stable for 150 ns.
Applicable for only VCC applying.
Embedded Algorithm (program or erase) is in progress. (@5 MHz)
13
MBM29DL32XTD/BD-80/90/12
2. AC Characteristics
• Read Only Operations Characteristics
Parameter
symbols
Description
80
(Note)
90
(Note)
12
(Note)
Unit
Min.
80
90
120
ns
Test setup
JEDEC
Standard
tAVAV
tRC
Read Cycle Time
tAVQV
tACC
Address to Output Delay
CE = VIL
Max.
OE = VIL
80
90
120
ns
tELQV
tCE
Chip Enable to Output Delay
OE = VIL Max.
80
90
120
ns
tGLQV
tOE
Output Enable to Output Delay
—
Max.
30
35
50
ns
tEHQZ
tDF
Chip Enable to Output High-Z
—
Max.
25
30
30
ns
tGHQZ
tDF
Output Enable to Output High-Z
—
Max.
25
30
30
ns
tAXQX
tOH
Output Hold Time from Addresses,
CE or OE, Whichever Occurs First
—
Min.
0
0
0
ns
—
tREADY
RESET Pin Low to Read Mode
—
Max.
20
20
20
µs
—
tELFL
tELFH
CE or BYTE Switching Low or High
—
Max.
5
5
5
ns
—
Note: Test Conditions:
Output Load: 1 TTL gate and 30 pF (MBM29DL32XTD/BD 80)
1 TTL gate and 100 pF (MBM29DL32XTD/BD 90/12)
Input rise and fall times: 5 ns
Input pulse levels: 0.0 V to 3.0 V
Timing measurement reference level
Input: 1.5 V
Output:1.5 V
3.3 V
IN3064
or Equivalent
2.7 kΩ
Device
Under
Test
6.2 kΩ
CL
Diodes = IN3064
or Equivalent
Figure 4 Test Conditions
14
MBM29DL32XTD/BD-80/90/12
• Write/Erase/Program Operations
Parameter symbols
Description
80
90
12
Unit
Min.
80
90
120
ns
Address Setup Time
Min.
0
0
0
ns
tASO
Address Setup Time to OE Low During
Toggle Bit Polling
Min.
12
15
15
ns
tWLAX
tAH
Address Hold Time
Min.
45
45
50
ns
—
tAHT
Address Hold Time from CE or OE High
During Toggle Bit Polling
Min.
0
0
0
ns
tDVWH
tDS
Data Setup Time
Min.
30
35
50
ns
tWHDX
tDH
Data Hold Time
Min.
0
0
0
ns
Min.
0
0
0
ns
tOEH
Output Enable
Hold Time
Read
—
Toggle and Data Polling
Min.
10
10
10
ns
JEDEC
Standard
tAVAV
tWC
Write Cycle Time
tAVWL
tAS
—
—
tCEPH
CE High During Toggle Bit Polling
Min.
20
20
20
ns
—
tOEPH
OE High During Toggle Bit Polling
Min.
20
20
20
ns
tGHWL
tGHWL
Read Recover Time Before Write
Min.
0
0
0
ns
tGHEL
tGHEL
Read Recover Time Before Write
Min.
0
0
0
ns
tELWL
tCS
CE Setup Time
Min.
0
0
0
ns
tWLEL
tWS
WE Setup Time
Min.
0
0
0
ns
tWHEH
tCH
CE Hold Time
Min.
0
0
0
ns
tEHWH
tWH
WE Hold Time
Min.
0
0
0
ns
tWLWH
tWP
Write Pulse Width
Min.
35
35
50
ns
tELEH
tCP
CE Pulse Width
Min.
35
35
50
ns
tWHWL
tWPH
Write Pulse Width High
Min.
25
30
30
ns
tEHEL
tCPH
CE Pulse Width High
Min.
25
30
30
ns
tWHWH1
tWHWH1
Byte Programming Operation
Typ.
8
8
8
µs
tWHWH2
tWHWH2
Sector Erase Operation (Note 1)
Typ.
1
1
1
sec
—
tVCS
VCC Setup Time
Min.
50
50
50
µs
—
tVIDR
Rise Time to VID (Note 2)
Min.
500
500
500
ns
—
tVACCR
Rise Time to VID (Note 2)
Min.
500
500
500
ns
—
tVLHT
Voltage Transition Time (Note 2)
Min.
4
4
4
µs
—
tWPP
Write Pulse Width (Note 2)
Min.
100
100
100
µs
—
tOESP
OE Setup Time to WE Active (Note 2)
Min.
4
4
4
µs
(Continued)
15
MBM29DL32XTD/BD-80/90/12
(Continued)
Parameter symbols
Description
80
90
12
Unit
Min.
4
4
4
µs
Recover Time from RY/BY
Min.
0
0
0
ns
tRP
RESET Pulse Width
Min.
500
500
500
ns
—
tRH
RESET High Level Period before Read
Min.
200
200
200
ns
—
tFLQZ
BYTE Switching Low to Output High-Z
Max.
30
30
40
ns
—
tFHQV
BYTE Switching High to Output Active
Max.
80
90
120
ns
—
tBUSY
Program/Erase Valid to RY/BY Delay
Max.
90
90
90
ns
—
tEOE
Delay Time from Embedded Output Enable Max.
80
90
120
ns
—
tTOW
Erase Time-Out Time
Min.
50
50
50
µs
—
tSPD
Erase Suspend Transition Time
Max.
20
20
20
µs
JEDEC
Standard
—
tCSP
CE Setup Time to WE Active (Note 2)
—
tRB
—
Notes: 1. This does not include the preprogramming time.
2. This timing is for Sector Group Protection operation.
16
MBM29DL32XTD/BD-80/90/12
■ ERASE AND PROGRAMMING PERFORMANCE
Limits
Parameter
Unit
Comments
Min.
Typ.
Max.
Sector Erase Time
—
1
10
sec
Word Programming Time
—
16
360
µs
Byte Programming Time
—
8
300
µs
Chip Programming Time
—
—
100
sec
100,000
—
—
cycles
Program/Erase Cycle
Excludes programming time
prior to erasure
Excludes system-level
overhead
Excludes system-level
overhead
—
■ PIN CAPACITANCE
Parameter
symbol
Parameter description
Test setup
Typ.
Max.
Unit
6
7.5
pF
8.5
12
pF
CIN
Input Capacitance
VIN = 0
COUT
Output Capacitance
VOUT = 0
CIN2
Control Pin Capacitance
VIN = 0
8
11
pF
CIN3
WP/ACC Pin Capacitance
VIN = 0
21.5
22.5
pF
Note: Test conditions TA = 25°C, f = 1.0 MHzs
17
MBM29DL32XTD/BD-80/90/12
■ TIMING DIAGRAM
• Key to Switching Waveforms
WAVEFORM
INPUTS
OUTPUTS
Must Be
Steady
Will Be
Steady
May
Change
from H to L
Will Be
Changing
from H to L
May
Change
from L to H
Will Be
Changing
from L to H
“H” or “L”
Any Change
Permitted
Changing
State
Unknown
Does Not
Apply
Center Line is
HighImpedance
“Off” State
t RC
Addresses
Addresses Stable
t ACC
CE
t OE
t DF
OE
t OEH
WE
t OH
t CE
Outputs
High-Z
Output Valid
Figure 5.1 AC Waveforms for Read Operations
18
High-Z
MBM29DL32XTD/BD-80/90/12
t RC
Addresses
Addresses Stable
t ACC
CE
t RH
t
RP
t
RH
t
CE
RESET
t OH
Outputs
High-Z
Output Valid
Figure 5.2 AC Waveforms for Hardware Reset/Read Operations
19
MBM29DL32XTD/BD-80/90/12
Data Polling
3rd Bus Cycle
Addresses
555H
t WC
PA
t AS
PA
t RC
t AH
CE
t CH
t CS
t CE
OE
t GHWL
t WP
t WPH
t OE
t WHWH1
WE
t OH
t DS
t DH
A0H
Data
Notes: 1.
2.
3.
4.
5.
6.
PD
DQ 7
D OUT
D OUT
PA is address of the memory location to be programmed.
PD is data to be programmed at byte address.
DQ7 is the output of the complement of the data written to the device.
DOUT is the output of the data written to the device.
Figure indicates last two bus cycles out of four bus cycle sequence.
These waveforms are for the ×16 mode. (The addresses differ from ×8 mode.)
Figure 6 AC Waveforms for Alternate WE Controlled Program Operations
20
MBM29DL32XTD/BD-80/90/12
3rd Bus Cycle
Addresses
Data Polling
PA
555H
t WC
t AS
PA
t AH
WE
t WS
t WH
OE
t GHEL
t CP
t CPH
t WHWH1
CE
t DS
t DH
Data
Notes: 1.
2.
3.
4.
5.
6.
A0H
PD
DQ 7
D OUT
PA is address of the memory location to be programmed.
PD is data to be programmed at byte address.
DQ7 is the output of the complement of the data written to the device.
DOUT is the output of the data written to the device.
Figure indicates last two bus cycles out of four bus cycle sequence.
These waveforms are for the ×16 mode. (The addresses differ from ×8 mode.)
Figure 7 AC Waveforms for Alternate CE Controlled Program Operations
21
MBM29DL32XTD/BD-80/90/12
Addresses
2AAH
555H
t WC
t AS
555H
555H
2AAH
SA *
t AH
CE
t CS
t CH
OE
t GHWL
t WP
t WPH
WE
t DS
AAH
Data
t DH
55H
80H
AAH
55H
10H/
30H
t VCS
V CC
*: SA is the sector address for Sector Erase. Addresses = 555H (Word), AAAH (Byte) for Chip Erase.
Note: These waveforms are for the ×16 mode. (The addresses differ from ×8 mode.)
Figure 8 AC Waveforms for Chip/Sector Erase Operations
22
MBM29DL32XTD/BD-80/90/12
CE
t CH
t OE
t DF
OE
t OEH
WE
t CE
*
DQ7
Data
DQ7 =
Valid Data
DQ7
High-Z
t WHWH1 or 2
DQ0 to DQ6
Data
DQ0 to DQ6 = Output Flag
t BUSY
DQ0 to DQ6
Valid Data
High-Z
t EOE
RY/BY
* : DQ7 = Valid Data (The device has completed the Embedded operation).
Figure 9 AC Waveforms for Data Polling during Embedded Algorithm Operations
23
MBM29DL32XTD/BD-80/90/12
Address
tAHT tASO
tAHT tAS
CE
tCEPH
WE
tOEPH
tOEH
tOEH
OE
tDH
DQ 6/DQ2
tOE
Toggle
Data
Data
tCE
Toggle
Data
Toggle
Data
*
Stop
Toggling
Output
Valid
tBUSY
RY/BY
* : DQ6 stops toggling (The device has completed the Embedded operation).
Figure 10 AC Waveforms for Toggle Bit I during Embedded Algorithm Operations
24
MBM29DL32XTD/BD-80/90/12
Address
Read
Command
Read
Command
Read
Read
tRC
tWC
tRC
tWC
tRC
tRC
BA2
(PA)
BA1
BA2
(PA)
BA2
(555H)
BA1
tAS
BA1
tACC
tAH
tAS
tAHT
tCE
CE
tOE
tCEPH
OE
tGHWL
tDF
tOEH
tWP
WE
tDS
Valid
Output
DQ
tDH
Valid
Intput
(A0H)
tDF
Valid
Output
Valid
Intput
(PD)
Valid
Output
Status
Note: This is example of Read for Bank 1 and Embedded Algorithm (program) for Bank 2.
BA1: Address of Bank 1.
BA2: Address of Bank 2.
Figure 11 Bank-to-bank Read/Write Timing Diagram
Enter
Embedded
Erasing
WE
Erase
Suspend
Erase
Enter Erase
Suspend Program
Erase Suspend
Read
Erase
Suspend
Program
Erase
Resume
Erase Suspend
Read
Erase
Erase
Complete
DQ6
DQ2
Toggle
DQ2 and DQ6
with OE or CE
Note: DQ2 is read from the erase-suspended sector.
Figure 12 DQ2 vs. DQ6
25
MBM29DL32XTD/BD-80/90/12
CE
The rising edge of the last write pulse
WE
Entire programming
or erase operations
RY/BY
t BUSY
Figure 13 RY/BY Timing Diagram during Program/Erase Operations
WE
RESET
tRP
t RB
RY/BY
tREADY
Figure 14 RESET, RY/BY Timing Diagram
26
MBM29DL32XTD/BD-80/90/12
CE
tCE
BYTE
Data Output
(DQ0 to DQ7)
DQ0 to DQ14
tELFH
DQ15/A-1
Data Output
(DQ0 to DQ14)
tFHQV
DQ15
A-1
Figure 15 Timing Diagram for Word Mode Configuration
CE
BYTE
DQ0 to DQ14
tELFL
Data Output
(DQ0 to DQ7)
Data Output
(DQ0 to DQ14)
tACC
DQ15/A-1
DQ15
A-1
tFLQZ
Figure 16 Timing Diagram for Byte Mode Configuration
The falling edge of the last write signal
CE or WE
Input
Valid
BYTE
tSET
(tAS)
tHOLD (tAH)
Figure 17 BYTE Timing Diagram for Write Operations
27
MBM29DL32XTD/BD-80/90/12
A20, A19, A18
A17, A16, A15
A14, A13, A12
SGAX
SGAY
A0
A1
A6
VID
3V
A9
t VLHT
VID
3V
OE
t VLHT
t VLHT
t VLHT
t WPP
WE
t OESP
t CSP
CE
Data
01H
t VCS
t OE
VCC
SGAX : Sector Group Address for initial sector
SGAY : Sector Group Address for next sector
Note: A-1 is VIL on byte mode.
Figure 18 AC Waveforms for Sector Group Protection
28
MBM29DL32XTD/BD-80/90/12
VCC
tVIDR
tVCS
tVLHT
VID
3V
3V
RESET
CE
WE
tVLHT
Program or Erase Command Sequence
tVLHT
RY/BY
Unprotection period
Figure 19 Temporary Sector Group Unprotection Timing Diagram
29
MBM29DL32XTD/BD-80/90/12
VCC
tVCS
tVLHT
RESET
tVIDR
tWC
Add
tWC
SGAX
SGAX
SGAY
A0
A1
A6
CE
OE
TIME-OUT
tWP
WE
Data
60H
60H
40H
01H
tOE
SGAX : Sector Group Address to be protected
SGAY : Next Sector Group Address to be protected
TIME-OUT : Time-Out window = 250 µs (min)
Figure 20 Extended Sector Group Protection Timing Diagram
30
60H
MBM29DL32XTD/BD-80/90/12
VCC
tVACCR
tVCS
tVLHT
VACC
3V
3V
WP/ACC
CE
WE
tVLHT
Program or Erase Command Sequence
tVLHT
RY/BY
Acceleration period
Figure 21 Accelerated Program Timing Diagram
31
MBM29DL32XTD/BD-80/90/12
■ FLEXIBLE SECTOR-ERASE ARCHITECTURE
Table 5.1 Sector Address Tables (MBM29DL321TD)
Sector address
Bank Sector
A20
SA0
SA1
SA2
SA3
SA4
SA5
SA6
SA7
SA8
SA9
SA10
SA11
SA12
SA13
SA14
SA15
SA16
Bank 2 SA17
SA18
SA19
SA20
SA21
SA22
SA23
SA24
SA25
SA26
SA27
SA28
SA29
SA30
SA31
SA32
SA33
SA34
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
Bank address
A19 A18 A17 A16 A15 A14 A13 A12 A11
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Sector
size
(Kbytes/
Kwords)
(×8)
Address range
(×16)
Address range
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
00000H to 0FFFFH
10000H to 1FFFFH
20000H to 2FFFFH
30000H to 3FFFFH
40000H to 4FFFFH
50000H to 5FFFFH
60000H to 6FFFFH
70000H to 7FFFFH
80000H to 8FFFFH
90000H to 9FFFFH
A0000H to AFFFFH
B0000H to BFFFFH
C0000H to CFFFFH
D0000H to DFFFFH
E0000H to EFFFFH
F0000H to FFFFFH
100000H to 10FFFFH
110000H to 11FFFFH
120000H to 12FFFFH
130000H to 13FFFFH
140000H to 14FFFFH
150000H to 15FFFFH
160000H to 16FFFFH
170000H to 17FFFFH
180000H to 18FFFFH
190000H to 19FFFFH
1A0000H to 1AFFFFH
1B0000H to 1BFFFFH
1C0000H to 1CFFFFH
1D0000H to 1DFFFFH
1E0000H to 1EFFFFH
1F0000H to 1FFFFFH
200000H to 20FFFFH
210000H to 21FFFFH
220000H to 22FFFFH
000000H to 007FFFH
008000H to 00FFFFH
010000H to 017FFFH
018000H to 01FFFFH
020000H to 027FFFH
028000H to 02FFFFH
030000H to 037FFFH
038000H to 03FFFFH
040000H to 047FFFH
048000H to 04FFFFH
050000H to 057FFFH
058000H to 05FFFFH
060000H to 067FFFH
068000H to 06FFFFH
070000H to 077FFFH
078000H to 07FFFFH
080000H to 087FFFH
088000H to 08FFFFH
090000H to 097FFFH
098000H to 09FFFFH
0A0000H to 0A7FFFH
0A8000H to 0AFFFFH
0B0000H to 0B7FFFH
0B8000H to 0BFFFFH
0C0000H to 0C7FFFH
0C8000H to 0CFFFFH
0D0000H to 0D7FFFH
0D8000H to 0DFFFFH
0E0000H to 0E7FFFH
0E8000H to 0EFFFFH
0F0000H to 0F7FFFH
0F8000H to 0FFFFFH
100000H to 107FFFH
108000H to 10FFFFH
110000H to 117FFFH
(Continued)
32
MBM29DL32XTD/BD-80/90/12
(Continued)
Bank Sector
A20
SA35
SA36
SA37
SA38
SA39
SA40
SA41
SA42
SA43
SA44
SA45
SA46
SA47
SA48
Bank 2
SA49
SA50
SA51
SA52
SA53
SA54
SA55
SA56
SA57
SA58
SA59
SA60
SA61
SA62
SA63
SA64
SA65
SA66
Bank 1
SA67
SA68
SA69
SA70
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Sector address
Sector
size
Bank address
(Kbytes/
A19 A18 A17 A16 A15 A14 A13 A12 A11 Kwords)
X
X
X
X
X
X
X
X
X
X
X
X
X
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
1
1
1
1
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
1
1
1
1
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
0
0
1
1
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
1
1
0
0
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
1
0
1
0
1
0
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
8/4
8/4
8/4
8/4
8/4
8/4
8/4
8/4
(×8)
Address range
(×16)
Address range
230000H to 23FFFFH
240000H to 24FFFFH
250000H to 25FFFFH
260000H to 26FFFFH
270000H to 27FFFFH
280000H to 28FFFFH
290000H to 29FFFFH
2A0000H to 2AFFFFH
2B0000H to 2BFFFFH
2C0000H to 2CFFFFH
2D0000H to 2DFFFFH
2E0000H to 2EFFFFH
2F0000H to 2FFFFFH
300000H to 30FFFFH
310000H to 31FFFFH
320000H to 32FFFFH
330000H to 33FFFFH
340000H to 34FFFFH
350000H to 35FFFFH
360000H to 36FFFFH
370000H to 37FFFFH
380000H to 38FFFFH
390000H to 39FFFFH
3A0000H to 3AFFFFH
3B0000H to 3BFFFFH
3C0000H to 3CFFFFH
3D0000H to 3DFFFFH
3E0000H to 3EFFFFH
3F0000H to 3F1FFFH
3F2000H to 3F3FFFH
3F4000H to 3F5FFFH
3F6000H to 3F7FFFH
3F8000H to 3F9FFFH
3FA000H to 3FBFFFH
3FC000H to 3FDFFFH
3FE000H to 3FFFFFH
118000H to 11FFFFH
120000H to 127FFFH
128000H to 12FFFFH
130000H to 137FFFH
138000H to 13FFFFH
140000H to 147FFFH
148000H to 14FFFFH
150000H to 157FFFH
158000H to 15FFFFH
160000H to 167FFFH
168000H to 16FFFFH
170000H to 177FFFH
178000H to 17FFFFH
180000H to 187FFFH
188000H to 18FFFFH
190000H to 197FFFH
198000H to 19FFFFH
1A0000H to 1A7FFFH
1A8000H to 1AFFFFH
1B0000H to 1B7FFFH
1B8000H to 1BFFFFH
1C0000H to 1C7FFFH
1C8000H to 1CFFFFH
1D0000H to 1D7FFFH
1D8000H to 1DFFFFH
1E0000H to 1E7FFFH
1E8000H to 1EFFFFH
1F0000H to 1F7FFFH
1F8000H to 1F8FFFH
1F9000H to 1F9FFFH
1FA000H to 1FAFFFH
1FB000H to 1FBFFFH
1FC000H to 1FCFFFH
1FD000H to 1FDFFFH
1FE000H to 1FEFFFH
1FF000H to 1FFFFFH
MBM29DL321TD Top Boot Sector Architecture
Note: The address range is A20: A-1 if in byte mode (BYTE = VIL).
The address range is A20: A0 if in word mode (BYTE = VIH).
33
MBM29DL32XTD/BD-80/90/12
Table 5.2 Sector Address Tables (MBM29DL321BD)
Bank Sector
A20
SA70
SA69
SA68
SA67
SA66
SA65
SA64
SA63
SA62
SA61
SA60
SA59
SA58
SA57
SA56
SA55
SA54
SA53
Bank 2
SA52
SA51
SA50
SA49
SA48
SA47
SA46
SA45
SA44
SA43
SA42
SA41
SA40
SA39
SA38
SA37
SA36
SA35
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
Sector address
Sector
size
Bank address
(Kbytes/
A19 A18 A17 A16 A15 A14 A13 A12 A11 Kwords)
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
(×8)
Address range
(×16)
Address range
3F0000H to 3FFFFFH
3E0000H to 3EFFFFH
3D0000H to 3DFFFFH
3C0000H to 3CFFFFH
3B0000H to 3BFFFFH
3A0000H to 3AFFFFH
390000H to 39FFFFH
380000H to 38FFFFH
370000H to 37FFFFH
360000H to 36FFFFH
350000H to 35FFFFH
340000H to 34FFFFH
330000H to 33FFFFH
320000H to 32FFFFH
310000H to 31FFFFH
300000H to 30FFFFH
2F0000H to 2FFFFFH
2E0000H to 2EFFFFH
2D0000H to 2DFFFFH
2C0000H to 2CFFFFH
2B0000H to 2BFFFFH
2A0000H to 2AFFFFH
290000H to 29FFFFH
280000H to 28FFFFH
270000H to 27FFFFH
260000H to 26FFFFH
250000H to 25FFFFH
240000H to 24FFFFH
230000H to 23FFFFH
220000H to 22FFFFH
210000H to 21FFFFH
200000H to 20FFFFH
1F0000H to 1FFFFFH
1E0000H to 1EFFFFH
1D0000H to 1DFFFFH
1C0000H to 1CFFFFH
1F8000H to 1FFFFFH
1F0000H to 1F7FFFH
1E8000H to 1EFFFFH
1E0000H to 1E7FFFH
1D8000H to 1DFFFFH
1D0000H to 1D7FFFH
1C8000H to 1CFFFFH
1C0000H to 1C7FFFH
1B8000H to 1BFFFFH
1B0000H to 1B7FFFH
1A8000H to 1AFFFFH
1A0000H to 1A7FFFH
198000H to 19FFFFH
190000H to 197FFFH
188000H to 18FFFFH
180000H to 187FFFH
178000H to 17FFFFH
170000H to 177FFFH
168000H to 16FFFFH
160000H to 167FFFH
158000H to 15FFFFH
150000H to 157FFFH
148000H to 14FFFFH
140000H to 147FFFH
138000H to 13FFFFH
130000H to 137FFFH
128000H to 12FFFFH
120000H to 127FFFH
118000H to 11FFFFH
110000H to 117FFFH
108000H to 10FFFFH
100000H to 107FFFH
0F8000H to 0FFFFFH
0F0000H to 0F7FFFH
0E8000H to 0EFFFFH
0E0000H to 0E7FFFH
(Continued)
34
MBM29DL32XTD/BD-80/90/12
(Continued)
Bank Sector
A20
SA34
SA33
SA32
SA31
SA30
SA29
SA28
SA27
SA26
SA25
SA24
SA23
SA22
Bank 2 SA21
SA20
SA19
SA18
SA17
SA16
SA15
SA14
SA13
SA12
SA11
SA10
SA9
SA8
SA7
SA6
SA5
SA4
Bank 1
SA3
SA2
SA1
SA0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Sector address
Sector
size
Bank address
(Kbytes/
A19 A18 A17 A16 A15 A14 A13 A12 A11 Kwords)
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
0
0
0
0
0
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
1
1
1
0
0
0
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
1
0
0
1
1
0
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
0
1
0
1
0
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
8/4
8/4
8/4
8/4
8/4
8/4
8/4
8/4
(×8)
Address range
(×16)
Address range
1B0000H to 1BFFFFH
1A0000H to 1AFFFFH
190000H to 19FFFFH
180000H to 18FFFFH
170000H to 17FFFFH
160000H to 16FFFFH
150000H to 15FFFFH
140000H to 14FFFFH
130000H to 13FFFFH
120000H to 12FFFFH
110000H to 11FFFFH
100000H to 10FFFFH
0F0000H to 0FFFFFH
0E0000H to 0EFFFFH
0D0000H to 0DFFFFH
0C0000H to 0CFFFFH
0B0000H to 0BFFFFH
0A0000H to 0AFFFFH
090000H to 09FFFFH
080000H to 08FFFFH
070000H to 07FFFFH
060000H to 06FFFFH
050000H to 05FFFFH
040000H to 04FFFFH
030000H to 03FFFFH
020000H to 02FFFFH
010000H to 01FFFFH
00E000H to 00FFFFH
00C000H to 00DFFFH
00A000H to 00BFFFH
008000H to 009FFFH
006000H to 007FFFH
004000H to 005FFFH
002000H to 003FFFH
000000H to 001FFFH
0D8000H to 0DFFFFH
0D0000H to 0D7FFFH
0C8000H to 0CFFFFH
0C0000H to 0C7FFFH
0B8000H to 0BFFFFH
0B0000H to 0B7FFFH
0A8000H to 0AFFFFH
0A0000H to 0A7FFFH
098000H to 09FFFFH
090000H to 097FFFH
088000H to 08FFFFH
080000H to 087FFFH
078000H to 07FFFFH
070000H to 077FFFH
068000H to 06FFFFH
060000H to 067FFFH
058000H to 05FFFFH
050000H to 057FFFH
048000H to 04FFFFH
040000H to 047FFFH
038000H to 03FFFFH
030000H to 037FFFH
028000H to 02FFFFH
020000H to 027FFFH
018000H to 01FFFFH
010000H to 017FFFH
008000H to 00FFFFH
007000H to 007FFFH
006000H to 006FFFH
005000H to 005FFFH
004000H to 004FFFH
003000H to 003FFFH
002000H to 002FFFH
001000H to 001FFFH
000000H to 000FFFH
MBM29DL321BD Bottom Boot Sector Architecture
Note: The address range is A20: A-1 if in byte mode (BYTE = VIL).
The address range is A20: A0 if in word mode (BYTE = VIH).
35
MBM29DL32XTD/BD-80/90/12
Table 6.1 Sector Address Tables (MBM29DL322TD)
Bank Sector
A20
SA0
SA1
SA2
SA3
SA4
SA5
SA6
SA7
SA8
SA9
SA10
SA11
SA12
SA13
SA14
SA15
SA16
Bank 2 SA17
SA18
SA19
SA20
SA21
SA22
SA23
SA24
SA25
SA26
SA27
SA28
SA29
SA30
SA31
SA32
SA33
SA34
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
Sector address
Sector
size
Bank address
(Kbytes/
A19 A18 A17 A16 A15 A14 A13 A12 A11 Kwords)
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
(×8)
Address range
(×16)
Address range
000000H to 00FFFFH
010000H to 01FFFFH
020000H to 02FFFFH
030000H to 03FFFFH
040000H to 04FFFFH
050000H to 05FFFFH
060000H to 06FFFFH
070000H to 07FFFFH
080000H to 08FFFFH
090000H to 09FFFFH
0A0000H to 0AFFFFH
0B0000H to 0BFFFFH
0C0000H to 0CFFFFH
0D0000H to 0DFFFFH
0E0000H to 0EFFFFH
0F0000H to 0FFFFFH
100000H to 10FFFFH
110000H to 11FFFFH
120000H to 12FFFFH
130000H to 13FFFFH
140000H to 14FFFFH
150000H to 15FFFFH
160000H to 16FFFFH
170000H to 17FFFFH
180000H to 18FFFFH
190000H to 19FFFFH
1A0000H to 1AFFFFH
1B0000H to 1BFFFFH
1C0000H to 1CFFFFH
1D0000H to 1DFFFFH
1E0000H to 1EFFFFH
1F0000H to 1FFFFFH
200000H to 20FFFFH
210000H to 21FFFFH
220000H to 22FFFFH
000000H to 007FFFH
008000H to 00FFFFH
010000H to 017FFFH
018000H to 01FFFFH
020000H to 027FFFH
028000H to 02FFFFH
030000H to 037FFFH
038000H to 03FFFFH
040000H to 047FFFH
048000H to 04FFFFH
050000H to 057FFFH
058000H to 05FFFFH
060000H to 067FFFH
068000H to 06FFFFH
070000H to 077FFFH
078000H to 07FFFFH
080000H to 087FFFH
088000H to 08FFFFH
090000H to 097FFFH
098000H to 09FFFFH
0A0000H to 0A7FFFH
0A8000H to 0AFFFFH
0B0000H to 0B7FFFH
0B8000H to 0BFFFFH
0C0000H to 0C7FFFH
0C8000H to 0CFFFFH
0D0000H to 0D7FFFH
0D8000H to 0DFFFFH
0E0000H to 0E7FFFH
0E8000H to 0EFFFFH
0F0000H to 0F7FFFH
0F8000H to 0FFFFFH
100000H to 107FFFH
108000H to 10FFFFH
110000H to 117FFFH
(Continued)
36
MBM29DL32XTD/BD-80/90/12
(Continued)
Bank Sector
A20
SA35
SA36
SA37
SA38
SA39
SA40
SA41
SA42
SA43
SA44
Bank 2 SA45
SA46
SA47
SA48
SA49
SA50
SA51
SA52
SA53
SA54
SA55
SA56
SA57
SA58
SA59
SA60
SA61
SA62
Bank 1 SA63
SA64
SA65
SA66
SA67
SA68
SA69
SA70
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Sector address
Sector
size
Bank address
(Kbytes/
A19 A18 A17 A16 A15 A14 A13 A12 A11 Kwords)
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
1
1
1
1
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
1
1
1
1
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
0
0
1
1
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
1
1
0
0
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
1
0
1
0
1
0
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
8/4
8/4
8/4
8/4
8/4
8/4
8/4
8/4
(×8)
Address range
(×16)
Address range
230000H to 23FFFFH
240000H to 24FFFFH
250000H to 25FFFFH
260000H to 26FFFFH
270000H to 27FFFFH
280000H to 28FFFFH
290000H to 29FFFFH
2A0000H to 2AFFFFH
2B0000H to 2BFFFFH
2C0000H to 2CFFFFH
2D0000H to 2DFFFFH
2E0000H to 2EFFFFH
2F0000H to 2FFFFFH
300000H to 30FFFFH
310000H to 31FFFFH
320000H to 32FFFFH
330000H to 33FFFFH
340000H to 34FFFFH
350000H to 35FFFFH
360000H to 36FFFFH
370000H to 37FFFFH
380000H to 38FFFFH
390000H to 39FFFFH
3A0000H to 3AFFFFH
3B0000H to 3BFFFFH
3C0000H to 3CFFFFH
3D0000H to 3DFFFFH
3E0000H to 3EFFFFH
3F0000H to 3F1FFFH
3F2000H to 3F3FFFH
3F4000H to 3F5FFFH
3F6000H to 3F7FFFH
3F8000H to 3F9FFFH
3FA000H to 3FBFFFH
3FC000H to 3FDFFFH
3FE000H to 3FFFFFH
118000H to 11FFFFH
120000H to 127FFFH
128000H to 12FFFFH
130000H to 137FFFH
138000H to 13FFFFH
140000H to 147FFFH
148000H to 14FFFFH
150000H to 157FFFH
158000H to 15FFFFH
160000H to 167FFFH
168000H to 16FFFFH
170000H to 177FFFH
178000H to 17FFFFH
180000H to 187FFFH
188000H to 18FFFFH
190000H to 197FFFH
198000H to 19FFFFH
1A0000H to 1A7FFFH
1A8000H to 1AFFFFH
1B0000H to 1B7FFFH
1B8000H to 1BFFFFH
1C0000H to 1C7FFFH
1C8000H to 1CFFFFH
1D0000H to 1D7FFFH
1D8000H to 1DFFFFH
1E0000H to 1E7FFFH
1E8000H to 1EFFFFH
1F0000H to 1F7FFFH
1F8000H to 1F8FFFH
1F9000H to 1F9FFFH
1FA000H to 1FAFFFH
1FB000H to 1FBFFFH
1FC000H to 1FCFFFH
1FD000H to 1FDFFFH
1FE000H to 1FEFFFH
1FF000H to 1FFFFFH
MBM29DL322TD Top Boot Sector Architecture
Note: The address range is A20: A-1 if in byte mode (BYTE = VIL).
The address range is A20: A0 if in word mode (BYTE = VIH).
37
MBM29DL32XTD/BD-80/90/12
Table 6.2 Sector Address Tables (MBM29DL322BD)
Bank Sector
A20
SA70
SA69
SA68
SA67
SA66
SA65
SA64
SA63
SA62
SA61
SA60
SA59
SA58
SA57
SA56
SA55
SA54
SA53
Bank 2
SA52
SA51
SA50
SA49
SA48
SA47
SA46
SA45
SA44
SA43
SA42
SA41
SA40
SA39
SA38
SA37
SA36
SA35
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
Sector address
Sector
size
Bank address
(Kbytes/
A19 A18 A17 A16 A15 A14 A13 A12 A11 Kwords)
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
(×8)
Address range
(×16)
Address range
3F0000H to 3FFFFFH
3E0000H to 3EFFFFH
3D0000H to 3DFFFFH
3C0000H to 3CFFFFH
3B0000H to 3BFFFFH
3A0000H to 3AFFFFH
390000H to 39FFFFH
380000H to 38FFFFH
370000H to 37FFFFH
360000H to 36FFFFH
350000H to 35FFFFH
340000H to 34FFFFH
330000H to 33FFFFH
320000H to 32FFFFH
310000H to 31FFFFH
300000H to 30FFFFH
2F0000H to 2FFFFFH
2E0000H to 2EFFFFH
2D0000H to 2DFFFFH
2C0000H to 2CFFFFH
2B0000H to 2BFFFFH
2A0000H to 2AFFFFH
290000H to 29FFFFH
280000H to 28FFFFH
270000H to 27FFFFH
260000H to 26FFFFH
250000H to 25FFFFH
240000H to 24FFFFH
230000H to 23FFFFH
220000H to 22FFFFH
210000H to 21FFFFH
200000H to 20FFFFH
1F0000H to 1FFFFFH
1E0000H to 1EFFFFH
1D0000H to 1DFFFFH
1C0000H to 1CFFFFH
1F8000H to 1FFFFFH
1F0000H to 1F7FFFH
1E8000H to 1EFFFFH
1E0000H to 1E7FFFH
1D8000H to 1DFFFFH
1D0000H to 1D7FFFH
1C8000H to 1CFFFFH
1C0000H to 1C7FFFH
1B8000H to 1BFFFFH
1B0000H to 1B7FFFH
1A8000H to 1AFFFFH
1A0000H to 1A7FFFH
198000H to 19FFFFH
190000H to 197FFFH
188000H to 18FFFFH
180000H to 187FFFH
178000H to 17FFFFH
170000H to 177FFFH
168000H to 16FFFFH
160000H to 167FFFH
158000H to 15FFFFH
150000H to 157FFFH
148000H to 14FFFFH
140000H to 147FFFH
138000H to 13FFFFH
130000H to 137FFFH
128000H to 12FFFFH
120000H to 127FFFH
118000H to 11FFFFH
110000H to 117FFFH
108000H to 10FFFFH
100000H to 107FFFH
0F8000H to 0FFFFFH
0F0000H to 0F7FFFH
0E8000H to 0EFFFFH
0E0000H to 0E7FFFH
(Continued)
38
MBM29DL32XTD/BD-80/90/12
(Continued)
Bank Sector
A20
SA34
SA33
SA32
SA31
SA30
SA29
SA28
SA27
SA26
SA25
Bank 2
SA24
SA23
SA22
SA21
SA20
SA19
SA18
SA17
SA16
SA15
SA14
SA13
SA12
SA11
SA10
SA9
SA8
Bank 1 SA7
SA6
SA5
SA4
SA3
SA2
SA1
SA0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Sector address
Sector
size
Bank address
(Kbytes/
A19 A18 A17 A16 A15 A14 A13 A12 A11 Kwords)
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
0
0
0
0
0
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
1
1
1
0
0
0
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
1
0
0
1
1
0
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
0
1
0
1
0
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
8/4
8/4
8/4
8/4
8/4
8/4
8/4
8/4
(×8)
Address range
(×16)
Address range
1B0000H to 1BFFFFH
1A0000H to 1AFFFFH
190000H to 19FFFFH
180000H to 18FFFFH
170000H to 17FFFFH
160000H to 16FFFFH
150000H to 15FFFFH
140000H to 14FFFFH
130000H to 13FFFFH
120000H to 12FFFFH
110000H to 11FFFFH
100000H to 10FFFFH
0F0000H to 0FFFFFH
0E0000H to 0EFFFFH
0D0000H to 0DFFFFH
0C0000H to 0CFFFFH
0B0000H to 0BFFFFH
0A0000H to 0AFFFFH
090000H to 09FFFFH
080000H to 08FFFFH
070000H to 07FFFFH
060000H to 06FFFFH
050000H to 05FFFFH
040000H to 04FFFFH
030000H to 03FFFFH
020000H to 02FFFFH
010000H to 01FFFFH
00E000H to 00FFFFH
00C000H to 00DFFFH
00A000H to 00BFFFH
008000H to 009FFFH
006000H to 007FFFH
004000H to 005FFFH
002000H to 003FFFH
000000H to 001FFFH
0D8000H to 0DFFFFH
0D0000H to 0D7FFFH
0C8000H to 0CFFFFH
0C0000H to 0C7FFFH
0B8000H to 0BFFFFH
0B0000H to 0B7FFFH
0A8000H to 0AFFFFH
0A0000H to 0A7FFFH
098000H to 09FFFFH
090000H to 097FFFH
088000H to 08FFFFH
080000H to 087FFFH
078000H to 07FFFFH
070000H to 077FFFH
068000H to 06FFFFH
060000H to 067FFFH
058000H to 05FFFFH
050000H to 057FFFH
048000H to 04FFFFH
040000H to 047FFFH
038000H to 03FFFFH
030000H to 037FFFH
028000H to 02FFFFH
020000H to 027FFFH
018000H to 01FFFFH
010000H to 017FFFH
008000H to 00FFFFH
007000H to 007FFFH
006000H to 006FFFH
005000H to 005FFFH
004000H to 004FFFH
003000H to 003FFFH
002000H to 002FFFH
001000H to 001FFFH
000000H to 000FFFH
MBM29DL322BD Bottom Boot Sector Architecture
Note: The address range is A20: A-1 if in byte mode (BYTE = VIL).
The address range is A20: A0 if in word mode (BYTE = VIH).
39
MBM29DL32XTD/BD-80/90/12
Table 7.1 Sector Address Tables (MBM29DL323TD)
Bank Sector
A20
SA0
SA1
SA2
SA3
SA4
SA5
SA6
SA7
SA8
SA9
SA10
SA11
SA12
SA13
SA14
SA15
SA16
Bank 2 SA17
SA18
SA19
SA20
SA21
SA22
SA23
SA24
SA25
SA26
SA27
SA28
SA29
SA30
SA31
SA32
SA33
SA34
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
Sector address
Sector
size
Bank address
(Kbytes/
A19 A18 A17 A16 A15 A14 A13 A12 A11 Kwords)
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
(×8)
Address range
(×16)
Address range
000000H to 00FFFFH
010000H to 01FFFFH
020000H to 02FFFFH
030000H to 03FFFFH
040000H to 04FFFFH
050000H to 05FFFFH
060000H to 06FFFFH
070000H to 07FFFFH
080000H to 08FFFFH
090000H to 09FFFFH
0A0000H to 0AFFFFH
0B0000H to 0BFFFFH
0C0000H to 0CFFFFH
0D0000H to 0DFFFFH
0E0000H to 0EFFFFH
0F0000H to 0FFFFFH
100000H to 10FFFFH
110000H to 11FFFFH
120000H to 12FFFFH
130000H to 13FFFFH
140000H to 14FFFFH
150000H to 15FFFFH
160000H to 16FFFFH
170000H to 17FFFFH
180000H to 18FFFFH
190000H to 19FFFFH
1A0000H to 1AFFFFH
1B0000H to 1BFFFFH
1C0000H to 1CFFFFH
1D0000H to 1DFFFFH
1E0000H to 1EFFFFH
1F0000H to 1FFFFFH
200000H to 20FFFFH
210000H to 21FFFFH
220000H to 22FFFFH
000000H to 007FFFH
008000H to 00FFFFH
010000H to 017FFFH
018000H to 01FFFFH
020000H to 027FFFH
028000H to 02FFFFH
030000H to 037FFFH
038000H to 03FFFFH
040000H to 047FFFH
048000H to 04FFFFH
050000H to 057FFFH
058000H to 05FFFFH
060000H to 067FFFH
068000H to 06FFFFH
070000H to 077FFFH
078000H to 07FFFFH
080000H to 087FFFH
088000H to 08FFFFH
090000H to 097FFFH
098000H to 09FFFFH
0A0000H to 0A7FFFH
0A8000H to 0AFFFFH
0B0000H to 0B7FFFH
0B8000H to 0BFFFFH
0C0000H to 0C7FFFH
0C8000H to 0CFFFFH
0D0000H to 0D7FFFH
0D8000H to 0DFFFFH
0E0000H to 0E7FFFH
0E8000H to 0EFFFFH
0F0000H to 0F7FFFH
0F8000H to 0FFFFFH
100000H to 107FFFH
108000H to 10FFFFH
110000H to 117FFFH
(Continued)
40
MBM29DL32XTD/BD-80/90/12
(Continued)
Bank Sector
A20
SA35
SA36
SA37
SA38
SA39
SA40
Bank 2 SA41
SA42
SA43
SA44
SA45
SA46
SA47
SA48
SA49
SA50
SA51
SA52
SA53
SA54
SA55
SA56
SA57
SA58
Bank 1 SA59
SA60
SA61
SA62
SA63
SA64
SA65
SA66
SA67
SA68
SA69
SA70
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Sector address
Sector
size
Bank address
(Kbytes/
A19 A18 A17 A16 A15 A14 A13 A12 A11 Kwords)
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
1
1
1
1
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
1
1
1
1
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
0
0
1
1
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
1
1
0
0
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
1
0
1
0
1
0
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
8/4
8/4
8/4
8/4
8/4
8/4
8/4
8/4
(×8)
Address range
(×16)
Address range
230000H to 23FFFFH
240000H to 24FFFFH
250000H to 25FFFFH
260000H to 26FFFFH
270000H to 27FFFFH
280000H to 28FFFFH
290000H to 29FFFFH
2A0000H to 2AFFFFH
2B0000H to 2BFFFFH
2C0000H to 2CFFFFH
2D0000H to 2DFFFFH
2E0000H to 2EFFFFH
2F0000H to 2FFFFFH
300000H to 30FFFFH
310000H to 31FFFFH
320000H to 32FFFFH
330000H to 33FFFFH
340000H to 34FFFFH
350000H to 35FFFFH
360000H to 36FFFFH
370000H to 37FFFFH
380000H to 38FFFFH
390000H to 39FFFFH
3A0000H to 3AFFFFH
3B0000H to 3BFFFFH
3C0000H to 3CFFFFH
3D0000H to 3DFFFFH
3E0000H to 3EFFFFH
3F0000H to 3F1FFFH
3F2000H to 3F3FFFH
3F4000H to 3F5FFFH
3F6000H to 3F7FFFH
3F8000H to 3F9FFFH
3FA000H to 3FBFFFH
3FC000H to 3FDFFFH
3FE000H to 3FFFFFH
118000H to 11FFFFH
120000H to 127FFFH
128000H to 12FFFFH
130000H to 137FFFH
138000H to 13FFFFH
140000H to 147FFFH
148000H to 14FFFFH
150000H to 157FFFH
158000H to 15FFFFH
160000H to 167FFFH
168000H to 16FFFFH
170000H to 177FFFH
178000H to 17FFFFH
180000H to 187FFFH
188000H to 18FFFFH
190000H to 197FFFH
198000H to 19FFFFH
1A0000H to 1A7FFFH
1A8000H to 1AFFFFH
1B0000H to 1B7FFFH
1B8000H to 1BFFFFH
1C0000H to 1C7FFFH
1C8000H to 1CFFFFH
1D0000H to 1D7FFFH
1D8000H to 1DFFFFH
1E0000H to 1E7FFFH
1E8000H to 1EFFFFH
1F0000H to 1F7FFFH
1F8000H to 1F8FFFH
1F9000H to 1F9FFFH
1FA000H to 1FAFFFH
1FB000H to 1FBFFFH
1FC000H to 1FCFFFH
1FD000H to 1FDFFFH
1FE000H to 1FEFFFH
1FF000H to 1FFFFFH
MBM29DL323TD Top Boot Sector Architecture
Note: The address range is A20: A-1 if in byte mode (BYTE = VIL).
The address range is A20: A0 if in word mode (BYTE = VIH).
41
MBM29DL32XTD/BD-80/90/12
Table 7.2 Sector Address Tables (MBM29DL323BD)
Bank Sector
A20
SA70
SA69
SA68
SA67
SA66
SA65
SA64
SA63
SA62
SA61
SA60
SA59
SA58
SA57
SA56
SA55
SA54
SA53
Bank 2
SA52
SA51
SA50
SA49
SA48
SA47
SA46
SA45
SA44
SA43
SA42
SA41
SA40
SA39
SA38
SA37
SA36
SA35
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
Sector address
Sector
size
Bank address
(Kbytes/
A19 A18 A17 A16 A15 A14 A13 A12 A11 Kwords)
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
(×8)
Address range
(×16)
Address range
3F0000H to 3FFFFFH
3E0000H to 3EFFFFH
3D0000H to 3DFFFFH
3C0000H to 3CFFFFH
3B0000H to 3BFFFFH
3A0000H to 3AFFFFH
390000H to 39FFFFH
380000H to 38FFFFH
370000H to 37FFFFH
360000H to 36FFFFH
350000H to 35FFFFH
340000H to 34FFFFH
330000H to 33FFFFH
320000H to 32FFFFH
310000H to 31FFFFH
300000H to 30FFFFH
2F0000H to 2FFFFFH
2E0000H to 2EFFFFH
2D0000H to 2DFFFFH
2C0000H to 2CFFFFH
2B0000H to 2BFFFFH
2A0000H to 2AFFFFH
290000H to 29FFFFH
280000H to 28FFFFH
270000H to 27FFFFH
260000H to 26FFFFH
250000H to 25FFFFH
240000H to 24FFFFH
230000H to 23FFFFH
220000H to 22FFFFH
210000H to 21FFFFH
200000H to 20FFFFH
1F0000H to 1FFFFFH
1E0000H to 1EFFFFH
1D0000H to 1DFFFFH
1C0000H to 1CFFFFH
1F8000H to 1FFFFFH
1F0000H to 1F7FFFH
1E8000H to 1EFFFFH
1E0000H to 1E7FFFH
1D8000H to 1DFFFFH
1D0000H to 1D7FFFH
1C8000H to 1CFFFFH
1C0000H to 1C7FFFH
1B8000H to 1BFFFFH
1B0000H to 1B7FFFH
1A8000H to 1AFFFFH
1A0000H to 1A7FFFH
198000H to 19FFFFH
190000H to 197FFFH
188000H to 18FFFFH
180000H to 187FFFH
178000H to 17FFFFH
170000H to 177FFFH
168000H to 16FFFFH
160000H to 167FFFH
158000H to 15FFFFH
150000H to 157FFFH
148000H to 14FFFFH
140000H to 147FFFH
138000H to 13FFFFH
130000H to 137FFFH
128000H to 12FFFFH
120000H to 127FFFH
118000H to 11FFFFH
110000H to 117FFFH
108000H to 10FFFFH
100000H to 107FFFH
0F8000H to 0FFFFFH
0F0000H to 0F7FFFH
0E8000H to 0EFFFFH
0E0000H to 0E7FFFH
(Continued)
42
MBM29DL32XTD/BD-80/90/12
(Continued)
Bank Sector
A20
SA34
SA33
SA32
SA31
SA30
SA29
Bank 2
SA28
SA27
SA26
SA25
SA24
SA23
SA22
SA21
SA20
SA19
SA18
SA17
SA16
SA15
SA14
SA13
SA12
Bank 1 SA11
SA10
SA9
SA8
SA7
SA6
SA5
SA4
SA3
SA2
SA1
SA0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Sector address
Sector
size
Bank address
(Kbytes/
A19 A18 A17 A16 A15 A14 A13 A12 A11 Kwords)
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
0
0
0
0
0
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
1
1
1
0
0
0
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
1
0
0
1
1
0
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
0
1
0
1
0
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
8/4
8/4
8/4
8/4
8/4
8/4
8/4
8/4
(×8)
Address range
(×16)
Address range
1B0000H to 1BFFFFH
1A0000H to 1AFFFFH
190000H to 19FFFFH
180000H to 18FFFFH
170000H to 17FFFFH
160000H to 16FFFFH
150000H to 15FFFFH
140000H to 14FFFFH
130000H to 13FFFFH
120000H to 12FFFFH
110000H to 11FFFFH
100000H to 10FFFFH
0F0000H to 0FFFFFH
0E0000H to 0EFFFFH
0D0000H to 0DFFFFH
0C0000H to 0CFFFFH
0B0000H to 0BFFFFH
0A0000H to 0AFFFFH
090000H to 09FFFFH
080000H to 08FFFFH
070000H to 07FFFFH
060000H to 06FFFFH
050000H to 05FFFFH
040000H to 04FFFFH
030000H to 03FFFFH
020000H to 02FFFFH
010000H to 01FFFFH
00E000H to 00FFFFH
00C000H to 00DFFFH
00A000H to 00BFFFH
008000H to 009FFFH
006000H to 007FFFH
004000H to 005FFFH
002000H to 003FFFH
000000H to 001FFFH
0D8000H to 0DFFFFH
0D0000H to 0D7FFFH
0C8000H to 0CFFFFH
0C0000H to 0C7FFFH
0B8000H to 0BFFFFH
0B0000H to 0B7FFFH
0A8000H to 0AFFFFH
0A0000H to 0A7FFFH
098000H to 09FFFFH
090000H to 097FFFH
088000H to 08FFFFH
080000H to 087FFFH
078000H to 07FFFFH
070000H to 077FFFH
068000H to 06FFFFH
060000H to 067FFFH
058000H to 05FFFFH
050000H to 057FFFH
048000H to 04FFFFH
040000H to 047FFFH
038000H to 03FFFFH
030000H to 037FFFH
028000H to 02FFFFH
020000H to 027FFFH
018000H to 01FFFFH
010000H to 017FFFH
008000H to 00FFFFH
007000H to 007FFFH
006000H to 006FFFH
005000H to 005FFFH
004000H to 004FFFH
003000H to 003FFFH
002000H to 002FFFH
001000H to 001FFFH
000000H to 000FFFH
MBM29DL323BD Bottom Boot Sector Architecture
Note: The address range is A20: A-1 if in byte mode (BYTE = VIL).
The address range is A20: A0 if in word mode (BYTE = VIH).
43
MBM29DL32XTD/BD-80/90/12
Table 8.1 Sector Address Tables (MBM29DL324TD)
Bank Sector
A20
SA0
SA1
SA2
SA3
SA4
SA5
SA6
SA7
SA8
SA9
SA10
SA11
SA12
SA13
SA14
SA15
Bank 2
SA16
SA17
SA18
SA19
SA20
SA21
SA22
SA23
SA24
SA25
SA26
SA27
SA28
SA29
SA30
SA31
SA32
Bank 1 SA33
SA34
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
Sector address
Sector
size
Bank address
(Kbytes/
A19 A18 A17 A16 A15 A14 A13 A12 A11 Kwords)
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
(×8)
Address range
(×16)
Address range
000000H to 00FFFFH
010000H to 01FFFFH
020000H to 02FFFFH
030000H to 03FFFFH
040000H to 04FFFFH
050000H to 05FFFFH
060000H to 06FFFFH
070000H to 07FFFFH
080000H to 08FFFFH
090000H to 09FFFFH
0A0000H to 0AFFFFH
0B0000H to 0BFFFFH
0C0000H to 0CFFFFH
0D0000H to 0DFFFFH
0E0000H to 0EFFFFH
0F0000H to 0FFFFFH
100000H to 10FFFFH
110000H to 11FFFFH
120000H to 12FFFFH
130000H to 13FFFFH
140000H to 14FFFFH
150000H to 15FFFFH
160000H to 16FFFFH
170000H to 17FFFFH
180000H to 18FFFFH
190000H to 19FFFFH
1A0000H to 1AFFFFH
1B0000H to 1BFFFFH
1C0000H to 1CFFFFH
1D0000H to 1DFFFFH
1E0000H to 1EFFFFH
1F0000H to 1FFFFFH
200000H to 20FFFFH
210000H to 21FFFFH
220000H to 22FFFFH
000000H to 007FFFH
008000H to 00FFFFH
010000H to 017FFFH
018000H to 01FFFFH
020000H to 027FFFH
028000H to 02FFFFH
030000H to 037FFFH
038000H to 03FFFFH
040000H to 047FFFH
048000H to 04FFFFH
050000H to 057FFFH
058000H to 05FFFFH
060000H to 067FFFH
068000H to 06FFFFH
070000H to 077FFFH
078000H to 07FFFFH
080000H to 087FFFH
088000H to 08FFFFH
090000H to 097FFFH
098000H to 09FFFFH
0A0000H to 0A7FFFH
0A8000H to 0AFFFFH
0B0000H to 0B7FFFH
0B8000H to 0BFFFFH
0C0000H to 0C7FFFH
0C8000H to 0CFFFFH
0D0000H to 0D7FFFH
0D8000H to 0DFFFFH
0E0000H to 0E7FFFH
0E8000H to 0EFFFFH
0F0000H to 0F7FFFH
0F8000H to 0FFFFFH
100000H to 107FFFH
108000H to 10FFFFH
110000H to 117FFFH
(Continued)
44
MBM29DL32XTD/BD-80/90/12
(Continued)
Bank Sector
A20
SA35
SA36
SA37
SA38
SA39
SA40
SA41
SA42
SA43
SA44
SA45
SA46
SA47
SA48
SA49
SA50
SA51
SA52
Bank 1
SA53
SA54
SA55
SA56
SA57
SA58
SA59
SA60
SA61
SA62
SA63
SA64
SA65
SA66
SA67
SA68
SA69
SA70
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Sector address
Sector
size
Bank address
(Kbytes/
A19 A18 A17 A16 A15 A14 A13 A12 A11 Kwords)
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
1
1
1
1
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
1
1
1
1
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
0
0
1
1
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
1
1
0
0
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
1
0
1
0
1
0
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
8/4
8/4
8/4
8/4
8/4
8/4
8/4
8/4
(×8)
Address range
(×16)
Address range
230000H to 23FFFFH
240000H to 24FFFFH
250000H to 25FFFFH
260000H to 26FFFFH
270000H to 27FFFFH
280000H to 28FFFFH
290000H to 29FFFFH
2A0000H to 2AFFFFH
2B0000H to 2BFFFFH
2C0000H to 2CFFFFH
2D0000H to 2DFFFFH
2E0000H to 2EFFFFH
2F0000H to 2FFFFFH
300000H to 30FFFFH
310000H to 31FFFFH
320000H to 32FFFFH
330000H to 33FFFFH
340000H to 34FFFFH
350000H to 35FFFFH
360000H to 36FFFFH
370000H to 37FFFFH
380000H to 38FFFFH
390000H to 39FFFFH
3A0000H to 3AFFFFH
3B0000H to 3BFFFFH
3C0000H to 3CFFFFH
3D0000H to 3DFFFFH
3E0000H to 3EFFFFH
3F0000H to 3F1FFFH
3F2000H to 3F3FFFH
3F4000H to 3F5FFFH
3F6000H to 3F7FFFH
3F8000H to 3F9FFFH
3FA000H to 3FBFFFH
3FC000H to 3FDFFFH
3FE000H to 3FFFFFH
118000H to 11FFFFH
120000H to 127FFFH
128000H to 12FFFFH
130000H to 137FFFH
138000H to 13FFFFH
140000H to 147FFFH
148000H to 14FFFFH
150000H to 157FFFH
158000H to 15FFFFH
160000H to 167FFFH
168000H to 16FFFFH
170000H to 177FFFH
178000H to 17FFFFH
180000H to 187FFFH
188000H to 18FFFFH
190000H to 197FFFH
198000H to 19FFFFH
1A0000H to 1A7FFFH
1A8000H to 1AFFFFH
1B0000H to 1B7FFFH
1B8000H to 1BFFFFH
1C0000H to 1C7FFFH
1C8000H to 1CFFFFH
1D0000H to 1D7FFFH
1D8000H to 1DFFFFH
1E0000H to 1E7FFFH
1E8000H to 1EFFFFH
1F0000H to 1F7FFFH
1F8000H to 1F8FFFH
1F9000H to 1F9FFFH
1FA000H to 1FAFFFH
1FB000H to 1FBFFFH
1FC000H to 1FCFFFH
1FD000H to 1FDFFFH
1FE000H to 1FEFFFH
1FF000H to 1FFFFFH
MBM29DL324TD Top Boot Sector Architecture
Note: The address range is A20: A-1 if in byte mode (BYTE = VIL).
The address range is A20: A0 if in word mode (BYTE = VIH).
45
MBM29DL32XTD/BD-80/90/12
Table 8.2 Sector Address Tables (MBM29DL324BD)
Bank Sector
A20
SA70
SA69
SA68
SA67
SA66
SA65
SA64
SA63
SA62
SA61
SA60
SA59
SA58
SA57
SA56
SA55
Bank 2
SA54
SA53
SA52
SA51
SA50
SA49
SA48
SA47
SA46
SA45
SA44
SA43
SA42
SA41
SA40
SA39
SA38
SA37
Bank 1
SA36
SA35
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
Sector address
Sector
size
Bank address
(Kbytes/
A19 A18 A17 A16 A15 A14 A13 A12 A11 Kwords)
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
(×8)
Address range
(×16)
Address range
3F0000H to 3FFFFFH
3E0000H to 3EFFFFH
3D0000H to 3DFFFFH
3C0000H to 3CFFFFH
3B0000H to 3BFFFFH
3A0000H to 3AFFFFH
390000H to 39FFFFH
380000H to 38FFFFH
370000H to 37FFFFH
360000H to 36FFFFH
350000H to 35FFFFH
340000H to 34FFFFH
330000H to 33FFFFH
320000H to 32FFFFH
310000H to 31FFFFH
300000H to 30FFFFH
2F0000H to 2FFFFFH
2E0000H to 2EFFFFH
2D0000H to 2DFFFFH
2C0000H to 2CFFFFH
2B0000H to 2BFFFFH
2A0000H to 2AFFFFH
290000H to 29FFFFH
280000H to 28FFFFH
270000H to 27FFFFH
260000H to 26FFFFH
250000H to 25FFFFH
240000H to 24FFFFH
230000H to 23FFFFH
220000H to 22FFFFH
210000H to 21FFFFH
200000H to 20FFFFH
1F0000H to 1FFFFFH
1E0000H to 1EFFFFH
1D0000H to 1DFFFFH
1C0000H to 1CFFFFH
1F8000H to 1FFFFFH
1F0000H to 1F7FFFH
1E8000H to 1EFFFFH
1E0000H to 1E7FFFH
1D8000H to 1DFFFFH
1D0000H to 1D7FFFH
1C8000H to 1CFFFFH
1C0000H to 1C7FFFH
1B8000H to 1BFFFFH
1B0000H to 1B7FFFH
1A8000H to 1AFFFFH
1A0000H to 1A7FFFH
198000H to 19FFFFH
190000H to 197FFFH
188000H to 18FFFFH
180000H to 187FFFH
178000H to 17FFFFH
170000H to 177FFFH
168000H to 16FFFFH
160000H to 167FFFH
158000H to 15FFFFH
150000H to 157FFFH
148000H to 14FFFFH
140000H to 147FFFH
138000H to 13FFFFH
130000H to 137FFFH
128000H to 12FFFFH
120000H to 127FFFH
118000H to 11FFFFH
110000H to 117FFFH
108000H to 10FFFFH
100000H to 107FFFH
0F8000H to 0FFFFFH
0F0000H to 0F7FFFH
0E8000H to 0EFFFFH
0E0000H to 0E7FFFH
(Continued)
46
MBM29DL32XTD/BD-80/90/12
(Continued)
Bank Sector
A20
SA34
SA33
SA32
SA31
SA30
SA29
SA28
SA27
SA26
SA25
SA24
SA23
SA22
SA21
SA20
SA19
SA18
Bank 1 SA17
SA16
SA15
SA14
SA13
SA12
SA11
SA10
SA9
SA8
SA7
SA6
SA5
SA4
SA3
SA2
SA1
SA0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Sector address
Sector
size
Bank address
(Kbytes/
A19 A18 A17 A16 A15 A14 A13 A12 A11 Kwords)
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
0
0
0
0
0
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
1
1
1
0
0
0
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
1
0
0
1
1
0
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
0
1
0
1
0
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
8/4
8/4
8/4
8/4
8/4
8/4
8/4
8/4
(×8)
Address range
(×16)
Address range
1B0000H to 1BFFFFH
1A0000H to 1AFFFFH
190000H to 19FFFFH
180000H to 18FFFFH
170000H to 17FFFFH
160000H to 16FFFFH
150000H to 15FFFFH
140000H to 14FFFFH
130000H to 13FFFFH
120000H to 12FFFFH
110000H to 11FFFFH
100000H to 10FFFFH
0F0000H to 0FFFFFH
0E0000H to 0EFFFFH
0D0000H to 0DFFFFH
0C0000H to 0CFFFFH
0B0000H to 0BFFFFH
0A0000H to 0AFFFFH
090000H to 09FFFFH
080000H to 08FFFFH
070000H to 07FFFFH
060000H to 06FFFFH
050000H to 05FFFFH
040000H to 04FFFFH
030000H to 03FFFFH
020000H to 02FFFFH
010000H to 01FFFFH
00E000H to 00FFFFH
00C000H to 00DFFFH
00A000H to 00BFFFH
008000H to 009FFFH
006000H to 007FFFH
004000H to 005FFFH
002000H to 003FFFH
000000H to 001FFFH
0D8000H to 0DFFFFH
0D0000H to 0D7FFFH
0C8000H to 0CFFFFH
0C0000H to 0C7FFFH
0B8000H to 0BFFFFH
0B0000H to 0B7FFFH
0A8000H to 0AFFFFH
0A0000H to 0A7FFFH
098000H to 09FFFFH
090000H to 097FFFH
088000H to 08FFFFH
080000H to 087FFFH
078000H to 07FFFFH
070000H to 077FFFH
068000H to 06FFFFH
060000H to 067FFFH
058000H to 05FFFFH
050000H to 057FFFH
048000H to 04FFFFH
040000H to 047FFFH
038000H to 03FFFFH
030000H to 037FFFH
028000H to 02FFFFH
020000H to 027FFFH
018000H to 01FFFFH
010000H to 017FFFH
008000H to 00FFFFH
007000H to 007FFFH
006000H to 006FFFH
005000H to 005FFFH
004000H to 004FFFH
003000H to 003FFFH
002000H to 002FFFH
001000H to 001FFFH
000000H to 000FFFH
MBM29DL324BD Bottom Boot Sector Architecture
Note: The address range is A20: A-1 if in byte mode (BYTE = VIL).
The address range is A20: A0 if in word mode (BYTE = VIH).
47
MBM29DL32XTD/BD-80/90/12
Table 9.1 Sector Group Addresses (MBM29DL32XTD)
(Top Boot Block)
Sector group
A20
A19
A18
A17
A16
A15
A14
A13
A12
Sectors
SGA0
0
0
0
0
0
0
X
X
X
SA0
0
1
1
0
X
X
X
SA1 to SA3
1
1
SGA1
0
0
0
SGA2
0
0
0
1
X
X
X
X
X
SA4 to SA7
SGA3
0
0
1
0
X
X
X
X
X
SA8 to SA11
SGA4
0
0
1
1
X
X
X
X
X
SA12 to SA15
SGA5
0
1
0
0
X
X
X
X
X
SA16 to SA19
SGA6
0
1
0
1
X
X
X
X
X
SA20 to SA23
SGA7
0
1
1
0
X
X
X
X
X
SA24 to SA27
SGA8
0
1
1
1
X
X
X
X
X
SA28 to SA31
SGA9
1
0
0
0
X
X
X
X
X
SA32 to SA35
SGA10
1
0
0
1
X
X
X
X
X
SA36 to SA39
SGA11
1
0
1
0
X
X
X
X
X
SA40 to SA43
SGA12
1
0
1
1
X
X
X
X
X
SA44 to SA47
SGA13
1
1
0
0
X
X
X
X
X
SA48 to SA51
SGA14
1
1
0
1
X
X
X
X
X
SA52 to SA55
SGA15
1
1
1
0
X
X
X
X
X
SA56 to SA59
0
0
0
1
X
X
X
SA60 to SA62
1
0
SGA16
48
0
1
1
1
1
SGA17
1
1
1
1
1
1
0
0
0
SA63
SGA18
1
1
1
1
1
1
0
0
1
SA64
SGA19
1
1
1
1
1
1
0
1
0
SA65
SGA20
1
1
1
1
1
1
0
1
1
SA66
SGA21
1
1
1
1
1
1
1
0
0
SA67
SGA22
1
1
1
1
1
1
1
0
1
SA68
SGA23
1
1
1
1
1
1
1
1
0
SA69
SGA24
1
1
1
1
1
1
1
1
1
SA70
MBM29DL32XTD/BD-80/90/12
Table 9.2 Sector Group Addresses (MBM29DL32XBD)
(Bottom Boot Block)
Sector group
A20
A19
A18
A17
A16
A15
A14
A13
A12
Sectors
SGA0
0
0
0
0
0
0
0
0
0
SA0
SGA1
0
0
0
0
0
0
0
0
1
SA1
SGA2
0
0
0
0
0
0
0
1
0
SA2
SGA3
0
0
0
0
0
0
0
1
1
SA3
SGA4
0
0
0
0
0
0
1
0
0
SA4
SGA5
0
0
0
0
0
0
1
0
1
SA5
SGA6
0
0
0
0
0
0
1
1
0
SA6
SGA7
0
0
0
0
0
0
1
1
1
SA7
0
1
1
0
X
X
X
SA8 to SA10
1
1
SGA8
0
0
0
0
SGA9
0
0
0
1
X
X
X
X
X
SA11 to SA14
SGA10
0
0
1
0
X
X
X
X
X
SA15 to SA18
SGA11
0
0
1
1
X
X
X
X
X
SA19 to SA22
SGA12
0
1
0
0
X
X
X
X
X
SA23 to SA26
SGA13
0
1
0
1
X
X
X
X
X
SA27 to SA30
SGA14
0
1
1
0
X
X
X
X
X
SA31 to SA34
SGA15
0
1
1
1
X
X
X
X
X
SA35 to SA38
SGA16
1
0
0
0
X
X
X
X
X
SA39 to SA42
SGA17
1
0
0
1
X
X
X
X
X
SA43 to SA46
SGA18
1
0
1
0
X
X
X
X
X
SA47 to SA50
SGA19
1
0
1
1
X
X
X
X
X
SA51 to SA54
SGA20
1
1
0
0
X
X
X
X
X
SA55 to SA58
SGA21
1
1
0
1
X
X
X
X
X
SA59 to SA62
SGA22
1
1
1
0
X
X
X
X
X
SA63 to SA66
0
0
0
1
X
X
X
SA67 to SA69
1
0
1
1
X
X
X
SA70
SGA23
SGA24
1
1
1
1
1
1
1
1
49
MBM29DL32XTD/BD-80/90/12
■ FUNCTIONAL DESCRIPTION
• Simultaneous Operation
MBM29DL32XTD/BD have feature, which is capability of reading data from one bank of memory while a program
or erase operation is in progress in the other bank of memory (simultaneous operation), in addition to the
conventional features (read, program, erase, erase-suspend read, and erase-suspend program). The bank
selection can be selected by bank address (A15 to A20) with zero latency.
The MBM29DL321TD/BD have two banks which contain
Bank 1 (8KB × eight sectors) and Bank 2 (64KB × sixty-three sectors).
The MBM29DL322TD/BD have two banks which contain
Bank 1 (8KB × eight sectors, 64KB × seven sectors) and Bank 2 (64KB × fifty-six sectors).
The MBM29DL323TD/BD have two banks which contain
Bank 1 (8KB × eight sectors, 64KB × fifteen sectors) and Bank 2 (64KB × forty-eight sectors).
The MBM29DL324TD/BD have two banks which contain
Bank 1 (8KB × eight sectors, 64KB × thirty-one sectors) and Bank 2 (64KB × thirty-two sectors).
The simultaneous operation can not execute multi-function mode in the same bank. Table 10 shows combination
to be possible for simultaneous operation. (Refer to the Figure 11 Back-to-back Read/Write Timing Diagram.)
Table 10 Simultaneous Operation
Case
Bank 1 status
Bank 2 status
1
Read Mode
Read Mode
2
Read Mode
Autoselect Mode
3
Read Mode
Program Mode
4
Read Mode
Erase Mode *
5
Autoselect Mode
Read Mode
6
Program Mode
Read Mode
7
Erase Mode *
Read Mode
*: An erase operation may also be supended to read from or program to a sector not being erased.
• Read Mode
The MBM29DL32XTD/BD have two control functions which must be satisfied in order to obtain data at the
outputs. CE is the power control and should be used for a device selection. OE is the output control and should
be used to gate data to the output pins if a device is selected.
Address access time (tACC) is equal to the delay from stable addresses to valid output data. The chip enable
access time (tCE) is the delay from stable addresses and stable CE to valid data at the output pins. The output
enable access time is the delay from the falling edge of OE to valid data at the output pins. (Assuming the
addresses have been stable for at least tACC-tOE time.) When reading out a data without changing addresses after
power-up, it is necessary to input hardware reset or to change CE pin from “H” or “L”
50
MBM29DL32XTD/BD-80/90/12
• Standby Mode
There are two ways to implement the standby mode on the MBM29DL32XTD/BD devices, one using both the
CE and RESET pins; the other via the RESET pin only.
When using both pins, a CMOS standby mode is achieved with CE and RESET inputs both held at VCC ± 0.3 V.
Under this condition the current consumed is less than 5 µA max. During Embedded Algorithm operation, VCC
active current (ICC2) is required even CE = “H”. The device can be read with standard access time (tCE) from either
of these standby modes.
When using the RESET pin only, a CMOS standby mode is achieved with RESET input held at VSS ± 0.3 V (CE
= “H” or “L”). Under this condition the current is consumed is less than 5 µA max. Once the RESET pin is taken
high, the device requires tRH of wake up time before outputs are valid for read access.
In the standby mode the outputs are in the high impedance state, independent of the OE input.
• Automatic Sleep Mode
There is a function called automatic sleep mode to restrain power consumption during read-out of
MBM29DL32XTD/BD data. This mode can be used effectively with an application requested low power
consumption such as handy terminals.
To activate this mode, MBM29DL32XTD/BD automatically switch themselves to low power mode when
MBM29DL32XTD/BD addresses remain stably during access fine of 150 ns. It is not necessary to control CE,
WE, and OE on the mode. Under the mode, the current consumed is typically 1 µA (CMOS Level).
During simultaneous operation, VCC active current (ICC2) is required.
Since the data are latched during this mode, the data are read-out continuously. If the addresses are changed,
the mode is canceled automatically and MBM29DL32XTD/BD read-out the data for changed addresses.
• Output Disable
With the OE input at a logic high level (VIH), output from the devices are disabled. This will cause the output pins
to be in a high impedance state.
• Autoselect
The autoselect mode allows the reading out of a binary code from the devices and will identify its manufacturer
and type. This mode is intended for use by programming equipment for the purpose of automatically matching
the devices to be programmed with its corresponding programming algorithm. This mode is functional over the
entire temperature range of the devices.
To activate this mode, the programming equipment must force VID (11.5 V to 12.5 V) on address pin A9. Two
identifier bytes may then be sequenced from the devices outputs by toggling address A0 from VIL to VIH. All
addresses are DON’T CARES except A0, A1, and A6 (A-1). (See Tables 3 and 4.)
The manufacturer and device codes may also be read via the command register, for instances when the
MBM29DL32XTD/BD are erased or programmed in a system without access to high voltage on the A9 pin. The
command sequence is illustrated in Table 12. (Refer to Autoselect Command section.)
51
MBM29DL32XTD/BD-80/90/12
Byte 0 (A0 = VIL) represents the manufacturer’s code (Fujitsu = 04H) and word 1 (A0 = VIH) represents the device
identifier code (MBM29DL321TD = 59H and MBM29DL321BD = 5AH for ×8 mode; MBM29DL321TD = 2259H
and MBM29DL321BD = 225AH for ×16 mode). (MBM29DL322TD = 55H and MBM29DL322BD = 56H for ×8
mode; MBM29DL322TD = 2255H and MBM29DL322BD = 2256H for ×16 mode). (MBM29DL323TD = 50H and
MBM29DL323BD = 53H for ×8 mode; MBM29DL323TD = 2250H and MBM29DL323BD = 2253H for ×16 mode).
(MBM29DL324TD = 5CH and MBM29DL324BD = 5FH for ×8 mode; MBM29DL324TD = 225CH and
MBM29DL324BD = 225FH for ×16 mode). These two bytes/words are given in the tables 11.1 to 11.8. All
identifiers for manufactures and device will exhibit odd parity with DQ7 defined as the parity bit. In order to read
the proper device codes when executing the autoselect, A1 must be VIL. (See Tables 11.1 to 11.8.)
In case of applying VID on A9, since both Bank 1 and Bank 2 enters Autoselect mode, the simultenous operation
can not be executed.
Table 11.1 MBM29DL321TD/BD Sector Group Protection Verify Autoselect Codes
Type
A12 to A20
A6
A1
A0
A-1*1
Code (HEX)
X
VIL
VIL
VIL
VIL
04H
VIL
59H
X
VIL
VIL
VIH
X
2259H
VIL
5AH
X
225AH
VIL
01H*2
Manufacture’s Code
Byte
MBM29DL321TD
Word
Device
Code
Byte
MBM29DL321BD
X
VIL
VIL
VIH
Word
Sector Group
Addresses
Sector Group Protection
VIH
VIL
VIL
*1: A-1 is for Byte mode.
*2: Outputs 01H at protected sector group addresses and outputs 00H at unprotected sector group addresses.
Table 11.2 Expanded Autoselect Code Table
Type
Code
Manufacturer’s Code
04H
(B)
DQ15 DQ14 DQ13 DQ12 DQ11 DQ10 DQ9 DQ8 DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0
0
0
0
0
0
1
0
0
59H A-1 HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z 0
1
0
1
1
0
0
1
0
1
0
1
1
0
0
1
5AH A-1 HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z 0
1
0
1
1
0
1
0
A-1/0
0
0
0
0
0
0
0
MBM29DL321TD
(W) 2259H 0
Device
Code
(B)
0
1
0
0
0
1
0
MBM29DL321BD
(W) 225AH 0
Sector Group Protection
(B): Byte mode
(W): Word mode
52
01H
A-1/0
0
1
0
0
0
1
0
0
1
0
1
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
MBM29DL32XTD/BD-80/90/12
Table 11.3 MBM29DL322TD/BD Sector Group Protection Verify Autoselect Codes
Type
A12 to A20
A6
A1
A0
A-1*1
Code (HEX)
X
VIL
VIL
VIL
VIL
04H
VIL
55H
X
VIL
VIL
VIH
X
2255H
VIL
56H
X
2256H
VIL
01H*2
Manufacture’s Code
Byte
MBM29DL322TD
Word
Device
Code
Byte
MBM29DL322BD
X
VIL
VIL
VIH
Word
Sector group
addresses
Sector Group Protection
VIH
VIL
VIL
*1: A-1 is for Byte mode.
*2: Outputs 01H at protected sector group addresses and outputs 00H at unprotected sector group addresses.
Table 11.4 Expanded Autoselect Code Table
Type
Code
Manufacturer’s Code
04H
(B)
DQ15 DQ14 DQ13 DQ12 DQ11 DQ10 DQ9 DQ8 DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0
0
0
0
0
0
1
0
0
55H A-1 HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z 0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
56H A-1 HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z 0
1
0
1
0
1
1
0
A-1/0
0
0
0
0
0
0
0
MBM29DL322TD
(W) 2255H 0
Device
Code
(B)
0
1
0
0
0
1
0
MBM29DL322BD
(W) 2256H 0
Sector Group Protection
01H
A-1/0
0
1
0
0
0
1
0
0
1
0
1
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
(B): Byte mode
(W): Word mode
53
MBM29DL32XTD/BD-80/90/12
Table 11.5 MBM29DL323TD/BD Sector Group Protection Verify Autoselect Codes
Type
A12 to A20
A6
A1
A0
A-1*1
Code (HEX)
X
VIL
VIL
VIL
VIL
04H
VIL
50H
X
VIL
VIL
VIH
X
2250H
VIL
53H
X
2253H
VIL
01H*2
Manufacture’s Code
Byte
MBM29DL323TD
Word
Device
Code
Byte
MBM29DL323BD
X
VIL
VIL
VIH
Word
Sector group
addresses
Sector Group Protection
VIH
VIL
VIL
*1: A-1 is for Byte mode.
*2: Outputs 01H at protected sector group addresses and outputs 00H at unprotected sector group addresses.
Table 11.6 Expanded Autoselect Code Table
Type
Code
Manufacturer’s Code
04H
(B)
DQ15 DQ14 DQ13 DQ12 DQ11 DQ10 DQ9 DQ8 DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0
0
0
0
0
0
1
0
0
50H A-1 HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z 0
1
0
1
0
0
0
0
0
1
0
1
0
0
0
0
53H A-1 HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z 0
1
0
1
0
0
1
1
A-1/0
0
0
0
0
0
0
0
MBM29DL323TD
(W) 2250H 0
Device
Code
(B)
0
1
0
0
0
1
0
MBM29DL323BD
(W) 2253H 0
Sector Group Protection
(B): Byte mode
(W): Word mode
54
01H
A-1/0
0
1
0
0
0
1
0
0
1
0
1
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
MBM29DL32XTD/BD-80/90/12
Table 11.7 MBM29DL324TD/BD Sector Group Protection Verify Autoselect Codes
Type
A12 to A20
A6
A1
A0
A-1*1
Code (HEX)
X
VIL
VIL
VIL
VIL
04H
VIL
5CH
X
VIL
VIL
VIH
X
225CH
VIL
5FH
X
225FH
VIL
01H*2
Manufacture’s Code
Byte
MBM29DL324TD
Word
Device
Code
Byte
MBM29DL324BD
X
VIL
VIL
VIH
Word
Sector group
addresses
Sector Group Protection
VIH
VIL
VIL
*1: A-1 is for Byte mode.
*2: Outputs 01H at protected sector group addresses and outputs 00H at unprotected sector group addresses.
Table 11.8 Expanded Autoselect Code Table
Type
Code
Manufacturer’s Code
04H
(B)
DQ15 DQ14 DQ13 DQ12 DQ11 DQ10 DQ9 DQ8 DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0
0
0
0
0
0
1
0
0
5CH A-1 HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z 0
1
0
1
1
1
0
0
0
1
0
1
1
1
0
0
5FH A-1 HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z 0
1
0
1
1
1
1
1
A-1/0
0
0
0
0
0
0
0
MBM29DL324TD
(W) 225CH 0
Device
Code
(B)
0
1
0
0
0
1
0
MBM29DL324BD
(W) 225FH 0
Sector Group Protection
01H
A-1/0
0
1
0
0
0
1
0
0
1
0
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
(B): Byte mode
(W): Word mode
55
MBM29DL32XTD/BD-80/90/12
• Write
Device erasure and programming are accomplished via the command register. The contents of the register serve
as inputs to the internal state machine. The state machine outputs dictate the function of the device.
The command register itself does not occupy any addressable memory location. The register is a latch used to
store the commands, along with the address and data information needed to execute the command. The
command register is written by bringing WE to VIL, while CE is at VIL and OE is at VIH. Addresses are latched on
the falling edge of WE or CE, whichever happens later; while data is latched on the rising edge of WE or CE,
whichever happens first. Standard microprocessor write timings are used.
Refer to AC Write Characteristics and the Erase/Programming Waveforms for specific timing parameters.
• Sector Group Protection
The MBM29DL32XTD/BD feature hardware sector group protection. This feature will disable both program and
erase operations in any combination of twenty five sector groups of memory. (See Tables 9.1 and 9.2). The
sector group protection feature is enabled using programming equipment at the user’s site. The device is shipped
with all sector groups unprotected.
To activate this mode, the programming equipment must force VID on address pin A9 and control pin OE, (suggest
VID = 11.5 V), CE = VIL and A0 = A6 = VIL, A1 = VIH. The sector group addresses (A20, A19, A18, A17, A16, A15, A14,
A13, and A12) should be set to the sector to be protected. Tables 5.1 to 8.2 define the sector address for each of
the seventy one (71) individual sectors, and tables 9.1 and 9.2 define the sector group address for each of the
twenty five (25) individual group sectors. Programming of the protection circuitry begins on the falling edge of
the WE pulse and is terminated with the rising edge of the same. Sector group addresses must be held constant
during the WE pulse. See Figures 18 and 26 for sector group protection waveforms and algorithm.
To verify programming of the protection circuitry, the programming equipment must force VID on address pin A9
with CE and OE at VIL and WE at VIH. Scanning the sector group addresses (A20, A19, A18, A17, A16, A15, A14, A13,
and A12) while (A6, A1, A0) = (0, 1, 0) will produce a logical “1” code at device output DQ0 for a protected sector.
Otherwise the device will produce “0” for unprotected sector. In this mode, the lower order addresses, except
for A0, A1, and A6 are DON’T CARES. Address locations with A1 = VIL are reserved for Autoselect manufacturer
and device codes. A-1 requires to apply to VIL on byte mode.
It is also possible to determine if a sector group is protected in the system by writing an Autoselect command.
Performing a read operation at the address location XX02H, where the higher order addresses (A20, A19, A18,
A17, A16, A15, A14, A13, and A12) are the desired sector group address will produce a logical “1” at DQ0 for a protected
sector group. See Tables 11.1 to 11.8 for Autoselect codes.
• Temporary Sector Group Unprotection
This feature allows temporary unprotection of previously protected sector groups of the MBM29DL32XTD/BD
devices in order to change data. The Sector Group Unprotection mode is activated by setting the RESET pin to
high voltage (VID). During this mode, formerly protected sector groups can be programmed or erased by selecting
the sector group addresses. Once the VID is taken away from the RESET pin, all the previously protected sector
groups will be protected again. Refer to Figures 19 and 27.
56
MBM29DL32XTD/BD-80/90/12
• RESET
Hardware Reset
The MBM29DL32XTD/BD devices may be reset by driving the RESET pin to VIL. The RESET pin has a pulse
requirement and has to be kept low (VIL) for at least “tRP” in order to properly reset the internal state machine.
Any operation in the process of being executed will be terminated and the internal state machine will be reset
to the read mode “tREADY” after the RESET pin is driven low. Furthermore, once the RESET pin goes high, the
devices require an additional “tRH” before it will allow read access. When the RESET pin is low, the devices will
be in the standby mode for the duration of the pulse and all the data output pins will be tri-stated. If a hardware
reset occurs during a program or erase operation, the data at that particular location will be corrupted. Please
note that the RY/BY output signal should be ignored during the RESET pulse. See Figure 14 for the timing
diagram. Refer to Temporary Sector Group Unprotection for additional functionality.
• Boot Block Sector Protection
The Write Protection function provides a hardware method of protecting certain boot sectors without using VID.
This function is one of two provided by the WP/ACC pin.
If the system asserts VIL on the WP/ACC pin, the device disables program and erase functions in the two
“outermost” 8K byte boot sectors independently of whether those sectors were protected or unprotected using
the method described in “Sector Protection/Unprotection”. The two outermost 8K byte boot sectors are the two
sectors containing the lowest addresses in a bottom-boot-configured device, or the two sectors containing the
highest addresses in a top-boot-congfigured device.
(MBM29DL32XTD: SA69 and SA70, MBM29DL32XBD: SA0 and SA1)
If the system asserts VIH on the WP/ACC pin, the device reverts to whether the two outermost 8K byte boot
sectors were last set to be protected or unprotected. That is, sector protection or unprotection for these two
sectors depends on whether they were last protected or unprotected using the method described in “Sector
protection/unprotection”.
• Accelerated Program Operation
MBM29DL32XTD/BD offers accelerated program operation which enables the programming in high speed.
If the system asserts VACC to the WP/ACC pin, the device automatically enters the acceleration mode and the
time required for program operation will reduce to about 60%. This function is primarily intended to allow high
speed program, so caution is needed as the sector group will temporarily be unprotected.
The system would use a fact program command sequence when programming during acceleration mode.
Set command to fast mode and reset command from fast mode are not necessary. When the device enters the
acceleration mode, the device automatically set to fast mode. Therefore, the pressent sequence could be
used for programming and detection of completion during acceleration mode.
Removing VACC from the WP/ACC pin returns the device to normal operation. Do not remove VACC from WP/
ACC pin while programming. See Figure 21.
57
MBM29DL32XTD/BD-80/90/12
Table 12 MBM29DL32XTD/BD Command Definitions
Command
sequence
Read/Reset
Read/Reset
Word
Byte
Word
Byte
Bus
write
cycles
req’d
1
3
Word
3
Autoselect
Byte
Program
Word
Byte
Program Suspend
Program Resume
Chip Erase
Sector Erase
Word
Byte
Word
Byte
Erase Suspend
Erase Resume
Set to
Fast Mode
Word
Fast
Program *1
Word
Reset from
Fast Mode *1
Word
Extended
Sector Group
Protection *2
Query *3
Byte
Byte
Byte
Word
Byte
Word
Byte
Hi-ROM
Entry
Word
Hi-ROM
Program *4
Word
Hi-ROM
Erase *4
Word
Byte
Byte
Byte
4
1
1
6
6
1
1
3
2
2
4
1
3
4
6
—
—
—
555H
2AAH
555H
AAH
55H
AAAH
555H
AAAH
(BA)
555H
2AAH
555H
AAH
55H
(BA)
AAAH
555H
AAAH
555H
2AAH
555H
AAH
55H
AAAH
555H
AAAH
BA
B0H
—
—
—
BA
30H
—
—
—
555H
2AAH
555H
AAH
55H
AAAH
555H
AAAH
555H
2AAH
555H
AAH
55H
AAAH
555H
AAAH
BA
B0H
—
—
—
BA
30H
—
—
—
555H
2AAH
555H
AAH
55H
AAAH
555H
AAAH
XXXH
A0H
PA
PD
—
XXXH
BA
XXXH
90H
F0H
—
BA
XXXH
XXXH 60H
55H
AAH
555H
AAAH
555H
AAAH
555H
AAAH
4
Byte
58
XXXH F0H
98H
—
—
—
—
—
—
F0H
RA
RD
—
—
—
—
90H
—
—
—
—
—
—
A0H
PA
PD
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
555H
2AAH
555H
80H
AAH
55H
10H
AAAH
555H
AAAH
555H
2AAH
80H
AAH
55H
SA
30H
AAAH
555H
—
—
—
—
—
—
—
—
—
—
—
—
—
—
20H
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
SPA
60H
SPA
40H
SPA
SD
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
HRA
30H
—
—
2AAH
555H
55H
88H
—
—
—
—
555H
AAAH
2AAH
555H
AAH
55H
A0H
PA
PD
—
—
555H
AAAH
2AAH
555H
555H
2AAH
AAH
55H
80H
AAH
55H
555H
AAAH
AAAH
555H
(HRBA)
2AAH
AAH
AAAH
—
AAH
555H
Word
Hi-ROM
Exit *4
Fourth bus
Fifth bus
Sixth bus
read/write write
cycle
write
cycle
cycle
Addr. Data Addr. Data Addr. Data Addr. Data Addr. Data Addr. Data
First bus Second bus Third bus
write cycle write cycle write cycle
55H
555H
555H
(HRBA)
AAAH
90H XXXH 00H
—
—
MBM29DL32XTD/BD-80/90/12
Notes: 1. Address bits A11 to A20 = X = “H” or “L” for all address commands except or Program Address (PA), Sector
Address (SA), and Bank Address (BA).
2. Bus operations are defined in Tables 3 and 4.
3. RA = Address of the memory location to be read
PA = Address of the memory location to be programmed
Addresses are latched on the falling edge of the write pulse.
SA = Address of the sector to be erased. The combination of A20, A19, A18, A17, A16, A15, A14, A13, and
A12 will uniquely select any sector.
BA = Bank Address (A15 to A20)
4. RD = Data read from location RA during read operation.
PD = Data to be programmed at location PA. Data is latched on the falling edge of write pulse.
5. SPA = Sector group address to be protected. Set sector group address (SGA) and (A6, A1, A0) = (0, 1, 0).
SD = Sector group protection verify data. Output 01H at protected sector group addresses and output
00H at unprotected sector group addresses.
6. HRA = Address of the Hi-ROM area
29DL32XTD (Top Boot Type)
Word Mode: 1F8000H to 1FFFFFH
Byte Mode: 3F0000H to 3FFFFFH
29DL32XBD (Bottom Boot Type) Word Mode: 000000H to 007FFFH
Byte Mode: 000000H to 00FFFFH
7. HRBA =Bank Address of the Hi-ROM area
29DL32XTD (Top Boot Type)
:A15 = A16= A17 = A18 = A19 = A20 = 1
29DL32XBD (Bottom Boot Type) :A15 = A16= A17 = A18 = A19 = A20 = 0
8. The system should generate the following address patterns:
Word Mode: 555H or 2AAH to addresses A0 to A10
Byte Mode: AAAH or 555H to addresses A–1 and A0 to A10
9. Both Read/Reset commands are functionally equivalent, resetting the device to the read mode.
*1:This command is valid while Fast Mode.
*2:This command is valid while RESET = VID.
*3:The valid addresses are A6 to A0.
*4:This command is valid while Hi-ROM mode.
59
MBM29DL32XTD/BD-80/90/12
■ COMMAND DEFINITIONS
Device operations are selected by writing specific address and data sequences into the command register.
Writing incorrect address and data values or writing them in the improper sequence will reset the devices to the
read mode. Some commands are required Bank Address (BA) input. When command sequences are inputed
to bank being read, the commands have priority than reading. Table 12 defines the valid register command
sequences. Note that the Erase Suspend (B0H) and Erase Resume (30H) commands are valid only while the
Sector Erase operation is in progress. Also the Program Suspend (B0H) and Program Resume (30H) commands
are valid only while the Program operation is in progress. Moreover both Read/Reset commands are functionally
equivalent, resetting the device to the read mode. Please note that commands are always written at DQ0 to DQ7
and DQ8 to DQ15 bits are ignored.
• Read/Reset Command
In order to return from Autoselect mode or Exceeded Timing Limits (DQ5 = 1) to Read/Reset mode, the Read/
Reset operation is initiated by writing the Read/Reset command sequence into the command register.
Microprocessor read cycles retrieve array data from the memory. The devices remain enabled for reads until the
command register contents are altered.
The devices will automatically power-up in the Read/Reset state. In this case, a command sequence is not
required to read data. Standard microprocessor read cycles will retrieve array data. This default value ensures
that no spurious alteration of the memory content occurs during the power transition. Refer to the AC Read
Characteristics and Waveforms for the specific timing parameters.
• Autoselect Command
Flash memories are intended for use in applications where the local CPU alters memory contents. As such,
manufacture and device codes must be accessible while the devices reside in the target system. PROM
programmers typically access the signature codes by raising A9 to a high voltage. However, multiplexing high
voltage onto the address lines is not generally desired system design practice.
The device contains an Autoselect command operation to supplement traditional PROM programming
methodology. The operation is initiated by writing the Autoselect command sequence into the command register.
The Autoselect command sequence is initiated by first writing two unlock cycles. This is followed by a third write
cycle that contains the bank address (BA) and the Autoselect command. Then the manufacture and device
codes can be read from the bank, and an actual data of memory cell can be read from the another bank.
Following the command write, a read cycle from address (BA)00H retrieves the manufacture code of 04H. A
read cycle from address (BA)01H for ×16((BA)02H for ×8) returns the device code (MBM29DL321TD = 59H and
MBM29DL321BD = 5AH for ×8 mode; MBM29DL321TD = 2259H and MBM29DL321BD = 225AH for ×16 mode).
(MBM29DL322TD = 55H and MBM29DL322BD = 56H for ×8 mode; MBM29DL322TD = 2255H and
MBM29DL322BD = 2256H for ×16 mode). (MBM29DL323TD = 50H and MBM29DL323BD = 53H for ×8 mode;
MBM29DL323TD = 2250H and MBM29DL323BD = 2253H for ×16 mode). (MBM29DL324TD = 5CH and
MBM29DL324BD = 5FH for ×8 mode; MBM29DL324TD = 225CH and MBM29DL324BD = 225FH for ×16 mode).
(See Tables 11.1 to 11.8.)
All manufacturer and device codes will exhibit odd parity with DQ7 defined as the parity bit. Sector state (protection
or unprotection) will be informed by address (BA)02H for ×16 ((BA)04H for ×8). Scanning the sector group
addresses (A20, A19, A18, A17, A16, A15, A14, A13, and A12) while (A6, A1, A0) = (0, 1, 0) will produce a logical “1” at
device output DQ0 for a protected sector group. The programming verification should be performed by verify
sector group protection on the protected sector. (See Tables 8 and 9.)
60
MBM29DL32XTD/BD-80/90/12
The manufacture and device codes can be allowed reading from selected bank. To read the manufacture and
device codes and sector protection status from non-selected bank, it is necessary to write Read/Reset command
sequence into the register and then Autoselect command should be written into the bank to be read.
If the software (program code) for Autoselect command is stored into the Flash memory, the device and
manufacture codes should be read from the other bank where is not contain the software.
To terminate the operation, it is necessary to write the Read/Reset command sequence into the register, and
also to write the Autoselect command during the operation, execute it after writing Read/Reset command
sequence.
• Byte/Word Programming
The devices are programmed on a byte-by-byte (or word-by-word) basis. Programming is a four bus cycle
operation. There are two “unlock” write cycles. These are followed by the program set-up command and data
write cycles. Addresses are latched on the falling edge of CE or WE, whichever happens later and the data is
latched on the rising edge of CE or WE, whichever happens first. The rising edge of CE or WE (whichever
happens first) begins programming. Upon executing the Embedded Program Algorithm command sequence,
the system is not required to provide further controls or timings. The device will automatically provide adequate
internally generated program pulses and verify the programmed cell margin.
The system can determine the status of the program operation by using DQ7 (Data Polling), DQ6 (Toggle Bit),
or RY/BY. The Data Polling and Toggle Bit must be performed at the memory location which is being programmed.
The automatic programming operation is completed when the data on DQ7 is equivalent to data written to this
bit at which time the devices return to the read mode and addresses are no longer latched. (See Table 13,
Hardware Sequence Flags.) Therefore, the devices require that a valid address to the devices be supplied by
the system at this particular instance of time. Hence, Data Polling must be performed at the memory location
which is being programmed.
Any commands written to the chip during this period will be ignored. If hardware reset occurs during the
programming operation, it is impossible to guarantee the data are being written.
Programming is allowed in any sequence and across sector boundaries. Beware that a data “0” cannot be
programmed back to a “1”. Attempting to do so may either hang up the device or result in an apparent success
according to the data polling algorithm but a read from Read/Reset mode will show that the data is still “0”. Only
erase operations can convert “0”s to “1”s.
Figure 22 illustrates the Embedded ProgramTM Algorithm using typical command strings and bus operations.
• Chip Erase
Chip erase is a six bus cycle operation. There are two “unlock” write cycles. These are followed by writing the
“set-up” command. Two more “unlock” write cycles are then followed by the chip erase command.
Chip erase does not require the user to program the device prior to erase. Upon executing the Embedded Erase
Algorithm command sequence the devices will automatically program and verify the entire memory for an all
zero data pattern prior to electrical erase (Preprogram function). The system is not required to provide any
controls or timings during these operations.
The system can determine the status of the erase operation by using DQ7 (Data Polling), DQ6 (Toggle Bit), or
RY/BY. The chip erase begins on the rising edge of the last CE or WE, whichever happens first in the command
sequence and terminates when the data on DQ7 is “1” (See Write Operation Status section.) at which time the
device returns to read the mode.
Chip Erase Time; Sector Erase Time × All sectors + Chip Program Time (Preprogramming)
Figure 23 illustrates the Embedded EraseTM Algorithm using typical command strings and bus operations.
61
MBM29DL32XTD/BD-80/90/12
• Sector Erase
Sector erase is a six bus cycle operation. There are two “unlock” write cycles. These are followed by writing the
“set-up” command. Two more “unlock” write cycles are then followed by the Sector Erase command. The sector
address (any address location within the desired sector) is latched on the falling edge of CE or WE whichever
happens later, while the command (Data = 30H) is latched on the rising edge of CE or WE which happens first.
After time-out of “tTOW” from the rising edge of the last sector erase command, the sector erase operation will begin.
Multiple sectors may be erased concurrently by writing the six bus cycle operations on Table 12. This sequence
is followed with writes of the Sector Erase command to addresses in other sectors desired to be concurrently
erased. The time between writes must be less than “tTOW” otherwise that command will not be accepted and
erasure will start. It is recommended that processor interrupts be disabled during this time to guarantee this
condition. The interrupts can be re-enabled after the last Sector Erase command is written. A time-out of “tTOW”
from the rising edge of last CE or WE whichever happens first will initiate the execution of the Sector Erase
command(s). If another falling edge of CE or WE, whichever happens first occurs within the “tTOW” time-out
window the timer is reset. (Monitor DQ3 to determine if the sector erase timer window is still open, see section
DQ3, Sector Erase Timer.) Any command other than Sector Erase or Erase Suspend during this time-out period
will reset the devices to the read mode, ignoring the previous command string. Resetting the devices once
execution has begun will corrupt the data in the sector. In that case, restart the erase on those sectors and allow
them to complete. (Refer to the Write Operation Status section for Sector Erase Timer operation.) Loading the
sector erase buffer may be done in any sequence and with any number of sectors (0 to 38).
Sector erase does not require the user to program the devices prior to erase. The devices automatically program
all memory locations in the sector(s) to be erased prior to electrical erase (Preprogram function). When erasing
a sector or sectors the remaining unselected sectors are not affected. The system is not required to provide any
controls or timings during these operations.
The system can determine the status of the erase operation by using DQ7 (Data Polling), DQ6 (Toggle Bit), or
RY/BY.
The sector erase begins after the “tTOW” time out from the rising edge of CE or WE whichever happens first for
the last sector erase command pulse and terminates when the data on DQ7 is “1” (See Write Operation Status
section.) at which time the devices return to the read mode. Data polling and Toggle Bit must be performed at
an address within any of the sectors being erased.
Multiple Sector Erase Time; [Sector Erase Time + Sector Program Time (Preprogramming)] × Number of Sector
Erase
In case of multiple sector erase across bank boundaries, a read from bank (read-while-erase) can not performe.
Figure 23 illustrates the Embedded EraseTM Algorithm using typical command strings and bus operations.
• Erase Suspend/Resume
The Erase Suspend command allows the user to interrupt a Sector Erase operation and then perform data reads
from or programs to a sector not being erased. This command is applicable ONLY during the Sector Erase
operation which includes the time-out period for sector erase. The Erase Suspend command will be ignored if
written during the Chip Erase operation or Embedded Program Algorithm. Writting the Erase Suspend command
(B0H) during the Sector Erase time-out results in immediate termination of the time-out period and suspension
of the erase operation.
Writing the Erase Resume command (30H) resumes the erase operation. The bank addresses of sector being
erasing or suspending should be set when writting the Erase Suspend or Erase Resume command.
When the Erase Suspend command is written during the Sector Erase operation, the device will take a maximum
of “tSPD” to suspend the erase operation. When the devices have entered the erase-suspended mode, the
62
MBM29DL32XTD/BD-80/90/12
RY/BY output pin will be at Hi-Z and the DQ7 bit will be at logic “1”, and DQ6 will stop toggling. The user must
use the address of the erasing sector for reading DQ6 and DQ7 to determine if the erase operation has been
suspended. Further writes of the Erase Suspend command are ignored.
When the erase operation has been suspended, the devices default to the erase-suspend-read mode. Reading
data in this mode is the same as reading from the standard read mode except that the data must be read from
sectors that have not been erase-suspended. Successively reading from the erase-suspended sector while the
device is in the erase-suspend-read mode will cause DQ2 to toggle. (See the section on DQ2.)
After entering the erase-suspend-read mode, the user can program the device by writing the appropriate
command sequence for Program. This program mode is known as the erase-suspend-program mode. Again,
programming in this mode is the same as programming in the regular Program mode except that the data must
be programmed to sectors that are not erase-suspended. Successively reading from the erase-suspended sector
while the devices are in the erase-suspend-program mode will cause DQ2 to toggle. The end of the erasesuspended Program operation is detected by the RY/BY output pin, Data polling of DQ7 or by the Toggle Bit I
(DQ6) which is the same as the regular Program operation. Note that DQ7 must be read from the Program address
while DQ6 can be read from any address within bank being erase-suspended.
To resume the operation of Sector Erase, the Resume command (30H) should be written to the bank being erase
suspended. Any further writes of the Resume command at this point will be ignored. Another Erase Suspend
command can be written after the chip has resumed erasing.
63
MBM29DL32XTD/BD-80/90/12
• Extended Command
(1) Fast Mode
MBM29DL32XTD/BD has Fast Mode function. This mode dispenses with the initial two unclock cycles
required in the standard program command sequence by writing Fast Mode command into the command
register. In this mode, the required bus cycle for programming is two cycles instead of four bus cycles in
standard program command. (Do not write erase command in this mode.) The read operation is also executed
after exiting this mode. To exit this mode, it is necessary to write Fast Mode Reset command into the command
register. The first cycle must contain the bank address. (Refer to the Figure 28.) The VCC active current is
required even CE = VIH during Fast Mode.
(2) Fast Programming
During Fast Mode, the programming can be executed with two bus cycles operation. The Embedded Program
Algorithm is executed by writing program set-up command (A0H) and data write cycles (PA/PD). (Refer to
the Figure 28.)
(3) Extended Sector Group Protection
In addition to normal sector group protection, the MBM29DL32XTD/BD has Extended Sector Group
Protection as extended function. This function enable to protect sector group by forcing VID on RESET pin
and write a command sequence. Unlike conventional procedure, it is not necessary to force VID and control
timing for control pins. The only RESET pin requires VID for sector group protection in this mode. The extended
sector group protection requires VID on RESET pin. With this condition, the operation is initiated by writing
the set-up command (60H) into the command register. Then, the sector group addresses pins (A20, A19, A18,
A17, A16, A15, A14, A13 and A12) and (A6, A1, A0) = (0, 1, 0) should be set to the sector group to be protected
(recommend to set VIL for the other addresses pins), and write extended sector group protection command
(60H). A sector group is typically protected in 250 µs. To verify programming of the protection circuitry, the
sector group addresses pins (A20, A19, A18, A17, A16, A15, A14, A13 and A12) and (A6, A1, A0) = (0, 1, 0) should
be set and write a command (40H). Following the command write, a logical “1” at device output DQ0 will
produce for protected sector in the read operation. If the output data is logical “0”, please repeat to write
extended sector group protection command (60H) again. To terminate the operation, it is necessary to set
RESET pin to VIH. (Refer to the Figures 20 and 29.)
(4) CFI (Common Flash Memory Interface)
The CFI (Common Flash Memory Interface) specification outlines device and host system software
interrogation handshake which allows specific vendor-specified software algorithms to be used for entire
families of devices. This allows device-independent, JEDEC ID-independent, and forward-and backwardcompatible software support for the specified flash device families. Refer to CFI specification in detail.
The operation is initiated by writing the query command (98H) into the command register. The bank address
should be set when writing this command. Then the device information can be read from the bank, and an
actual data of memory cell be read from the another bank. Following the command write, a read cycle from
specific address retrives device information. Please note that output data of upper byte (DQ8 to DQ15) is “0”
in word mode (16 bit) read. Refer to the CFI code table. To terminate operation, it is necessary to write the
read/reset command sequence into the register. (See Table 15.)
64
MBM29DL32XTD/BD-80/90/12
• Hidden ROM (Hi-ROM) Region
The Hi-ROM feature provides a Flash memory region that the system may access through a new command
sequence. This is primarily intended for customers who wish to use an Electronic Serial Number (ESN) in the
device with the ESN protected against modification. Once the Hi-ROM region is protected, any further
modification of that region is impossible. This ensures the security of the ESN once the product is shipped to
the field.
The Hi-ROM region is 64K bytes in length and is stored at the same address of the 8KB ×8 sectors. The
MBM29DL32XTD occupies the address of the byte mode 3F0000H to 3FFFFFH (word mode 1F8000H to
1FFFFFH) and the MBM29DL32XBD type occupies the address of the byte mode 000000H to 00FFFFH (word
mode 000000H to 007FFFH). After the system has written the Enter Hi-ROM command sequence, the system
may read the Hi-ROM region by using the addresses normally occupied by the boot sectors. That is, the device
sends all commands that would normally be sent to the boot sectors to the Hi-ROM region. This mode of operation
continues until the system issues the Exit Hi-ROM command sequence, or until power is removed from the
device. On power-up, or following a hardware reset, the device reverts to sending commands to the boot sectors.
• Hidden ROM (Hi-ROM) Entry Command
MBM29DL32XTD/BD has a Hidden ROM area with One Time Protect function. This area is to enter the security
code and to unable the change of the code once set. Program/erase is possible in this area until it is protected.
However, once it is protected, it is impossible to unprotect, so please use this with caution.
Hidden ROM area is 64K Byte and in the same address area of 8KB sector. The address of top boot is 3F0000H
to 3FFFFFH at byte mode (1F8000H to 1FFFFFH at word mode) and the bottom boot is 000000H to 00FFFFH
at byte mode (000000H to 007FFFH at word mode). These areas are normally the boot block area (8KB ×8
sector). Therefore, write the Hidden ROM entry command sequence to enter the Hidden ROM area. It is called
as Hidden ROM mode when the Hidden ROM area appears.
Sector other than the boot block area could be read during Hidden ROM mode. Read/program/earse of the
Hidden ROM area is possible during Hidden ROM mode. Write the Hidden ROM reset command sequence to
exit the Hidden ROM mode. The bank address of the Hidden ROM should be set on the third cycle of this reset
command sequence.
In case of MBM29DL321TD/BD, whose Bank 1 size is 0.5 Mbit, the simultaneous operation cannot execute
multi-function mode between the Hidden ROM area and Bank 2 Region.
• Hidden ROM (Hi-ROM) Program Command
To program the data to the Hidden ROM area, write the Hidden ROM program command sequence during Hidden
ROM mode. This command is same as the program command in the past except to write the command during
Hidden ROM mode. Therefore the detection of completion method is the same as in the past, using the DQ7
data poling, DQ6 toggle bit and RY/BY pin. Need to pay attention to the address to be programmed. If the address
other than the Hidden ROM area is selected to program, the data of the address will be changed.
• Hidden ROM (Hi-ROM) Erase Command
To erase the Hidden ROM area, write the Hidden ROM erase command sequence during Hidden ROM mode.
This command is same as the sector erase command in the past except to write the command during Hidden
ROM mode. Therefore the detection of completion method is the same as in the past, using the DQ7 data poling,
DQ6 toggle bit and RY/BY pin. Need to pay attention to the sector address to be erased. If the sector address
other than the Hidden ROM area is selected, the data of the sector will be changed.
65
MBM29DL32XTD/BD-80/90/12
• Hidden ROM (Hi-ROM) Protect Command
There are two methods to protect the Hidden ROM area. One is to write the sector group protect setup
command(60H), set the sector address in the Hidden ROM area and (A6, A1, A0) = (0,1,0), and write the sector
group protect command(60H) during the Hidden ROM mode. The same command sequence could be used
because except that it is in the Hidden ROM mode and that it does not apply high voltage to RESET pin, it is
the same as the extension sector group protect in the past. Please refer to “Function Explanation Extended
Command (3) Extentended Sector Group Protection” for details of extention sector group protect setting.
The other is to apply high voltage (VID) to A9 and OE, set the sector address in the Hidden ROM area and (A6,
A1, A0) = (0,1,0), and apply the write pulse during the Hidden ROM mode. To verify the protect circuit, apply high
voltage (VID) to A9, specify (A6, A1, A0) = (0,1,0) and the sector address in the Hidden ROM area, and read.
When “1” appears to DQ0, the protect setting is completed. “0” will appear to DQ0 if it is not protected. Please
apply write pulse agian. The same command sequence could be used for the above method because other than
the Hidden ROM mode, it is the same as the sector group protect in the past. Please refer to “Function Explanation
Secor Group Protection” for details of sector group protect setting
Other sector group will be effected if the address other than the Hidden ROM area is selected for the sectoer
group address, so please be carefull. Once it is protected, protection can not be cancelled, so please pay closest
attention.
• Write Operation Status
Detailed in Table 13 are all the status flags that can determine the status of the bank for the current mode
operation. The read operation from the bank where is not operate Embedded Algorithm returns a data of memory
cell. These bits offer a method for determining whether a Embedded Algorithm is completed properly. The
information on DQ2 is address sensitive. This means that if an address from an erasing sector is consectively
read, then the DQ2 bit will toggle. However, DQ2 will not toggle if an address from a non-erasing sector is
consectively read. This allows the user to determine which sectors are erasing and which are not.
The status flag is not output from bank (non-busy bank) not executing Embedded Algorithm. For example, there
is bank (busy bank) which is now executing Embedded Algorithm. When the read sequence is [1] <busy bank>,
[2] <non-busy bank>, [3] <busy bank>, the DQ6 is toggling in the case of [1] and [3]. In case of [2], the data of
memory cell is outputted. In the erase-suspend read mode with the same read sequence, DQ6 will not be toggled
in the [1] and [3].
In the erase suspend read mode, DQ2 is toggled in the [1] and [3]. In case of [2], the data of memory cell is
outputted.
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MBM29DL32XTD/BD-80/90/12
Table 13 Hardware Sequence Flags
DQ7
DQ6
DQ5
DQ3
DQ2
DQ7
Toggle
0
0
1
0
Toggle
0
1
Toggle*
Data
Data
Data Data
Data
Data
Data
Data Data
Data
1
1
Data
Data
DQ7
Toggle
0
0
1*
Embedded Program Algorithm
DQ7
Toggle
1
0
1
Embedded Erase Algorithm
Exceeded
Time Limits Erase
Erase Suspend Program
Suspended
(Non-Erase Suspended Sector)
Mode
0
Toggle
1
1
N/A
DQ7
Toggle
1
0
N/A
Status
Embedded Program Algorithm
Embedded Erase Algorithm
In Progress
Program Suspend Read
Program
(Program Suspended Sector)
Suspended
Program Suspend Read
Mode
(Non-Program Suspended Sector)
Erase Suspend Read
(Erase Suspended Sector)
Erase
Erase Suspend Read
Suspended
(Non-Erase Suspended Sector)
Mode
Erase Suspend Program
(Non-Erase Suspended Sector)
0
0
Data Data
Toggle
Data
*: Successive reads from the erasing or erase-suspend sector will cause DQ2 to toggle. Reading from non-erase
suspend sector address will indicate logic “1” at the DQ2 bit.
Note: 1.DQ0 and DQ1 are reserve pins for future use.
2.DQ4 is Fujitsu internal use only.
67
MBM29DL32XTD/BD-80/90/12
• DQ7
Data Polling
The MBM29DL32XTD/BD devices feature Data Polling as a method to indicate to the host that the Embedded
Algorithms are in progress or completed. During the Embedded Program Algorithm an attempt to read the
devices will produce the complement of the data last written to DQ7. Upon completion of the Embedded Program
Algorithm, an attempt to read the device will produce the true data last written to DQ7. During the Embedded
Erase Algorithm, an attempt to read the device will produce a “0” at the DQ7 output. Upon completion of the
Embedded Erase Algorithm an attempt to read the device will produce a “1” at the DQ7 output. The flowchart
for Data Polling (DQ7) is shown in Figure 24.
For programming, the Data Polling is valid after the rising edge of fourth write pulse in the four write pulse
sequence.
For chip erase and sector erase, the Data Polling is valid after the rising edge of the sixth write pulse in the six
write pulse sequence. Data Polling must be performed at sector address within any of the sectors being erased
and not a protected sector. Otherwise, the status may not be valid.
If a program address falls within a protected sector, Data Polling on DQ7 is active for approximately 1 µs, then
that bank returns to the read mode. After an erase command sequence is written, if all sectors selected for
erasing are protected, Data Polling on DQ7 is active for approximately 400 µs, then the bank returns to read mode.
Once the Embedded Algorithm operation is close to being completed, the MBM29DL32XTD/BD data pins (DQ7)
may change asynchronously while the output enable (OE) is asserted low. This means that the devices are
driving status information on DQ7 at one instant of time and then that byte’s valid data at the next instant of time.
Depending on when the system samples the DQ7 output, it may read the status or valid data. Even if the device
has completed the Embedded Algorithm operation and DQ7 has a valid data, the data outputs on DQ0 to DQ6
may be still invalid. The valid data on DQ0 to DQ7 will be read on the successive read attempts.
The Data Polling feature is only active during the Embedded Programming Algorithm, Embedded Erase Algorithm
or sector erase time-out. (See Table 13.)
See Figure 9 for the Data Polling timing specifications and diagrams.
• DQ6
Toggle Bit I
The MBM29DL32XTD/BD also feature the “Toggle Bit I” as a method to indicate to the host system that the
Embedded Algorithms are in progress or completed.
During an Embedded Program or Erase Algorithm cycle, successive attempts to read (OE toggling) data from
the devices will result in DQ6 toggling between one and zero. Once the Embedded Program or Erase Algorithm
cycle is completed, DQ6 will stop toggling and valid data will be read on the next successive attempts. During
programming, the Toggle Bit I is valid after the rising edge of the fourth write pulse in the four write pulse sequence.
For chip erase and sector erase, the Toggle Bit I is valid after the rising edge of the sixth write pulse in the six
write pulse sequence. The Toggle Bit I is active during the sector time out.
In programming, if the sector being written to is protected, the toggle bit will toggle for about 1 µs and then stop
toggling without the data having changed. In erase, the devices will erase all the selected sectors except for the
ones that are protected. If all selected sectors are protected, the chip will toggle the toggle bit for about 400 µs
and then drop back into read mode, having changed none of the data.
Either CE or OE toggling will cause the DQ6 to toggle. In addition, an Erase Suspend/Resume command will
cause the DQ6 to toggle.
68
MBM29DL32XTD/BD-80/90/12
The system can use DQ6 to determine whether a sector is actively erasing or is erase-suspended. When a bank
is actively erasing (that is, the Embedded Erase Algorithm is in progress), DQ6 toggles. When a bank enters the
Erase Suspend mode, DQ6 stops toggling. Successive read cycles during the erase-suspend-program cause
DQ6 to toggle.
To operate toggle bit function properly, CE or OE must be high when bank address is changed.
See Figure 10 for the Toggle Bit I timing specifications and diagrams.
• DQ5
Exceeded Timing Limits
DQ5 will indicate if the program or erase time has exceeded the specified limits (internal pulse count). Under
these conditions DQ5 will produce a “1”. This is a failure condition which indicates that the program or erase
cycle was not successfully completed. Data Polling is the only operating function of the devices under this
condition. The CE circuit will partially power down the device under these conditions (to approximately 2 mA).
The OE and WE pins will control the output disable functions as described in Tables 3 and 4.
The DQ5 failure condition may also appear if a user tries to program a non blank location without erasing. In this
case the devices lock out and never complete the Embedded Algorithm operation. Hence, the system never
reads a valid data on DQ7 bit and DQ6 never stops toggling. Once the devices have exceeded timing limits, the
DQ5 bit will indicate a “1.” Please note that this is not a device failure condition since the devices were incorrectly
used. If this occurs, reset the device with command sequence.
• DQ3
Sector Erase Timer
After the completion of the initial sector erase command sequence the sector erase time-out will begin. DQ3 will
remain low until the time-out is complete. Data Polling and Toggle Bit are valid after the initial sector erase
command sequence.
If Data Polling or the Toggle Bit I indicates the device has been written with a valid erase command, DQ3 may
be used to determine if the sector erase timer window is still open. If DQ3 is high (“1”) the internally controlled
erase cycle has begun; attempts to write subsequent commands to the device will be ignored until the erase
operation is completed as indicated by Data Polling or Toggle Bit I. If DQ3 is low (“0”), the device will accept
additional sector erase commands. To insure the command has been accepted, the system software should
check the status of DQ3 prior to and following each subsequent Sector Erase command. If DQ3 were high on
the second status check, the command may not have been accepted.
See Table 13: Hardware Sequence Flags.
• DQ2
Toggle Bit II
This toggle bit II, along with DQ6, can be used to determine whether the devices are in the Embedded Erase
Algorithm or in Erase Suspend.
Successive reads from the erasing sector will cause DQ2 to toggle during the Embedded Erase Algorithm. If the
devices are in the erase-suspended-read mode, successive reads from the erase-suspended sector will cause
DQ2 to toggle. When the devices are in the erase-suspended-program mode, successive reads from the byte
address of the non-erase suspended sector will indicate a logic “1” at the DQ2 bit.
DQ6 is different from DQ2 in that DQ6 toggles only when the standard program or Erase, or Erase Suspend
Program operation is in progress. The behavior of these two status bits, along with that of DQ7, is summarized
as follows:
69
MBM29DL32XTD/BD-80/90/12
For example, DQ2 and DQ6 can be used together to determine if the erase-suspend-read mode is in progress.
(DQ2 toggles while DQ6 does not.) See also Table 14 and Figure 12.
Furthermore, DQ2 can also be used to determine which sector is being erased. When the device is in the erase
mode, DQ2 toggles if this bit is read from an erasing sector.
To operate toggle bit function properly, CE or OE must be high when bank address is changed.
Table 14 Toggle Bit Status
DQ7
DQ6
DQ2
DQ7
Toggle
1
Erase
0
Toggle
Toggle (Note)
Erase-Suspend Read
(Erase-Suspended Sector)
1
1
Toggle
DQ7
Toggle
1 (Note)
Mode
Program
Erase-Suspend Program
Note: Successive reads from the erasing or erase-suspend sector will cause DQ2 to toggle. Reading from nonerase suspend sector address will indicate logic “1” at the DQ2 bit.
• RY/BY
Ready/Busy
The MBM29DL32XTD/BD provide a RY/BY open-drain output pin as a way to indicate to the host system that
the Embedded Algorithms are either in progress or has been completed. If the output is low, the devices are
busy with either a program or erase operation. If the output is high, the devices are ready to accept any read/
write or erase operation. When the RY/BY pin is low, the devices will not accept any additional program or erase
commands. If the MBM29DL32XTD/BD are placed in an Erase Suspend mode, the RY/BY output will be high.
During programming, the RY/BY pin is driven low after the rising edge of the fourth write pulse. During an erase
operation, the RY/BY pin is driven low after the rising edge of the sixth write pulse. The RY/BY pin will indicate
a busy condition during the RESET pulse. Refer to Figures 13 and 14 for a detailed timing diagram. The RY/BY
pin is pulled high in standby mode.
Since this is an open-drain output, RY/BY pins can be tied together in parallel with a pull-up resistor to VCC.
• Byte/Word Configuration
The BYTE pin selects the byte (8-bit) mode or word (16-bit) mode for the MBM29DL32XTD/BD devices. When
this pin is driven high, the devices operate in the word (16-bit) mode. The data is read and programmed at DQ0
to DQ15. When this pin is driven low, the devices operate in byte (8-bit) mode. Under this mode, the DQ15/A-1 pin
becomes the lowest address bit and DQ8 to DQ14 bits are tri-stated. However, the command bus cycle is always
an 8-bit operation and hence commands are written at DQ0 to DQ7 and the DQ8 to DQ15 bits are ignored. Refer
to Figures 15, 16 and 17 for the timing diagram.
• Data Protection
The MBM29DL32XTD/BD are designed to offer protection against accidental erasure or programming caused
by spurious system level signals that may exist during power transitions. During power up the devices
automatically reset the internal state machine in the Read mode. Also, with its control register architecture,
alteration of the memory contents only occurs after successful completion of specific multi-bus cycle command
sequences.
The devices also incorporate several features to prevent inadvertent write cycles resulting form VCC power-up
and power-down transitions or system noise.
70
MBM29DL32XTD/BD-80/90/12
• Low VCC Write Inhibit
To avoid initiation of a write cycle during VCC power-up and power-down, a write cycle is locked out for VCC less
than VLKO (min). If VCC < VLKO, the command register is disabled and all internal program/erase circuits are disabled.
Under this condition the device will reset to the read mode. Subsequent writes will be ignored until the VCC level
is greater than VLKO. It is the users responsibility to ensure that the control pins are logically correct to prevent
unintentional writes when VCC is above VLKO (min).
If Embedded Erase Algorithm is interrupted, there is possibility that the erasing sector(s) cannot be used.
• Write Pulse “Glitch” Protection
Noise pulses of less than 5 ns (typical) on OE, CE, or WE will not initiate a write cycle.
• Logical Inhibit
Writing is inhibited by holding any one of OE = VIL, CE = VIH, or WE = VIH. To initiate a write cycle CE and WE
must be a logical zero while OE is a logical one.
• Power-Up Write Inhibit
Power-up of the devices with WE = CE = VIL and OE = VIH will not accept commands on the rising edge of WE.
The internal state machine is automatically reset to the read mode on power-up.
71
MBM29DL32XTD/BD-80/90/12
Table 15 Common Flash Memory Interface Code
Description
Query-unique ASCII string
“QRY”
Primary OEM Command Set
2h: AMD/FJ standard type
Address for Primary
Extended Table
Alternate OEM Command
Set (00h = not applicable)
Address for Alternate OEM
Extended Table
VCC Min. (write/erase)
D7-4: volt, D3-0: 100 mvolt
VCC Max. (write/erase)
D7-4: volt, D3-0: 100 mvolt
VPP Min. voltage
VPP Max. voltage
Typical timeout per single
byte/word write 2N µs
Typical timeout for Min. size
buffer write 2N µs
Typical timeout per individual
block erase 2N ms
Typical timeout for full chip
erase 2N ms
Max. timeout for byte/word
write 2N times typical
Max. timeout for buffer write
2N times typical
Max. timeout per individual
block erase 2N times typical
Max. timeout for full chip
erase 2N times typical
Device Size = 2N byte
Flash Device Interface
description
Max. number of byte in
multi-byte write = 2N
Number of Erase Block
Regions within device
Erase Block Region 1
Information
Erase Block Region 2
Information
72
A0 to A6
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
DQ0 to DQ15
1Ch
0036h
1Dh
1Eh
1Fh
0000h
0000h
0004h
20h
0000h
21h
000Ah
22h
0000h
23h
0005h
24h
0000h
25h
0004h
26h
0000h
27h
28h
29h
2Ah
2Bh
2Ch
0016h
0002h
0000h
0000h
0000h
0002h
2Dh
2Eh
2Fh
30h
31h
32h
33h
34h
0007h
0000h
0020h
0000h
003Eh
0000h
0000h
0001h
0051h
0052h
0059h
0002h
0000h
0040h
0000h
0000h
0000h
0000h
0000h
0027h
Description
Query-unique ASCII string
“PRI”
Major version number, ASCII
Minor version number, ASCII
Address Sensitive Unlock
0h = Required
1h = Not Required
Erase Suspend
0h = Not Supported
1h = To Read Only
2h = To Read & Write
Sector Protection
0h = Not Supported
X = Number of sectors in per
group
Sector Temporary
Unprotection
00h = Not Supported
01h = Supported
Sector Protection Algorithm
Number of Sector for Bank 2
00h = Not Supported
3Fh = MBM29DL321TD
38h = MBM29DL322TD
30h = MBM29DL323TD
20h = MBM29DL324TD
3Fh = MBM29DL321BD
38h = MBM29DL322BD
30h = MBM29DL323BD
20h = MBM29DL324BD
Burst Mode Type
00h = Not Supported
Page Mode Type
00h = Not Supported
ACC (Acceleration) Supply
Minimum
00h = Not Supported,
D7-4: volt, D3-0: 100 mvolt
ACC (Acceleration) Supply
Maximum
00h = Not Supported,
D7-4: volt, D3-0: 100 mvolt
Boot Type
02h = MBM29DL32XBD
03h = MBM29DL32XTD
A0 to A6
40h
41h
42h
43h
44h
45h
DQ0 to DQ15
46h
0002h
47h
0001h
48h
0001h
49h
4Ah
0004h
00XXh
4Bh
0000h
4Ch
0000h
4Dh
0085h
4Eh
0095h
4Fh
00XXh
0050h
0052h
0049h
0031h
0031h
0000h
MBM29DL32XTD/BD-80/90/12
■ FLOW CHART
EMBEDDED ALGORITHMS
Start
Write Program Command
Sequence
(See below)
Data Polling Device
Increment Address
No
Last Address
?
Yes
Programming Completed
Program Command Sequence* (Address/Command):
555H/AAH
2AAH/55H
555H/A0H
Program Address/Program Data
* : The sequence is applied for × 16 mode.
The addresses differ from × 8 mode.
Figure 22 Embedded ProgramTM Algorithm
73
MBM29DL32XTD/BD-80/90/12
EMBEDDED ALGORITHMS
Start
Write Erase Command
Sequence
(See below)
Data Polling or Toggle Bit
Successfully Completed
Erasure Completed
Chip Erase Command Sequence*
(Address/Command):
Individual Sector/Multiple Sector*
Erase Command Sequence
(Address/Command):
555H/AAH
555H/AAH
2AAH/55H
2AAH/55H
555H/80H
555H/80H
555H/AAH
555H/AAH
2AAH/55H
2AAH/55H
555H/10H
Sector Address/30H
Sector Address/30H
Additional sector
erase commands
are optional.
Sector Address/30H
* : The sequence is applied for × 16 mode.
The addresses differ from × 8 mode.
Figure 23 Embedded EraseTM Algorithm
74
MBM29DL32XTD/BD-80/90/12
Start
Read
(DQ 0 to DQ 7)
Addr. = VA
DQ 7 = Data?
VA = Byte address for programming
= Any of the sector addresses within
the sector being erased during
sector erase or multiple sector
erases operation
= Any of the sector addresses within
the sector not being protected
during chip erase
Yes
No
No
DQ 5 = 1?
Yes
Read
(DQ 0 to DQ 7)
Addr. = VA
DQ 7 = Data?
Yes
No
Fail
Pass
Note: DQ7 is rechecked even if DQ5 = “1” because DQ7 may change simultaneously with DQ5.
Figure 24 Data Polling Algorithm
75
MBM29DL32XTD/BD-80/90/12
Start
Read
(DQ 0 to DQ 7)
Addr. = VA
DQ 6 = Toggle
?
VA = Bank address being executed
Embedded Algorithm.
No
Yes
No
DQ 5 = 1?
Yes
Read
(DQ 0 to DQ 7)
Addr. = VA
DQ 6 = Toggle
?
No
Yes
Fail
Pass
Note: DQ6 is rechecked even if DQ5 = “1” because DQ6 may stop toggling at the same time as
DQ5 changing to “1” .
Figure 25 Toggle Bit Algorithm
76
MBM29DL32XTD/BD-80/90/12
Start
Setup Sector Group Addr.
(A20, A19, A18, A17, A16, A15, A14, A13, A12)
PLSCNT = 1
OE = V ID, A 9 = V ID,
A 6 = CE = V IL, RESET = V IH
A 0 = V IL, A 1 = V IH
Activate WE Pulse
Time out 100 µs
Increment PLSCNT
WE = V IH, CE = OE = V IL
(A 9 should remain V ID)
Read from Sector Group
(Addr. = SGA, A 0 = V IL,
A 1 = V IH, A 6 = V IL)*
No
No
PLSCNT = 25?
Yes
Data = 01H?
Yes
Yes
Remove V ID from A 9
Write Reset Command
Protect Another Sector
Group ?
No
Device Failed
Remove V ID from A 9
Write Reset Command
Sector Group Protection
Completed
* : A-1 is V IL on byte mode.
Figure 26 Sector Group Protection Algorithm
77
MBM29DL32XTD/BD-80/90/12
Start
RESET = VID
(Note 1)
Perform Erase or
Program Operations
RESET = VIH
Temporary Sector Group
Unprotection Completed
(Note 2)
Notes: 1. All protected sector groups are unprotected.
2. All previously protected sector groups are protected once again.
Figure 27 Temporary Sector Group Unprotection Algorithm
78
MBM29DL32XTD/BD-80/90/12
FAST MODE ALGORITHM
Start
555H/AAH
Set Fast Mode
2AAH/55H
555H/20H
XXXH/A0H
Program Address/Program Data
Data Polling Device
Verify Byte?
No
In Fast Program
Yes
Increment Address
No
Last Address
?
Yes
Programming Completed
(BA) XXXH/90H
Reset Fast Mode
XXXH/F0H
Note: The sequence is applied for × 16 mode.
The addresses differ from × 8 mode.
Figure 28 Embedded ProgramTM Algorithm for Fast Mode
79
MBM29DL32XTD/BD-80/90/12
Start
RESET = VID
Wait to 4 µs
Device is Operating in
Temporary Sector Group
Unprotection Mode
No
Extended Sector Group
Protection Entry?
Yes
To Setup Sector Group
Protection Write XXXH/60H
PLSCNT = 1
To Sector Group Protection
Write SGA/60H
(A0 = VIL, A1 = VIH, A6 = VIL)
Time Out 250 µs
Increment PLSCNT
To Verify Sector Group
Protection Write SGA/40H
(A0 = VIL, A1 = VIH, A6 = VIL)
Setup Next Sector Group
Address
Read from Sector Group
Address
(A0 = VIL, A1 = VIH, A6 = VIL)
No
No
PLSCNT = 25?
Yes
Remove VID from RESET
Write Reset Command
Data = 01H?
Yes
Yes
Protection Other Sector
Group ?
No
Device Failed
Remove VID from RESET
Write Reset Command
Sector Group Protection
Completed
Figure 29 Extended Sector Group Protection Algorithm
80
MBM29DL32XTD/BD-80/90/12
■ ORDERING INFORMATION
Standard Products
Fujitsu standard products are available in several packages. The order number is formed by a combination of:
MBM29DL32X
T
D
80
PFTN
PACKAGE TYPE
PFTN = 48-Pin Thin Small Outline Package
(TSOP) Standard Pinout
PFTR = 48-Pin Thin Small Outline Package
(TSOP) Reverse Pinout
PBT = Fine pitch Ball Grid Array
Package (FBGA)
SPEED OPTION
See Product Selector Guide
DEVICE REVISION
BOOT CODE SECTOR ARCHITECTURE
T = Top sector
B = Bottom sector
DEVICE NUMBER/DESCRIPTION
MBM29DL32X
32Mega-bit (4M × 8-Bit or 2M × 16-Bit) CMOS Dual Operation Flash Memory
3.0 V-only Read, Program, and Erase
Valid Combinations
Valid Combinations
MBM29DL321TD/BD
MBM29DL322TD/BD
MBM29DL323TD/BD
MBM29DL324TD/BD
80
90
12
PFTN
PFTR
PBT
Valid Combinations list configurations planned to
be supported in volume for this device. Consult
the local Fujitsu sales office to confirm availability
of specific valid combinations and to check on
newly released combinations.
81
MBM29DL32XTD/BD-80/90/12
■ PACKAGE DIMENSIONS
48-pin plastic TSOP(I)
(FPT-48P-M19)
* Resin Protrusion. (Each Side: 0.15 (.006)Max)
LEAD No.
1
48
Details of "A" part
INDEX
0.15(.006)
MAX
0.35(.014)
MAX
"A"
0.15(.006)
24
0.25(.010)
25
* 12.00±0.20
20.00±0.20
(.787±.008)
* 18.40±0.20
(.724±.008)
(.472±.008)
11.50REF
(.460)
+0.10
1.10 –0.05
+.004
.043 –.002
(Mounting height)
0.50(.0197)
TYP
0.10(.004)
0.05(0.02)MIN
(STAND OFF)
0.15±0.05
(.006±.002)
19.00±0.20
(.748±.008)
0.20±0.10
(.008±.004)
0.10(.004)
Dimensions in mm (inches)
1996 FUJITSU LIMITED F48029S-2C-2
C
M
0.50±0.10
(.020±.004)
48-pin plastic TSOP(I)
(FPT-48P-M20)
* Resin Protrusion. (Each Side: 0.15 (.006)Max)
LEAD No.
1
48
Details of "A" part
INDEX
0.15(.006)
MAX
0.35(.014)
MAX
"A"
0.15(.006)
24
0.25(.010)
25
19.00±0.20
(.748±.008)
0.50±0.10
(.020±.004)
0.15±0.10
(.006±.002)
0.10(.004)
0.20±0.10
(.008±.004)
0.50(.0197)
TYP
0.10(.004)
M
0.05(0.02)MIN
(STAND OFF)
+0.10
1.10 –0.05
* 18.40±0.20
(.724±.008)
20.00±0.20
(.787±.008)
C
1996 FUJITSU LIMITED F48030S-2C-2
11.50(.460)REF
+.004
.043 –.002
(Mounting height)
* 12.00±0.20(.472±.008)
Dimensions in mm (inches)
(Continued)
82
MBM29DL32XTD/BD-80/90/12
(Continued)
57-pin plastic FBGA
(BGA-57P-M01)
(8.80(.346))
(7.20(.283))
13.95±0.05(.549±.002)
1.05
.041
7.95±0.05
(.313±.002)
+0.15
–0.10
+.006
–.004
(Mounting height)
(5.60(.220))
0.80(.031)
TYP
8
7
6
5
4
3
2
1
0.80(.031)
(5.60(.220))
TYP
(4.00(.157))
INDEX
M L K J H G F E D C B A
C0.25(.010)
0.36±0.10
(Stand off)
(.014±.004)
INDEX BALL
57-Ø0.45±0.05
(57-Ø.018±.002)
0.08(.003)
M
0.10(.004)
C
1998 FUJITSU LIMITED B57001S-1C-1
Dimensions in mm (inches)
83
MBM29DL32XTD/BD-80/90/12
FUJITSU LIMITED
For further information please contact:
Japan
FUJITSU LIMITED
Corporate Global Business Support Division
Electronic Devices
KAWASAKI PLANT, 4-1-1, Kamikodanaka
Nakahara-ku, Kawasaki-shi
Kanagawa 211-8588, Japan
Tel: 81(44) 754-3763
Fax: 81(44) 754-3329
http://www.fujitsu.co.jp/
North and South America
FUJITSU MICROELECTRONICS, INC.
Semiconductor Division
3545 North First Street
San Jose, CA 95134-1804, USA
Tel: (408) 922-9000
Fax: (408) 922-9179
Customer Response Center
Mon. - Fri.: 7 am - 5 pm (PST)
Tel: (800) 866-8608
Fax: (408) 922-9179
http://www.fujitsumicro.com/
Europe
FUJITSU MICROELECTRONICS EUROPE GmbH
Am Siebenstein 6-10
D-63303 Dreieich-Buchschlag
Germany
Tel: (06103) 690-0
Fax: (06103) 690-122
http://www.fujitsu-ede.com/
Asia Pacific
FUJITSU MICROELECTRONICS ASIA PTE LTD
#05-08, 151 Lorong Chuan
New Tech Park
Singapore 556741
Tel: (65) 281-0770
Fax: (65) 281-0220
http://www.fmap.com.sg/
F9909
 FUJITSU LIMITED Printed in Japan
All Rights Reserved.
The contents of this document are subject to change without
notice. Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information and circuit diagrams in this document are
presented as examples of semiconductor device applications,
and are not intended to be incorporated in devices for actual use.
Also, FUJITSU is unable to assume responsibility for
infringement of any patent rights or other rights of third parties
arising from the use of this information or circuit diagrams.
FUJITSU semiconductor devices are intended for use in
standard applications (computers, office automation and other
office equipment, industrial, communications, and
measurement equipment, personal or household devices, etc.).
CAUTION:
Customers considering the use of our products in special
applications where failure or abnormal operation may directly
affect human lives or cause physical injury or property damage,
or where extremely high levels of reliability are demanded
(such as aerospace systems, atomic energy controls, sea floor
repeaters, vehicle operating controls, medical devices for life
support, etc.) are requested to consult with FUJITSU sales
representatives before such use. The company will not be
responsible for damages arising from such use without prior
approval.
Any semiconductor devices have an inherent chance of
failure. You must protect against injury, damage or loss from
such failures by incorporating safety design measures into your
facility and equipment such as redundancy, fire protection, and
prevention of over-current levels and other abnormal operating
conditions.
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Law of Japan, the prior
authorization by Japanese government will be required for
export of those products from Japan.
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