ON CM1405 Lcd emi filter array with esd protection Datasheet

LCD EMI Filter Array
with ESD Protection
CM1405
Features
Product Description
•
•
California Micro Device's CM1405 is an EMI filter
array with ESD protection, which integrates eight Pifilters (C-R-C). The CM1405 has component values
of 25pF-100W-25pF. The parts include avalanchetype ESD diodes on every pin, which provide a very
high level of protection for sensitive electronic
components that may be subjected to electrostatic
discharge (ESD). The ESD diodes connected to the
filter ports safely dissipate ESD strikes of •30kV,
exceeding the maximum requirement of the
IEC61000-4-2 international standard. Using the MILSTD-883 (Method 3015) specification for Human
Body Model (HBM) ESD, the pins are protected for
contact discharges at greater than •30kV.
•
•
•
•
•
•
Eight channels of EMI filtering
30kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
30kV ESD protection on each channel (HBM)
Better than 35dB of attenuation at 800-2700MHz
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
20-bump, 4.000mm x 1.458mm footprint
Chip Scale Package
OptiGuard™ coated version available for
improved reliability at assembly
RoHS-compliant, lead-free finishing
Applications
•
•
•
•
•
•
•
LCD data lines in mobile handsets
EMI filtering & ESD protection for high-speed I/O
ports
EMI filtering for high-speed data lines
Wireless handsets
Cell phones
Notebook computers
PDAs / Handheld PCs
This device is particularly well-suited for portable
electronics (e.g. mobile handsets, PDAs, notebook
computers) because of its small package and easyto-use pin assignments. In particular, the CM1405 is
ideal for EMI filtering and protecting data lines from
ESD for the LCD display in mobile handsets.
The CM1405-03 incorporates OptiGuardä coating
which results in improved reliability at assembly and
is available in space-saving, low-profile chip-scale
packages with RoHS-compliant, lead-free finishing.
The CM1400-03 incorporates OptiGuard™ coating
which results in improved reliability at assembly. The
CM1400-03 is available in a space-saving, low-profile
chip scale package with RoHS compliant lead-free
finishing.
©2010 SCILLC. All rights reserved.
April 2010 Rev.2
Publication Order Number:
CM1405/D
CM1405
Block Diagram
Rev. 2 | Page 2 of 14 | www.onsemi.com
CM1405
PIN DESCRIPTIONS
PIN(s)
NAME
DESCRIPTION
PIN(s)
NAME
DESCRIPTION
A1
FILTER1
Filter Channel 1
C1
FILTER1
Filter Channel 1
A2
FILTER2
Filter Channel 2
C2
FILTER2
Filter Channel 2
A3
FILTER3
Filter Channel 3
C3
FILTER3
Filter Channel 3
A4
FILTER4
Filter Channel 4
C4
FILTER4
Filter Channel 4
A5
FILTER5
Filter Channel 5
C5
FILTER5
Filter Channel 5
A6
FILTER6
Filter Channel 6
C6
FILTER6
Filter Channel 6
A7
FILTER7
Filter Channel 7
C7
FILTER7
Filter Channel 7
A8
FILTER8
Filter Channel 8
C8
FILTER8
Filter Channel 8
B1-B4
GND
Device Ground
Ordering Information
PART NUMBERING INFORMATION
2
Standard Finish
Lead-free Finish
TM
No Coating
Optiguard
Coated
TM
-No Coating
Optiguard
Coated
Bumps
PKG
Ordering Part
1
Number
Part
Marking
Ordering Part
1
Number
Part
Marking
Ordering Part
1
Number
Part
Marking
Ordering Part
1
Number
Part
Marking
20
CSP
CM1405-01CS
N051
CM1405-03CS
N053
CM1405-01CP
N051
CM1405-03CP
N053
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
-65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
500
mW
Storage Temperature Range
Rev. 2 | Page 3 of 14 | www.onsemi.com
CM1405
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
RATING
UNITS
-40 to +85
°C
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
80
100
120
Ω
20
25
30
pF
R
Resistance
C
Capacitance
At 2.5V DC, 1MHz, 30mV
AC
Diode Standoff Voltage
IDIODE = 10μA
6.0
ILEAK
Diode Leakage Current (reverse bias)
VDIODE = +3.3V
0.1
1
μA
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
ILOAD = -10mA
6.8
-0.8
9.0
-0.4
V
V
VDIODE
VESD
RDYN
f
C
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Note 2
Dynamic Resistance
Positive
Negative
Cut-off Frequency
ZSOURCE=50Ω, ZLOAD=50Ω
5.6
-1.5
V
30
kV
30
kV
1.5
0.9
Ω
Ω
70
MHz
R = 100Ω, C = 25pF
Note 1: TA = 25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Rev. 2 | Page 4 of 14 | www.onsemi.com
CM1405
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. A1-C1 EMI Filter Performance
Figure 2. A2-C2 EMI Filter Performance
Rev. 2 | Page 5 of 14 | www.onsemi.com
CM1405
Performance Information (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 3. A3-C3 EMI Filter Performance
Figure 4. A4-C4 EMI Filter Performance
Rev. 2 | Page 6 of 14 | www.onsemi.com
CM1405
Performance Information (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 5. A5-C5 EMI Filter Performance
Figure 6. A6-C6 EMI Filter Performance
Rev. 2 | Page 7 of 14 | www.onsemi.com
CM1405
Performance Information (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 7. A7-C7 EMI Filter Performance
Figure 8. A8-C8 EMI Filter Performance
Rev. 2 | Page 8 of 14 | www.onsemi.com
CM1405
Performance Information (cont’d)
Figure 9. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25°C)
Figure 9.
Rev. 2 | Page 9 of 14 | www.onsemi.com
CM1405
Application Information
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.290mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 8. Recommended Non-Solder Mask Defined Pad Illustration
Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. 2 | Page 10 of 14 | www.onsemi.com
260°C
CM1405
Mechanical Details
CM1405-01 Mechanical Specifications
The package dimensions for the CM1405-01 are presented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
20
Millimeters
Inches
Dim
Min
Nom
Max
Min
Nom
Max
A1
3.955 4.000 4.045 0.1557 0.1575 0.1593
A2
1.413 1.458 1.503 0.0556 0.0574 0.0592
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.200 0.250 0.300 0.0079 0.0098 0.0118
C2
0.244 0.294 0.344 0.0096 0.0116 0.0135
D1
0.562 0.606 0.650 0.0221 0.0239 0.0256
D2
0.356 0.381 0.406 0.0140 0.0150 0.0160
# per tape and
reel
Package Dimensions for
CM1405-01 Chip Scale Package
3500 pieces
Controlling dimension: millimeters
Rev. 2 | Page 11 of 14 | www.onsemi.com
CM1405
Mechanical Details (cont’d)
CM1405-03 Mechanical Specifications
The package dimensions for the CM1405-03 are presented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
20
Millimeters
Inches
Dim
Min
Nom
Max
Min
Nom
Max
A1
3.955 4.000 4.045 0.1557 0.1575 0.1593
A2
1.413 1.458 1.503 0.0556 0.0574 0.0592
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.200 0.250 0.300 0.0079 0.0098 0.0118
C2
0.244 0.294 0.344 0.0096 0.0116 0.0135
D1
0.575 0.644 0.714 0.0226 0.0254 0.0281
D2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
Package Dimensions for
CM1405-03 Chip Scale Package
3500 pieces
Controlling dimension: millimeters
Rev. 2 | Page 12 of 14 | www.onsemi.com
CM1405
CSP Tape and Reel Specifications
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
4.00 X 1.46 X
0.606
4.11 X 1.57 X 0.76
12mm
330mm (13")
3500
4mm
4mm
4.00 X 1.46 X
0.644
4.11 X 1.57 X 0.76
12mm
330mm (13")
3500
4mm
4mm
PART NUMBER
CHIP SIZE (mm)
CM1405-01
CM1405-03
Figure 13. Tape and Reel Mechanical Data
Rev. 2 | Page 13 of 14 | www.onsemi.com
CM1405
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
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Rev. 2 | Page 14 of 14 | www.onsemi.com
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