TI DAC3174IRGC25 Dual 14-bit 500 msps digital to analog converter Datasheet

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SLAS837A – APRIL 2013 – REVISED MAY 2013
Dual 14-bit 500 MSPS Digital to Analog Converter
FEATURES
APPLICATIONS
•
•
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•
•
1
2
•
•
•
•
•
•
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Dual Channel
14-Bit Resolution
Maximum Sample Rate: 500 MSPS
Pin Compatible with DAC3154/DAC3164 and
DAC3151/DAC3161/DAC3171
Input Interface:
– 14 LVDS Inputs
– Single 14-bit wide interface
or Dual 7-bit wide interface
– Single or dual DDR data clock
– Internal FIFO
Chip to Chip Synchronization
Power Dissipation: 460mW
Spectral Performance at 20 MHz IF
– SNR: 76 dBFS
– SFDR: 78 dBc
Current sourcing DACs
Compliance Range: –0.5V to 1V
Package: 64 pin QFN (9x9mm)
•
•
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Multi-carrier, Multi-mode Cellular Infrastructure
Base Stations
Radar
Signal Intelligence
Software-defined Radio
Test and Measurement Instrumentation
DESCRIPTION
The DAC3174 is a dual channel 14-bit, 500 MSPS
digital-to-analog converter (DAC). The DAC3174
uses a 14-bit wide LVDS digital bus with 1 or 2
independent data clocks for flexibility in providing
each channel’s data from different data sources. An
input FIFO allows independent data and sample
clocks. FIFO input and output pointers can be
synchronized across multiple devices for precise
signal synchronization. The DAC outputs are current
sourcing and terminate to GND with a compliance
range of –0.5 to 1V. DAC3174 is pin compatible with
the dual-channel, 12-/10-bit, 500 MSPS digital-toanalog converter DAC3164/DAC3154 and singlechannel, 14-/12-/10-bit, 500 MSPS digital-to-analog
converter DAC3171/DAC3161/DAC3151.
The device is available in a QFN-64 PowerPAD™
package is specified over the full industrial
temperature range (–40°C to 85°C).
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
DAC3174
SLAS837A – APRIL 2013 – REVISED MAY 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
VDDA18
VFUSE
DIGVDD18
CLKVDD18
BLOCK DIAGRAMS
DACCLKP
Clock Distribution
LVPECL
1. 2 V
Reference
DACCLKN
DATACLKN
DATA13N
Programmable
Delay
DACA
Gain
LVDS
100
DATA13P
QMC
A-offset
8 Sample FIFO
De-interleave
Pattern Test
14
14
SYNCP
SYNCN
IOUTAP
IOUTAN
14-b
DACB
IOUTBP
IOUTBN
QMC
B-offset
100
DATA0N
LVDS
14-b
DACA
DACB
Gain
LVDS
VDDA33
100
DATA0P
BIASJ
LVDS
100
DATACLKP
EXTIO
Optional Input
Used for multi-DAC sync
ALIGNP
Control Interface
LVPECL
TESTMODE
ALARM
SLEEP
RESETB
TXENABLE
SCLK
SDIO
SDENB
SDO
IOVDD
GND
ALIGNN
Figure 1. 14-Bit Interface Mode
2
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VDDA18
DIGVDD18
VFUSE
SLAS837A – APRIL 2013 – REVISED MAY 2013
CLKVDD18
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DACCLKP
Clock Distribution
LVPECL
1.2 V
Reference
DACCLKN
DA_CLKN
DA0N
DB_CLKP
DB_CLKN
7
8 Sample FIFO
De-interleave
100
LVDS
Pattern Test
DA0P
DACA
Gain
QMC
A-offset
IOUTAP
IOUTAN
14-b
DACB
IOUTBP
IOUTBN
LVDS
Programmable
Delay
100
LVDS
7
8 Sample FIFO
Pattern Test
DB6N
De-interleave
100
DB6P
DB0P
14-b
DACA
100
DA6N
Programmable
Delay
LVDS
100
DA6P
BIASJ
LVDS
100
DA_CLKP
EXTIO
QMC
B-offset
DACB
Gain
DB0N
VDDA33
TESTMODE
ALARM
SLEEP
RESETB
TXENABLE
SCLK
SDENB
SDIO
SDO
IOVDD
GND
Control Interface
Figure 2. 7-Bit Interface Mode
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VDDA18
NC
NC
IOUTAP
IOUTAN
VDDA33
EXTIO
BIASJ
VDDA33
VDDA33
IOUTBN
IOUTBP
NC
NC
VDDA18
SLEEP
PINOUT – SINGLE BUS MODE
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
DACCLKP
1
48
TXENABLE
DACCLKN
2
47
ALARM
CLKVDD18
3
46
SDO
ALIGNP
4
45
IOVDD
ALIGNN
5
44
SDIO
SYNCP
6
43
SCLK
SYNCN
7
42
SDENB
VFUSE
8
41
RESETB
(MSB) D13P
9
40
D0N
D13N
10
39
D0P (LSB)
D12P
11
38
D1N
D12N
12
37
D1P
D11P
13
36
D2N
D11N
14
35
D2P
34
D3N
33
D3P
23
24
25
26
DIGVDD18
D7P
D7N
DATACLKP
DATACLKN
D6P
27
28
29
30
31
32
D4N
22
D4P
21
D5N
20
D5P
19
DIGVDD18
18
D6N
17
D8N
16
D8P
D10N
D9N
15
GND PAD (backside)
D9P
D10P
DAC3174
PIN ASSIGNMENT TABLE – SINGLE BUS MODE
PIN
NAME
NO.
I/O
DESCRIPTION
CONTROL/SERIAL
SCLK
43
I
Serial interface clock. Internal pull-down.
SDENB
42
I
Serial interface clock. Internal pull-up.
SDIO
44
I/O Bi-directional serial data in 3 pin mode (default). In 4-pin interface mode (register sif4_ena (config 0, bit
9)), the SDIO pin in an input only. Internal Pull-down.
SDO
46
O
Uni-directional serial interface data in 4 pin mode (register sif4_ena (config 0, bit 9)). The SDO pin is tristated in 3-pin interface mode (default). Internal Pulldown.
RESETB
41
I
Serial interface reset input. Active low. Initialized internal registers during high to low transition.
Asynchronous. Internal pull-up.
ALARM
47
O
CMOS output for ALARM condition.
TXENABLE
48
I
Transmit enable active high input. TXENABLE must be high for the DATA to the DAC to be enabled.
When TXENABLE is low, the digital logic section is forced to all 0, and any input data is ignored. Internal
pull-down.
SLEEP
49
I
Puts device in sleep, active high. Internal pull-down.
4
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SLAS837A – APRIL 2013 – REVISED MAY 2013
PIN ASSIGNMENT TABLE – SINGLE BUS MODE (continued)
PIN
NAME
NO.
I/O
DESCRIPTION
I
LVDS input data bits for both channels. Each positive/negative LVDS pair has an internal 100 Ω
termination resistor. Data format relative to DATACLKP/N clock is Double Data Rate (DDR) with two data
transfers per DATACKP/N clock cycle.
DATA INTERFACE
DATA[13:0]P/N
9/1019/20
22/23
26/27
29/3039/40
The data format is interleaved with channel A (rising edge) and channel B falling edge.
In the default mode (reverse bus not enabled):
DATA13P/N is most significant data bit (MSB)
DATA0P/N is most significant data bit (LSB)
DATACLKP/N
24/25
I
DDR differential input data clock. Edge to center nominal timing. Ch A rising edge, Ch B falling edge in
multiplexed output mode.
SYNCP/N
6/7
I
Reset the FIFO or to be used as a syncing source. These two functions are captured with the rising edge
of DATACLKP/N. The signal captured by the falling edge of DATACLKP/N.
ALIGNP/N
4/5
I
LVPECL FIFO output synchronization. This positive/negative pair is captured with the rising edge of
DACCLKP/N. It is used to reset the clock dividers and for multiple DAC synchronization. If unused it can
be left unconnected.
½
I
LVPECL clock input for DAC core with a self-bias of approximately CLKVDD18/2.
IOUTAP/N
61/60
O
A-Channel DAC current output. An offset binary data pattern of 0x0000 at the DAC input results in a full
scale current source and the most positive voltage on the IOUTAP pin. Similarly, a 0xFFFF data input
results in a 0 mA current source and the least positive voltage on the IOUTAP pin.
IOUTBP/N
53/54
O
B-Channel DAC current output. An offset binary data pattern of 0x0000 at the DAC input results in a full
scale current source and the most positive voltage on the IOUTBP pin. Similarly, a 0xFFFF data input
results in a 0 mA current source and the least positive voltage on the IOUTBP pin.
OUTPUT/CLOCK
DACCLKP/N
REFERENCE
EXTIO
58
I/O Used as external reference input when internal reference is disabled. Requires a 0.1 µF decoupling
capacitor to GND when used as reference output.
BIASJ
57
O
Full-scale output current bias. For 20 mA full-scale output current, connect a 960 Ω resistor to GND.
IOVDD
45
I
Supply voltage for CMOS IO’s. 1.8V – 3.3V.
CLKVDD18
3
I
1.8V clock supply
DIGVDD18
21, 28
I
1.8V digital supply. Also supplies LVDS receivers.
VDDA18
50, 64
I
Analog 1.8V supply
VDDA33
55, 56,
59
I
Analog 3.3V supply
VFUSE
8
I
Digital supply voltage. (1.8V) This supply pin is also used for factory fuse programming. Connect to
DVDD pins for normal operation.
POWER SUPPLY
NC
51, 52
62, 63
Not used. These pins can be left open or tied to GROUND in actual application use.
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EXTIO
BIASJ
VDDA33
VDDA33
59
58
57
56
55
54
SLEEP
VDDA33
60
VDDA18
IOUTAN
61
NC
IOUTAP
62
NC
NC
63
IOUTBP
NC
64
IOUTBN
VDDA18
PIN OUT – DUAL BUS MODE
53
52
51
50
49
DACCLKP
1
48
TXENABLE
DACCLKN
2
47
ALARM
CLKVDD18
3
46
SDO
NC
4
45
IOVDD
NC
5
44
SDIO
DA_CLKP
6
43
SCLK
DA_CLKN
7
42
SDENB
VFUSE
8
41
RESETB
(MSB) DA6P
9
40
DB0N
DA6N
10
39
DB0P (LSB)
DA5P
11
38
DB1N
DA5N
12
37
DB1P
DA4P
13
36
DB2N
DA4N
14
35
DB2P
34
DB3N
33
DB3P
25
26
DA0N
DB_CLKP
DB_CLKN
(MSB) DB6P
27
28
29
30
31
32
DB4N
24
DB4P
23
DB5N
22
DB5P
21
DIGVDD18
20
DB6N
19
(LSB) DA0P
18
DIGVDD18
17
DA1N
16
DA1P
DA3N
DA2N
15
GND PAD (backside)
DA2P
DA3P
DAC3174
PIN ASSIGNMENT TABLE – DUAL BUS MODE
PIN
NAME
NO.
I/O
DESCRIPTION
CONTROL/SERIAL
SCLK
43
I
Serial interface clock. Internal pull-down.
SDENB
42
I
Serial interface clock. Internal pull-up.
SDIO
44
I/O Bi-directional serial data in 3 pin mode (default). In 4-pin interface mode (register sif4_ena (config 0,
bit 9)), the SDIO pin in an input only. Internal Pull-down.
SDO
46
O
Uni-directional serial interface data in 4 pin mode (register sif4_ena (config 0, bit 9)). The SDO pin is
tri-stated in 3-pin interface mode (default). Internal Pulldown.
RESETB
41
I
Serial interface reset input. Active low. Initialized internal registers during high to low transition.
Asynchronous. Internal pull-up.
ALARM
47
O
CMOS output for ALARM condition.
TXENABLE
48
I
Transmit enable active high input. TXENABLE must be high for the DATA to the DAC to be enabled.
When TXENABLE is low, the digital logic section is forced to all 0, and any input data is ignored.
Internal pull-down.
SLEEP
49
I
Puts device in sleep, active high. Internal pull-down.
6
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SLAS837A – APRIL 2013 – REVISED MAY 2013
PIN ASSIGNMENT TABLE – DUAL BUS MODE (continued)
PIN
NAME
NO.
I/O
DESCRIPTION
DATA INTERFACE
DA[6:0]P/N
9/1019/20
22/23
I
LVDS positive input data bits for channel A. Each positive/negative LVDS pair has an internal 100 Ω
termination resistor. Data format relative to DA_CLKP/N clock is Double Data Rate (DDR) with two
data transfers per DA_CLKP/N clock cycle.
The data format is 7 MSBs (rising edge)/7 LSBs falling edge.
In the default mode (reverse bus not enabled):
D6P/N is most significant data bit (MSB)
D0P/N is most significant data bit (LSB)
DB[6:0]P/N
26/27
29/3039/40
I
LVDS positive input data bits for channel B. Each positive/negative LVDS pair has an internal 100 Ω
termination resistor. Data format relative to DB_CLKP/N clock is Double Data Rate (DDR) with two
data transfers per DB_CLKP/N clock cycle.
The data format is 7 MSBs (rising edge)/7 LSBs falling edge.
In the default mode (reverse bus not enabled):
D6P/N is most significant data bit (MSB)
D0P/N is most significant data bit (LSB)
DA_CLKP/N
6/7
I
DDR differential input data clock for channel A. Edge to center nominal timing.
DB_CLKP/N
24/25
I
DDR differential input data clock for channel B. Edge to center nominal timing.
OUTPUT/CLOCK
DACCLKP/N
½
I
LVPECL clock input for DAC core with a self-bias of approximately CLKVDD18/2.
IOUTAP/N
61/60
O
A-Channel DAC current output. An offset binary data pattern of 0x0000 at the DAC input results in a
full scale current source and the most positive voltage on the IOUTAP pin. Similarly, a 0xFFFF data
input results in a 0 mA current source and the least positive voltage on the IOUTAP pin. The IOUTAN
pin is the complement of IOUTAP.
IOUTBP/N
53/54
O
B-Channel DAC current output. An offset binary data pattern of 0x0000 at the DAC input results in a
full scale current source and the most positive voltage on the IOUTBP pin. Similarly, a 0xFFFF data
input results in a 0 mA current source and the least positive voltage on the IOUTBP pin. The IOUTBN
pin is the complement of IOUTBP.
REFERENCE
EXTIO
58
I/O Used as external reference input when internal reference is disabled. Requires a 0.1 µF decoupling
capacitor to GND when used as reference output.
BIASJ
57
O
Full-scale output current bias. For 20 mA full-scale output current, connect a 960 Ω resistor to GND.
IOVDD
45
I
Supply voltage for CMOS IO’s. 1.8V – 3.3V.
CLKVDD18
3
I
1.8V clock supply
DIGVDD18
21, 28
I
1.8V digital supply. Also supplies LVDS receivers.
VDDA18
50, 64
I
Analog 1.8V supply
VDDA33
55, 56,
59
I
Analog 3.3V supply
VFUSE
8
I
Digital supply voltage. (1.8V) This supply pin is also used for factory fuse programming. Connect to
DVDD pins for normal operation.
POWER SUPPLY
NC
4, 5
51, 52
62, 63
Not used. In actual application, Pins 51, 52, 62 and 63 can be left open or tied to GROUND. It is
recommended to tie Pins 4 and 5 to DIGVDD18 and GROUND , respectively.
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PACKAGE/ORDERING INFORMATION (1)
PRODUCT
PACKAGELEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
ECO PLAN
LEAD/BALL
FINISH
DAC3174
QFN-64
RGC
–40°C to 85°C
GREEN (RoHS
and no Sb/Br)
NiPdAu
ORDERING
NUMBER
TRANSPORT
MEDIA
QUANTITY
Tape and Reel
250
DAC3174IRGC25
DAC3174IRGCT
25
DAC3174IRGCR
(1)
2000
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
VALUE
Supply voltage
VDDA33 to GND
–0.5 to 4
VDDA18 to GND
–0.5 to 2.3
CLKVDD18 to GND
–0.5 to 2.3
IOVDD to GND
Terminal voltage
range
UNIT
V
–0.5 to 4
DIGVDD18 to GND
–0.5 to 2.3
CLKVDD18 to DIGVDD18
–0.5 to 0.5
VDDA18 to DIGVDD18
–0.5 to 0.5
DA[6..0]P, DA[6..0]N, DB[6..0]P, DB[6..0]N, D[13..0]P, D[13..0]N,
DATACLKP, DATACLKN, DA_CLKP, DA_CLKPN, DB_CLKP, DB_CLKN,
SYNCP, SYNCN to GND
–0.5 to DIGVDD18 + 0.5
DACCLKP, DACCLKN, ALIGNP, ALIGNN
–0.5 to CLKVDD18 + 0.5
TXENABLE, ALARM, SDO, SDIO, SCLK, SDENB, RESETB to GND
IOUTAP, IOUTAN, IOUTBP, IOUTBN to GND
EXTIO, BIASJ to GND
V
–0.5 to IOVDD + 0.5
–0.7 to 1.4
–0.5 to VDDA33 + 0.5
Storage temperature range
–65 to 150
°C
ESD, Human Body Model
2
kV
THERMAL INFORMATION
THERMAL METRIC (1)
DAC3174
QFN (64 PIN)
θJA
Junction-to-ambient thermal resistance
23.0
θJCtop
Junction-to-case (top) thermal resistance
7.6
θJB
Junction-to-board thermal resistance
2.8
ψJT
Junction-to-top characterization parameter
0.1
ψJB
Junction-to-board characterization parameter
2.8
θJCbot
Junction-to-case (bottom) thermal resistance
0.2
(1)
8
UNITS
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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SLAS837A – APRIL 2013 – REVISED MAY 2013
ELECTRICAL CHARACTERISTICS – DC SPECIFICATIONS
Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, DAC sample rate = 500MSPS, 50% clock
duty cycle, VDDA33/IOVDD = 3.3V, VDDA18/CLKVDD18/DIGVDD18 = 1.8V, IOUTFS = 20mA (unless otherwise noted).
PARAMETER
NOTES
Resolution
MIN
TYP
MAX
14
UNITS
Bits
DC ACCURACY
DNL Differential nonlinearity
±1
1 LSB = IOUTFS/214
INL Integral nonlinearity
LSB
±2
ANALOG OUTPUTS
Coarse gain linearity
Offset error
Mid code offset
Gain error
Gain mismatch
LSB
%FSR
With external reference
±2
With internal reference
±2
With internal reference
Minimum full scale output current
±0.4
0.01
Maximum full scale output current
Nominal full-scale current, IOUTFS =
16xIBAIS current
Output compliance range
IOUTFS = 20 mA
-2
%FSR
2
2
mA
20
-0.5
Output resistance
Output capacitance
%FSR
1
V
300
kΩ
5
pF
REFERENCE OUTPUT
VREF
Reference output voltage
1.14
Reference output current
1.2
1.26
V
100
nA
REFERENCE INPUT
VEXTIO Input voltage range
External reference mode
0.1
Input resistance
1.2
1.25
V
1
MΩ
Small signal bandwidth
500
kHz
Input capacitance
100
pF
±1
ppm of
FSR/°C
TEMPERATURE COEFFICIENTS
Offset drift
Gain drift
With external reference
±15
With internal reference
±30
Reference voltage drift
±8
ppm /°C
POWER SUPPLY
DIGVDD18, VFUSE, VDDA18, CLKVDD18
VDDA33
IOVDD
Sets CMOS IO voltage levels. Nominal
1.8V, 2.5V or 3.3V
1.71
1.8
1.89
V
3.15
3.3
3.45
V
3.45
V
1.71
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ELECTRICAL CHARACTERISTICS – DC SPECIFICATIONS (continued)
Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, DAC sample rate = 500MSPS, 50% clock
duty cycle, VDDA33/IOVDD = 3.3V, VDDA18/CLKVDD18/DIGVDD18 = 1.8V, IOUTFS = 20mA (unless otherwise noted).
PARAMETER
NOTES
MIN
TYP
MAX
UNITS
POWER CONSUMPTION
IVDDA33
3.3V Analog supply current
52
59
mA
ICLKVDD18
1.8V Clock supply current
49
57
mA
IDIGVDD18
1.8V Digital supply current (DIGVDD18
and VFUSE)
115
130
mA
IIOVDD
1.8V IO Supply current
0.002
0.015
mA
Pdis
Total power dissipation
464
530
mW
IVDDA33
3.3V Analog supply current
ICLKVDD18
1.8V Clock supply current
IDIGVDD18
1.8V Digital supply current (DIGVDD18
and VFUSE)
IIOVDD
MODE 1
fDAC = 491.52 MSPS, QMC on, IF = 20
MHz
51
mA
38
mA
87
mA
1.8V IO Supply current
0.002
mA
Pdis
Total power dissipation
396
mW
IVDDA33
3.3V Analog supply current
2.6
mA
ICLKVDD18
1.8V Clock supply current
43
mA
IDIGVDD18
1.8V Digital supply current (DIGVDD18
and VFUSE)
110
mA
IIOVDD
1.8V IO Supply current
0.003
mA
Pdis
Total power dissipation
284
IVDDA33
3.3V Analog supply current
1.6
4
mA
ICLKVDD18
1.8V Clock supply current
1.8
4
mA
IDIGVDD18
1.8V Digital supply current (DIGVDD18
and VFUSE)
0.7
3
mA
IIOVDD
1.8V IO Supply current
0.003
0.015
mA
Pdis
Total power dissipation
10
26
mW
PSRR
Power supply rejection ratio
–0.4
0.4
%/FSR/V
T
Operating temperature
–40
85
°C
10
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MODE 2
fDAC = 320 MSPS, QMC on, IF = 20 MHz
MODE 3
Sleep mode, fDAC = 491.52 MSPS, DAC in
sleep mode
MODE 4
Power-down mode, no clock, DAC in sleep
mode
DC tested
mW
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SLAS837A – APRIL 2013 – REVISED MAY 2013
ELECTRICAL CHARACTERISTICS – AC SPECIFICATIONS
Typical values at T A = 25°C, full temperature range is T MIN = –40°C to T MAX = 85°C, DAC sample rate = 500MSPS, 50%
clock duty cycle, VDDA33/IOVDD = 3.3V, VDDA18/CLKVDD18/DIGVDD18 = 1.8V, IOUT FS = 20mA (unless otherwise
noted).
PARAMETER
NOTES
MIN
TYP MAX
UNITS
ANALOG OUTPUT
fDAC
Maximum sample rate
ts(DAC)
Output settling time to 0.1%
Transition: Code 0x0000 to 0x3FFF
tPD
Output propagation delay
Does not include digital latency
tr(IOUT)
Output rise time 10% to 90%
tf(IOUT)
Output fall time 90% to 10%
Digital Latency
500
MSPS
11
ns
2
ns
200
ps
200
ps
Length of delay from DAC pin inputs to DATA at output
pins. In normal operation mode including the latency of
FIFO.
26
DACCLK
fDAC = 500 MSPS, fout = 10.1 MHz
82
fDAC = 500 MSPS, fout = 20.1 MHz
78
fDAC = 500 MSPS, fout = 70.1 MHz
74
fDAC = 500 MSPS, fout = 10.1 ±0.5 MHz
84
fDAC = 500 MSPS, fout = 20.1 ±0.5 MHz
84
fDAC = 500 MSPS, fout = 70.1 ±0.5 MHz
75
AC PERFORMANCE
SFDR
IMD3
Spurious free dynamic range
Intermodulation distortion
fDAC = 500 MSPS, fout = 150.1 ±0.5 MHz
NSD
ACLR
Noise spectral density
Adjacent channel leakage ratio
dBc
dBc
63
fDAC = 500 MSPS, fout = 10.1 MHz
160
fDAC = 500 MSPS, fout = 20.1 MHz
157
fDAC = 500 MSPS, fout = 70.1 MHz
155
fDAC = 491.52 MSPS, fout = 30.72 MHz, WCDMA TM1
78
f AC = 491.52 MSPS, fout = 153.6 MHzWCDMA TM1
74
dBc/Hz
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ELECTRICAL CHARACTERISTICS – DIGITAL SPECIFICATIONS
Typical values at T A = 25°C, full temperature range is T MIN = –40°C to T MAX = 85°C, DAC sample rate = 500MSPS, 50%
clock duty cycle, VDDA33/IOVDD = 3.3V, VDDA18/CLKVDD18/DIGVDD18 = 1.8V, IOUT FS = 20mA (unless otherwise
noted).
PARAMETERS
NOTES
MIN
TYP
MAX UNITS
CMOS DIGITAL INPUTS (RESETB, SDENB, SCLK, SDIO, TXENABLE)
VIH
High-level input voltage
VIL
Low-level input voltage
IIH
High-level input current
IIL
Low-level input current
IOVDD×
0.6
V
0.25×IO
VDD
V
–40
40
μA
–40
40
μA
IOVDD = 3.3 V, 2.5 V or
1.8 V
DIGITAL OUTPUTS – CMOS INTERFACE (SDOUT, SDIO)
VOH
High-level output voltage
VOL
Low-level output voltage
IOVDD = 3.3 V, 2.5 V,
1.8 V
0.85×IOV
DD
V
0.125×I
OVDD
V
SERIAL PORT TIMING
ts(SENDB)
Setup time, SDENB to rising edge of SCLK
20
ns
ts(SDIO)
Setup time, SDIO to rising edge of SCLK
10
ns
th(SDIO)
Hold time, SDIO from rising edge of SCLK
5
ns
t(SCLK)
Period of SCLK
100
ns
t(SCLKH)
High time of SCLK
40
ns
t(SCLKL)
Low time of SCLK
40
ns
td(DATA)
Data output delay after falling edge of SCLK
10
ns
TRESET
Minimum RESTB pulse width
25
ns
LVDS INTERFACE (D[x..0]P/N, DA[x..0]P/N , DB[x..0]P/N , DA_CLKP/N, DB_CLKP/N, DATACLKP/N, SYNCP/N, ALIGNP/N )
VA,B+
Logic high differential input voltage threshold
VA,B–
Logic low differential input voltage threshold
VCOM
Input Common Mode Range
1.0
1.2
2.0
V
ZT
Internal termination
85
110
135
Ω
CL
LVDS input capacitance
12
175
mV
–175
2
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pF
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ELECTRICAL CHARACTERISTICS – DIGITAL SPECIFICATIONS (continued)
Typical values at T A = 25°C, full temperature range is T MIN = –40°C to T MAX = 85°C, DAC sample rate = 500MSPS, 50%
clock duty cycle, VDDA33/IOVDD = 3.3V, VDDA18/CLKVDD18/DIGVDD18 = 1.8V, IOUT FS = 20mA (unless otherwise
noted).
PARAMETERS
NOTES
MIN
TYP
MAX UNITS
LVDS INPUT TIMING
config3 Setting
ts(DATA)
Setup time
D[x..0] valid to DATACLK rising or falling edge
for single bus single clock mode ;
_
DA/DB[x…0] valid to DB_CLK rising or falling
edge for dual bus single clock mode;
_
DA[x..0] valid to DA_CLK rising or falling edge,
and DB[x…0] valid for DB_CLK rising or falling
edge for dual bus dual clock mode
datadly
clkdly
0
0
-20
0
1
-120
0
2
-220
0
3
-310
0
4
-390
0
5
-480
0
6
-560
0
7
-630
1
0
70
2
0
150
3
0
230
4
0
330
5
0
430
6
0
530
7
0
620
ps
congfig3 Setting
th(DATA)
Hold time
D[x..0] valid to DATACLK rising or falling edge
for single bus single clock mode;
_
DA/DB[x…0] valid to DB_CLK rising or falling
edge for dual bus single clock mode;
_
DA[x..0] valid to DA_CLK rising or falling edge,
and DB[x…0] valid for DB_CLK rising or falling
edge for dual bus dual clock mode.
datadly
clkdly
0
0
310
0
1
390
0
2
480
0
3
560
0
4
650
0
5
740
0
6
850
0
7
930
1
0
200
2
0
100
3
0
20
4
0
-60
5
0
-140
6
0
-220
7
0
-290
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TYPICAL CHARACTERISTICS
All plots are at 25°C, nominal supply voltages, fDAC = 500MSPS, 50% clock duty cycle, 0-dBFS input signal and 20mA fullscale output current (unless otherwise noted).
2
Differential Nonlinearity Error (LSB)
Integral Nonlinearity Error (LSB)
2
1.5
1
0.5
0
−0.5
−1
−1.5
−2
5000
10000
1.5
1
0.5
0
−0.5
−1
−1.5
−2
15000
Code
5000
Figure 3. Integral Nonlinearity
0dBFS
−6dBFS
−12dBFS
90
80
70
70
HD2 (dBc)
SFDR (dBc)
80
60
50
60
50
40
40
30
30
20
20
0
50
100
150
Output Frequency (dB)
200
10
250
0
50
G001
100
150
Output Frequency (dB)
200
250
G002
Figure 5. SFDR vs Output Frequency Over Input Scale
Figure 6. Second-Order Harmonic Distortion vs Output
Frequency Over Input Scale
100
100
0dBFS
−6dBFS
−12dBFS
90
80
80
SFDR (dBc)
60
50
40
70
60
50
30
40
20
30
10
0
50
100
150
Output Frequency (dB)
200
fDAC = 200 MSPS
fDAC = 300 MSPS
fDAC = 400 MSPS
fDAC = 500 MSPS
90
70
HD3 (dBc)
G020
100
0dBFS
−6dBFS
−12dBFS
90
250
20
0
G003
Figure 7. Third-Order Harmonic Distortion vs Output
Frequency Over Input Scale
14
15000
Figure 4. Differential Nonlinearity
100
10
10000
Code
G019
50
100
150
Output Frequency (MHz)
200
250
G004
Figure 8. SFDR vs Output Frequency Over fDAC
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TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltages, fDAC = 500MSPS, 50% clock duty cycle, 0-dBFS input signal and 20mA fullscale output current (unless otherwise noted).
100
100
0dBFS
−6dBFS
−12dBFS
90
80
70
IMD3 (dBc)
IMD3 (dBc)
80
60
50
40
70
60
50
30
40
20
30
10
0
50
100
150
Output Frequency (dB)
200
20
250
50
100
150
Output Frequency (MHz)
G006
fDAC = 200 MSPS
fDAC = 300 MSPS
fDAC = 400 MSPS
fDAC = 500 MSPS
170
160
NSD (dBc/Hz)
160
150
140
150
140
130
130
120
120
0
50
100
150
Output Frequency (dB)
200
110
250
0
100
Output Frequency (MHz)
G007
Figure 11. NSD vs Output Frequency Over Input Scale
200
250
G008
Figure 12. NSD vs Output Frequency Over fDAC
−50
−50
Adjacent channel
Altenate channel
−60
ACLR (dBc)
−60
ACLR (dBc)
250
180
0dBFS
−6dBFS
−12dBFS
170
−70
−80
−90
−70
−80
−90
fDAC = 500 MSPS
−100
200
Figure 10. IMD3 vs Output Frequency Over fDAC
180
NSD (dBc/Hz)
0
G005
Figure 9. IMD3 vs Output Frequency Over Input Scale
110
fDAC = 200 MSPS
fDAC = 300 MSPS
fDAC = 400 MSPS
fDAC = 500 MSPS
90
0
50
100
150
Output Frequency (MHz)
fDAC = 500 MSPS
200
250
−100
0
G009
Figure 13. ACLR (Adjacent Channel) vs Output Frequency
50
100
150
Output Frequency (MHz)
200
250
G010
Figure 14. ACLR (Alternate Channel) vs Output Frequency
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TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltages, fDAC = 500MSPS, 50% clock duty cycle, 0-dBFS input signal and 20mA fullscale output current (unless otherwise noted).
10
10
fDAC= 491.52 MSPS
fOUT = 20 MHz
−10
−10
−20
−20
−30
−40
−50
−50
−70
−70
−80
−80
10
50
90
130
170
Frequency (MHz)
210
−90
250
10
50
90
G011
130
170
Frequency (MHz)
210
250
G012
Figure 16. Single-Tone Spectral Plot (IF = 70MHz)
10
10
fDAC = 500 MSPS
fout = 20 MHz
Tone spacing = 1 MHz
0
−10
fDAC = 500 MSPS
fout = 70 MHz
Tone spacing = 1 MHz
0
−10
−20
Power (dBm)
−20
Power (dBm)
−40
−60
Figure 15. Single-Tone Spectral Plot (IF = 20MHz)
−30
−40
−50
−60
−30
−40
−50
−60
−70
−70
−80
−80
−90
−90
−100
−100
15
17
19
21
Frequency (MHz)
23
25
65
G013
Figure 17. Two-tone Spectral Plot (IF = 20MHz)
0dBFs,
fDAC = 491.52MSPS,
fOUT = 70MHz
67
69
71
Frequency (MHz)
73
75
G014
Figure 18. Two-tone Spectral Plot (IF = 70MHz)
0dBFs,
fDAC = 491.52MSPS,
fOUT = 70MHz
Figure 19. Four-carrier WCDMA Test Mode 1
16
−30
−60
−90
fDAC= 491.52 MSPS
fOUT = 20 MHz
0
Power (dBm)
Power (dBm)
0
Figure 20. Single-carrier WCDMA Test Mode 1
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TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltages, fDAC = 500MSPS, 50% clock duty cycle, 0-dBFS input signal and 20mA fullscale output current (unless otherwise noted).
Ref -20 dBm
-30
-40
*Att 5 dB
*RBW 30 kHz
*VBW 300 kHz
*SWT 2 s
Ref -20 dBm
-30
0dBFs,
fDAC = 491.52MSPS,
fOUT = 70MHz
A
-40
-50
-50
1 RM *
CLRWR -60
1 RM *
CLRWR -60
-70
-70
*Att 5 dB
*RBW 30 kHz
*VBW 300 kHz
*SWT 2 s
0dBFs,
fDAC = 491.52MSPS,
fOUT = 70MHz
A
-80
-80
NOR
-90
NOR
-90
-100
-100
3DB
-110
Center 70 MHz
Tx Channel
Bandwidth
Adjacent Channel
Bandwidth
Spacing
2.92827419 MHz/
Span 29.2827419 MHz
E-UTRA/LTE Square
9.015 MHz
9.015 MHz
10 MHz
Power
Lower
Upper
-12.31 dBm
-74.95 dB
-74.23 dB
Figure 21. ACPR - LTE 10MHz FDD E-TM 1.1
3DB
-110
Center 70 MHz
Tx Channel
Bandwidth
Adjacent Channel
Bandwidth
Spacing
5.855034538 MHz/
Span 58.55034538 MHz
E-UTRA/LTE Square
18.015 MHz
Power
-11.16 dBm
18.015 MHz
20 MHz
Lower
Upper
-72.43 dB
-72.21 dB
Figure 22. ACPR – LTE 20MHz FDD E-TM 1.1
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DEFINITION OF SPECIFICATIONS
Adjacent Carrier Leakage Ratio (ACLR): Defined as the ratio in decibels relative to the carrier (dBc) between
the measured power within a channel and that of its adjacent channel.
Analog and Digital Power Supply Rejection Ratio (APSSR, DPSSR): Defined as the percentage error in the
ratio of the delta IOUT and delta supply voltage normalized with respect to the ideal IOUT current.
Differential Nonlinearity (DNL): Defined as the variation in analog output associated with an ideal 1 LSB
change in the digital input code.
Gain Drift: Defined as the maximum change in gain, in terms of ppm of full-scale range (FSR) per °C, from the
value at ambient (25°C) to values over the full operating temperature range.
Gain Error: Defined as the percentage error (in FSR%) for the ratio between the measured full-scale output
current and the ideal full-scale output current.
Integral Nonlinearity (INL): Defined as the maximum deviation of the actual analog output from the ideal output,
determined by a straight line drawn from zero scale to full scale.
Intermodulation Distortion (IMD3): The two-tone IMD3 is defined as the ratio (in dBc) of the 3rd-order
intermodulation distortion product to either fundamental output tone.
Offset Drift: Defined as the maximum change in DC offset, in terms of ppm of full-scale range (FSR) per °C,
from the value at ambient (25°C) to values over the full operating temperature range.
Offset Error: Defined as the percentage error (in FSR%) for the ratio between the measured mid-scale output
current and the ideal mid-scale output current.
Output Compliance Range: Defined as the minimum and maximum allowable voltage at the output of the
current-output DAC. Exceeding this limit may result reduced reliability of the device or adversely affecting
distortion performance.
Reference Voltage Drift: Defined as the maximum change of the reference voltage in ppm per degree Celsius
from value at ambient (25°C) to values over the full operating temperature range.
Spurious Free Dynamic Range (SFDR): Defined as the difference (in dBc) between the peak amplitude of the
output signal and the peak spurious signal.
Signal to Noise Ratio (SNR): Defined as the ratio of the RMS value of the fundamental output signal to the
RMS sum of all other spectral components below the Nyquist frequency, including noise, but excluding the first
six harmonics and dc.
TIMING DIAGRAMS
D[13:0]P/N
A3[13:0] B3[13:0] A4[13:0] B4[13:0] A5[13:0] B5[13:0] A6[13:0] B6[13:0] A7[13:0] B7[13:0]
ts(DATA )
th(DATA )
ts(DATA )
th(DATA )
DATACLKP/N
(DDR)
ts(DATA )
th(DATA )
SYNCP/N
Resets write pointer to position 0
Figure 23. Input Data Timing for Single Bus Single Clock Mode
18
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DA[6:0]P/N
A3[13:7]
A3[6:0]
A4[13:7]
ts(DATA )
A4[6:0]
A5[13:7]
th(DATA )
A5[6:0]
ts(DATA )
A6[13:7]
A6[6:0]
A7[13:7]
A7[6:0]
th(DATA )
DA_CLKP/N
There is no phase relationship requirement
between DA_CLK and DBCLK
DB[6:0]P/N
B3[13:7]
B3[6:0]
B4[13:7]
ts(DATA )
B4[6:0]
th(DATA )
B5[13:7]
B5[6:0]
ts(DATA )
B6[13:7]
B6[6:0]
B7[13:7]
B7[6:0]
th(DATA )
DB_CLKP/N
Figure 24. Input Data Timing Diagram for Dual Bus Dual Clock Mode
DA[6:0]P/N
A3[13:7]
A3[6:0]
A4[13:7]
ts(DATA )
DB[6:0]P/N
B3[13:7]
B3[6:0]
A4[6:0]
th(DATA )
B4[13:7]
ts(DATA )
B4[6:0]
th(DATA )
A5[13:7]
A5[6:0]
ts(DATA )
B5[13:7]
ts(DATA )
A6[13:7]
A6[6:0]
A7[13:7]
A7[6:0]
B6[6:0]
B7[13:7]
B7[6:0]
th(DATA )
B5[6:0]
B6[13:7]
th(DATA )
DB_CLKP/N
Figure 25. Input Data Timing Diagram Dual Bus Single Clock Mode
D[13:0]P/N
A3[13:0] A4[13:0] A5[13:0] A6[13:0] A7[13:0] A8[13:0] A9[13:0] A10[13:0] A11 [13:0]
ts(DATA )
th(DATA )
DATACLKP/N
(SDR)
ts(DATA )
th(DATA )
SYNCP/N
Resets write pointer to position 0
Figure 26. Input Data Timing Diagram Single Channel SDR Mode
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DATA INPUT FORMATS
Table 1. Mode: Single Bus Single Clock Mode
BITS
DIFFERENTIAL PAIR (P/N)
DATACLK RISING EDGE
DATACLK FALLING EDGE
D13
A13
B13
D12
A12
B12
D11
A11
B11
D10
A10
B10
D9
A9
B9
D8
A8
B8
D7
A7
B7
D6
A6
B6
D5
A5
B5
D4
A4
B4
D3
A3
B3
D2
A2
B2
D1
A1
B1
D0
A0
B0
SYNC
FIFO Write Reset
–
Table 2. Mode: Single Channel SDR Mode
BITS
20
DIFFERENTIAL PAIR (P/N)
DATACLK RISING EDGE
DATACLK FALLING EDGE
D13
A13
–
D12
A12
–
D11
A11
–
D10
A10
–
D9
A9
–
D8
A8
–
D7
A7
–
D6
A6
–
D5
A5
–
D4
A4
–
D3
A3
–
D2
A2
–
D1
A1
–
D0
A0
–
SYNC
FIFO Write Reset
–
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Table 3. Mode: Dual Bus Single Clock Mode
DIFFERENTIAL PAIR (P/N)
DB_CLK RISING EDGE
DB_CLK FALLING EDGE
DA6
A13
A6
DA5
A12
A5
DA4
A11
A4
DA3
A10
A3
DA2
A9
A2
DA1
A8
A1
DA0
A7
A0
DB6
B13
B6
DB5
B12
B5
DB4
B11
B4
DB3
B10
B3
DB2
B9
B2
DB1
B8
B1
DB0
B7
B0
SYNC
FIFO Write Reset
-
Table 4. Mode: Dual Bus Dual Clock Mode
DIFFERENTIAL PAIR (P/N)
DA_CLK RISING EDGE
DA_CLK FALLING EDGE
DA6
A13
A6
DA5
A12
A5
DA4
A11
A4
DA3
A10
A3
DA2
A9
A2
DA1
A8
A1
DA0
A7
A0
DB_CLK RISING EDGE
DB_CLK FALLING EDGE
DB6
B13
B6
DB5
B12
B5
DB4
B11
B4
DB3
B10
B3
DB2
B9
B2
DB1
B8
B1
DB0
B7
B0
.
NOTE
When the register rev (config0, bit 11) is asserted, the MSB/LSB of the input bits are
reversed. When using the 14-bit interface, all 14 bits are reversed as one word; when
using the 7-bit interface, each 7-bit is reversed.
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SERIAL INTERFACE DESCRIPTION
The serial port of the DAC3174 is a flexible serial interface which communicates with industry standard
microprocessors and microcontrollers. The interface provides read/write access to all registers used to define the
operating modes of DAC3174. It is compatible with most synchronous transfer formats and can be configured as
a 3 or 4 pin interface by sif4_ena in register config 0, bit 9. In both configurations, SCLK is the serial interface
input clock and SDENB is serial interface enable. For 3 pin configuration, SDIO is a bidirectional pin for both data
in and data out. For 4 pin configuration, SDIO is data in only and SDO is data out only. Data is input into the
device with the rising edge of SCLK. Data is output from the device on the falling edge of SCLK.
Each read/write operation is framed by signal SDENB (Serial Data Enable Bar) asserted low. The first frame byte
is the instruction cycle which identifies the following data transfer cycle as read or write as well as the 7-bit
address to be accessed. Table 5 indicates the function of each bit in the instruction cycle and is followed by a
detailed description of each bit. The data transfer cycle consists of two bytes.
Table 5. Instruction byte of the Serial interface
MSB
Bit
Description
LSB
7
R/W
6
A6
5
A5
4
A4
3
A3
2
A2
1
A1
0
A0
R/W
Identifies the following data transfer cycle as a read or write operation. A high indicates a read
operation from DAC3174 and a low indicates a write operation to DAC3174.
[A6 : A0]
Identifies the address of the register to be accessed during the read or write operation.
Figure 27 shows the serial interface timing diagram for a DAC3174 write operation. SCLK is the serial interface
clock input to DAC3174. Serial data enable SDENB is an active low input to DAC3174. SDIO is serial data in.
Input data to DAC3174 is clocked on the rising edges of SCLK.
Instruction Cycle
Data Transfer Cycle
SDENB
SCLK
SDIO
rwb
A6
A5
A4
A3
A2
tS (SDENB)
A1
A0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
t SCLK
SDENB
SCLK
SDIO
tS(SDIO) tH(SDIO)
Figure 27. Serial Interface Write Timing Diagram
Figure 28 shows the serial interface timing diagram for a DAC3174 read operation. SCLK is the serial interface
clock input to DAC3174. Serial data enable SDENB is an active low input to DAC3174. SDIO is serial data in
during the instruction cycle. In 3 pin configuration, SDIO is data out from the DAC3174 during the data transfer
cycle, while SDO is in a high-impedance state. In 4 pin configuration, both SDIO and SDO are data out from the
DAC3174 during the data transfer cycle. At the end of the data transfer, SDIO and SDO will output low on the
final falling edge of SCLK until the rising edge of SDENB when they will 3-state.
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Instruction Cycle
Data Transfer Cycle
SDENB
SCLK
SDIO
rwb
A6
A5
A4
A3
A2
A1
SDO
A0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
SDENB
SCLK
SDIO
SDO
Data n
Data n-1
td (Data)
Figure 28. Serial Interface Read Timing Diagram
REGISTER DESCRIPTIONS
In the SIF interface there are four types of registers:
NORMAL:
The NORMAL register type allows data to be written and read from. All 16-bits of the data are
registered at the same time. There is no synchronizing with an internal clock thus all register
writes are asynchronous with respect to internal clocks. There are three subtypes of NORMAL:
AUTOSYNC:
A NORMAL register that causes a sync to be generated after the write is
finished. These are most commonly used in things like offsets and phaseadd
where there is a word or block setup that extends across multiple registers
and all of the registers need to be programmed before any take effect on the
circuit. For example, the phaseadd is two registers long. It wouldn’t serve the
user to have the first write 16 of the 32 bits cause a change in the frequency,
so the design allows all the registers to be written and then when that last
one for this block is finished, an autosync is generated for the mixer telling it
to grab all the new SIF values. This will occur on a mixer clock cycle so that
no meta-stability errors occur.
No RESET Value: These are NORMAL registers, but for one reason or another reset value can
not be guaranteed. This could be because the register has some read_only
bits or some internal logic partially controls the bit values. An example is the
SIF_CONFIG6 register. The bits come from the temperature sensor and the
fuses. Depending on which fuses are blown and what the die temp is the
reset value will be different.
FUSE controlled:
READ_ONLY:
While this isn’t a type of register, you may see this description in the area
describing the default value for the register. What is means is that fuses will
change the default value and the value shown in the document is for when
no fuses are blown.
Registers that are internal wires ANDed with the address bus then connected to the SIF
output data bus.
WRITE_TO_CLEAR: These registers are just like NORMAL registers with one exception. They can be written
and read, however, when the internal logic asynchronously sets a bit high in one of
these registers, that bit stays high until it is written to ‘0’. This way interrupts will be
captured and stay constant until cleared by the user.
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Table 6. Register Map
(MSB)
Bit 15
Name
Address
Default
Bit 14
config0
0x00
0x44FC
qmc_
offset_ena
dual_ ena
config1
0x01
0x600E
iotest_ena
bsideclk_
ena
config2
0x02
0x3FFF
config3
0x03
0x0000
config4
0x04
0x0000
config5
0x05
0x0000
config6
0x06
0x0000
config7
0x07
0xFFFF
config8
0x08
0x4000
reserved
config9
0x09
0x8000
fifo_offset (2:0)
config10
0x0A
0xF080
Bit 13
Bit 12
chipwidth (1:0)
fullword_
interface_
ena
64cnt_ena
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
rev
twos
sif4_ ena
reserve
d
fifo_ ena
alarm_
out_ena
alarm_
out_pol
alignrx_
ena
syncrx_en
a
lvdsdataclk_
ena
reserved
synconly_en
a
dacclk_go
ne_ena
dataclkgone
_ena
collision_ena
reserve
d
daca_
compliment
dacb_
complime
nt
sif_ sync
sif_
sync_ena
alarm_
2away_en
a
alarm_
1away_ena
alarm
_collision
_ena
reserved
reserved
lvdsdata_ena (13:0)
datadlya (2:0)
clkdlya (2:0)
datadlyb (2:0)
clkdlyb (2:0)
reserved
alarm_fro
m_
zerochka
extref
_ena
reserved
dual_ ena
iotest_results (13:0)
alarm_fro
m_
zerochkb
alarms_from_fifoa (2:0)
alarms_from_fifob (2:0)
alarm_
dacclk_
gone
alarm_
dataclk_
gone
clock_gon
e
tempdata (7:0)
alarm_fro
m_ iotesta
alarm_fro
m_ iotestb
reserved
fuse_cntl (5:0)
reserved
alarms_mask (15:0)
qmc_offseta (12:0)
qmc_offsetb (12:0)
coarse_dac (3:0)
fuse_
sleep
reserved
reserved
reserved
tsense_
sleep
clkrecv_ ena
sleepa
config11
0x0B
0x1111
config12
0x0C
0x3A7A
reserved
iotest_pattern0 (13:0)
config13
0x0D
0x36B6
reserved
iotest_pattern1 (13:0)
config14
0x0E
0x2AEA
reserved
iotest_pattern2 (13:0)
config15
0x0F
0x0545
reserved
iotest_pattern3 (13:0)
config16
0x10
0x1A1A
reserved
iotest_pattern4 (13:0)
config17
0x11
0x1616
reserved
iotest_pattern5 (13:0)
config18
0x12
0x2AAA
reserved
iotest_pattern6 (13:0)
config19
0x13
0x06C6
reserved
iotest_pattern7 (13:0)
config20
0x14
0x0000
config21
0x15
0xFFFF
sleepcntl (15:0)
config22
0x16
0x0000
fa002_data(15:0)
config23
0x17
0x0000
fa002_data(31:16)
config24
0x18
0x0000
fa002_data(47:32)
config25
0x19
0x0000
config127
0x7F
0x0044
24
(LSB)
Bit 0
Bit 11
sifdac_
ena
reserved
sleepb
reserved
reserved
reserved
reserved
sifdac (13:0)
fa002_data(63:48)
reserved
reserved
reserved
reserved
reserved
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titest_vol
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Register name: config0 – Address: 0x00, Default: 0x44FC
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config0
0x00
15
qmc_offset_ena
Enable the offset function when asserted.
0
14
dual_ena
Utilizes both DACs when asserted.
1
FUSE
controlled
13:12
chipwidth
Programmable bits for setting the input interface width.
00: all 14 bits are used.
01: upper 12 bits are used10: upper 10 bits are used
11: upper 10 bits are used
00
11
rev
Reverses the input bits. When using the 7bit interface, this
reverse each 7-bit input, however when using the 14-bit
interface, all 14-bits are reversed as one word.
0
10
twos
When asserted, this bit tells the chip to presume 2’s
complement data is arriving at the input. Otherwise offset
binary is presumed.
1
9
sif4_ena
When asserted the SIF interface becomes a 4 pin interface.
This bit has a lower priority than the dieid_ena bit.
0
8
reserved
reserved
0
7
fifo_ena
When asserted, the FIFO is absorbing the difference between 1
INPUT clock and DAC clock. If it is not asserted then the
FIFO buffering is bypassed but the reversing of bits and
handling of offset binary input is still available. NOTE: When
the FIFO is bypassed the DACCCLK and DATACLK must
be aligned or there may be timing errors; and, it is not
recommended for actual application use.
6
alarm_out_ena
When asserted the pin alarm becomes an output instead of a
tri-stated pin.
1
5
alarm_out_pol
This bit changes the polarity of the ALARM signal.
(0=negative logic, 1=positive logic)
1
4
alignrx_ena
When asserted the ALIGN pin receiver is powered up. NOTE: 1
It is recommended to clear this bit when ALIGNP/N are
not used (dual bus mode, and SYNC ONLY and
SIF_SYNC modes in single bus mode).
3
syncrx_ena
When asserted the SYNC pin receiver is powered up NOTE:
It is recommended to clear this bit when SYNCP/N are
not used (dual bus mode, and SIF_SYNC mode in single
bus mode.)
1
2
lvdsdataclk_ena
When asserted the DATACLK pin receiver is powered up.
1
1
reserved
reserved
0
0
synconly_ena
When asserted the chip is put into the SYNC ONLY mode
where the SYNC ONLY pin is used as the sync input for both
the front and back of the FIFO.
0
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Register name: config1 – Address: 0x01, Default: 0x600E
Register
Name
Addr
(Hex)
Bit
Name
Function
Default
Value
config1
0x01
15
iotest_ena
Turns on the io-testing circuitry when asserted. This is the circuitry
that will compare a 8 sample input pattern to SIF programmed
registers to make sure the data coming into the chip meets
setup/hold requirements. If this bit is a ‘0’ then the clock to this
circuitry is turned off for power savings. NOTE: Sample 0 should
be aligned with the rising edge of SYNC.
0
14
bsideclk_ena
When asserted the input clock for the B side datapath is enabled.
Otherwise the IOTEST and the FIFO on the B side of the design
will not get a clock.
1
13
fullwordinterface_ena
When asserted the input interface is changed to use the full 14-bits
for each word, instead of dual 7-bit buses for two half words.
1
12
64cnt_ena
This enables the resetting of the alarms after 64 good samples with 0
the goal of removing unnecessary errors. For instance on a lab
board, when checking the setup/hold through IO TEST, there may
initially be errors, but once the test is up and running everything
works. Setting this bit removes the need for a SIF write to clear the
alarm register.
11
dacclkgone_ena
This allows the DACCLK gone signal from the clock monitor to be
used to shut the output off.
0
10
dataclkgone_ena
This allows the DATACLK gone signal from the clock monitor to be
used to shut the output off.
0
9
collision_ena
This allows the collision alarm from the FIFO to shut the output off
0
8
reserved
Reserved.
0
7
daca_compliment
When asserted the output to the DACA is complimented. This
allows the user of the chip to effectively change the + and –
designations of the DAC output pins.
0
6
dacb_compliment
When asserted the output to the DACB is complimented. This
allows the user of the chip to effectively change the + and –
designations of the DAC output pins.
0
5
sif_sync
This is the SIF_SYNC signal. Whatever is programmed into this bit 0
will be used as the chip sync when SIF_SYNC mode is
enabled.Design is sensitive to rising edges so programming from 0>1 is when the sync pulse is generated. 1->0 has no effect.
4
sif_sync_ena
When asserted enable SIF_SYNC mode.
0
3
alarm_2away_ena
When asserted alarms from the FIFO that represent the pointers
being 2 away are enabled
1
2
alarm_1away_ena
When asserted alarms from the FIFO that represent the pointers
being 1 away are enabled
1
1
alarm_collision_ena
When asserted the collision of FIFO pointers causes an alarm to be 1
generated
0
reserved
reserved
0
Register name: config2 – Address: 0x02, Default: 0x3FFF
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config2
0x02
15
reserved
reserved
0
14
reserved
reserved
0
13:0
lvdsdata_ena
These 14 bits are individual enables for the 14 input pin receivers.
bits(13:7) turn on Da(6:0) where as bits(6:0) enable Db(6:0).
0x3FFF
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Register name: config3 – Address: 0x03, Default: 0x0000
Register
Name
Addr
(Hex)
Bit
Name
Function
config3
0x03
15:13
datadlya
Controls the delay of the A data inputs through the LVDS receivers. 000
0= no additional delay and each LSB adds a nominal 80ps.
12:10
clkdlya
Controls the delay of the A data clock input through the LVDS
receivers. 0= no additional delay and each LSB adds a nominal
80ps.
9:7
datadlyb
Controls the delay of the B data inputs through the LVDS receivers. 000
0= no additional delay and each LSB adds a nominal 80ps.
6:4
clkdlyb
Controls the delay of the B data clock input through the LVDS
receivers. 0= no additional delay and each LSB adds a nominal
80ps.
000
3
extref_ ena
Enables external reference for the DAC when set.
0
2:1
reserved
reserved
00
0
dual_ clock_ena
When asserted it tells the LVDS input circuit that there are two
individual data clocks. NOTE: must be in SIF_SYNC mode.
0
Default Value
000
Register name: config4 – Address: 0x04, Default: 0x0000
Register
Name
Addr
(Hex)
Bit
Name
Function
Default
Value
config4
WRITE TO
CLEAR/
No RESET
value
0x04
15:14
reserved
reserved
00
13:0
iotest_ results
The values of these bits tell which bit in the input word failed during the
io-test pattern comparison. 13:7 match up with the 7 bits from port A
and 6:0 match up with bits from port B.
0x0000
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Register name: config5 – Address: 0x05, Default: 0x0000
Register
Name
Addr
(Hex)
Bit
Name
Function
config5
WRITE TO
CLEAR
0x05
15
alarm_from_ zerochka
When this bit is asserted the FIFO A write pointer has an all zeros
pattern in it. Since this pointer is a shift register, all zeros will cause
the input point to be stuck until the next sync. The result could be a
repeated 8T pattern at the output if the mixer is off and no syncs
occur. Check for this error will tell the user that another sync is
necessary to restart the FIFO write pointer.
0
14
alarm_from_ zerochkb
When this bit is asserted the FIFO B write pointer has an all zeros
pattern in it. Since this pointer is a shift register, all zeros will cause
the input point to be stuck until the next sync. The result could be a
repeated 8T pattern at the output if the mixer is off and no syncs
occur. Check for this error will tell the user that another sync is
necessary to restart the FIFO write pointer.
0
13:11
alarms_from_ fifoa
These bits report the FIFO A pointer status.
000: All fine
001: Pointers are 2 away
01X: Pointers are 1 away
1XX: FIFO Pointer collision
000
10:8
alarms_from_ fifob
These bits report the FIFO B pointer status.
000: All fine
001: Pointers are 2 away
01X: Pointers are 1 away
1XX: FIFO Pointer collision
0
7
alarm_dacclk_ gone
Bit gets asserted when the DACCLK has been stopped long for
enough cycles to be caught. The number of cycles varies with
interpolation.
0
6
alarm_dataclk_ gone
Bit gets asserted when the DATACLK has been stopped long for
enough cycles to be caught. The number of cycles varies with
interpolation.
0
5
clock_gone
This bit gets set when either alarm_dacclk_gone or
alarm_dataclk_gone are asserted. It controls the output of the
CDRV_SER block. When high, the CDRV_SER block will output
“0x8000” for each output connected to a DAC. The bit must be
written to ‘0’ for CDRV_SER outputs to resume normal operation.
0
4
alarm_from_ iotesta
This is asserted when the input data pattern does not match the
pattern in the iotest_pattern registers.
0
3
alarm_from_ iotestb
This is asserted when the input data pattern does not match the
pattern in the iotest_pattern registers.
0
2
reserved
reserved
0
1
reserved
reserved
0
0
reserved
reserved
0
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Register name: config6 – Address: 0x06, Default: 0x0000
Register
Name
Addr
(Hex)
Bit
Name
Function
Default
Value
config6
No RESET
Value
0x06
15:8
tempdata
This the output from the chip temperature sensor.
NOTE: when reading these bits the SIF interface must be exteremly
slow, 1MHz range.
0x00
7:2
fuse_cntl
These are the values of the blown fuses and are used to determine the
available functionality in the chip.
(*** NOTE ***) These bits are READ_ONLY and allow the user to check
what features have been disabled in the device.
bit5 = 1: Forces Full Word interface
bit4 = 1: reserved
bit3 = 1: reserved
bit2 = 1: Forces Single DAC Mode. Note: This does not force the
channel B in sleep mode. In order to do so, user needs to program
the sleepb SPI bit (config10, bit 5) to "1".
bit1:0 : Forces a different bits size.
“00” 14bit
“01” 12bit
“10” 10bit
“11” 10bit
0x00
1
reserved
reserved
0
0
reserved
reserved
0
Register name: config7 – Address: 0x07, Default: 0xFFFF
Register
Name
Addr
(Hex)
Bit
Name
Function
Default
Value
config7
0x07
15:0
alarms_ mask
Each bit is used to mask an alarm. Assertion masks the alarm: bit15 =
alarm_mask_zerochka
bit14 = alarm_mask_zerochkb
bit13 = alarm_mask_fifoa_collision
bit12 = alarm_mask_fifoa_1away
bit11 = alarm_mask_fifoa_2away
bit10 = alarm_mask_fifob_collision
bit9 = alarm_mask_fifob_1away
bit8 = alarm_mask_fifob_2away
bit7 = alarm_mask_dacclk_gone
bit6 = alarm_mask_dataclk_gone
bit5 = Masks the signal which turns off the DAC output when a clock or
collision occurs. This bit has no effect on the PAD_ALARM output.
bit4 = alarm_mask_iotesta
bit3 = alarm_mask_iotestb
bit2 =
bit1 =
bit0 =
0xFFFF
Register name: config8 – Address: 0x08, Default: 0x4000
Register
Name
Addr
(Hex)
Bit
Name
Function
Default
Value
config8
0x08
15:13
reserved
reserved
010
12:0
qmc_ offseta
The DAC A offset correction. The offset is measured in DAC LSBs.
0x0000
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Register name: config9 – Address: 0x09, Default: 0x8000
Register
Name
Addr
(Hex)
Bit
Name
Function
Default
Value
config9
AUTO
SYNC
0x09
15:13
fifo_ offset
This is the starting point for the READ_POINTER in the FIFO block.
The READ_POINTER is set to this location when a sync occurs on the
DACCLK side of the FIFO.
100
12:0
qmc_ offsetb
The DAC B offset correction. The offset is measured in DAC LSBs.
NOTE: Writing this register causes an autosync to be generated in
the QMOFFSET block.
0x0000
Register name: config10 – Address: 0x0A, Default: 0xF080
Register
Name
Addr
(Hex)
Bit
Name
Function
Default
Value
config10
0x0A
15:12
coarse_ dac
Scales the output current is 16 equal steps.
1111
VrefIO
Rbias
´ (mem_coarse_daca + 1)
11
fuse_ sleep
Put the fuses to sleep when set high.
0
10
reserved
reserved
0
9
reserved
reserved
0
8
tsense_ sleep
When asserted the temperature sensor is put to sleep.
0
7
clkrecv_ ena
Turn on the DAC CLOCK receiver block when asserted.
1
6
sleepa
When asserted DACA is put to sleep.
0
5
sleepb
When asserted DACB is put to sleep. Note: This bit needs to be
programmed to "1" for single DAC mode.
0
4:0
reserved
reserved
00000
Register name: config11 – Address: 0x0B, Default: 0x1111
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config11
0x0B
15:12
reserved
reserved
0001
11:8
reserved
reserved
0001
7:4
reserved
reserved
0001
3:0
reserved
reserved
0001
Register name: config12 – Address: 0x0C, Default: 0x3A7A
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config12
0x0C
15:14
reserved
reserved
00
13:0
iotest_ pattern0
This is dataword0 in the IO test pattern. It is used with the seven
other words to test the input data. NOTE: This word should be
aligned with the rising edge of SYNC when testing the IO
interface.
0x3A7A
Register name: config13 – Address: 0x0D, Default: 0x36B6
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config13
0x0D
15:14
reserved
reserved
00
13:0
iotest_ pattern1
This is dataword1 in the IO test pattern. It is used with the seven
other words to test the input data.
0x36B6
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Register name: config14 – Address: 0x0E, Default: 0x2AEA
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config14
0x0E
15:14
reserved
reserved
00
13:0
iotest_ pattern2
This is dataword2 in the IO test pattern. It is used with the seven
other words to test the input data.
0x2AEA
Register name: config15 – Address: 0x0F, Default: 0x0545
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config15
0x0F
15:14
reserved
reserved
00
13:0
iotest_ pattern3
This is dataword3 in the IO test pattern. It is used with the seven
other words to test the input data.
0x0545
Register name: config16 – Address: 0x10, Default: 0x1A1A
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config16
0x10
15:14
reserved
reserved
00
13:0
iotest_ pattern4
This is dataword4 in the IO test pattern. It is used with the seven
other words to test the input data.
0x1A1A
Register name: config17 – Address: 0x11, Default: 0x1616
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config17
0x11
15:14
reserved
reserved
00
13:0
iotest_ pattern5
This is dataword5 in the IO test pattern. It is used with the seven
other words to test the input data.
0x1616
Register name: config18 – Address: 0x12, Default: 0x2AAA
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config18
0x12
15:14
reserved
reserved
00
13:0
iotest_ pattern5
This is datawor6 in the IO test pattern. It is used with the seven
other words to test the input data.
0x2AAA
Register name: config19 – Address: 0x13, Default: 0x06C6
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config19
0x13
15:14
reserved
reserved
00
13:0
iotest_ pattern7
This is dataword7 in the IO test pattern. It is used with the seven
other words to test the input data.
0x06C6
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DAC3174
SLAS837A – APRIL 2013 – REVISED MAY 2013
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Register name: config20– Address: 0x14, Default: 0x0000
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config20
0x14
15
sifdac_ ena
When asserted the DAC output is set to the value in sifdac. This
can be used for trim setting and other static tests.
0
14
reserved
reserved
0
13:0
sifdac
This is the value that is sent to the DACs when sifdac_ena is
asserted.
0x0000
Register name: config21– Address: 0x15, Default: 0xFFFF
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config21
0x15
15:0
sleepcntl
This controls what blocks get sent a SLEEP signal when the
PAD_SLEEP pin is asserted. Programming a ‘1’ in a bit will pass
the SLEEP signal to the appropriate block.
0xFFFF
bit15 = DAC A
bit14 = DAC B
bit13 = FUSE Sleep
bit12 = Temperature Sensor
bit11 = Clock Receiver
bit10 = LVDS DATA Receivers
bit9 = LVDS SYNC Receiver
bit8 = PECL ALIGN Receiver
bit7 = LVDS DATACLK Receiver
bit6 =
bit5 =
bit4 =
bit3 =
bit2 =
bit1 =
bit0 =
Register name: config22– Address: 0x16
Register
Name
Addr
(Hex)
Bit
Name
Function
config22
READ
ONLY
0x16
15:0
fa002_ data(15:0)
Lower 16bits of the DIE ID word
Default Value
Register name: config23– Address: 0x17
Register
Name
Addr
(Hex)
Bit
Name
Function
config23
READ
ONLY
0x17
15:0
fa002_ data(31:16)
Lower middle 16bits of the DIE ID word
Default Value
Register name: config24– Address: 0x18
Register
Name
Addr
(Hex)
Bit
Name
Function
config24
READ
ONLY
0x18
15:0
fa002_ data(47:32)
Upper middle 16bits of the DIE ID word
32
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Default Value
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DAC3174
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SLAS837A – APRIL 2013 – REVISED MAY 2013
Register name: config25– Address: 0x19
Register
Name
Addr
(Hex)
Bit
Name
Function
config25
READ
ONLY
0x19
15:0
fa002_ data(63:48)
Upper 16bits of the DIE ID word
Default Value
Register name: config127– Address: 0x7F, Default: 0x0045
Register
Name
Addr
(Hex)
Bit
Name
Function
Default
Value
config127
READ
ONLY/No
RESET
Value
0x7F
15:14
reserved
reserved
00
13:12
reserved
reserved
00
11:10
reserved
reserved
00
9:8
reserved
reserved
00
7
reserved
reserved
0
6
titest_voh
A fixed ‘1’ that can be used to test the Voh at the SIF output.
1
5
titest_vol
A fixed ‘0’ that can be used to test the Vol at the SIF output.
0
4:3
vendorid
Fixed at 01
01
2:0
versionid
Chip version
001
Synchronization Modes
There are three modes of syncing included in the DAC3174.
• NORMAL Dual Sync – The SYNC pin is used to align the input side of the FIFO (write pointers) with the A(0)
sample. The ALIGN pin is used to reset the output side of the FIFO (read pointers) to the offset value.
Multiple chip alignment can be accomplished with this kind of syncing.
• SYNC ONLY – In this mode only the SYNC pin is used to sync both the read and write pointers of the FIFO.
There is an asynchronized handoff between the DATACLK and DACCLK when using this mode, therefore it is
impossible to accurately align multiple chips closer than 2 or 3T.
• SIF_SYNC – When neither SYNC nor ALIGN are used, a programmable SYNC pulse can be used to sync
the design. However, the same issues as SYNC ONLY apply. There is an asynchronized handoff between
the serial clock domain and the two sides of the FIFO. Because of the asynchronous nature of the SIF_SYNC
it is impossible to align the sync up with any sample at the input. NOTE: SIF_SYNC mode is the only
synchronization mode supported in dual bus mode.
NOTE
When ALIGNP/N are not used, it is recommended to clear the alignrx_ena register
(config1, bit 4), and tie ALIGNP to DIGVDD18 and ALIGNN to GROUND. When SYNCP/N
are not used, it is recommended to clear register syncrx_ena (config0, bit3), and the
unused SYNCP/N pins can be left open or tied to GROUND.
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DAC3174
SLAS837A – APRIL 2013 – REVISED MAY 2013
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Alarm Monitoring
DAC3174 includes flexible alarm monitoring that can be used to alert a possible malfunction scenario. All alarm
events can be accessed either through the SIP registers and/or through the ALARM pin. Once an alarm is set,
the corresponding alarm bit in register config5 must be reset through the serial interface to allow further testing.
The set of alarms includes the following conditions:
Zero check alarm
• Alarm_from_zerochk. Occurs when the FIFO write pointer has an all zeros pattern. Since the write pointer is a
shift register, all zeros will cause the input point to be stuck until the next sync event. When this happens a
sync to the FIFO block is required.
FIFO alarms
• alarm_from_fifo. Occurs when there is a collision in the FIFO pointers or a collision event is close.
• alarm_fifo_2away. Pointers are within two addresses of each other.
• alarm_fifo_1away. Pointers are within one address of each other.
• alarm_fifo_collision. Pointers are equal to each other.
Clock alarms
• clock_gone. Occurs when either the DACCLK or DATACLOCK have been stopped.
• alarm_dacclk_gone. Occurs when the DACCLK has been stopped.
• alarm_dataclk_gone. Occurs when the DATACLK has been stopped.
Pattern checker alarm
• alarm_from_iotest. Occurs when the input data pattern does not match the pattern key.
To prevent unexpected DAC outputs from propagating into the transmit channel chain, DAC3174 includes a
feature that disables the outputs when a catastrophic alarm occurs. The catastrophic alarms include FIFO pointer
collision, the loss DACCLK or the loss of DATACLK. When any of these alarms occur the internal TXenable
signal is driven low, causing a zeroing of the data going to the DAC in <10T. One caveat is if both clocks stop,
the circuit cannot determine clock loss so no alarms are generated; therefore, no zeroing of output data occurs.
34
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SLAS837A – APRIL 2013 – REVISED MAY 2013
REVISION HISTORY
Changes from Original (April 2013) to Revision A
•
Page
Deleted PRODUCT PREVIEW banner for device release ................................................................................................... 1
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PACKAGE OPTION ADDENDUM
www.ti.com
13-May-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
DAC3174IRGC25
PREVIEW
VQFN
RGC
64
25
Green (RoHS
& no Sb/Br)
Call TI
Level-3-260C-168 HR
-40 to 85
DAC3174I
DAC3174IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
Call TI
Level-3-260C-168 HR
-40 to 85
DAC3174I
DAC3174IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
Call TI
Level-3-260C-168 HR
-40 to 85
DAC3174I
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
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