Company URL for Additional Information http://www.national.com/quality/green/ National Semiconductor Contact Gerry Fields Title VP Quality Phone 1-408-721-8435 Part Number MSL Rating Peak Body Temp C MaxTime (Sec) Cycles 3 235 30 4 Weight (mg) Unit Type LMH6321TS Document Date This part number contains Lead(Pb) and is NOT RoHS Compliant. 9-Sep-2006 Email [email protected] 1,609.822 Each Homogeneous Material Composition Declaration for Electronic Products Item Weight (mg) Component Leadframe 947.510 Cu Sn P Plastic 630.540 SiO2 Chip Weight (mg) 946.032 1.421 0.057 ppm 998,440 1,500 60 60676-86-0 438.225 695,000 25928-94-3 170.246 270,000 Sb2O3 1309-64-4 16.394 26,000 Brominated Epoxy 40039-93-8 5.675 9,000 11.760 Sn 7440-31-5 9.996 850,000 Pb Epoxy Resin Ext. LeadFinish CAS# 7440-50-8 7440-31-5 7723-14-0 7439-92-1 1.764 150,000 8.400 Si 7440-21-3 8.350 994,000 Al 7429-90-5 0.050 6,000 As (dopant) 7440-38-2 0.000 1 B (dopant) 7440-42-8 0.000 1 Ge (dopant) 7440-56-4 0.000 1 P (dopant) 7723-14-0 0.000 1 Sb (dopant) 7440-36-0 0.000 1 Lead Plating 6.170 Ni 7440-02-0 6.170 1,000,000 Die Attach 3.410 Pb 7439-92-1 3.257 955,000 Ag 7440-22-4 0.085 25,000 Sn 7440-31-5 0.068 20,000 Int. LeadFinish 1.520 Ag 7440-22-4 1.520 1,000,000 Wires 0.512 Au or Cu 7440-57-5 or 7440-50-8 0.512 1,000,000 Note: The device content disclosed herewith is approximate and is based on engineering estimates only. It has not been verified through analytical testing. Additionally, the following should be noted: 1. One or more dopant materials may be present in the silicon die to provide semiconductor properties.The amounts are very small and estimated as listed. 2. Epoxy resin components listed are generic and may or may not be the specific compound used, which is considered proprietary. 3. Brominated epoxy resins listed are generic and may or may not be the specific chemical used. The identity of the compound used is proprietary, however National certifies that these brominated compounds are not PBB or PBDE's, which are banned. 4. The die attach, if present, does not contain any flame retardant. National Semiconductor Page 1 of 2 Banned Substance Monitoring Part Number LMH6321TS Document Date 9-Sep-2006 This part number contains Lead(Pb) and is NOT RoHS Compliant. Use Material Cd CrVl Device Pb CHIP <10 <10 <10 COMPOUND <2 <10 <5 EXTLF <2 <10 154000 FRAME ND ND ND PREFORM <2 <10 984763 WIRE <2 <10 <5 Packing BAG <2 <10 <5 BUBBLE PACK <2 <10 <5 BUBBLE SHEET <2 <10 <5 CONTAINER <2 <2 5 DESICCANT <5 <5 <10 INDICATOR <5 <5 <10 LABEL <5 <5 <10 PIN <2 <10 <5 RAIL * Cd: Cadmium, CrVI: Hexavalent Chromium, Pb: Lead, Hg: Mercury, ND: Not Detected * Unless otherwise noted, units are in PPM (parts-per-million) Ref # 48 56 108 120 504 527 528 539 542 542 550 561 562 565 Hg PBB PBDE Ref # <10 <1 <1 ND <1 <1 <1 <1 <1 <2 <1 <1 <1 <1 <10 <100 N/A NA <100 N/A N/A N/A N/A N/A NA NA NA N/A N/A <10 <100 N/A NA <100 N/A N/A N/A N/A N/A NA NA NA N/A N/A 1000 565 56 504 561 562 550 542 542 539 108 120 48 528 527 3rd Party Analysis (available upon request, subject to a non-disclosure agreement) Analysis on 05/30/2005 Analysis on 04/20/2006 Analysis on 05/30/2005 Analysis on 05/30/2005 Analysis on 03/18/2005 Analysis pending Analysis on 04/18/2006 Analysis on 03/30/2006 Analysis on 04/18/2006 Analysis on 04/18/2006 Analysis on 04/18/2006 Analysis on 04/20/2006 Analysis on 04/20/2006 Analysis on 04/18/2006 by PSB-Singapore per Report# 57S051137-048A-PPG by ALS TECHNICHEM-MALAYSIA per Report# ATJB/2047BS/2006 by PSB-Singapore per Report# 57S051137-108-PPG by PSB-Singapore per Report# 57S051137-120-PPG by SGS-Malacca per Report# LPCI/1263/05 by ALS TECHNICHEM per Report# ATJB/2016BS/2006 by SGS-Port Klang-Malaysia per Report# LPCI/05059/06 by ALS TECHNICHEM-MALAYSIA per Report# ATJB/2038BS/2006 by ALS TECHNICHEM-MALAYSIA per Report# ATJB/2038BS/2006 by ALS TECHNICHEM-MALAYSIA per Report# ATJB/2032BS/2006 by ALS TECHNICHEM-MALAYSIA per Report# ATJB/1996BS/2006 by ALS TECHNICHEM-MALAYSIA per Report# ATJB/2029BS/2006 by ALS TECHNICHEM-MALAYSIA per Report# ATJB/2005BS/2006 RoHS Material Composition Declaration RoHS Directive 2002/95/EC RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material for Cadmium Subject to the limitations below, National Semiconductor Corporation (“National”) certifies the following information as of the document date. 1. National products with lead-free solder comply with the European Union’s Directive on the Restriction of the Use of Hazardous Substances 2002/95/EC (“RoHS”). These products do not contain homogeneous materials with Joint Industry Guide (JIG) -101 Level A materials above Level A threshold levels, except lead in RoHS exempt applications 5, 7a and 7c. 2. National products with lead-containing solder do not comply with RoHS, because they contain lead in a non-exempt application. These products do not contain other RoHS restricted substances or homogeneous materials with JIG-101 Level A materials above Level A threshold levels, except lead in solder and RoHS exempt applications 5, 7a and 7c. 3. National products are manufactured in conformance with National specifications (SC) CSP-9-111C1 Supplier Environmental Requirements for Materials and Products and (SC) CSP-9-111S2 National’s List of Banned and Reportable Substances, which are available at www.national.com/quality/green/. 4. National products do not contain and are not manufactured with ozone depleting substances subject to The Montreal Protocol on Substances that Deplete the Ozone Layer and U.S. Clean Air Act, Title VI. National has taken commercially reasonable steps to provide representative and accurate information but may not have independently verified information provided by others or conducted testing or chemical analysis on incoming materials and chemicals. Information provided herein is derived from default values associated with internal monitoring process and may not be representative of all or actual materials used in the product (e.g. the default may indicate a particular material, while an equivalent compliant material from the same or alternate supplier was actually used). Certain National suppliers consider material content information to be confidential and thus CAS numbers for such materials may not be available for release. National’s standard warranty and limitation of liability provisions of National’s Standard Terms and Conditions of Sale apply to any issues arising out of or in connection with the statements or information provided herein. Gerry Fields Vice President Quality National Semiconductor Page 2 of 2