Diodes B220 2.0a surface mount schottky barrier rectifier Datasheet

B220/A - B260/A
2.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
Features
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Schottky Barrier Chip
Guard Ring Die Construction for
Transient Protection
Ideally Suited for Automatic Assembly
Low Power Loss, High Efficiency
Surge Overload Rating to 50A Peak
For Use in Low Voltage, High Frequency
Inverters, Free Wheeling, and Polarity
Protection Application
High Temperature Soldering:
260°C/10 Second at Terminal
Plastic Material - UL Flammability
Classification 94V-0
SMA
B
A
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Min
Max
Min
Max
A
2.29
2.92
3.30
3.94
B
4.00
4.60
4.06
4.57
C
1.27
1.63
1.96
2.21
D
0.15
0.31
0.15
0.31
D
J
Case: Molded Plastic
Terminals: Solder Plated Terminal - Solderable
per MIL-STD-202, Method 208
Polarity: Cathode Band or Cathode Notch
Approx. Weight: SMA 0.064 grams
SMB 0.093 grams
Mounting Position: Any
Marking: Type Number
E
4.80
5.59
5.00
5.59
G
0.10
0.20
0.10
0.20
H
0.76
1.52
0.76
1.52
2.01
2.62
2.00
2.62
J
G
E
Mechanical Data
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Dim
C
H
SMB
All Dimensions in mm
No Suffix Designates SMB Package
“A” Suffix Designates SMA Package
Maximum Ratings and Electrical Characteristics
@ TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
@ TT = 100°C
Symbol
B220/A
B230/A
B240/A
B250/A
B260/A
Unit
VRRM
VRWM
VR
20
30
40
50
60
V
VR(RMS)
14
21
28
35
42
V
IO
2.0
A
Non-Repetitive Peak Forward Surge Current, 8.3ms single
half sine-wave superimposed on rated load
(JEDEC Method)
IFSM
50
A
Forward Voltage
VFM
Peak Reverse Current
at Rated DC Blocking Voltage
@ IF = 2.0A
@ TA = 25°C
@ TA = 100°C
Typical Junction Capacitance (Note 2)
Typical Thermal Resistance, Junction to Terminal
Typical Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage Temperature Range
Notes:
0.50
0.70
V
IRM
0.5
20
Cj
200
pF
RqJT
20
K/W
RqJA
25
K/W
Tj, TSTG
-65 to +150
°C
mA
1. Thermal Resistance: Junction to terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pad as heat sink.
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.
DS13004 Rev. E-2
1 of 2
B220/A-B260/A
IF, INSTANTANEOUS FORWARD CURRENT (A)
IO, AVERAGE FORWARD CURRENT (A)
2.5
2.0
1.5
1.0
0.5
0
25
50
75
100
125
150
10
B220 thru B240
B250 thru B260
1.0
0.1
TJ - 25ºC
IF Pulse Width = 300 ms
0.01
0
0.2
0.4
0.6
0.8
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
TT, TERMINAL TEMPERATURE (ºC)
Fig. 1 Forward Current Derating Curve
50
1000
Tj = 25°C
f = 1MHz
Cj, JUNCTION CAPACITANCE (pF)
Single Half-Sine-Wave
(JEDEC Method)
IFSM, PEAK FWD SURGE CURRENT (A)
1.0
40
30
20
10
100
10
0
1
10
0.1
100
10
100
VR, REVERSE VOLTAGE (V)
Fig. 4 Typical Junction Capacitance
NUMBER OF CYCLES AT 60 Hz
Fig. 3 Max Non-Repetitive Peak Fwd Surge Current
IR, INSTANTANEOUS REVERSE CURRENT (mA)
1
100
10
Tj = 100°C
1.0
Tj = 75°C
0.1
0.01
Tj = 25°C
0.001
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Fig. 5 Typical Reverse Characteristics
DS13004 Rev. E-2
2 of 2
B220/A-B260/A
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